Alinket Electronic Technology ALXC2X Datasheet

1

ALXC2X

Wireless IoT Controller Datasheet

Version 1.2

2016.03.01

ALXC2X DATASHEET

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ALXC2X DATASHEET

Copyright

©Alinket Electronic Technologies Corp

This document is the property of Alinket Electronic Technologies Corp and is delivered

on the express condition that it not be disclosed, reproduced in whole or in part, or used

for manufacture for anyone other than Alinket Technologies Corp without its written

consent, and that no right is granted to disclose or so use any information contained in

said document. This restriction does not limit the right to use information obtained from

other sources.

Trademarks

ALXC2X is a registered trademark of Alinket Electronic Technologies Corp. Alinket is a

registered trademark of Alinket Technologies Corp. Other products and company names

mentioned herein may be the trademarks of their respective owners.

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Revision History

Date(Y/M/D)

Revision Content

Revision By

Version

2015/06/12

Revision Content

/

0.1

2016/01/08

Initial Version

Qi Shi

1.0

2016/02/01

Product Pic Update

Qi Shi

1.1

2016/03/01

Ceramic Antenna

Qi Shi

1.2

ALXC2X DATASHEET

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ALXC2X DATASHEET

List of Contents

1. INTRODUCTION ................................................................................................................................. 8

1.1 ALXC2X MODULE OVERVIEW............................................................................................................... 8

1.2 FEATURES ........................................................................................................................................... 8

2. PIN ASSIGNMENT ............................................................................................................................ 10

2.1 PIN CONFIGURATION ......................................................................................................................... 10

2.2 PIN DEFINITIONS .............................................................................................................................. 11

3. MICROCONTROLLER SUBSYSTEM .................................................................................................... 12

3.1 ARM CORTEX-M4 WITH FPU CORE WITH EMBEDDED FLASH AND SRAM................................................. 12

3.2 EMBEDDED FLASH MEMORY ............................................................................................................... 12

3.3 EMBEDDED SRAM ............................................................................................................................ 12

3.4 NRST .............................................................................................................................................. 12

3.5 UART INTERFACE .............................................................................................................................. 12

3.6 SERIAL PERIPHERAL INTERFACE (SPI) .................................................................................................... 12

3.7 UNIVERSAL SERIES BUS (USB) ............................................................................................................. 13

3.8 INTER-INTEGRATED SOUND (I2S) ......................................................................................................... 13

3.9 INTER-INTEGRATED CIRCUIT INTERFACE (I2C) ......................................................................................... 14

3.10 ANALOG-TO-DIGITAL CONVERTER (ADC) ............................................................................................... 14

3.11 GENERAL-PURPOSE INPUT/OUTPUTS (GPIOS) ....................................................................................... 14

3.12 JTAG DEBUG PORT (SWJ-DP) ............................................................................................................ 14

4. SPECIFICATION ................................................................................................................................ 15

4.1 GENERAL SPECIFICATION .................................................................................................................... 15

4.2 VOLTAGES......................................................................................................................................... 15

4.3 TEMPERATURE AND HUMIDITY ............................................................................................................. 15

5. WI-FI RF SPECIFICATION .................................................................................................................. 16

5.1 RF SPECIFICATION ............................................................................................................................. 16

5.2 WI-FI POWER CONSUMPTION ............................................................................................................. 16

5.3 WI-FI SENSITIVITY SPECIFICATION ........................................................................................................ 17

5.4 WI-FI RF TX SPECIFICATION ............................................................................................................... 17

6. BT SPECIFICATION............................................................................................................................ 18

6.1 RF SPECIFICATION ............................................................................................................................. 18

6.2 BT POWER CONSUMPTION ................................................................................................................. 18

7. DIMENSIONS ................................................................................................................................... 19

7.1 PHYSICAL DIMENSIONS ....................................................................................................................... 19

7.2 TOP VIEW ........................................................................................................................................ 19

7.3 PCB FOOTPRINT (TOP VIEW) .............................................................................................................. 19

8. RECOMMENDED REFLOW PROFILE ................................................................................................. 20

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ALXC2X DATASHEET

9. ROHS DECLARATION ........................................................................................................................ 20

10. ORDER INFORMATION ................................................................................................................. 21

11. TECHNICAL SUPPORT CONTACT .................................................................................................. 21

ACRONYMS AND ABBREVIATIONS ............................................................................................................ 21

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ALXC2X DATASHEET

List of Figures

Figure 1 ALXC2X PIN Configuration .......................................................................................... 10

Figure 2 ALXC2X (Ceramic Antenna) Top View ......................................................................... 19

