Datasheet 3977 Datasheet (ALLEGRO)

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3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
Data Sheet
26184.22D
A3977xED
(PLCC)
1A
OUT
65
NC
7
NC
8
PFD
9
RC
10
1
GND
11
GND
12
GND
13
REF
14
RC
2
15
LOGIC
16
V
SUPPLY
DD
NC NC
17 29
18
2A
OUT
1
HOME
DIR
SENSE
4321
PWM
TIMER
÷8
2019
221
MS
MS
SENSE
GND
GND
ABSOLUTE MAXIMUM RATINGS
at TA = +25°C
Load Supply Voltage, VBB............. 35 V
Output Current, I
Logic Supply Voltage, VDD........... 7.0 V
Logic Input Voltage Range, V
(tw >30 ns)..... -0.3 V to VDD + 0.3 V
(tw <30 ns)........... -1 V to VDD + 1 V
Sense Voltage, V Reference Voltage, V Package Power Dissipation,
PD................................. See page 3
Operating Temperature Range, T
(A3977Kx) ............ -40°C to +125°C
(A3977Sx) .............. -20°C to +85°C
Junction Temperature, TJ......... +150°C
Storage Temperature Range,
TS......................... -55°C to +150°C
* Output current rating may be limited by duty cycle, ambient temperature, and heat sinking. Under any set of conditions, do not exceed the specified current rating or a junction temperature of 150°C.
OUT
SENSE
1
LOAD
GND
GND
SUPPLY
44 43 424140
V
BB1
TRANSLATOR
& CONTROL LOGIC
V
BB2
232221
2
GND
GND
LOAD
SUPPLY
REG
SLEEP
SR
ENABLE
RESET
1B
OUT
CHARGE PUMP
2827262524
2B
OUT
Dwg. PP-075-1
39
38
37
36
35
34
33
32
31
30
.................. ±2.5 A
IN
................. 0.5 V
................ V
REF
A
DD
NC
CP
CP
V
GND
GND
GND
V
STEP
NC
The A3977xED and A3977xLP are complete microstepping motor drivers with built-in translator. They are designed to operate bipolar stepper motors in full-, half-, quarter-, and eighth-step modes, with output drive capability of 35 V and ±2.5 A. The A3977 includes a fixed off-time current regulator that has the ability to operate in slow-, fast-, or mixed-decay modes. This current­decay control scheme results in reduced audible motor noise, increased step accuracy, and reduced power dissipation.
2
1
CP
The translator is the key to the easy implementation of the A3977. By simply inputting one pulse on the STEP input the motor will take one step (full, half, quarter, or eighth depending on two logic inputs). There are no phase-sequence tables, high-frequency control lines, or complex interfaces to program. The A3977 interface is an ideal fit for applications where a complex
REG
µP is unavailable or over-burdened.
Internal synchronous-rectification control circuitry is provided to improve power dissipation during PWM operation.
Internal circuit protection includes thermal shutdown with hysteresis, under-voltage lockout (UVLO) and crossover-current protection. Special power-up sequencing is not required.
The A3977 is supplied in a choice of two power packages, a 44-pin plastic PLCC with copper batwing tabs (suffix ED), and a thin (<1.2 mm), 28­pin TSSOP with an exposed thermal pad (suffix LP). The SLP package is
available in a lead-free version (100% matte tin leadframe).
FEATURES
*
±2.5 A, 35 V Output Rating
Low r
Outputs, 0.45 Source, 0.36 Sink Typical
DS(on)
Automatic Current Decay Mode Detection/Selection
3.0 V to 5.5 V Logic Supply Voltage Range
Mixed, Fast, and Slow Current Decay Modes
Home Output
Synchronous Rectification for Low Power Dissipation
Internal UVLO and Thermal Shutdown Circuitry
Crossover-Current Protection
Always order by complete part number:
Part Number Package
A3977KED 44-pin PLCC
A3977KLP 28-pin TSSOP
A3977SED 44-pin PLCC
A3977SED-T 44-pin PLCC; Lead-free
A3977SLP 28-pin TSSOP
A3977SLP-T 28-pin TSSOP; Lead-free
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
FUNCTIONAL BLOCK DIAGRAM
LOGIC
SUPPLY
REF.
