▪ High efficiency, 50 1m/W with all LEDs illuminated;
equivalent to CCFLs
▪ Low thermal resistance, R
= 6°C/W
θJC
▪ High optical output, 25 lm, with all LEDs illuminated
▪ Superior directivity
▪ 5.23 mm × 13.7 mm case footprint, and
low 2.5-mm overall package height
▪ Silver-plated leadframe
▪ LED array of 8 RGB chips
Package:
16-pin, 1.27-mm pitch, surface mount
Description
The SEPM series of LEDs provides a range of high-powered
ALGaInP red (λD = 616 nm), and InGaN green (523 nm)
and blue (461 nm) LEDs that can be used in general lighting
applications, amusement and gaming equipment, and for
backlighting TFT displays. Each module combines 8 LED
chips in 4 separate channels.
Modular design allows the SEPM devices to be easily assembled
into string arrays by simply connecting the modules in series.
The devices also provide superior color balance throughout
the display because of the high density of LEDs that can be
achieved. This also minimizes the distance that power and
control lines must run between LEDs and from the LEDs to
the control electronics.
The white thermoplastic case is an innovative Sanken original
design with exceptional heat dissipation properties. The white
resin compound is especially formulated for superior reflectance
and transmittance of the generated light. Enhanced thermal
dissipation is achieved through the incorporated heatsink on the
bottom of the package. The heatsink can be mated directly to an
external radiator through the PCB for superior heat conduction
allowing dense placement of modules.
The leadframe is plated with silver, providing a highly-reflective
surface for the bottom and sides of the emitting area. The
terminals and heatsink are also silver-plated.
Not to scale
V
B
5 to 20 V
5 V
48101.001, Rev. 2
L1
10 μH
1 μF
36 V
0.1 μF
10 V
D1
SW SW OVP
SEL1
SEL2
SEL3
Allegro
VIN
A8500
LED Driver
IC
EN
PWM
APWM
SKIP
COMP
FSET
ISET
PGND
AGND
LED1
LED2
LED3
LED4
LED5
LED6
LED7
LED8
C
O
2.2 μF/50 V
T ypical Application
8 SEPM modules, 8 LEDs each
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
SEP8Mx
The SEPM devices can be mounted in tight
arrays on a single PCB substrate for ease of
manufacture and to provide a dense, uniform
appearance when illuminated.
The application shown here uses eight
SEP8Mx LED modules, each populated by
eight LEDs connected in series. Different
combinations of LEDs can be placed in the
modules
Measured from device pins to heatsink, with DC voltage applied±60V
IS
opr
stg
–40 to 85°C
–40 to 90°C
Maximum Allowable Forward Current
versus Ambient Temperature
50
(mA)
f
40
30
20
10
0
0 20406080100
Maximum Allowable Forward Current, I
120
Without heatsink
Ambient Temperature, TA (°C)
50
30
R
(°C/W)
QJA
15
(°C)
A
5V
All performance characteristics given are typical values for circuit or
system baseline design only and are at the nominal operating voltage and
an ambient temperature, T