Figure 3 ALXC2X Pad Dimensions (Top View) ........................................................................... 19

Figure 4 Reflow Profile ............................................................................................................. 20

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ALXC2X DATASHEET

List of Tables

Table 1 PIN Description ............................................................................................................ 11

Table 2 Comparison of I2C analog and digital filters ................................................................ 14

Table 3 Range of Operation – General Specification ................................................................ 15

Table 4 Range of Operation-temperature ................................................................................ 15

Table 5 Range of Operation - Voltages ..................................................................................... 15

Table 6 Temperature and Humidity ......................................................................................... 15

Table 7 2.4GHz Wireless Specification ..................................................................................... 16

Table 8 5GHz Wireless Specification ........................................................................................ 16

Table 9 Wi-Fi Power Consumption ........................................................................................... 16

Table 10 Wi-Fi 2.4GHz Receiver Sensitivity Specification ......................................................... 17

Table 11 Wi-Fi 5GHz Receiver Sensitivity Specification ............................................................ 17

Table 12 Wi-Fi 2.4GHz RF TX Power Specification .................................................................... 17

Table 13 Wi-Fi 5GHz RF TX Power Specification ....................................................................... 17

Table 14 Bluetooth Transmitter RF Specifications .................................................................... 18

Table 15 Bluetooth Receiver RF Specifications ........................................................................ 18

Table 16 BT Power Consumption ............................................................................................. 18

Table 17 Physical Dimensions .................................................................................................. 19

Table 18 Order Information ..................................................................................................... 21

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ALXC2X DATASHEET

1. Introduction

1.1 ALXC2X Module Overview

ALXC2X module is a low-cost and ultra-low power consumption wireless IoT controller, with

integrated IEEE 802.11a/b/g/n functionalities, dual band 5 GHz/2.4 GHz, and Bluetooth 4.0.

The ALXC2X Module series is a family of low-power, self-contained, embedded wireless module

solution that addresses the connectivity demands of machine to machine applications. An RF front

end and two clocks embeds into a small factor modules.

The ALXC2X module includes various different interfaces to communicate with the Host such as

UART, SPI etc. The modules can be purchased with ceramic antennas on-board.

1.2 Features

 Dynamic Efficiency Line

- Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART

Accelerator™) allowing 0-wait state execution from Flash memory, frequency 100MHz,

memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP

instructions.

 Memories

- 128 KB of SRAM

- 512 KB of Built-in Serial Flash

- 1 MB of additional Serial Flash

 Clock, reset and supply management

- 3v to 3.6v application supply and I/Os

- Internal 33kHz± 30% LPO clock

- Internal 26 MHz crystal oscillator

- Internal 37.4 MHz crystal oscillator

- Internal 32.768 kHz LPO clock for the PMU sequencer

 Concurrent Bluetooth, and WLAN operation

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ALXC2X DATASHEET

 Dual-band 2.4G/5GHz IEEE802.11a/b/g/n

 Bluetooth v4.0 with integrated Class 1 PA

 Bluetooth Low Energy (BLE) support

 Four WLAN power states: Active mode, Doze mode, Deep-sleep mode, Power-down mode

 Integrated WLAN CMOS power amplifier with internal power detector and closed-loop power

control

 HCI high-speed UART transport support

 Transmitter power:

- 2.4 GHz: +19.5dBm (11b), +18dBm (11g), +16.5dBm (11n)

- 5GHz: +16.5dBm (11a), +15dBm (11n)

 Receiver sensitivity:

- 2.4GHz Wi-Fi: -89dBm (11b), -83dBm (11g), -80dBm (11n)

- 5GHz Wi-Fi: -82dBm (11a), -81.8dBm (11n)

 Host interface Options with different module: UART, USBH, USHD, SPI

 Peripheral interface Options: ADC, I2C, I2S, GPIO

 Operation temperature range: -30 ºC to +85 ºC

 RoHS compliant

 Easy for integration into mobile and handheld device with flexible system configuration

 Security:

- Hardware WAPI acceleration engine

- Open, WEP, WPA_TKIP_PSK, WPA_AES_PSK, WPA2_AES_PSK, WPA2_Mixed_PSK

- WPA/WPA2_Enterprise

 Dimensions: 28mm(L)*14.3mm(W)*2.2mm(H), 36Pins Small size suitable for low volume

system integration

 Antenna configurations: On-board antenna

 Over-the-air (OTA) upgrade support

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2. PIN Assignment

2.1 PIN Configuration

ALXC2X DATASHEET

Figure 1 ALXC2X PIN Configuration

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2.2 PIN Definitions

Pin#

Type

Name˄Main function˅

Alternate functions

PIN connection(when not using)