SUPPLY
V
REF
RC
DD
1
UVLO
AND
FA
LT
DA
2 V
PWM LATCH BLANKING MIXED DECAY
REGULATOR
BANDGAP
SENSE
+-
CP
V
REG
2
CHARGE
CP
1
V
CP
LOAD
SUPPLY
PUMP
BB1
V
1
V
CP
DMOS H BRIDGE
OUT OUT
1A
1B
V
PFD
STEP
DIR
RESET
MS MS
HOME
SLEEP
SR
ENABLE
1 2
PFD
RC
4
TRANSLATOR
PWM TIMER
DMOS H BRIDGE
SENSE
V
BB2
1
GATE DRIVE
OUT
OUT
2A
2B
CONTROL LOGIC
PWM TIMER
PWM LATCH BLANKING MIXED DECAY
2
DAC
+-
SENSE
2
Dwg. FP-050-2
2
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 Copyright © 2002, 2003 Allegro MicroSystems, Inc.
A3977xLP
(TSSOP)
3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
5.0
SENSE
SUPPLY
SENSE
1
1
HOME
2
3
DIR
1A
OUT
4
PFD
5
PWM
1
RC
AGND
REF
2
RC
LOGIC
10
2A
OUT
11
MS
2
12
MS
1
13
2
14 15
TIMER
6
7
8
÷8
9
V
DD
TRANSLATOR
& CONTROL LOGIC
REG
LOAD
V
BB1
28
SUPPLY
SLEEP
27
26
ENABLE
OUT
25
CP
24
CP
23
V
22
CHARGE PUMP
PGND
21
V
20
STEP
19
18
OUT
RESET
17
16
SR
LOAD
V
BB2
SUPPLY
Dwg. PP-075
CP
REG
1
SUFFIX '–LP', RθJA = 28°C/W*
4.0
1B
2
1
3.0
SUFFIX '–LP',
θJA = 33°C/W†
R
SUFFIX '–ED', RθJA = 32°C/W†
2.0
1.0
2B
0
ALLOWABLE PACKAGE POWER DISSIPATION IN WATTS
25
2
Package Thermal Resistance, R
A3977xLP ......................... 28°C/W
A3977xED ........................ 32°C/W
A3977xLP ......................... 33°C/W
SUFFIX 'S–'
SUFFIX 'K–'
50 75 100 125 150
AMBIENT TEMPERATURE IN °°°°C
Dwg. GP-018-2A
θJA
* † †
* Measured on JEDEC standard “High-K” four-layer board. † Measured on typical two-sided PCB with three square inches
2
(1935 mm
) copper ground area.
www.allegromicro.com
Table 1. Microstep Resolution Truth Table
MS
1
MS
2
Resolution
L L Full step (2 phase)
H L Half step
L H Quarter step
H H Eighth step
3
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
ELECTRICAL CHARACTERISTICS at T
= +25°C, V
A
= 35 V, VDD = 3.0 V to 5.5V (unless otherwise
BB
noted)
Limits
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Output Drivers
Load Supply Voltage Range V
BB
Operating 8.0 35 V
During sleep mode 0 35 V
Output Leakage Current I
Output On Resistance r
DS(on)
Body Diode Forward Voltage V
DSS
V
= V
OUT
V
OUT
Source driver, I
Sink driver, I
Source diode, IF = -2.5 A 1.4 V
F
BB
= 0 V <1.0 -20 µA
= -2.5 A
OUT
= 2.5 A 0.36 0.43
OUT
<1.0 20 µA
0.45 0.57
Sink diode, IF = 2.5 A 1.4 V
Motor Supply Current I
BB
f
< 50 kHz 8.0 mA
PWM
Control Logic
Logic Supply Voltage Range V
Logic Input Voltage V
V
Logic Input Current I
I
Maximum STEP Frequency f
HOME Output Voltage V
Blank Time t
BLANK
Fixed Off Time t
DD
IN(1)
IN(0)
IN(1)
IN(0)
STEP
OH
V
OL
off
Operating, outputs disabled
6.0 mA
Sleep mode 20 µA
Operating 3.0 5.0 5.5 V
VIN = 0.7V
VIN = 0.3V
DD
DD
0.7V
DD
0.3V
-20 <1.0 20 µA
-20 <1.0 20 µA
––V
DD
V
500* kHz
I
= -200 µA 0.7V
OH
I
= 200 µA 0.3V
OL
R
= 56 k, C
t
R
= 56 k, Ct = 680 pF 30 38 46 µs
t
= 680 pF 700 950 1200 ns
t
DD
V
DD
V
continued next page …
4
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
3977
MICROSTEPPPING DMOS DRIVER
WITH TRANSLATOR
ELECTRICAL CHARACTERISTICS at TA = +25°C, VBB = 35 V, VDD = 3.0 V to 5.5V (unless otherwise noted)
Limits
Characteristic Symbol Test Conditions
Control Logic (cont’d)
Mixed Decay Trip Point PFDH 0.6V
PFDL 0.21V Ref. Input Voltage Range V Reference Input Current I Gain (Gm) Error
E
(note 3)
Crossover Dead Time t Thermal Shutdown Temp. T Thermal Shutdown Hysteresis T UVLO Enable Threshold V
