▫ Overload Protection with latch
▫ Maximum on-time limit
/ 0.62 Ω R
DSS
DS(on)
derating
DSS
Package: 7-Pin TO-3P
Description
The STR-X6757 is a quasi-resonant topology IC designed for
SMPS applications. It shows lower EMI noise characteristics
than conventional PWM solutions, especially at greater than
2 MHz. It also provides a soft-switching mode to turn on the
internal MOSFET at close to zero voltage (VDS bottom point)
by use of the resonant characteristic of primary inductance
and a resonant capacitor.
The package is a fully molded TO-3P, which contains the
controller chip (MIC) and MOSFET, enabling output power
up to 320 W at 230 VAC and 165 W at universal input. The
bottom-skip mode skips the first bottom of VDS and turns on the
MOSFET at the second bottom point, to minimize an increase
of operating frequency at light output load, improving systemlevel efficiency over the entire load range.
There are two standby modes available to reduce the input power
under very light load conditions. The first is Auto-Standby
mode, which is internally triggered by periodic sensing, and
the other is a manual standby mode, which is executed by
clamping the secondary output. In general applications, the
manual standby mode reduces the input power further compared
to Auto-Standby mode.
Not to scale
Continued on the next page…
T ypical Application
28103.30-10
Page 2
STR-X6757
Off-Line Quasi-Resonant Switching Regulators
Description (continued)
The soft-start mode minimizes surge voltage and reduces power stress
to the MOSFET and to the secondary rectifying diodes during the
start-up sequence. Various protections such as overvoltage, overload,
overcurrent, maximum on-time protections and avalanche-energyguaranteed MOSFET secure good system-level reliability.
Applications include the following:
▪ Set Top Box
▪ LCD PC monitor, LCD TV
▪ Printer, Scanner
▪ SMPS power supplies
Selection Guide
Part NumberPackage
STR-X6757TO-3P
Absolute Maximum Ratings at T
= 25°C
A
ParameterSymbolConditionsRatingUnit
Drain Current
Maximum Switching Current
Single Pulse Avalanche Energy
Input Voltage for Controller (MIC)V
SS/OLP Terminal VoltageV
FB Terminal Inflow CurrentI
FB Terminal VoltageV
OCP/BD Terminal VoltageV
Recommended operation temperature, see cautions–20 to 125°C
F
is the drain current determined by the drive voltage of the IC and the threshold voltage, Vth, of the MOSFET
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, T
, of 25°C, unless oth er wise stated.
A
= 3.53 A326mJ
35V
–0.5 to 6.0V
10mA
–0.5 to 9.0V
–1.5 to 5.0V
0.8W
–20 to 125°C
–40 to 125°C
150°C
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
Page 3
STR-X6757
Functional
Block Diagram
Off-Line Quasi-Resonant Switching Regulators
Terminal List Table
NumberNameDescriptionFunctions
1DDrainMOSFET drain
2SSourceMOSFET source
3GNDGround terminalGround
4VCCPower supply terminalInput of power supply for control circuit
5SS/OLPSoft Start/Overload Protection terminalInput to set delay for Overload Protection and Soft Start operation
6FBFeedback terminal
7OCP/BDOvercurrent Protection/Bottom DetectionInput for Overcurrent Detection and Bottom Detection signals
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Input for Constant Voltage Control and Burst (intermittent) Mode
oscillation control signals
3
Page 4
STR-X6757
0
20
40
60
80
100
0 20 40 60 80 100 120
A.S.O. temperature derating coefficient (%)
TF [℃]
Internal frame temperature
