SEPM Series
RGB Multi Chip LED Modules
Features and Benefits
▪ High efficiency, 50 1m/W with all LEDs illuminated;
equivalent to CCFLs
▪ Low thermal resistance, R
= 6°C/W
θJC
▪ High optical output, 25 lm, with all LEDs illuminated
▪ Superior directivity
▪ 5.23 mm × 13.7 mm case footprint, and
low 2.5-mm overall package height
▪ Silver-plated leadframe
▪ LED array of 8 RGB chips
Package:
16-pin, 1.27-mm pitch, surface mount
Description
The SEPM series of LEDs provides a range of high-powered
ALGaInP red (λD = 616 nm), and InGaN green (523 nm)
and blue (461 nm) LEDs that can be used in general lighting
applications, amusement and gaming equipment, and for
backlighting TFT displays. Each module combines 8 LED
chips in 4 separate channels.
Modular design allows the SEPM devices to be easily assembled
into string arrays by simply connecting the modules in series.
The devices also provide superior color balance throughout
the display because of the high density of LEDs that can be
achieved. This also minimizes the distance that power and
control lines must run between LEDs and from the LEDs to
the control electronics.
The white thermoplastic case is an innovative Sanken original
design with exceptional heat dissipation properties. The white
resin compound is especially formulated for superior reflectance
and transmittance of the generated light. Enhanced thermal
dissipation is achieved through the incorporated heatsink on the
bottom of the package. The heatsink can be mated directly to an
external radiator through the PCB for superior heat conduction
allowing dense placement of modules.
The leadframe is plated with silver, providing a highly-reflective
surface for the bottom and sides of the emitting area. The
terminals and heatsink are also silver-plated.
Not to scale
V
B
5 to 20 V
5 V
48101.001, Rev. 2
L1
10 μH
1 μF
36 V
0.1 μF
10 V
D1
SW SW OVP
SEL1
SEL2
SEL3
Allegro
VIN
A8500
LED Driver
IC
EN
PWM
APWM
SKIP
COMP
FSET
ISET
PGND
AGND
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
C
O
2.2 μF/50 V
T ypical Application
8 SEPM modules, 8 LEDs each
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
The SEPM devices can be mounted in tight
arrays on a single PCB substrate for ease of
manufacture and to provide a dense, uniform
appearance when illuminated.
The application shown here uses eight
SEP8Mx LED modules, each populated by
eight LEDs connected in series. Different
combinations of LEDs can be placed in the
modules
SEPM Series
3
5678
Selection Guide
Part Number LEDs
SEP8MA4001 8
Channels
Color Circuit
Red
Green
Blue
2 LEDs in series
4 LEDs, 2 in series
2 LEDs in series
RGB Multi Chip LED Modules
Internal Circuit Diagram
(Pin Numbers Shown)
16 15 14 13 12 11 10 9
GGRRGGBB
Packing
1000 pieces per reel
SEP8MA8001 8
Absolute Maximum Ratings
Characteristic Symbol Notes Rating Units
Forward Current (Continuous) I
Forward Current (Pulsed) I
Reverse Voltage V
Isolation Voltage V
Operating Temperature T
Storage Temperature T
Maximum Allowable Forward Current
versus Duty Cycle
TA = 25°C, tw ≤ 100 μs
120
(mA)
f
100
80
60
40
20
0
0 10 100
Maximum Allowable Forward Current, I
Duty Cycle (on-time), (%) Ambient Temperature, T
12
4
16 15 14 13 12 11 10 9
Red
Green
Blue
2 LEDs in parallel
4 LEDs in parallel
2 LEDs in parallel
GB
1000 pieces per reel
RGGRBG
12345678
Per element 40 mA
f
Frequency, f = 1 kHz, pulse width, tw = 100 μs 100 mA
fp
R
Measured from device pins to heatsink, with DC voltage applied ±60 V
IS
opr
stg
–40 to 85 °C
–40 to 90 °C
Maximum Allowable Forward Current
versus Ambient Temperature
50
(mA)
f
40
30
20
10
0
0 20406080100
Maximum Allowable Forward Current, I
120
Without heatsink
Ambient Temperature, TA (°C)
50
30
R
(°C/W)
QJA
15
(°C)
A
5V
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, T
, of 25°C, unless oth er wise stated.
