A1 101, A1 102, A1 103, A1 104, and A1 106
Continuous-T ime Switch Family
Features and Benefits
▪ Continuous-time operation
▫ Fast power-on time
▫ Low noise
▪ Stable operation over full operating temperature range
▪ Reverse battery protection
▪ Solid-state reliability
▪ Factory-programmed at end-of-line for optimum
performance
▪ Robust EMC performance
▪ High ESD rating
▪ Regulator stability without a bypass capacitor
Packages: 3 pin SOT23W (suffix LH), and
3 pin SIP (suffix UA)
Description
The Allegro® A1101-A1104 and A1106 Hall-effect switches
are next generation replacements for the popular Allegro
312x and 314x lines of unipolar switches. The A110x family,
produced with BiCMOS technology, consists of devices that
feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and lowoffset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A1101-A1104 and A1106 Hall-effect switches include
the following on a single silicon chip: voltage regulator,
Hall-voltage generator, small-signal amplifier, Schmitt
trigger, and NMOS output transistor. The integrated voltage
regulator permits operation from 3.8 to 24 V. The extensive
on-board protection circuitry makes possible a ±30 V absolute
maximum voltage rating for superior protection in automotive
and industrial motor commutation applications, without adding
Not to scale
VCC
Continued on the next page…
Functional Block Diagram
Regulator
To all subcircuits
Amp
Control
OffsetGain
Trim
VOUT
GND
A1101-DS, Rev. 4
A1101, A1102, A1 103,
A1104, and A1106
Description (continued)
external components. All devices in the family are identical except
for magnetic switchpoint levels.
The small geometries of the BiCMOS process allow these devices
to be provided in ultrasmall packages. The package styles available
Selection Guide
Part Number Packing
A1101ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1101EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1101LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1101LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1102ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1102EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1102LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1102LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1103ELHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1103EUA-T
A1103LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1103LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1104ELHLT-T27-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1104EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1104LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1104LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1106ELHLT-T
A1106EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
A1106LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
A1106LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole
2
Contact Allegro for additional packing options.
2
Variant is in production but has been determined to be NOT FOR NEW DESIGN. This classification indicates that sale of the variant is currently
restricted to existing customer applications. The variant should not be purchased for new design applications because obsolescence in the near future
is probable. Samples are no longer available. Status change: November 1, 2008.
2
Bulk, 500 pieces/bag 3-pin SIP through hole
2
7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount
1
Mounting Ambient, T
Continuous-T ime Switch Family
provide magnetically optimized solutions for most applications.
Package LH is an SOT23W, a miniature low-profile surface-mount
package, while package UA is a three-lead ultramini SIP for throughhole mounting. Each package is lead (Pb) free, with 100% matte
tin plated leadframes.
A
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
–40ºC to 85ºC
–40ºC to 150ºC
BRP (Min) BOP (Max)
10 175
60 245
150 355
25 450
160 430
Absolute Maximum Ratings
Characteristic Symbol Notes Rating Units
Supply Voltage V
Reverse Supply Voltage V
Output Off Voltage V
Reverse Output Voltage V
Output Current I
Magnetic Flux Density B Unlimited G
Operating Ambient Temperature T
Maximum Junction Temperature TJ(max) 165 ºC
Storage Temperature T
CC
RCC
OUT
ROUT
OUTSINK
A
stg
Range E –40 to 85 ºC
Range L –40 to 150 ºC
30 V
–30 V
30 V
–0.5 V
25 mA
–65 to 170 ºC
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A1101, A1102, A1 103,
A1104, and A1106
ELECTRICAL OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Supply Voltage
1
Output Leakage Current I
Output On Voltage V
Power-On Time
Output Rise Time
Output Fall Time
2
3
3
Supply Current
Reverse Battery Current I
Supply Zener Clamp Voltage V
Supply Zener Current
1
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2
For VCC slew rates greater than 250 V/s, and TA = 150°C, the Power-On Time can reach its maximum value.
3
CS =oscilloscope probe capacitance.
