Alliance Semiconductor AS7C1024A, AS7C31024A Service Manual

May 2002
5V/3.3V 128KX8 CMOS SRAM (Evolutionary Pinout)

Features

• AS7C1024A (5V version)
• AS7C31024A (3.3V version)
• Industrial and commercial temperatures
• Organization: 131,072 words x 8 bits
•High speed
- 10/12/15/20 ns address access time
- 5, 6, 7, 8 ns output enable access time
• Low power consumption: ACTIVE
- 853 mW (AS7C1024A) / max @ 10 ns
- 522 mW (AS7C31024A) / max @ 10 ns
• Low power consumption: STANDBY
- 55 mW (AS7C1024A) / max CMOS
- 36 mW (AS7C31024A) / max CMOS
®
• Latest 6T 0.25u CMOS technology
• Easy memory expansion with CE1
• TTL/LVTTL-compatible, three-state I/O
• 32-pin JEDEC standard packages
- 300 mil SOJ
- 400 mil SOJ
-8 × 20mm TSOP 1
- 8 x 13.4mm sTSOP 1
• ESD protection 2000 volts
• Latch-up current 200 mA

Pin arrangement

32-pin SOJ (300 mil) 32-pin SOJ (400 mil)
AS7C1024A
AS7C31024A
, CE2, OE inputs

Logic block diagram

V
CC
GND
Input buffer
A0 A1 A2 A3 A4 A5 A6 A7 A8
Row decoder
512×256×8
(1,048,576)
Column decoder
A9
A10
Array
A11
A12
1
NC
2
A16
3
A14
4
A12
5
A7
6
A6
7
A5
8
A4
9
A3
10
A2
11
A1
A0 I/O0 I/O1 I/O2
I/O7
Sense amp
I/O0
Control
circuit
A13
A14
A15
A16
WE OE CE1 CE2
GND
32-pin (8 x 20mm) TSOP I
32-pin (8 x 13.4mm) sTSOP1
A11 OE
1 2
A9
3
A8
4
A13
5
WE
6
CE2
7
A15
8
V
CC
9
NC
10
A16
11
A14
12
A12
13
A7
14
A6
15
A5
16
A4 A3
12 13 14 15 16
AS7C1024A
AS7C1024A
V
32
A15
31
CE2
30 29
WE
28
A13
27
A8
26
A9 A11
25 24
OE
23
A10
22
CE1
AS7C31024A
21
I/O7
20
I/O6
19
I/O5
18
I/O4
17
I/O3
AS7C31024A
CC
32
A10
31
CE1
30
I/O7
29 28
I/O6
27
I/O5
26
I/O4
25
I/O3
24
GND
23
I/O2
22
I/O1
21
I/O0
20
A0
19
A1
18
A2
17
Selection guide
-10
Maximum address access time 10 12 15 20 ns Maximum output enable access time 5 6 7 8 ns
Maximum operating current
Maximum CMOS standby current
AS7C1024A 155 150 145 140 mA
AS7C31024A 145 140 135 130 mA
AS7C1024A 10 10 10 10 mA
AS7C31024A 5 5 5 5 mA
-12 -15 -20 Unit
9/26/02; 0.9.9
Alliance Semiconductor
Copyright © Alliance Semiconductor. All rights reserved.
AS7C1024A
AS7C31024A
®