A
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
2
SEPM Series
Operating Characteristics
Characteristic Symbol Conditions Min. Typ. Max. Units
Electrical
Forward Voltage (per LED channel) V
Reverse Current (per LED channel) I
Optical
Luminous Flux (all channels) Φ
Dominant Wavelength λ
Thermal
Thermal Resistance
RGB Multi Chip LED Modules
Red
SEP8MA4001
Green 5.4 6.4 7.8 V
Each subcircuit: 2 chips in series;
If = 20 mA, TA = 25˚C
Blue 5.2 6.2 7.6 V
f
SEP8MA8001
VR = 5 V – – 10 μA
R
Red
Green 2.7 3.2 3.9 V
Blue 2.6 3.1 3.8 V
Each subcircuit: 1 chip in parallel;
= 20 mA, TA = 25˚C
I
f
Red
I
Green 12.0 17.0 – lm
= 20 mA / LED
f
Blue 1.5 2.2 – lm
Red
Green 518 524 530 nm
D
If = 20 mA TA = 25°C
Blue 455 460 465 nm
R
R
Junction to heat sink – 6 – °C/W
θJC
Junction to ambient – 120 – °C/W
θJA
3.4 4.4 5.4 V
1.7 2.2 2.7 V
3.5 5.0 – lm
615 625 635 nm
Chromaticity
TA= 25°C, If = 20 mA
0.9
0.8
0.7
0.6
0.5
Y
0.4
0.3
0.2
0.1
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0. 151,
0.698
0.699,
0.301
0.146,
0.038
X
R
G
B
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
3
SEPM Series
RGB Multi Chip LED Modules
100
75
50
25
100
75
50
25
0
-80
-90
Long Axis Direction
-70
-40
-50
-60
Relative Intensity (%)
0
-90
100
-80
-70
-60
50
40
-
-
Directivity
TA= 25°C, If = 20 mA, Viewing Angle
100
75
2Q
=124°
1/2
0
-10
-20
-30
2Q
=133° 2Q
1/2
0
-10
-20
-30
40
30
20
10
40
20
10
30
80
90
60
70
50
50
90
80
70
60
50
25
0
-80
-90
100
75
50
25
Relative Intensity (%)
0
-80
-90
100
1,2
= 2θ
1/2
Short Axis Direction
2Q
1/2
-70
-70
-60
-60
-50
-50
-40
-40
-30
-30
-20
-20
-10
1/2
-10
=121°
0
10
=116°
0
10
40
30
60
80
20
50
40
50
20
30
90
70
90
80
70
60
75
50
Blue LEDs Green LEDs Red LEDs
25
0
-80
-90
-70
50
-
-60
Long Axis
Module
Top View
75
2Q
=131° 2Q
1/2
0
-20
-10
10
Short Axis
40
-
-30
50
40
20
30
90
80
70
60
1
50
Blue LEDs Green LEDs Red LEDs
25
0
-70
-40
-50
-60
-80
-90
θ
is the angular displacement from the indicated device
1/2
-30
-20
1/2
-10
=116°
0
10
20
40
50
30
70
60
90
80
axis to 50% of peak intensity, on one side of that axis.
2
Viewing Angle, 2θ
– θ
and θ
1/2
for the indicated axis.
1/2
, is the included angle between
1/2
Relative Luminescence Spectrum
Blue at 100%, TA= 25°C, If = 20 mA
100
80
60
40
20
0
380 430 480 530 580 630 680 730 780
Relative Luminescence (%)
Blue
Red
Green
Emission Frequency (nm)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
4
SEPM Series
RGB Multi Chip LED Modules
Forward Current versus Forward Voltage
2 LEDs in Series
Red LEDs
100
(mA)
f
I
10
3.0 4.0 5.0 6.0
Vf (V)
Red LEDs
2 LEDs in Series
20
18
16
14
12
10
8
& (lm)
6
4
2
0
0 102030405060
If (mA)
Green LEDs Blue LEDs
100
(mA)
f
I
10
12.0 13.0 14.0 15.0 16.0
(mA)
I
Vf (V)
Luminous Flux versus Forward Current
Green LEDs
4 LEDs in Series
60.0
50.0
40.0
30.0
& (lm)
20.0
10.0
0.0
0 102030405060
If (mA)
10.0
& (lm)
100
f
10
5.0 6.0 7.0 8.0
Vf (V)
Blue LEDs
2 LEDs in Series
8.0
6.0
4.0
2.0
0.0
0 102030405060
If (mA)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
5
SEPM Series
RGB Multi Chip LED Modules
Dominant Wavelength verses Forward Current
TA = 25°C
Red LEDs
634
632
630
628
626
624
622
(nm)
D
620
L
618
616
614
612
610
10 100 10 100 10 100
If (mA)
(nm)
D
L
534
532
530
528
526
524
522
520
518
516
514
512
510
Green LEDs Blue LEDs
474
472
470
468
466
464
462
(nm)
D
460
L
458
456
454
452
450
If (mA)
If (mA)
Chromaticity verses Forward Current
Red LEDs Green LEDs Blue LEDs
0.310
0.308
0.306
Y
0.304
0.302
0.300
0.688 0.690 0.692 0.694 0.696 0.698
10 mA