UVLO
UVLO Hysteresis V Logic Supply Current I
Operating 0 V
REF
REF
V
G
DT
J
J
UVLO
DDfPWM
= 2 V, Phase Current = 38.27% ±10 %
REF
V
= 2 V, Phase Current = 70.71% ±5.0 %
REF
= 2 V, Phase Current = 100.00% ±5.0 %
V
REF
SR enabled 100 475 800 ns
Increasing V
DD
< 50 kHz 12 mA Outputs off 10 mA Sleep mode 20 µA
* Operation at a step frequency greater than the specifi ed minimum value is possible but not warranteed. NOTES: 1. Typical Data is for design information only.
2. Negative current is defi ned as coming out of (sourcing) the specifi ed device terminal.
3. EG = ([V
REF
/8] – V
SENSE
)/(V
REF
/8)
Min. Typ. Max. Units
DD
DD
–V –V
DD
0 ±3.0 µA
165 °C –15 –°C
2.45 2.7 2.95 V
0.05 0.10 V
V
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5
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
Functional Description
Device Operation. The A3977 is a complete
microstepping motor driver with built in translator for easy operation with minimal control lines. It is designed to operate bipolar stepper motors in full-, half-, quarter­and eighth-step modes. The current in each of the two output H-bridges, all n-channel DMOS, is regulated with fixed off time pulse-width modulated (PWM) control circuitry. The H-bridge current at each step is set by the value of an external current sense resistor (R voltage (V
), and the DAC’s output voltage controlled
REF
), a reference
S
by the output of the translator.
At power up, or reset, the translator sets the DACs and phase current polarity to initial home state (see figures for home-state conditions), and sets the current regulator for both phases to mixed-decay mode. When a step command signal occurs on the STEP input the translator automati­cally sequences the DACs to the next level (see table 2 for the current level sequence and current polarity). The microstep resolution is set by inputs MS
and MS2 as
1
shown in table 1. If the new DAC output level is lower than the previous level the decay mode for that H-bridge will be set by the PFD input (fast, slow or mixed decay). If the new DAC level is higher or equal to the previous level then the decay mode for that H-bridge will be slow decay. This automatic current-decay selection will improve microstepping performance by reducing the distortion of the current waveform due to the motor BEMF.
Reset Input (RESET). The RESET input (active low) sets the translator to a predefined home state (see figures for home state conditions) and turns off all of the DMOS outputs. The HOME output goes low and all STEP inputs are ignored until the RESET input goes high.
Home Output (HOME). The HOME output is a logic output indicator of the initial state of the translator. At power up the translator is reset to the home state (see figures for home state conditions).
Step Input (STEP). A low-to-high transition on the STEP input sequences the translator and advances the motor one increment. The translator controls the input to the DACs and the direction of current flow in each wind­ing. The size of the increment is determined by the state of inputs MS
Microstep Select (MS
and MS2 (see table 1).
1
and MS2). Input terminals
1
MS1 and MS2 select the microstepping format per table 1. Changes to these inputs do not take effect until the STEP command (see figure).
