Designed for pulse-width modulated (PWM) current control of dc
motors, the A3959SB, A3959SLB, and A3959SLP are capable of
output currents to ±3 A and operating voltages to 50 V. Internal fixed
V
24
REG
23
SLEEP
NO
NC
22
CONNECTION
21
B
OUT
V
20
LOAD SUPPLY
BB
19
GROUND
18
GROUND
SENSE
17
A
OUT
16
NO
NC
15
CONNECTION
EXT MODE
14
REF
13
Dwg. PP-069-4
CP
PHASE
ROSC
GROUND
GROUND
LOGIC SUPPLY
ENABLE
PFD
BLANK
PFD
CP
1
2
2
CP
1
3
4
5
6
7
8
9
9
2
10
11
1
12
θ
V
DD
CHARGE PUMP
LOGIC
÷
10
PWM TIMER
Note that the A3959SLB(SOIC), A3959SB (DIP),
and A3959SLP (TSSOP) do
not share a common
terminal assignment.
off-time PWM current-control timing circuitry can be adjusted via
control inputs to operate in slow, fast, and mixed current-decay modes.
PHASE and ENABLE input terminals are provided for use in
controlling the speed and direction of a dc motor with externally
applied PWM-control signals. Internal synchronous rectification
control circuitry is provided to reduce power dissipation during PWM
operation.
Internal circuit protection includes thermal shutdown with
hysteresis, undervoltage monitoring of supply and charge pump, and
crossover-current protection. Special power-up sequencing is not
required.
The A3959SB/SLB/SLP is a choice of three power packages, a
24-pin plastic DIP with a copper batwing tab (package suffix ‘B’), a
24-lead plastic SOIC with a copper batwing tab (package suffix ‘LB’),
and a thin (<1.2 mm) 28-lead plastic TSSOP with an exposed thermal
pad (suffix ‘LP’). In all cases, the power tab is at ground potential and
needs no electrical isolation.
free version (100% matte tin leadframe).
ABSOLUTE MAXIMUM RATINGS
Load Supply Voltage, VBB......................... 50 V
Output Current, I
(Repetitive) ........... ±3.0 A
OUT
(Peak, <3 µs) ................................... ±6.0 A
Logic Supply Voltage, VDD....................... 7.0 V
Logic Input Voltage Range, V
IN
(Continuous) ............ -0.3 V to VDD + 0.3 V
<30 ns) ............... -1.0 V to VDD + 1.0 V
(t
w
Sense Voltage, VS (Continuous) .............. 0.5 V
(tw <3 µs) ........................................... 2.5 V
Reference Voltage, V
Package Power Dissipation (TA = 25°C), P
Output current rating may be limited by duty cycle,
ambient temperature, and heat sinking. Under any
set of conditions, do not exceed the specified
current rating or a junction temperature of 150°C.
* Double-sided board, one square inch copper each side. See also, Layout, page 7.
FEATURES
■ ±3 A, 50 V Output Rating
■ Low
■ Mixed, Fast, and Slow Current-Decay Modes
■ Synchronous Rectification for Low Power Dissipation
. This internally generated voltage is used to operate
REG
the sink-side DMOS outputs. The V
be decoupled with a 0.22 µF capacitor to ground. V
terminal should
REG
REG
is
internally monitored and in the case of a fault condition,
the outputs of the device are disabled.
Charge Pump. The charge pump is used to generate a
gate-supply voltage greater than V
to drive the source-
BB
side DMOS gates. A 0.22 µF ceramic capacitor should be
connected between CP1 and CP2 for pumping purposes.
A 0.22 µF ceramic capacitor should be connected between
CP and V
to act as a reservoir to operate the high-side
BB
DMOS devices. The CP voltage is internally monitored
and, in the case of a fault condition, the source outputs of
the device are disabled.
PHASE Logic. The PHASE input terminal determines if
the device is operating in the “forward” or “reverse” state.
PHASEOUT
A
OUT
B
0LowHigh
1HighLow
ENABLE Logic. The ENABLE input terminal allows
external PWM. ENABLE high turns on the selected sinksource pair. ENABLE low switches off the source driver
or the source and sink driver, depending on EXT MODE,
and the load current decays. If ENABLE is kept high, the
current will rise until it reaches the level set by the internal
current-control circuit.