Functional description

The AS7C1024A and AS7C31024A are high performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as 131,072 words x 8 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5, 6, 7, 8 ns are ideal for high performance applications. Active high and low chip enables (CE1, CE2) permit easy memory expansion with multiple-bank systems.
When CE1 is high or CE2 is low the devices enter standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is static, then full standby pow er is reached (I conditions. All devices in this family will retain data when VCC is reduced as low as 2.0V.
A write cycle is accomplished by asserting write enable (WE) and both chip enables (CE1, CE2). Data on the input pins I/O0-I/O7 is wr itten on the rising edge of WE should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and both chip enables (CE1, CE2), with write enable (WE) high. The chips drive I/O pins with the data word referenced by the input address. When either chip enable is inactive, output enable is inactive, or write enable is active, output drivers stay in high-impedance mode.
(write cycle 1) or the active-to-inactive edge of CE1 or CE2 (write cycle 2). To avoid bus contention, external devices
). For example, the AS7C31024A is guaranteed not to exceed 36mW under nominal full standby
SB1
Absolute maximum ratings
Parameter Symbol Min Max Unit
Voltage on V
relative to GND
CC
AS7C1024A V
AS7C31024A V Voltage on any pin relative to GND Both V Power dissipation Both P Storage temperature (plastic) Both T Ambient temperature with V
applied Both T
CC
DC current into outputs (low) Both I
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause perma nent damage to the device. This is a stress rating only and functional oper­ation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
t1 t1 t2 D
stg
bias
OUT
–0.50 +7.0 V
-0.50 +5.0 V
–0.50 VCC +0.50 V
–1.0W –65 +150 –55 +125
C
°
C
°
–20mA
Truth table
CE1
HXXX High Z Standby (I XLXX High Z Standby (I
L H H H High Z Output disable (I LHHL D LHLX D
Key: X = Don’t Care, L = Low, H = High
CE2
WE OE
Data Mode
OUT
IN
Read (ICC)
Write (
SB SB
ICC
, I , I
SB1 SB1
)
CC
) )
)
9/26/02; 0.9.9
Alliance Semiconductor
P. 2 of 9
Recommended operating conditions
Parameter Device Symbol Min Nominal Max Unit
Supply voltag e
Input voltage
Ambient operating temperature
VILmin. = –3.0V for pulse width less than t
1
AS7C1024A V
AS7C31024A V
ASAS7C1024A V
AS7C31024A V
commercial T
industrial T
.
RC/2
CC CC IH IH
1
V
IL
A A
DC operating characteristics (over the operating range)
Parameter Sym Test conditions Device
Input lea k age current
Output leakage current
Operating pow er suppl y current
Standby power supply current
Output voltage
|I
|VCC = Max, VIN = GND to V
LI
V
= Max, CE1 = VIH or
|
|I
LO
CC
CE2 = V
, V
= GND to V
IL
OUT
VCC = Max, CE1 = VIL,
CE2 = V
I
CC
IH
, f = f
Max
mA
VCC = Max, CE1 ≥ VIH and/or
CE2
I
SB
VIL, VIN = VIH or VIL,
f = f
, I
Max
OUT
VCC = Max, CE1 ≥ VCC–0.2V
V
I
SB1
V
OL
V
OH
≤ GND + 0.2V or
IN
V
≥ VCC –0.2V, f = 0
IN
IOL = 8 mA, VCC = Min
IOH = –4 mA, VCC = Min 2.4 2.4 2.4 2.4 V
, I
OUT
= 0mA
CC
Both –1–1–1–1µA
Both –1–1–1–1µA
CC
AS7C1024A 155 150 145 140
= 0
AS7C31024A 145 140 135 130
AS7C1024A 30 25 20 20
AS7C31024A 30 25 20 20
AS7C1024A 10 10 10 10
AS7C31024A 5 5 5 5
Both
AS7C1024A
AS7C31024A
®
4.5 5.0 5.5 V
3.0 3.3 3.6 V
2.2 VCC + 0.5 V
2.0 VCC + 0.5 V
–0.5 0.8 V
0–70°C
–40 85
-10 -12 -15 -20
Min Max Min Max Min Max Min Max
–0.4–0.4–0.4–0.4V
C
°
Unit
mA
mA
mA
Capacitance (f = 1 MHz, Ta = 25 °C, VCC = NOMINAL)
Parameter Symbol Signals Test conditions Max Unit
Input capacitance C
I/O capacitance C
9/26/02; 0.9.9
IN
I/O
Alliance Semiconductor
A, CE1, CE2, WE, OE VIN = 0V 5 pF
I/O VIN = V
2
= 0V 7 pF
OUT
P. 3 of 9
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