The AS7C34098A is a high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) device organized as
262,144 words × 16 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are
desired.
Equal address access and cycle times (t
ideal for high-performance applications. The chip enable input CE
memory systems.
When CE
is high the device enters standby mode. The device is guaranteed not to exceed 28.8mW power consumption in
CMOS standby mode. A write cycle is accomplished by asserting write enable (WE
pins I/O1–I/O16 is written on the rising edge of WE
devices should drive I/O pins only after outputs have been disabled with output enable (OE
A read cycle is accomplished by asserting output enable (OE
drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or
write enable is active, output drivers stay in high-impedance mode.
The device provides multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be
written and read. LB
controls the lower bits, I/O1–I/O8, and UB controls the higher bits, I/O9–I/O16.
All chip inputs and outputs are TTL- and CMOS-compatible, and operation is for 3.3V (AS7C34098A) supply. The device is
available in the JEDEC standard 400-mL, 44-pin SOJ, TSOP 2.
, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 4/5/6/7 ns are
AA
permits easy memory expansion with multiple-bank
) and chip enable (CE). Data on the input
(write cycle 1) or CE (write cycle 2). To avoid bus contention, external
) or write enable (WE).
) and chip enable (CE), with write enable (WE) high. The chip
Absolute maximum ratings
ParameterSymbolMinMaxUnit
Voltage on V
Voltage on any pin relative to GNDV
Power dissipationP
Storage temperature (plastic)T
Ambient temperature with V
DC current into outputs (low)I
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Truth table
CEWEOELBUBI/O1–I/O8I/O9–I/O16Mode
HXXXX High Z High Z Standby (I
LHHXX
LXXHH
LHL
LLX
Key: X = Don’t care, L = Low, H = High.
relative to GNDV
CC
appliedT
CC
LH D
LL D
LH D
HLHigh ZD
LL D
t1
t2
D
stg
bias
OUT
–0.50+5.0V
–0.50VCC +0.50V
–1.5W
–65+150°C
–55 +125°C
–±20mA
, I
)
SB
SB1
High ZHigh ZOutput disable (I
OUT
OUT
IN
IN
High Z
OUT
D
OUT
High Z
IN
D
IN
Read (I
Writ e (I
)
CC
)HLHigh ZD
CC
)
CC
8/17/04,v. 2.1Alliance Memory IncP. 2 of 10
Page 3
Recommended operating conditions
ParameterSymbolMin TypicalMaxUnit
Supply voltageV
Input voltage
Ambient operating temperature
*
min = –1.0V for pulse width less than 5ns.
V
IL
**
V
max = VCC + 2.0V for pulse width less than 5ns.
IH
commercialT
industrialT
®
(10/12/15/20)3.03.33.6V
CC
**
V
IH
*
V
IL
A
A
2.0–VCC + 0.5V
–0.5–0.8V
0– 70°C
–40–85°C
AS7C34098A
DC operating characteristics (over the operating range)
1During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
2This parameter is sampled, but not 100% tested.
3For test conditions, see AC Test Conditions, Figures A and B.
and t
4t
CLZ
5This parameter is guaranteed, but not tested.
is High for read cycle.
6WE
and OE are Low for read cycle.
7CE
8Address valid prior to or coincident with CE
9All read cycle timings are referenced from the last valid address to the first transitioning address.
10 All write cycle timings are referenced from the last valid address to the first transitioning address.
11 C=30pF, except on High Z and Low Z parameters, where C=5pF.
are specified with CL = 5pF as in Figure B. Transition is measured ±500mV from steady-state voltage.
Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this
document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data
contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any
time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in
this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide,
any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any
product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or
warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in
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Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights,
trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in
life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of
Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all
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