ENABLEOutputs
0Chopped
1On
EXT MODE Logic. When using external PWM current
control, the EXT MODE input determines the current path
during the chopped cycle. With EXT MODE low, fast
decay mode, the opposite pair of selected outputs will be
enabled during the off cycle. With EXT MODE high,
slow decay mode, both sink drivers are on with ENABLE
low.
EXT MODEDecay
0Fast
1Slow
Current Regulation. Load current is regulated by an
internal fixed off-time PWM control circuit. When the
outputs of the DMOS H bridge are turned on, the current
increases in the motor winding until it reaches a trip value
determined by the external sense resistor (R
applied analog reference voltage (V
I
= V
TRIP
REF
/10R
REF
S
):
) and the
S
At the trip point, the sense comparator resets the sourceenable latch, turning off the source driver. The load
inductance then causes the current to recirculate for the
fixed off-time period. The current path during
recirculation is determined by the configuration of slow/
mixed/fast current-decay mode via PFD1 and PFD2.
Oscillator. The PWM timer is based on an internal
oscillator set by a resistor connected from the R
OSC
terminal to VDD. Typical value of 4 MHz is set with a
51 kΩ resistor. The allowable range of the resistor is from
20 kΩ to 100 kΩ.
f
If R
= 204 x 109/R
OSC
is not pulled up to VDD, it must be shorted to
OSC
OSC
.
ground.
www.allegromicro.com
Fixed Off Time. The A3959 is set for a fixed off time of
96 cycles of the internal oscillator, typically 24 µs with a
4 MHz oscillator.
5
3959
DMOS FULL-BRIDGE
PWM MOTOR DRIVER
FUNCTIONAL DESCRIPTION (continued)
Internal Current-Control Mode. Inputs PFD1 and
PFD2 determine the current-decay method after an
overcurrent event is detected at the SENSE input. In
slow-decay mode, both sink drivers are turned on for the
fixed off-time period. Mixed-decay mode starts out in
fast-decay mode for a portion (15% or 48%) of the fixed
off time, and then is followed by slow decay for the
remainder of the period.
PFD2PFD1% t
off
Decay
000Slow
0115Mixed
1048Mixed
11100Fast
PWM Blank Timer. When a source driver turns on, a
current spike occurs due to the reverse-recovery currents
of the clamp diodes and/or switching transients related to
distributed capacitance in the load. To prevent this current
spike from erroneously resetting the source-enable latch,
the sense comparator is blanked. The blank timer runs
after the off-time counter to provide the blanking function.
The blank timer is reset when ENABLE is chopped or
PHASE is changed. For external PWM control, a PHASE
change or ENABLE on will trigger the blanking function.
The duration is determined by the BLANK input and the
oscilator.
BLANKt
06/f
112/f
blank
osc
osc
Synchronous Rectification. When a PWM off cycle
is triggered, either by an ENABLE chop command or
internal fixed off-time cycle, load current will recirculate
according to the decay mode selected by the control logic.
The A3959 synchronous rectification feature will turn on
the appropriate pair of DMOS outputs during the current
decay and effectively short out the body diodes with the
low r
driver. This will reduce power dissipation
DS(on)
significantly and can eliminate the need for external
Schottky diodes.
Synchronous rectification will prevent reversal of load
current by turning off all outputs when a zero-current level
is detected.
Shutdown. In the event of a fault (excessive junction
temperature, or low voltage on CP or V
) the outputs of
REG
the device are disabled until the fault condition is
removed. At power up, and in the event of low V
DD
, the
UVLO circuit disables the drivers.
Braking. The braking function is implemented by
driving the device in slow-decay mode via EXTMODE
and applying an enable chop command. Because it is
possible to drive current in either direction through the
DMOS drivers, this configuration effectively shorts out
the motor-generated BEMF as long as the ENABLE chop
mode is asserted. It is important to note that the internal
PWM current-control circuit will not limit the current
when braking, because the current does not flow through
the sense resistor. The maximum brake current can be
approximated by V
BEMF/RL
. Care should be taken to
ensure that the maximum ratings of the device are not
exceeded in worst-case braking situations of high speed
and high inertial loads.