50 mA
X
0.74
0.72
0.70
Y
0.68
0.66
0.64
50 mA
0.10 0.12 0.14 0.16 0.18 0.20 0.22
10 mA
X
0.044
0.042
0.040
0.038
Y
0.036
0.034
0.032
0.030
0.140 0.142 0.144 0.146 0.148 0.150
10 mA
50 mA
X
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
6
SEPM Series
RGB Multi Chip LED Modules
Dominant Wavelength verses Case Temperature
TA = 25°C, If = 20 mA
Red LEDs
630
628
626
624
622
620
(nm)
618
D
616
λ
614
612
610
25 35 45 55 65 75 85 95
Red LEDs
5..00
4..50
4..00
(V)
f
V
3..50
3..00
25 35 45 55 65 75 85 95
Green LEDs Blue LEDs
530
528
526
(nm)
524
D
λ
522
520
25 35 45 55 65 75 85 95
Case Temperature, TC (°C) Case Temperature, TC (°C)Case Temperature, TC (°C)
465
463
461
(nm)
459
D
λ
457
455
Forward Voltage versus Case Temperature
2 LEDs in Series, If = 20 mA
Green LEDs Blue LEDs
7.5
7.0
6.5
(V)
f
6.0
V
5.5
5.0
25 35 45 55 65 75 85 95
Case Temperature, TC (°C) Case Temperature, TC (°C)Case Temperature, TC (°C)
7.0
6.8
6.6
6.4
6.2
6.0
(V)
f
5.8
V
5.6
5.4
5.2
5.0
25 35 45 55 65 75 85 95
25 35 45 55 65 75 85 95
Red LEDs Green LEDs Blue LEDs
100
90
80
70
60
50
40
30
20
10
Relative Intensity (%)
0
25 35 45 55 65 75 85 95
Luminous Flux versus Case Temperature
100
90
80
70
60
50
40
30
20
10
Relative Intensity (%)
0
25 35 45 55 65 75 85 95
Case Temperature, TC (°C) Case Temperature, TC (°C)Case Temperature, TC (°C)
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
100
Relative Intensity (%)
90
80
70
60
50
40
30
20
10
0
25 35 45 55 65 75 85 95
7
SEPM Series
Schematics are shown for the SEP8MA8001; with all parallel circuits, this device
supports the greatest variety of possible circuit configurations.
End-to-end layout
RGB Multi Chip LED Modules
T ypical Applications Diagrams
Side-by-side layout
G1+
B+
R+
G2+
G1+
B+
R+
G2+
G1
B–
R–
G2
G1
B–
R–
G2
Matrix layout
G1+
B+
R+
G2+
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
G1
B–
R–
G2
8
SEPM Series
RGB Multi Chip LED Modules
Package Outline Drawing
0° to 5°
LED element
Au wires
to LEDs
Section A-A
Terminal
Heatsink
Resin
case
Sealing Resin
(Transparent)
Section B-B
Heatsink
Resin
case
4X
R0.5
5.23
Pin #1
Indicator
4.23
0. 3
1. 35 0. 8
0. 10
16
1
1. 25
A
A
0. 40
P 1. 27 × 7 = 8. 89
13. 7
13. 3
B
9
8
B
0. 25
)
0.80
(
1. 5
0.3
0. 1
(1. 6)
1. 25
( 8. 43)
4XR1.8
2. 5
Terminal core material: Cu
Terminal treatment: Ag plating
Heatsink core material: Cu
Heatsink treatment: Ag plating
Dimensions in millimeters
Device is lead (Pb) free.
11. 4
Package labeling codes (exact appearance at manufacturer discretion):
1st line, type: SEP[A][BB][C][D][EE]
Where: A is the quantity of LEDs in the module
BB is the color combination code
C is the number of channels
D is the package code, and
EE is the device subtype code
2nd line, lot: YMDD
Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
DD is the date
3rd line, quantity of units in the container
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
2.4
9
SEPM Series
RGB Multi Chip LED Modules
Solder Pad Layout
Pin Number
7. 505
Pin #1 Indicator
16 914 1315 1112 10
0. 8
1. 475
0. 470. 8
3.575
0.635
3.415 3.415
Recommended Solder
Pad Pattern (16 pads)
Pin Number
3712 456 8
In case the device is installed to external radiator, please coat heatsink area with thermal conduction material
such as thermal conductive bond or thermal conductive grease.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
10
SEPM Series
RGB Multi Chip LED Modules
Embossed Tape and Reel Specifi cation
Taping reel dimensions (1/4)
Embossed taping outline dimensions (1/1)
330±2
8
.