Direction Input (DIR). The state of the DIRECTION input will determine the direction of rotation of the motor.
Internal PWM Current Control. Each H-bridge is controlled by a fixed off time PWM current-control circuit that limits the load current to a desired value (I
TRIP
). Initially, a diagonal pair of source and sink DMOS outputs are enabled and current flows through the motor winding and RS. When the voltage across the current-sense resistor equals the DAC output voltage, the current-sense com­parator resets the PWM latch, which turns off the source driver (slow-decay mode) or the sink and source drivers (fast- or mixed-decay modes).
The maximum value of current limiting is set by the
selection of R
and the voltage at the V
S
input with a
REF
transconductance function approximated by:
max = V
I
TRIP
The DAC output reduces the V
REF
/8R
REF
S
output to the current-sense comparator in precise steps (see table 2 for % I
max at each step).
TRIP
= (% I
I
TRIP
max/100) x I
TRIP
TRIP
max
It is critical to ensure that the maximum rating (0.5 V) on the SENSE terminal is not exceeded. For full-step mode, V VDD, because the peak sense value is 0.707 x V all other modes V
can be applied up to the maximum rating of
REF
REF
should not exceed 4 V.
REF
/8. In
6
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
MICROSTEPPING DMOS DRIVER
Functional Description (cont’d)
3977
WITH TRANSLATOR
Fixed Off-Time. The internal PWM current-control circuitry uses a one shot to control the time the driver(s) remain(s) off. The one shot off-time, t the selection of an external resistor (R (C
) connected from the RC timing terminal to ground.
T
, is determined by
off
) and capacitor
T
The off time, over a range of values of CT = 470 pF to 1500 pF and RT = 12 k to 100 k is approximated by:
= RTC
t
off
T
RC Blanking. In addition to the fixed off time of the PWM control circuit, the C
component sets the compara-
T
tor blanking time. This function blanks the output of the current-sense comparator when the outputs are switched by the internal current-control circuitry. The comparator output is blanked to prevent false over-current detection due to reverse recovery currents of the clamp diodes, and/ or switching transients related to the capacitance of the load. The blank time t
t
BLANK
can be approximated by:
BLANK
= 1400C
T
Charge Pump. (CP1 and CP2). The charge pump is used to generate a gate supply greater than VBB to drive the source-side DMOS gates. A 0.22 µF ceramic capaci- tor should be connected between CP1 and CP2 for pump­ing purposes. A 0.22 µF ceramic capacitor is required between VCP and VBB to act as a reservoir to operate the high-side DMOS devices.
. This internally generated voltage is used to operate
V
REG
the sink-side DMOS outputs. The V be decoupled with a 0.22 µF capacitor to ground. V
terminal should
REG
REG
is internally monitored and in the case of a fault condition, the outputs of the device are disabled.
Enable Input (ENABLE). This active-low input enables all of the DMOS outputs. When logic high the outputs are disabled. Inputs to the translator (STEP, DIRECTION, MS
, MS2) are all active independent of the
1
ENABLE input state.
Shutdown. In the event of a fault (excessive junction temperature, or low voltage on V
) the outputs of the
CP
device are disabled until the fault condition is removed. At power up, and in the event of low VDD, the under­voltage lockout (UVLO) circuit disables the drivers and resets the translator to the HOME state.
Sleep Mode (SLEEP). An active-low control input used to minimize power consumption when not in use. This disables much of the internal circuitry including the output DMOS, regulator, and charge pump. A logic high allows normal operation and startup of the device in the home position. When coming out of sleep mode, wait 1 ms before issuing a STEP command to allow the charge pump (gate drive) to stabilize.
Percent Fast Decay Input (PFD). When a STEP input signal commands a lower output current from the previous step, it switches the output current decay to either slow-, fast-, or mixed-decay depending on the voltage level at the PFD input. If the voltage at the PFD input is greater than 0.6V
then slow-decay mode is selected. If
DD
the voltage on the PFD input is less than 0.21VDD then fast-decay mode is selected. Mixed decay is between these two levels. This terminal should be decoupled with a 0.1 µF capacitor.
