ALLEGRO SEPW User Manual

SEPW Series

Multi Chip White LED Modules

Features and Benefits

▪ High efficiency, 100 1m/W (20 mA ) with all LEDs

illuminated; equivalent to fluorescent lamps (HCFL)

▪ Low thermal resistance, R

= 6°C/W

θJC

▪ High optical, 50 lm, output with all LEDs illuminated
▪ Superior directivity
▪ 5.23 mm × 13.7 mm case footprint, and

low 2.5 mm overall package height

▪ Silver plating on leadframe
▪ 8 LED configuration

Package:

16-pin, 1.27 mm pitch, surface mount

Description

The SEPW series of LEDs provides a range of high-powered
InGaN blue LEDs producing brilliant white light that can be
used in general lighting applications, amusement and gaming
equipment, and for backlighting TFT displays. Each module
combines 8 LEDs in 2 separate channels.
Modular design allows the SEPW devices to be easily assembled
into string arrays by simply connecting the modules in series.
The devices also provide superior color balance throughout
the display because of the high density of LEDs that can be
achieved. This also minimizes the distance that power and
control lines must run between LEDs and from the LEDs to
the control electronics.
The white thermoplastic case is an innovative Sanken original
design with exceptional heat dissipation properties. The white
resin compound is especially formulated for superior reflectance
and transmittance of the generated light. Enhanced thermal
dissipation is achieved through the incorporated heatsink on the
bottom of the package. The heatsink can be mated directly to an
external radiator through the PCB for superior heat conduction
allowing dense placement of modules.
The leadframe is plated with silver, providing a highly-reflective
surface for the bottom and sides of the emitting area. The
terminals and heatsink are also silver-plated.

Not to scale

V

B

5 to 20 V

5 V

Use only
one dimming
method

C

COMP

48100.000, Rev. 4

R

0.1 μF
10 V

FSET

L1

10 μH

1 μF
35 V

R

ISET

SW SW OVP
SEL1
SEL2
SEL3

VIN

LED Driver
EN
PWM
APWM
SKIP
COMP

FSET

ISET
AGND

PGND LGND

D1

Allegro
A8500

IC

R

OVP

C

O

2.2 μF/50 V

LED1

LED2

LED3

LED4

LED5

LED6

LED7

LED8

T ypical Application

8 SEPW modules, 8 LEDs each

SEP8W

SEP8W

SEP8W

SEP8W

SEP8W

SEP8W

SEP8W

SEP8W

R

C

R

R

The SEPW devices can be mounted in tight
arrays on a single PCB substrate for ease of
manufacture and to provide a dense, uniform
appearance when illuminated.

The application shown here uses eight
SEP8Wx2001 LED modules, each populated
by eight LEDs connected in series.

OVP

COMP

ISET

FSET

100 kΩ

0.1 μF / 6.3 V

12.7 kΩ (for 20.3 mA)

26.1 kΩ (for 1 MHz
switching frequency)

SEPW Series

Selection Guide

Part Number LEDs Channels Color Temperature

Multi Chip White LED Modules

Internal Circuit Diagram

(Pin Numbers Shown)

Packing

SEP8WL2001 8 2 Bulb Light (2900)

16 15 14 13 12 11 10 9

B BBB BB

SEP8WN2001 8 2 Day White (5000)

12345678

Absolute Maximum Ratings (electrical characteristics at TA=25°C)

Characteristic Symbol Notes Rating Units

Forward Current (Continuous) I

Forward Current (Pulsed) I

Reverse Voltage V

Isolation Voltage V

Operating Temperature T

Storage Temperature T

Per element 40 mA

f

Frequency, f = 1 kHz, pulse width, tw = 100 μs 100 mA

fp

R

Measured from device pins to heatsink, with DC

IS

voltage applied

opr

stg

Operating Characteristics

Characteristic Symbol Conditions Min. Typ. Max. Units

Electrical

Forward Voltage (per LED channel) V

Reverse Current (per LED channel) I

Optical

Luminous Flux (all channels) Φ SEP8Wx 8 LEDs, I

Peak Wavelength λ

Thermal

Thermal Resistance (junction to
exposed thermal pad)

Thermal Resistance (junction to
ambient)

R

R

If = 20 mA, TA = 25˚C 2.6 3.1 3.8 V

f

VR = 5 V – – 10 μA

R

= 20 mA / LED 25 40 – lm

f

If = 20 mA TA = 25°C – 460 – nm

P

SEP8Wx 8 LEDs – 6 – °C/W

θJC

All SEPxWx – 120 – °C/W

θJA

BB

5V

±60 V

–40 to 85 °C

–40 to 90 °C

1000 pieces per reel

All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, T

, of 25°C, unless oth er wise stated.

A

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 [phone]
www.allegromicro.com

2

SEPW Series

Chromaticity and Color Temperature (JIS Z9112-2004) at TA = 25°C, If= 20 mA

Day White WN Yes

Bulb Light WL Yes

Color Symbol JIS Compliant

Multi Chip White LED Modules

x

(±0.01)

0.3616 0.3875

0.3552 0.3476

0.3324 0.3296

0.3326 0.3635

0.4834 0.4382

0.4594 0.3971

0.4153 0.3862

0.4305 0.4218

y

(±0.01)

Color Temperature (Center)

(K)

4600 to 5500

(5000)

2600 to 3250

(2900)

Chromaticity Diagram (Compliance with CIE1931)

0.50

0.45

0.40

Y

0.35

0.30

0.25

0.20

0.20 0.25 0.30 0.35 0.40 0.45 0.50

:1

Planckian Locus

X

:/

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 [phone]
www.allegromicro.com

3

SEPW Series

Short Axis

Long Axis

Module

Top View

–50

Multi Chip White LED Modules

SEPW Series Directivity

TA= 25°C, If = 20 mA

0

–10

–20

–30 30

–40

10

20

Degrees from Normal

40

Common in Long and Short Axes

50

–80

–90

–70

–60

60

70

80

90

050100

Relative Emission Intensity

Emission Color Mixing

Additive white light

Silicone resin
with mixed
fluorescent material

Blue LED

Emission Spectrum (Typical)

TA= 25°C, If = 20 mA

Day White (WN) Bulb Light (WL)

1.2

1.0

0.8

0.6

0.4

0.2

Relative Emission Intensity Factor

0

380 480 580 680 780

Emission Wavelength (nm) Emission Wavelength (nm)

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 [phone]
www.allegromicro.com

1.2

1.0

0.8

0.6

0.4

0.2

Relative Emission Intensity Factor

0

380 480 580 680 780

4