4
Maximum current limit is equal to the maximum I
4
V
CC
OUTOFF
OUT(SAT)IOUT
t
PO
t
r
t
f
I
CCON
I
CCOFF
RCC
Z
I
Z
Operating, TJ < 165°C 3.8 – 24 V
V
OUT
Slew rate (dVCC/dt) < 2.5 V/s, B > BOP + 5 G or
B < BRP – 5 G
VCC = 12 V, R
VCC = 12 V, R
B > B
B < B
V
RCC
ICC = 10.5 mA; TA = 25°C 32 – – V
VZ = 32 V; TA = 25°C – – 10.5 mA
CC(max)
= 24 V, B < B
= 20 mA, B > B
OP
RP
= –30 V – – –10 mA
+ 3 mA.
Continuous-T ime Switch Family
RP
OP
= 820 , CS = 12 pF – – 400 ns
LOAD
= 820 , CS = 12 pF – – 400 ns
LOAD
––10A
– 215 400 mV
––4s
– 4.1 7.5 mA
– 3.8 7.5 mA
DEVICE QUALIFICATION PROGRAM
Contact Allegro for information.
EMC (Electromagnetic Compatibility) REQUIREMENTS
Contact Allegro for information.
Package LH
GND
3
VCC
Terminal List
Name Description
VCC Connects power supply to chip 1 1
VOUT Output from circuit 2 3
GND Ground 3 2
VOUT
Package UA, 3-pin SIP
2
VCC
GND
Number
Package LH Package UA
VOUT
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
A1101, A1102, A1 103,
A1104, and A1106
Continuous-T ime Switch Family
MAGNETIC OPERATING CHARACTERISTICS
1
over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic Symbol Test Conditions Min. Typ. Max. Units
A1101
A1102
Operate Point B
Release Point B
Hysteresis B
1
Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated
by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but
opposite polarity).
OP
RP
HYS
A1103
A1104
A1106
A1101
A1102
A1103
A1104
A1106
A1101
A1102
A1103
A1104
A1106
TA = 25°C 50 100 160 G
Operating Temperature Range 30 100 175 G
= 25°C 130 180 230 G
T
A
Operating Temperature Range 115 180 245 G
TA = 25°C 220 280 340 G
Operating Temperature Range 205 280 355 G
TA = 25°C 70 – 350 G
Operating Temperature Range 35 – 450 G
TA = 25°C 280 340 400 G
Operating Temperature Range 260 340 430 G
TA = 25°C 10 45 130 G
Operating Temperature Range 10 45 145 G
TA = 25°C 75 125 175 G
Operating Temperature Range 60 125 190 G
TA = 25°C 165 225 285 G
Operating Temperature Range 150 225 300 G
TA = 25°C 50 – 330 G
Operating Temperature Range 25 – 430 G
TA = 25°C 180 240 300 G
Operating Temperature Range 160 240 330 G
TA = 25°C 20 55 80 G
Operating Temperature Range 20 55 80 G
TA = 25°C 30 55 80 G
Operating Temperature Range 30 55 80 G
TA = 25°C 30 55 80 G
Operating Temperature Range 30 55 80 G
TA = 25°C 20 55 – G
Operating Temperature Range 20 55 – G
TA = 25°C 70 105 140 G
Operating Temperature Range 70 105 140 G
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
A1101, A1102, A1 103,
A1104, and A1106
Characteristic Symbol Test Conditions Value Units
Package Thermal Resistance
Continuous-T ime Switch Family
Package LH, 1-layer PCB with copper limited to solder pads 228 ºC/W
R
θJA
25
24
23
22
21
(V)
20
CC
19
18
17
16
15
14
13
12
11
10
9
Maximum Allowable V
8
7
6
5
4
3
2
20 40 60 80 100 120 140 160 180
Package LH, 2-layer PCB with 0.463 in.
side connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads 165 ºC/W
Power Derating Curve
T
= 165ºC; I
J(max)
Package LH, 2-layer PCB
= 110 ºC/W)
(R
QJA
Package UA, 1-layer PCB
= 165 ºC/W)
(R
QJA
Package LH, 1-layer PCB
= 228 ºC/W)
(R
QJA
CC
= I
CC(max)
2
of copper area each
V
CC(max)
V
CC(min)
110 ºC/W
1900
1800
1700
1600
1500
1400
1300
1200
(mW)
1100
D
1000
900
800
700
600
500
400
Power Dissipation, P
300
200
100
0
Power Dissipation versus Ambient Temperature
Package LH, 2-layer PCB
(R
QJA
= 110 ºC/W)
Package UA, 1-layer PCB
(R
QJA
= 165 ºC/W)
Package LH, 1-layer PCB
(R
QJA
= 228 ºC/W)
20 40 60 80 100 120 140 160 180
Temperature (°C)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
A1101, A1102, A1 103,
A1104, and A1106
Continuous-T ime Switch Family
Characteristic Data
Supply Current (On) versus Ambient Temperature
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
(mA)
4.0
CCON
I
3.0
2.0
1.0
0
–50 0 50 100 150
TA (°C)
Supply Current (Off) versus Ambient Temperature
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
(mA)
4.0
CCOFF
I
3.0
2.0
1.0
0
–50 0 50 100 150
TA (°C)
VCC (V)
24
3.8
VCC (V)
24
3.8
Supply Current (On) versus Supply Voltage
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
(mA)
4.0
CCON
I
3.0
2.0
1.0
0
0 5 10 15 20 25
VCC (V)
TA (°C)
–40
25
150
Supply Current (Off) versus Supply Voltage
(A1101/02/03/04/06)
8.0
7.0
6.0
5.0
(mA)
4.0
CCOFF
3.0
I
2.0
1.0
0
0 5 10 15 20 25
VCC (V)
TA (°C)
–40
25
150
Output Voltage (On) versus Ambient Temperature
400
350
300
250
(mV)
200
150
OUT(SAT)
V
100
50
0
–50 0 50 100 150
(A1101/02/03/04/06)
TA (°C)
VCC (V)
24
3.8
Output Voltage (On) versus Supply Voltage
400
350
300
250
(mV)
200
150
OUT(SAT)
V
100
50
0
0 5 10 15 20 25
(A1101/02/03/04/06)
VCC (V)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
TA (°C)
–40
25
150
6
A1101, A1102, A1 103,
A1104, and A1106
Functional Description
OPERATION
The output of these devices switches low (turns on) when a
magnetic field (south polarity) perpendicular to the Hall sensor exceeds the operate point threshold, BOP. After turn-on, the
output is capable of sinking 25 mA and the output voltage is
V
OUT(SAT)
point, B
ence in the magnetic operate and release points is the hysteresis,
B
hys
ing of the output, even in the presence of external mechanical
vibration and electrical noise.
Powering-on the device in the hysteresis region, less than BOP and
higher than BRP, allows an indeterminate output state. The correct
state is attained after the first excursion beyond BOP or BRP.
CONTINUOUS-TIME BENEFITS
Continuous-time devices, such as the A110x family, offer the
fastest available power-on settling time and frequency response.
Due to offsets generated during the IC packaging process,
continuous-time devices typically require programming after
. When the magnetic field is reduced below the release
, the device output goes high (turns off). The differ-
RP
, of the device. This built-in hysteresis allows clean switch-
Continuous-T ime Switch Family
packaging to tighten magnetic parameter distributions. In contrast, chopper-stabilized switches employ an offset cancellation
technique on the chip that eliminates these offsets without the
need for after-packaging programming. The tradeoff is a longer
settling time and reduced frequency response as a result of the
chopper-stabilization offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery management is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they
are the clear choice for such applications.
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensor Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
(A) (B)
V
V+
Switch to Low
OUT
V
Switch to High
0
B–
0
B
Figure 1. Switching Behavior of Unipolar Switches. On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field
strength, and the B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can
be exhibited when using a circuit such as that shown in Panel B.
RP
B
HYS
B
OP
V
V
B+
CC
OUT(SAT)
S
VCC
A110x
VOUT
GND
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
R
L
Sensor Output
7
A1101, A1102, A1 103,
A1104, and A1106
ADDITIONAL APPLICA TIONS INFORMA TION
Extensive applications information for Hall-effect sensors is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead
Welding and Lead Forming, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and Through-
Hole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
Continuous-T ime Switch Family
1
V
CC
V
OUT
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, t
The case shown is where the correct output state is HIGH . Position 3, t
valid, a control unit reads the output. Position 5, power is removed from the device.
2
3
t
PO(max)
PO(max)
Output Sampled
has elapsed. The device output is valid. Position 4, after the output is
5 4
t
t
.
PO(max)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
A1101, A1102, A1103,
A1104, and A1106
Power Derating
Power Derating
The device must be operated below the maximum junction
temperature of the device, T
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, R
relatively small component of R
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × I
T = PD × R
. Under certain combinations of
J(max)
, is a figure of merit sum-
JA
. Ambient air temperature,
JA
IN
JA
(2)
(1)
JC
, is
Continuous-T ime Switch Family
Example: Reliability for V
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
R
165°C/W, T
JA =
I
CC(max) =
7.5 mA.