Mixed Decay Operation. If the voltage on the PFD input is between 0.6V
and 0.21VDD, the bridge will
DD
operate in mixed-decay mode depending on the step sequence (see figures). As the trip point is reached, the device will go into fast-decay mode until the voltage on the RC terminal decays to the voltage applied to the PFD terminal. The time that the device operates in fast decay is approximated by:
= RTCTIn (0.6VDD/V
t
FD
After this fast decay portion, t
, the device will
FD
PFD
)
switch to slow-decay mode for the remainder of the fixed off-time period.
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7
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
Functional Description (cont’d)
Synchronous Rectification. When a PWM off cycle
is triggered by an internal fixed off-time cycle, load current will recirculate according to the decay mode selected by the control logic. The A3977 synchronous rectification feature will turn on the appropriate MOSFETs during the current decay and effectively short out the body diodes with the low r
driver. This will
DS(on)
reduce power dissipation significantly and eliminate the need for external Schottky diodes for most applications.
The synchronous rectification can be set in either
active mode or disabled mode.
Timing Requirements
(T
A
STEP
= +25°C, V
= 5 V, Logic Levels are VDD and Ground)
DD
50%
B
A
Active Mode. When the SR input is logic low, active mode is enabled and synchronous rectification will occur. This mode prevents reversal of the load current by turning off synchronous rectification when a zero current level is detected. This prevents the motor winding from conduct­ing in the reverse direction.
Disabled Mode. When the SR input is logic high, synchronous rectification is disabled. This mode is typically used when external diodes are required to transfer power dissipation from the A3977 package to the external diodes.
C D
MS1/MS2/
DIR/RESET
E
SLEEP
Dwg. WP-042
A. Minimum Command Active Time
Before Step Pulse (Data Set-Up Time) ..... 200 ns
B. Minimum Command Active Time
After Step Pulse (Data Hold Time)............ 200 ns
C. Minimum STEP Pulse Width ...................... 1.0 µs
D. Minimum STEP Low Time ......................... 1.0 µs
E. Maximum Wake-Up Time ......................... 1.0 ms
8
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
MICROSTEPPING DMOS DRIVER
Applications Information
3977
WITH TRANSLATOR
Layout.
The printed wiring board should use a heavy ground
plane.
For optimum electrical and thermal performance, the
driver should be soldered directly onto the board.
The load supply terminal, V
, should be decoupled
BB
with an electrolytic capacitor (>47 µF is recommended) placed as close to the device as possible.
To avoid problems due to capacitive coupling of the high dv/dt switching transients, route the bridge-output traces away from the sensitive logic-input traces. Always drive the logic inputs with a low source impedance to increase noise immunity.
Grounding. A star ground system located close to the driver is recommended.
The 44-lead PLCC has the analog ground and the power ground internally bonded to the power tabs of the package (leads 44, 1, 2, 11 – 13, 22 – 24, and 33 – 35).
On the 28-lead TSSOP package, the analog ground (lead 7) and the power ground (lead 21) must be con­nected together externally. The copper ground plane located under the exposed thermal pad is typically used as the star ground.
Current Sensing. To minimize inaccuracies caused by ground-trace IR drops in sensing the output current level, the current-sense resistor (R
) should have an independent
S
ground return to the star ground of the device. This path should be as short as possible. For low-value sense resistors the IR drops in the printed wiring board sense resistor’s traces can be significant and should be taken into account. The use of sockets should be avoided as they can introduce variation in RS due to their contact resistance.
Allegro MicroSystems recommends a value of R
S
given by
= 0.5/I
R
S
TRIP
max
Thermal Protection. Circuitry turns off all drivers when the junction temperature reaches 165°C, typically. It is intended only to protect the device from failures due to excessive junction temperatures and should not imply that output short circuits are permitted. Thermal shut­down has a hysteresis of approximately 15°C.
