Speed and Direction Sensor with Vibration Immunity
Package SH
ATS651LSH
Two-Wire Self-Calibrating Differential
The ATS651LSH is a mechatronics component with an integrated Hall-effect sensor and magnet, providing an easy-to-use solution for speed and direction sensing
applications. The solid thermoset molded plastic package contains a samarium
cobalt magnet and a Hall-effect IC optimized to the magnetic circuit. This sensor
module has been designed specifically for high reliability in the harsh automotive
environment.
The IC employs patented algorithms for the special operational requirements of
transmission applications. This two-wire device communicates the speed and
direction of a ferrous target via a pulse width modulation (PWM) output protocol.
The ATS651LSH is particularly adept at handling vibration without sacrificing
maximum air gap capability or creating an erroneous “direction” pulse. Even the
higher angular vibration caused by engine cranking is completely rejected by
the device. The advanced vibration detection algorithm systematically calibrates
the sensor on the true rotation signals from the first three and a half teeth, not on
vibration, thus always guaranteeing an accurate signal in running mode.
1
2
3
4
1. VCC
2. Test pin, Channel 1
3. Test pin, Channel 2
4. GND
AB SO LUTE MAX I MUM RAT INGS
Supply Voltage*, V
Reverse-Supply Voltage, V
Reverse-Output Voltage, V
Temperatures
Operating Ambient, T
Junction, T
Storage, T
*Refer to Power Derating section
.........................................28 V
CC
.......................................165ºC
J(MAX)
................................. –65ºC to 170ºC
S
........................ –18 V
RCC
....................–50 mA
ROUT
................. –40ºC to 150ºC
A
Patented running mode algorithms also protect against air gap changes, whether
or not the target is in motion. Direction information is always available on the first
magnetic edge after a direction change. Advanced signal processing and innovative algorithms make the ATS651LSH an ideal solution for a wide range of speed
and direction sensing needs.
The device package is lead (Pb) free, with 100% matte tin plated leadframe.
Features and Benefits
• Rotational direction detection
• Fully optimized digital differential gear-tooth sensor
• Single-chip sensing IC for high reliability
• Small mechanical size (8 mm diameter × 5.5 mm vertical, flat-to-flat)
• Internal current regulator for 2-wire operation
• Automatic Gain Control (AGC) and reference adjust circuit
• 3-bit factory trimmed for tight pulse width accuracy
• True zero-speed operation
• Wide operating voltage range
• Undervoltage lockout
• Defined power-on state
• ESD and reverse polarity protection
Use the following complete part numbers when ordering:
Operating Signal RangeSigWithin specification30–1200G
*
Operational Air Gap Range is dependent on the available differential magnetic field. The available field is dependent on target geometry and material,
and should be independently characterized. The field available from the Reference Target is given in the Reference Target Parameters section of this
datasheet.
Two-Wire Self-Calibrating Differential Speed and Direction Sensor with Vibration Immunity
Applications Information
Data Protocol Description
Rotation Right. Referring to figure 1, a ferrous target passes in
front of the sensor (not shown) in the direction indicated. Each
tooth of the target generates a pulse from the sensor. Each pulse
provides speed and direction data. Speed is provided by the
pulse rate, while direction is obtained by measuring the width
45 μs45 μs45 μs45 μs
of the pulses. A 45 μs pulse indicates rotation in the clockwise
direction.
Rotation Left. Referring to figure 2, when the target changes
direction, the sensor outputs a current pulse of or 90 μs, twice
as long as the Rotation Right pulse width. The maximum speed
is limited by the width of the pulse and the shortest Low-State
Duration the controller can resolve.
651LSH-DS
Figure 1. Target rotation to the right (CW) relative to the sensor gives forward speed.
90 μs90 μs90 μs90 μs
Figure 2. Target rotation to the left (CCW) relative to the sensor gives reverse speed.
Two-Wire Self-Calibrating Differential Speed and Direction Sensor with Vibration Immunity
Power Derating
The device must be operated below the maximum junction
temperature of the device, T
. Under certain combinations of
J(max)
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
, is a figure of merit sum-
θJA
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, R
relatively small component of R
. Ambient air temperature,
θJA
θJC
, is
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
P
= VIN × I
D
ΔT = PD × R
IN
(2)
θJA
(1)
Example: Reliability for V
at TA = 150°C, package SH, using
CC
the PCB with least exposed copper.
Observe the worst-case ratings for the device, specifically:
R
126°C/W, T
θJA =
I
CC(max) =
16.8 mA.
Calculate the maximum allowable power level, P
J(max) =
165°C, V
CC(max) = 28
V, and
D(max)
. First,
invert equation 3:
ΔT
This provides the allowable increase to T
max
= T
– TA = 165 °C – 150 °C = 15 °C
J(max)
resulting from internal
J
power dissipation. Then, invert equation 2:
P
D(max)
= ΔT
max
÷ R
= 15°C ÷ 126 °C/W = 119 mW
θJA
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D(max)
÷ I
= 119 mW ÷ 16.8 mA = 7.1 V
CC(max)
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤V
CC(est)
.
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
V
= 5 V, I
CC
PD = VCC × I
ΔT = P
= TA + ΔT = 25°C + 8.8°C = 23.8°C
T
J
A worst-case estimate, P
able power level (V
at a selected R
= 14 mA, and R
CC
= 12 V × 4.0 mA = 70.0 mW
CC
× R
D
= 70.0 mW × 126 °C/W = 8.8°C
θJA
CC(max)
and TA.
θJA
= 126 °C/W, then:
θJA
, represents the maximum allow-
D(max)
, I
), without exceeding T
CC(max)
J(max)
Compare V
able operation between V
R
. If V
θJA
V
is reliable under these conditions.
CC(max)
CC(est)
CC(est)
to V
≥ V
. If V
CC(max)
CC(est)
CC(max)
CC(est)
and V
CC(max)
, then operation between V
≤ V
CC(max)
requires enhanced
This value applies only to the voltage drop across the
ATS651LSH chip. If a protective series diode or resistor is used,
the effective maximum supply voltage is increased.
For example, when a standard diode with a 0.7 V drop is used:
Two-Wire Self-Calibrating Differential Speed and Direction Sensor with Vibration Immunity
Package SH, 4-pin SIP
5.5 .217
1.50 .0591
5.8 .228
E
E
0.23 .009
E
1.50 .0591
2.9 .114
C
B
8.0 .315
E
4.0 .157
5.0 .244
20.95 .825
13.05 .514
Preliminary dimensions, for reference only
Untoleranced dimensions are nominal.
Dimensions in millimeters
U.S. Customary dimensions (in.) in brackets, for reference only
Dimensions exclusive of mold flash, burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
0.6
1.7 .067
.024
A
1
243
1 .039
A
A
B
C
D
E
0.6 .024
1.27 .050
Dambar removal protrusion (16X)
Metallic protrusion, electrically connected to pin 4 and substrate (both sides)
Active Area Depth, 0.43 [.017]
Thermoplastic Molded Lead Bar for alignment during shipment
Hall elements (3X); controlling dimension inches
0.38 .015
1.08 .043
D
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to permit
improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro products are not authorized for use as critical components in life-support devices or sys tems without express written approval.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.