0
±
0
.
1
2
φ
φ13.0±0.2
Label
29.4±1.0
25.4±1.0
100±1
Pull direction
No LEDsLEDs mounting partNo LEDs
Top cover tape
Reel Lead Min. 160 mm
Detailed drawing (1/1)
Anode mark
Tolerance ±0.2
P4.0
Embossed carrie r tape
φ1.5
2.0
φ1.5P12.0
1000 pcs/reel
0.34
1.75
11.5
14.5
3.7
9.2
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Accmulative tol erance per 10 pitches shall be ±0.2 mm.
Adhesion streng th shall be 0.1-0. 7 N when the c over tape and
the carrier ta pe are torn o at the angle of 10 deg rees.
24.0
P/N, manufacturing date code number and quantitiy shall be indicated on
moist-proof package.
Reel Lead (No LEDs) Min. 320 mm
Reel Lead Min. 400 mm
11
SEPM Series
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Pre cau tions must be
that embody these components must conform with applicable safety requirements. Pre cau tions must be
taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.
taken to prevent accidental contact with power-line potentials. Do not connect ground ed test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
The use of an isolation transformer is recommended during circuit development and breadboarding.
This product series emits high light output. Do NOT look directly into the light emitting area. Direct
This product series emits high light output. Do NOT look directly into the light emitting area. Direct
exposure to the light over an extended time period may harm eyes.
exposure to the light over an extended time period may harm eyes.
RGB Multi Chip LED Modules
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following:
Cautions for Storage
• Ensure that storage conditions are within 5°C to 40°C and relative
humidity < 30%; avoid storage locations that experience extreme
changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
• Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Precautions During Use
• Because the light generated inside the LED must be emitted
efficiently out of the module, a resin with high light transmittance
is used. Therefore, additives that are commonly used in
semiconductor devices to improve the heat resistance or moisture
resistance (such as silica glass) cannot be added to the resin.
Consequently, the ability of the resin to withstand heat is usually
low and the following precautions must be observed.
• Never apply an external force, stress, or excess vibration to resin
or terminals when at high temperature.
• Take particular care about heat dissipation when designing the
application. If dissipation is not adequate, the LEDs can reach
high temperatures, with resulting color change, luminous flux
reduction, and shortening of product lifetime.
• When the device is connected to an external radiator, please
coat the heatsink area with thermal conduction material such as
thermal conductive bond or thermal conductive grease.
• Extra attention should be paid to the sealing resin of the product,
which is rubber-like silicon resin. The surface of sealing resin is
slightly sticky (surface tack). Therefore, touching the emitting area
or exposing it to unclean conditions may cause dust or smudges
to adhere to it and possibly penetrate the resin. This could
cause deterioration of product characteristics when contacted by
materials such as epoxy resin.
• The silver plating of the leadframe may discolor if the product
comes into contact with material containing sulfides or if it is
exposed to an atmosphere containing sulfide gas.
• The emitting area of the LEDs contains fine gold wires. Touching
this area without care may add excess stress on the internal gold
wires and may result in disconnection of the internal wires.
Soldering
• The product is in a surface mount package. The product should
not be mounted on warped direction of the PCB.
• When the product is mounted by means of solder reflow and the
resin is unusually damp, solder dipping may cause interfacial
defoliation. This occurs when a drastic temperature change
causes moisture in the resin to evaporate and to swell. Therefore,
attention must be paid to the following:
• Examine the moisture-resistant packing before opening. If
the indicator color (blue) of the desiccant (such as silica gel)
has disappeared, the product must be prebaked as described
below.
• After the product packing is opened and staged for assembly,
soldering should be carried out as soon as practicable.
• During handling, ambient conditions should be 5°C to 30°C,
with relative humidity < 70%
• After 120 hours of exposure, prebake is recommended
before soldering; bake-out at 60±5°C for more than 10 hours
• After soldering, no mechanical force or excessive vibration should
be applied to the product until the product has cooled down to
normal room temperature. Quick cooling must be avoided.