STR-X6757
A.S.O. tem perature derating coefficient
curve
0
20
40
60
80
100
255075100125150
E
AS
temperature derating coefficient (%)
Tch [℃]
Channel temperature
STR-X6757
Avalanch e energy d erating cu rve
0.01
0.1
1
10
100
1101001000
I
D
[A]
Drain Current
VDS[V]
Drain-to-Source Voltage
STR-X6757
MOSFET A.S.O. Curve
Determined by On-Resistance
1ms
100μs
Off-Line Quasi-Resonant Switching Regulators
App ly A.S.O temp erature
co efficient fr om the l eft graph to
th is cur ve fo r ev aluating actual
op erations' safety
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
Page 5
STR-X6757
0
5
10
15
20
25
30
35
40
45
50
0 20 40 60 80 100 120 140
P
D1
[W]
Power dissipation
Ta[℃]
Ambient temperature
STR-X6757
MOSFET Ta-P
D1
Curve
PD1=2.8[W]
With infinite heatsink
Without heatsink
PD1=44[W]
0
0.2
0.4
0.6
0.8
1
020 4060 80 100 120 140
P
D2
〔W〕
Power dissipation
TF〔℃〕
Internal frame temperature
STR-X6757
MIC T
F-PD2
Curve
0.001
0.01
0.1
1
1.0E-061.0E-051.0E-041.0E-031.0E-021.0E-01
θch-c[℃/W]
Transient thermal resistance
t [sec]
time
STR-X6757
Transient thermal resistance curve
Off-Line Quasi-Resonant Switching Regulators
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
, valid at TA = 25°C, VCC = 20 V, unless otherwise specified
Power Supply Start-up Operation
osc
VCC = 0→20 V
VCC = 20→8.8 V
VCC = 15 V
V
increasing
SS/OLP
V
= 0 V
SS/OLP
16.318.219.9V
8.89.710.6V
––6mA
––100μA
192225kHz
1.11.21.4V
–710–550–390μA
Operation Start VoltageV
Operation Stop VoltageV
Circuit Current In OperationI
Circuit Current In Non-OperationI
Oscillation Frequencyf
Soft Start Operation Stop VoltageV
Soft Start Operation Charging CurrentI
SSOLP(SS)
SSOLP(SS)
CC(ON)
CC(OFF)
CC(ON)
CC(OFF)
Normal Operation
Bottom-Skip Operation Threshold Voltage 1V
Bottom-Skip Operation Threshold Voltage 2V
Overcurrent Detection Threshold VoltageV
OCP/BD Terminal Outflow CurrentI
Quasi-Resonant Operation Threshold Voltage 1V
Quasi-Resonant Operation Threshold Voltage 2V
FB Terminal Threshold VoltageV
FB Terminal Inflow Current (Normal Operation)I
OCPBD(BS1)
OCPBD(BS2)
OCPBD(LIM)
OCPBD
OCPBD(TH1)
OCPBD(TH2)
FB(OFF)
FB(ON)
V
falling
OCP/BD
V
= –0.95 V
OCP/BD
V
falling
OCP/BD
V
rising
OCP/BD
VFB rising
VFB = 1.6 V
–0.720–0.665–0.605V
–0.485–0.435–0.385V
–0.995–0.940–0.895V
–250–100–40μA
0.280.400.52V
0.670.800.93V
1.321.451.58V
60010001400μA
Standby Operation
Standby Operation Start VoltageV
Standby Operation Start Voltage IntervalV
Standby Non-Operation Circuit CurrentI
FB Terminal Inflow Current, Standby OperationI
FB Terminal Threshold Voltage, Standby OperationV
Minimum On Timet
CC(S)
CC(SK)
CC(S)
FB(S)
FB(S)
ON(MIN)
VCC = 0→15 V, VFB = 1.6 V
V
= V
CC(SK)
CC(S)
– V
CC(OFF)
VCC = 10.2 V, VFB = 1.6 V
VCC = 10.2 V, VFB = 1.6 V
VCC = 15 V, VFB rising
10.311.212.1V
1.101.351.65V
–2056μA
–414μA
0.551.101.50V
0.651.001.35μs
Protection Operation
Maximum On Timet
Overload Protection Operation Threshold VoltageV
Overload Protection Operation Charging CurrentI
Overvoltage Protection Operation VoltageV
Latch Circuit Holding Current
Latch Circuit Release Voltage
2
2
ELECTRICAL CHARACTERISTICS for MOSFET, valid at T
Drain-to-Source Breakdown VoltageV
Drain Leakage CurrentI
On ResistanceR
Switching Timet
Thermal ResistanceR
1
Current polarity with respect to the IC: positive current indicates current sink at the terminal named, negative current indicates source at the
terminal named.
2
The latch circuit means a circuit operated OVP and OLP.