J(max) =
Calculate the maximum allowable power level, P
invert equation 3:
T
max
= T
– TA = 165 °C – 150 °C = 15 °C
J(max)
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
P
D(max)
= T
max
÷ R
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D(max)
÷ I
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤V
Compare V
CC(est)
to V
able operation between V
R
JA
V
CC(max)
. If V
is reliable under these conditions.
CC(est)
≥ V
CC(max)
at TA = 150°C, package UA, using
CC
165°C, V
= 15°C ÷ 165 °C/W = 91 mW
JA
CC(max)
CC(max)
CC(est)
CC(max) =
= 91 mW ÷ 7.5 mA = 12.1 V
. If V
CC(est)
and V
24 V, and
≤ V
CC(max)
requires enhanced
CC(max)
, then operation between V
D(max)
CC(est)
, then reli-
CC(est)
. First,
.
and
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
V
= 12 V, I
CC
PD = VCC × I
T = PD × R
= 4 mA, and R
CC
= 12 V × 4 mA = 48 mW
CC
= 48 mW × 140 °C/W = 7°C
JA
JA
= 140 °C/W, then:
TJ = TA + T = 25°C + 7°C = 32°C
A worst-case estimate, P
able power level (V
at a selected R
and TA.
JA
CC(max)
, represents the maximum allow-
D(max)
, I
), without exceeding T
CC(max)
J(max)
,
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
A1101, A1102, A1103,
A1104, and A1106
+0.10
2.90
–0.20
1
8X 10° REF
2.98
Continuous-T ime Switch Family
Package LH, 3-Pin (SOT-23W)
+0.12
–0.08
D
1.49
3
0.96
D
2
0.55 REF
Branded Face
A
D
+0.19
1.91
–0.06
0.25
+4°
4°
–0°
+0.020
0.180
–0.053
0.25 MIN
Seating Plane
Gauge Plane
1.00
0.70
PCB Layout Reference View
B
2.40
0.95
0.05
0.95
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Active Area Depth, 0.28 mm REF
A
B
Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
C
Branding scale and appearance at supplier discretion
D
Hall element, not to scale
0.40 ±0.10
1.00 ±0.13
+0.10
–0.05
NNN
1
C
Standard Branding Reference View
N = Device part number
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
A1101, A1102, A1103,
A1104, and A1106
4.09
+0.08
–0.05
Continuous-T ime Switch Family
Package UA, 3-Pin SIP
Matrix Leadframe
+0.08
3.02
–0.05
14.99 ±0.25
1.02
MAX
0.51
REF
45°
E
2.04
231
B
1.44
E
2X10°
E
Branded
Face
A
C
1.52 ±0.5
45°
0.79 REF
+0.03
0.41
–0.06
Mold Ejector
Pin Indent
Standard Branding Reference View
D
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
For Reference Only; not for tooling use (reference DWG-9013)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Dambar removal protrusion (6X)
A
B
Gate and tie bar burr area
Active Area Depth, 0.50 mm REF
C
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
NNT
1
0.43
+0.05
–0.07
1.27 NOM
Note: Matrix configuration not available for A1106 variants.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A1101, A1102, A1103,
A1104, and A1106
4.09
+0.08
–0.05
Continuous-T ime Switch Family
Package UA, 3-Pin SIP
Conventional Leadframe
+0.08
3.02
–0.05
15.75 ±0.51
2.16
MAX
0.51
REF
45°
E
2.04
231
B
1.44
E
E
Branded
Face
A
C
1.52 ±0.5
45°
0.79 REF
+0.03
0.41
–0.06
Mold Ejector
Pin Indent
Standard Branding Reference View
D
= Supplier emblem
N = Last two digits of device part number
T = Temperature code
For Reference Only; not for tooling use (reference DWG-9049)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Dambar removal protrusion (6X)
A
B
Gate burr area
Active Area Depth, 0.50 mm REF
C
D
Branding scale and appearance at supplier discretion
E
Hall element, not to scale
NNT
1
0.43
+0.05
–0.07
1.27 NOM
Copyright ©2006-2008, Allegro MicroSystems, Inc.
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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