• When soldering the products, please be sure to minimize the
working time, within the following limits:
Soldering Iron Temperature
(°C)
Time
(s)
350±10 3 (once only)
• Reflow soldering can be performed a maximum of 2 times, with
preheat conditions of 150°C to 180°C (at the device surface)
for 60 to 120 s, and soldering conditions less than 40 s at more
than 220°C, with a peak temperature less than 260°C, using the
following recommended profile:
Reflow Soldering Profile
300
260
220
180
140
100
60
20
Temperature of Device Package Surface (°C)
0 50 100 150 200 250 300
Peak 260°C Max
Pre-heat
60 to 120 sec
Soldering Time (s)
40 sec
Max
Between the first and second reflow sessions, follow the
guidelines in the Cautions for Storage section, above.
Electrostatic Discharge
• When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
12
SEPM Series
RGB Multi Chip LED Modules
resistance to ground to prevent shock hazard.
• Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the
equipment should be grounded.
• When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
• The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
Power Supply
Bypass
Capacitor
0.1 μF
R
10 kΩ
Protective Circuit
Reference Circuit Using Capacitor Reference Circuit Using Zener Diode
C
>0.01 μF
Resistor
aluminum foil.
• Exposure to any overvoltage exceeding the Absolute Maximum
Rating of the products may cause damage to, or possibly result in
destruction of, the products. Buyer shall take absolutely secured
countermeasures against static electricity and surge when
handling the products.
• Typical anti-static and anti-surge reference circuits are shown
below. The circuits shown are for reference only, and the buyer
must make a sufficient experimental verification of the static and
surge levels when employing the product.
Resistor
1X per LED
ZD
VR 7 to 8 V
Protective Circuit
Application and operation examples described in this document are quoted for the sole purpose of reference only, for the use of the products
herein, and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights
of Sanken or any third party which may result from its use.
When using the products herein, the applicability and suitability of such products for an intended purpose or object shall be reviewed at the
user’s responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design
of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment measuring equipment, etc.). Before placing an order, the user’s written
consent to the specifications is requested.
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control
systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken
sales representative to discuss and obtain written confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace
equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
Anti radioactive ray design is not considered for the products listed herein.
If there is any discrepancy between English and Japanese versions of this datasheet, the Japanese version should take precedence over the
English one.
Please accept in advance that the content of this datasheet is subject to change without notice for the purpose of such as improvement of the
product.
Copyright © 2007-2008 Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
13
SEPM Series
Asia-Pacific
RGB Multi Chip LED Modules
Worldwide Contacts
China
Sanken Electric Hong Kong Co., Ltd.
Suite 1026, Ocean Centre, Canton Road
Tsimshatsui, Kowloon, Hong Kong
Tel: 852-2735-5262, Fax: 852-2735-5494
Sanken Electric (Shanghai) Co., Ltd.
Room 3202, Maxdo Centre, Xingyi Road 8
Changning District, Shanghai, China
Tel: 86-21-5208-1177, Fax: 86-21-5208-1757
Taiwan Sanken Electric Co., Ltd.
Room 1801, 18th Floor, 88 Jung Shiau East Road
Sec. 2, Taipei 100, Taiwan R.O.C.
Tel: 886-2-2356-8161, Fax: 886-2-2356-8261
India
Saket Devices Pvt. Ltd.
Office No. 13, First Floor, Bandal-Dhankude Plaza
Near PMT Depot, Paud Road
Kothrud, Pune 411 038, India
Tel: 91-20-5621-2340, 91-20-2528-5449
Fax: 91-20-2528-5459
Japan
Sanken Electric Co., Ltd.
Overseas Sales Headquarters
Metropolitan Plaza Building, 1-11-1 Nishi-Ikebukuro
Toshima-ku, Tokyo 171-0021, Japan
Tel: 81-3-3986-6164, Fax: 81-3-3986-8637
Korea
Sanken Electric Korea Co., Ltd.
Mirae Asset Life Building, 6F
168 Kongduk-dong, Mapo-ku
Seoul 121-705, Korea
Tel: 82-2-714-3700, Fax: 82-2-3272-2145
Singapore
Sanken Electric Singapore Pte. Ltd.
150 Beach Road, #14-03 The Gateway West
Singapore 189720
Tel: 65-6291-4755, Fax: 65-6297-1744
Europe
Sanken Power Systems (UK) Limited
Pencoed Technology Park
Pencoed, Bridgend CF35 5HY, United Kingdom
Tel: 44-1656-869-100, Fax: 44-1656-869-162
North America
United States
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01606, U.S.A.
Tel: 1-508-853-5000, Fax: 1-508-853-7895
Allegro MicroSystems, Inc.
14 Hughes Street, Suite B105
Irvine, California 92618, U.S.A.
Tel: 1-949-460-2003, Fax: 1-949-460-7837
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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