SLEEP Logic. The SLEEP input terminal is used to
minimize power consumption when when not in use. This
disables much of the internal circuitry including the
regulator and charge pump. Logic low will put the device
into sleep mode, logic high will allow normal operation.
Current Sensing. To minimize inaccuracies in sensing
the I
current level, which may be caused by ground
TRIP
trace IR drops, the sense resistor should have an
independent ground return to the ground terminal of the
device. For low-value sense resistors the IR drops in the
PCB sense resistor’s traces can be significant and should
be taken into account. The use of sockets should be
avoided as they can introduce variation in R
due to their
S
contact resistance.
The maximum value of R
where I
TRIP
≤ 3.0 A.
is given as RS ≤ 0.5/I
S
TRIP
Thermal Protection. Circuitry turns off all drivers
when the junction temperature reaches 165°C typically. It
is intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits are permitted. Thermal shutdown has
a hysteresis of approximately 15°C.
5
SUFFIX 'B', R
SUFFIX 'LP', R
4
SUFFIX 'LB', R
MULTI-LAYER HIGH-K BOARD
θJA
= 26°C/W
θJA
θJA
= 28°C/W
= 35°C/W
Layout. A star ground system located close to the driver
is recommended. The printed wiring board should use a
heavy ground plane. For optimum electrical and thermal
performance*, the driver should be soldered directly onto
the board. The ground side of R
should have an indi-
S
vidual path to the ground terminals of the device. This
path should be as short as is possible physically and
should not have any other components connected to it. It
is recommended that a 0.1 µF capacitor be placed between
SENSE and ground as close to the device as possible; the
load supply terminal, V
, should be decoupled with an
BB
electrolytic capacitor (> 47 µF is recommended) placed as
close to the device as is possible. On the 28-lead TSSOP
package, the copper ground plane located under the
exposed thermal pad is typically used as a star ground.
* The thermal resistance, R
, and absolute maximum
θJA
allowable package power dissipation specified on page 1
is measured on a typical two-sided PCB with one square
inch copper ground area on each side. With minimal
copper on a single-sided PCB (worst-case), the ‘B’
package R
is 40°C/W, ‘LB’ is 77°C/W, and ‘LP’ is
θJA
80°C/W. See also, Application Note 29501.5, ImprovingBatwing Power Dissipation.
3
2
1
SUFFIX 'B', R
SUFFIX 'LP', R
SUFFIX 'LB', R
DOUBLE-SIDED BOARD,
1 SQ. IN. COPPER EA. SIDE
0
25
ALLOWABLE PACKAGE POWER DISSIPATION IN WATTS
www.allegromicro.com
θJA
= 38°C/W
θJA
= 40°C/W
θJA
= 50°C/W
5075100125150
TEMPERATURE IN °°°°C
Dwg. GP-049-6
For specification purposes, the multi-layer high-K board
performance graphed here is per JEDEC Standard
JESD51.
The products described here are manufactured under one or more
U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to
time, such departures from the detail specifications as may be
required to permit improvements in the performance, reliability, or
manufacturability of its products. Before placing an order, the user is
cautioned to verify that the information being relied upon is current.
Allegro products are not authorized for use as critical components
in life-support devices or systems without express written approval.
The information included herein is believed to be accurate and
reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of
third parties which may result from its use.
* For the A3959SB (DIP) only, there is an indeterminate resistance between the substrate grounds (pins 6, 7,
18, and 19) and the grounds at pins 5 and 8. Pins 5 and 8, and 6, 7, 18, or 19 must be connected together
externally. For the A3959SLP (TSSOP) the grounds at terminals 7, 8, and 28 should be connected together at
the exposed pad beneath the device.
* Current is maximum specified test condition, voltage is maximum rating. See specification for sustaining voltage limits
or over-current protection voltage limits. Negative current is defined as coming out of (sourcing) the output.
† Complete part number includes additional characters to indicate operating temperature range and package style.
Also, see 3175, 3177, 3235, and 3275 Hall-effect sensors for use with brushless dc motors.