ON(MAX)
SSOLP(OLP)
V
= 2.5 V
SSOLP(OLP)
CC(OVP)
I
CC(H)
V
CC(La.OFF)
DSS
DSS
DS(on)IDS
θch-F
SS/OLP
VCC = 0→30 V
V
– 0.3 V
CC(OFF)
VCC = 30→6 V, OVP operating
= 25°C, unless otherwise specified
A
I
= 300 μA650––V
DSS
V
= 650 V––300μA
DSSS
= 3.4 A––0.62Ω
f
Channel to internal frame––1.09°C/W
27.532.539.0μs
4.04.95.8V
–16–11–6μA
25.527.729.9V
–45140μA
6.07.28.5V
––500ns
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
Page 7
STR-X6757
100 pieces per tray
5 trays per inner carton
(Outer packing dependent on quantity)
Dimensions in millimeters
48
333
Off-Line Quasi-Resonant Switching Regulators
Packing Specifications
388
137
364
177
4 inner cartons per outer carton
500 pieces maximum per inner carton
2000 pieces maximum per outer carton
137
Dimensions in millimeters
356
206
2 inner cartons per outer carton
500 pieces maximum per inner carton
1000 pieces maximum per outer carton
Dimensions in millimeters
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
Page 8
STR-X6757
Off-Line Quasi-Resonant Switching Regulators
Package Outline Drawing, TO-3P
15.6 ±0.2
Gate Burr
Branding
Area
View A
2X 2.54±0.14X 1.27±0.1
Terminal dimension at lead tip
6
XXXXXXXX
XXXXXXXX
XXXXXXXX
257
1
2 ±0.2
5.5±0.2
634
23 ±0.3
5.5±0.2
6.7±0.5
12.5±0.5
5.8
REF
4.3 ±0.5
Terminal dimension at lead tip
0.55
3.45±0.2
Ø3.2 ±0.2
3.35±0.1
+0.2
–0.1
3.6 ±0.5
3.3
1.33
2X 0.83
+0.2
–0.1
+0.2
–0.1
1.89
+0.2
–0.1
3
5X 0.75
5X 0.65
+0.2
–0.1
+0.2
–0.1
Gate burr: 0.3 mm (max.)
Terminal core material: Cu
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 1905
Approximate weight: 6 g
Dimensions in millimeters
Leadframe plating Pb-free. Device composition
includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
0.5
Front View (Plan View)
0.5
Drawing for reference only
Branding codes (exact appearance at manufacturer discretion):
1st line, type: STR
2nd line, subtype: X6757
3rd line, lot: YM DDWhere: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the 2-digit date
Enlargement View A
8
Page 9
STR-X6757
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit
designs that embody these components must conform with applicable safety requirements. Pre cau tions must be taken to prevent accidental contact with power-line potentials.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Off-Line Quasi-Resonant Switching Regulators
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
TypeSuppliers
G746Shin-Etsu Chemical Co., Ltd.
YG6260Momentive Performance Materials
SC102Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
• Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the heatsink
can be deformed, and distortion can arise in the product frame. To avoid
these problems, observe the recommended tightening torques for this
product package type, TO-3P: 0.588 to 0.785 N•m (6 to 8 kgf•cm).
• For effective heat transfer, the contact area between the product and
the heatsink should be free from burrs and metal fragments, and the
heatsink should be flat and large enough to contact over the entire
side of the product, including mounting flange and exposed thermal
pad, and have a minimal mounting hole to prevent possible deflection
and cracking of the product case when fastened to the heatsink.
Soldering
• When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
350±5°C 3 s
• Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
• When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the
equipment should be grounded.
• When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
• The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Recommended operation temperature
• Inner frame temperature in operation T
= 115°C
F
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
Page 10
STR-X6757
Off-Line Quasi-Resonant Switching Regulators
The products described herein are manufactured in Ja pan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be re quired to per mit im prove ments in the per for mance, reliability, or manufacturability of its prod ucts. Therefore, the user is cau tioned to verify that the in for ma tion in this
publication is current before placing any order.
When using the products described herein, the ap pli ca bil i ty and suit abil i ty of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its prod ucts, the occurrence of failure and defect of semi con duc tor products
at a certain rate is in ev i ta ble.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equip ment or apparatus
(home ap pli anc es, office equipment, tele com mu ni ca tion equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aero space equipment) is not supported.
When considering the use of Sanken products in ap pli ca tions where higher reliability is re quired (transportation equipment and its control systems
or equip ment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your spec i fi ca tions.
The use of Sanken products without the written consent of Sanken in applications where ex treme ly high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information in clud ed herein is believed to be accurate and reliable. Ap pli ca tion and operation examples described in this pub li ca tion are
given for reference only and Sanken and Allegro assume no re spon si bil i ty for any in fringe ment of in dus tri al property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use. The contents in this document must not be transcribed
or copied without Sanken’s or Allegro's written consent.