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July 2005 ASM3P623S00A/B/C/D/E/F
rev 1.0
Zero Cycle Slip Peak EMI reduction IC
General Features
Input frequency range: 20MHz - 50MHz.
Zero input - output propagation delay.
Low-skew outputs.
Output-output skew less than 250pS.
Device-device skew less than 700pS.
Less than 200pS cycle-to-cycle jitter is compatible
with Pentium
®
based systems.
Available in 16pin, 150mil SOIC, 4.4mm TSSOP
(ASM3P623S00D/E/F), and in 8pin, 150 mil SOIC,
4.4mm TSSOP Packages (ASM3P623S00A/B/C).
3.3V operation
Advanced 0.35µ CMOS technology.
The First True Drop-in Solution.
Functional Description
ASM3P623S00D/E/F is a versatile, 3.3V zero-delay buffer
designed to distribute high-speed clocks. It accepts one
reference input and drives out eight low-skew clocks. It is
available in a 16pin package. The ASM3P623S00A/B/C is
the eight-pin version of the ASM3P623S00. It accepts one
reference input and drives out one low-skew clock.
Block Diagram
VDD
SSON
All parts have on-chip PLLs that lock to an input clock on
the CLKIN pin. The PLL feedback is on-chip and is
obtained from the CLKOUT pad, internal to the device.
Multiple ASM3P623S00D/E/F devices can accept the same
input clock and distribute it. In this case, the skew between
the outputs of the two devices is guaranteed to be less than
700pS.
All outputs have less than 200pS of cycle-to-cycle jitter.
The input and output propagation delay is guaranteed to be
less than 250pS, and the output-to-output skew is
guaranteed to be less than 250pS.
Please refer
“Differential Cycle Slips and Spread Spectrum
Control Table” for deviations and differential Cycle Slips
for ASM3P623S00A/B/C and the ASM3P623S00D/E/F
devices
The ASM3P623S00A/B/C and the ASM3P623S00D/E/F
are available in two different configurations, as shown in
the ordering information table.
SS%
CLKIN
Reference
Divide
Feedback
Divide
Modulation
Phase
Detecto
Loop
Filte
VCO
PLL
Feedforward
Divide
CLKOUT
VSS
Alliance Semiconductor
2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com
Notice: The information in this document is subject to change without notice.
July 2005
ASM3P623S00A/B/C/D/E/F
rev 1.0
Spread Spectrum Frequency Generation
The clocks in digital systems are typically square waves
with a 50% duty cycle and as frequencies increase the
edge rates also get faster. Analysis shows that a square
wave is composed of fundamental frequency and
harmonics. The fundamental frequency and harmonics
generate the energy peaks that become the source of
EMI. Regulatory agencies test electronic equipment by
measuring the amount of peak energy radiated from the
equipment. In fact, the peak level allowed decreases as
the frequency increases. The standard methods of
reducing EMI are to use shielding, filtering, multi-layer
Cycle Slip
Cycle slip occurs when the output clock edge
‘wanders’ away from the corresponding input clock
edge. There are two types of cycle slips – a Differential
cycle slip and an Integral cycle slip. The differential
cycle slip is caused due the clock edge variation over
one modulation cycle. It is defined by the maximum
amount of ‘wander’ the clock edge will have within one
Pin Configuration
PCBs etc. These methods are expensive. Spread
spectrum clocking reduces the peak energy by reducing
the Q factor of the clock. This is done by slowly
modulating the clock frequency. The ASM3P623S00X
uses the center modulation spread spectrum technique in
which the modulated output frequency varies above and
below the reference frequency with a specified
modulation rate. With center modulation, the average
frequency is the same as the unmodulated frequency and
there is no performance degradation
modulation cycle. Integral cycle slip occurs due to the
accumulation of the cycle slip over successive modulation
cycles. In ASM3P623S00A/B/C/D/E/F the differential cycle
slip is within the value mentioned in the
“Differential Cycle
Slip and Spread Spectrum Control Table” and the Integral
Cycle Slip is ‘Zero’.
NC
CLKIN
NC
SS%
GND
1
2
ASM3P623S00A/B/C
3
4
8
7
6
5
V
DD
CLKOUT
SSON
1
CLKIN
VDD
SS%
GND
2
3
4
ASM3P623S00 D/E/F
5
6
7
8
CLKOUT1
CLKOUT2
CLKOUT3
DLY CNTRL
16
15
14
13
12
11
10
9
CLKOUT8
CLKOUT7
CLKOUT6
VDD
GND
CLKOUT5
CLKOUT4
SSON
Zero Cycle Slip Peak EMI Reduction IC 2 of 16
Notice: The information in this document is subject to change without notice.
July 2005
ASM3P623S00A/B/C/D/E/F
rev 1.0
Pin Description for ASM3P623S00A/B/C
Pin # Pin Name Description
1 CLKIN2 Input reference frequency, 5V-tolerant input
2 NC No Connect
3 SS%4 Spread Spectrum Selection
4 GND Ground
5 SSON4 Spread Spectrum enable and disable option When SSON is HIGH, the spread
spectrum is enabled and when LOW, it turns off the spread spectrum.