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9
3977
MICROSTEPPPING DMOS DRIVER WITH TRANSLATOR
Table 2. Step Sequencing
Home State = 45º Step Angle, DIR = H
Phase 1 Current
Full Step Half Step ¼ Step Step
1 1 1 100.00 0.00 0.0
2 98.08 19.51 11.3
2 3 92.39 38.27 22.5
4 83.15 55.56 33.8
1 2 3 5 70.71 70.71 45.0
6 55.56 83.15 56.3
4 7 38.27 92.39 67.5
8 19.51 98.08 78.8
3 5 9 0.00 100.00 90.0
10 –19.51 98.08 101.3
6 11 –38.27 92.39 112.5
12 –55.56 83.15 123.8
2 4 7 13 –70.71 70.71 135.0
14 –83.15 55.56 146.3
8 15 –92.39 38.27 157.5
16 –98.08 19.51 168.8
5 9 17 –100.00 0.00 180.0
18 –98.08 –19.51 191.3
10 19 –92.39 –38.27 202.5
20 –83.15 –55.56 213.8
3 6 11 21 –70.71 –70.71 225.0
22 –55.56 –83.15 236.3
12 23 –38.27 –92.39 247.5
24 –19.51 –98.08 258.8
7 13 25 0.00 –100.00 270.0
26 19.51 –98.08 281.3
14 27 38.27 –92.39 292.5
28 55.56 –83.15 303.8
4 8 15 29 70.71 –70.71 315.0
30 83.15 –55.56 326.3
16 31 92.39 –38.27 337.5
32 98.08 –19.51 348.8
(%I
trip
(%)
max)
Phase 2 Current
(%I
max)
trip
(%)
Step Angle
(º)
10
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
STEP
INPUT
HOME
OUTPUT
70.7%
3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
Full-Step Operation
MS1 = MS2 = L, DIR = H
SLOW
DECAY
PHASE 1
CURRENT
–70.7%
70.7%
PHASE 2
CURRENT
70.7%
SLOW
DECAY
Dwg. WK-004-15
www.allegromicro.com
The vector addition of the output currents at any step is 100%.
11
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
Half-Step Operation
= H, MS2 = L, DIR = H
MS
1
STEP
INPUT
HOME
OUTPUT
100%
70.7%
PHASE 1
CURRENT
70.7%
100%
100%
70.7%
PHASE 2
CURRENT
70.7%
–100%
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
DECAY
DECAY
MIXED
SLOW
SLOW
MIXED
Dwg. WK-004-14
DECAY
DECAY
12
The mixed-decay mode is controlled by the percent fast decay voltage (V
). If the voltage at the PFD input is
PFD
greater than 0.6VDD then slow-decay mode is selected. If the voltage on the PFD input is less than 0.21VDD then fast-decay mode is selected. Mixed decay is between these two levels.
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
STEP
INPUT
HOME
OUTPUT
MICROSTEPPING DMOS DRIVER
Quarter-Step Operation
MS
= L, MS2 = H, DIR = H
1
3977
WITH TRANSLATOR
100%
70.7%
38.3%
PHASE 1
CURRENT
38.3%70.7%
100%
100%
70.7%
38.3%
PHASE 2
CURRENT
38.3%
70.7%
100%
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
Dwg. WK-004-13
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The mixed-decay mode is controlled by the percent fast decay voltage (V
). If the voltage at the PFD input is
PFD
greater than 0.6VDD then slow-decay mode is selected. If the voltage on the PFD input is less than 0.21VDD then fast-decay mode is selected. Mixed decay is between these two levels.
13
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
8 Microstep/Step Operation
MS
= MS2 = H, DIR = H
1
STEP
INPUT
HOME
OUTPUT
100%
70.7%
38.3%
PHASE 1
CURRENT
38.3%
70.7%
100%
100%
70.7%
38.3%
PHASE 2
CURRENT
38.3%
70.7%
100%
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
SLOW
DECAY
MIXED
DECAY
MIXED
DECAY
SLOW
DECAY
Dwg. WK-004-12
14
The mixed-decay mode is controlled by the percent fast decay voltage (V
). If the voltage at the PFD input is
PFD
greater than 0.6VDD then slow-decay mode is selected. If the voltage on the PFD input is less than 0.21VDD then fast-decay mode is selected. Mixed decay is between these two levels.
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
Terminal List
Terminal A3977xLP A3977xED Name Terminal Description (TSSOP) (PLCC)
GND Analog and power ground 44, 1, 2 SENSE HOME Logic output 2 4 DIR Logic Input 3 5 OUT NC No (internal) connection 7, 8 PFD Mixed decay setting 5 9 RC1 Analog Input for fixed offtime – bridge 1 6 10 GND Analog and power ground 11, 12, 13 AGND Analog ground 7* – REF Gm reference input 8 14 RC2 Analog input for fixed offtime – bridge 2 9 15 LOGIC SUPPLY VDD, the logic supply voltage 10 16 NC No (internal) connection 17 OUT2A DMOS H bridge 2 output A 11 18 MS2 Logic input 12 19 MS1 Logic input 13 20 SENSE2 Sense resistor for bridge 2 14 21 GND Analog and power ground 22, 23, 24 LOAD SUPPLY2 VBB2, the load supply for bridge 2 15 25 SR Logic input 16 26 RESET Logic input 17 27 OUT2B DMOS H bridge 2 output B 18 28 NC No (internal) connection 29, 30 STEP Logic input 19 31 VREG Regulator decoupling 20 32 PGND Power ground 21* – GND Analog and power ground 33, 34, 35 VCP Reservoir capacitor 22 36 CP1 Charge pump capacitor 23 37 CP2 Charge pump capacitor 24 38 NC No (internal) connection 39 OUT1B DMOS H bridge 1 output B 25 40 ENABLE Logic input 26 41 SLEEP Logic input 27 42 LOAD SUPPLY1 VBB1, the load supply for bridge 1 28 43
1 Sense resistor for bridge 1 1 3
1A DMOS H bridge 1 output A 4 6
* AGND and PGND on the TSSOP package must be connected together externally.
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15
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
A3977xED
0.319
0.291
0.319
0.291
0.021
0.013
0.050
BSC
0.020
MIN
0.180
0.165
0.695
0.685
0.656
0.650
0.032
0.026
28
29
18
17
Dimensions in Inches
(controlling dimensions)
INDEX AREA
39
144
40
0.656
0.650
28
2
0.695
0.685
6
18
7
Dwg. MA-005-44A in
29
17.65
17.40
16.662
16.510
0.812
0.661
INDEX AREA
39
144
17.65
17.40
2
40
16.662
16.510
8.10
7.39
8.10
7.39
0.533
0.331
1.27
BSC
0.51
MIN
4.57
4.20
NOTES: 1. Exact body and lead configuration at vendors option within limits shown.
2. Lead spacing tolerance is non-cumulative.
3. Webbed lead frame. Terminals 1, 2, 11, 12, 13, 22, 23, 24, 33, 34, 35, and 44 are internally one piece.
4. Supplied in standard sticks/tubes of 27 devices or add TR to part number for tape and reel.
17
Dimensions in Millimeters
(for reference only)
7
6
Dwg. MA-005-44A mm
16
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
0.177
0.169
0.012
0.0075
0.0472
MAX
INDEX AREA
3
0.197
0.386
0.378
5.0
0.118
28 15
1 2
0.0059
0.00
28 15
A3977xLP
GAUGE PLANE SEATING PLANE
0.026
BSC
0.0079
0.0035
0.0098
BSC
0° TO 8°
EXPOSED
THERMAL PAD
0.0394
0.260
0.244
REF
Dwg. MA-008-30A in
0.030
0.018
Dimensions in Inches
(for reference only)
4.50
4.30
0.30
0.19
1.20
MAX
1 2
0.15
0.00
INDEX
AREA
3
9.80
9.60
3.0
GAUGE PLANE SEATING PLANE
0.65
BSC
0.20
0.09
0.25
BSC
0° TO 8°
EXPOSED
THERMAL PAD
NOTES: 1. Exact body and lead configuration at vendors option within limits shown.
2. Lead spacing tolerance is non-cumulative.
3. Supplied in standard sticks/tubes of 49 devices or add TR to part number for tape and reel.
6.60
6.20
1.00
REF
Dwg. MA-008-30A mm
0.75
0.45
Dimensions in Millimeters
(controlling dimensions)
www.allegromicro.com
17
3977
MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
18
The products described here are manufactured under one or more
U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.
Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi­bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.
115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000
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