6 CLKOUT
7 VDD 3.3V supply
8 NC No Connect
Pin Description for ASM3P623S00D/E/F
Pin # Pin Name Description
1 CLKIN2 Input reference frequency, 5V tolerant input
2 CLKOUT13 Buffered clock output
3 VDD 3.3V supply
4 SS%4 Spread Spectrum Selection
5 GND Ground
6 CLKOUT23 Buffered clock output
7 CLKOUT33 Buffered clock output
8 DLY CNTRL
9 SSON4
10 CLKOUT43 Buffered clock output
11 CLKOUT53 Buffered clock output
12 GND Ground
13 VDD 3.3V supply
14 CLKOUT63 Buffered clock output
15 CLKOUT73 Buffered clock output
16 CLKOUT83 Buffered clock output
Notes:
1. This output is driven and has an internal feedback for the PLL.
2. Weak pull-down. 3. Weak pull-down on all outputs. 4. Weak pull-up on these inputs.
1,3
Buffered clock output
The pin is used to skew the outputs such that they align with the input. The skew can
is in the range of 100-200pS
Spread Spectrum enable and disable option. When SSON is HIGH, the spread
spectrum is enabled and when LOW, it turns off the spread spectrum.
Zero Cycle Slip Peak EMI Reduction IC 3 of 16
Notice: The information in this document is subject to change without notice.
July 2005
ASM3P623S00A/B/C/D/E/F
rev 1.0
Differential Cycle Slips and Spread Spectrum Control Table
(Note: The values given in the table are for an input frequency of 32 MHz)
Device SS% Deviation
ASM3P623S00A
ASM3P623S00B
ASM3P623S00C
ASM3P623S00D
ASM3P623S00E
0 ±0.5 % 0.125
1 ±1 % 0.25
0 ±0.25 % 0.125
1 ±0.5 % 0.25
0 ±0.125 % 0.125
1 ±0.25 % 0.25
0 ±0.5 % 0.125
1 ±1 % 0.25
0 ±0.25 % 0.125
1 ±0.5 % 0.25
Differential Cycle Slips
(Nd)
ASM3P623S00F
0 ±0.125 % 0.125
1 ±0.25 % 0.25
Absolute Maximum Ratings
Parameter Min Max Unit
Supply Voltage to Ground Potential -0.5 +7.0 V
DC Input Voltage (Except CLKIN) -0.5 VDD + 0.5 V
DC Input Voltage (CLKIN) -0.5 7 V
Storage Temperature -65 +150 °C
Max. Soldering Temperature (10 sec) 260 °C
Junction Temperature 150 °C
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device
reliability.
2000 V
Zero Cycle Slip Peak EMI Reduction IC 4 of 16
Notice: The information in this document is subject to change without notice.
July 2005
ASM3P623S00A/B/C/D/E/F
rev 1.0
Operating Conditions for ASM3P623S00A/B/C and ASM3P623S00D/E/F Devices
Parameter Description Min Max Unit
VDD Supply Voltage 3.0 3.6 V
TA Operating Temperature (Ambient Temperature) 0 70 °C
CL Load Capacitance 30 pF
CIN Input Capacitance 7 pF
Electrical Characteristics for ASM3P623S00A/B/C and ASM3P623S00D/E/F
Parameter Description Test Conditions Min Typ Max Unit
VIL Input LOW Voltage5 0.8 V
VIH Input HIGH Voltage5 2.0 V
IIL Input LOW Current VIN = 0V 50 µA
IIH Input HIGH Current VIN = VDD 100 µA
VOL Output LOW Voltage6 I
VOH Output HIGH Voltage6 I
IDD Supply Current Unloaded outputs 15 mA
Zo Output Impedance 23 Ω
Switching Characteristics for ASM3P623S00A/B/C and ASM3P623S00D/E/F
= 8mA 0.4 V
OL
= -8mA 2.4 V
OH
7
Parameter Description Test Conditions Min Typ Max Unit
1/t1 Output Frequency 30pF load 20 50 MHz
Duty Cycle
t3 Output Rise Time 6 Measured between 0.8V and 2.0V 2.5 nS
t4 Output Fall Time 6 Measured between 2.0V and 0.8V 2.5 nS
t5 Output-to-output skew
t6 Delay, CLKIN Rising Edge to
CLKOUT Rising Edge
t7 Device-to-Device Skew
tJ Cycle-to-cycle jitter
t
PLL Lock Time 6 Stable power supply, valid clock presented
LOCK
Notes:
5. CLKIN input has a threshold voltage of VDD/2
6. Parameter is guaranteed by design and characterization. Not 100% tested in production
7. All parameters specified with loaded outputs.
6
= (t2 / t1) * 100 Measured at VDD/2 40 50 60 %
6
All outputs equally loaded 250 pS
Measured at VDD /2
6
6
Measured at VDD/2 on the CLKOUT pins
of the device
6
Loaded outputs 200 pS
on CLKIN pin
±350 pS
700 pS
1.0 mS
Zero Cycle Slip Peak EMI Reduction IC 5 of 16
Notice: The information in this document is subject to change without notice.