1 S GND 2 I/O

USART1_ TX

PB6

floating

3

I/O

USART1_ RX

PA10, USB_ID

floating

4 S VIO 5 I/O

I2C2_SDA

PB3, SPI1_SCK, USART1_RX

floating

6

I/O

I2C2_SCL

PB10

floating

7

I/O

SWCLK

PA14

floating

8 I BOOT0

floating

9 S VBAT

floating

10

I/O

USB_ID

PB13

floating

11

I/O

SWDIO

PA13

floating

12 I NRST

floating

13 S VIO

14 S GND

15 S GND

16

I/O

USB_DP

PA12, USART1_RTS, USART6_RX

floating

17

I/O

USB_DM

PA11, USART1_CTS, USART6_TX

floating

18

I/O

SPI1_NSS_EXT

PB12, I2C2_SMBA

floating

19

I/O

SPI1_MOSI

PA7, ADC1_7

floating

20

I/O

SPI1_MISO

PB4

floating

21

I/O

SPI1_SCK

PA5, ADC1_5

floating

22 S GND

23 S GND

24

I/O

GPIO1(PB1)

ADC1_9

floating

25

I/O

GPIO2(PB0)

ADC1_8

floating

26

NC

NC

BT_PCM_SYNC

floating

27

NC

NC

BT_PCM_CLK

floating

28

NC

NC

BT_PCM_IN

floating

29

NC

NC

BT_PCM_OUT

floating

30 S VIO

31

I/O

EXT_SLEEP_CLK

External 32.768K Clock

floating

32

NC

NC

BT_I2S_DI

floating

33

NC

NC

BT_I2S_WS

floating

34

NC

NC

BT_I2S_SCK

floating

35

NC

NC

BT_I2S_DO

floating

36 S GND

Table 1 PIN Description

ALXC2X DATASHEET

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ALXC2X DATASHEET

3. Microcontroller Subsystem

3.1 ARM Cortex-M4 with FPU core with embedded Flash and

SRAM

The ARM Cortex-M4 with FPU processor is the latest generation of ARM processors for

embedded systems. It provides a low-cost platform to meet the needs of MCU implementation with

a reduced pin count and low-power consumption, while delivering outstanding computational

performances and advanced responses to interrupts. The ARM Cortex-M4 with FPU 32-bit

RISC processor features exceptional code efficiency, delivering the high performance expected from

an ARM core in the memory footprint usually associated with 8- and 16-bit devices. The processor

supports a set of DSP instructions which allow efficient signal processing and complex algorithm

execution. Its single precision FPU (floating point unit) speeds up software development by using

meta-language development tools, while avoiding saturation.

3.2 Embedded Flash Memory

The ALXC2X Controller embeds 512 Kbytes of Flash memory, available for storing programs and data.

3.3 Embedded SRAM

The ALXC2X embeds 128 Kbytes of system SRAM which can be accessed (read/write) at CPU clock

speed with 0 wait states.

3.4 NRST

NRST is hardware PIN to support built-in reset simultaneously to the MCU and the Wi-Fi chip.

3.5 UART interface

The ALXC2X embeds 2 universal synchronous/asynchronous receiver transmitters (USART1 and

USART6). The UART interfaces are able to communicate at speed of up to 6.25Mbit/s. USART1

provides hardware management of the CTS and RTS signals, Smart Card mode (ISO 7816 compliant)

and SPI-like communication capability. All interfaces can be served by the DMA controller

3.6 Serial peripheral interface (SPI)

The ALXC2X features up to four SPIs in slave or master modes in full-duplex or simplex

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communication modes. The SPI can communicate at up to 50Mbit/s. The 3-bit pre-scaler gives 8

master mode frequencies and the frame is configurable to 8 bits or 16 bits. The hardware CRC

generation/verification supports basic SD Card/MMC modes. All SPIs can be served by DMA

controller.

The SPI interface can be configured to operate in TI mode for communications either in master mode

or slave mode.

3.7 Universal series bus (USB)

The ALXC2X embed an USB OTG full-speed device/host/OTG peripheral with integrated transceivers.

The USB OTG FS peripheral is compliant with the USB 2.0 specification and with the OTG 1.0

specification. It has software-configurable endpoint setting and supports suspend/resume. The USB

OTG full-speed controller requires a dedicated 48 MHz clock that is generated by a PLL connected

to the HSE oscillator. The major features are:

 Combined RX and TX FIFO size of 320 × 35 bits with dynamic FIFO sizing

 Supports the session request protocol (SRP) and host negotiation protocol (HNP)

 4 bidirectional endpoints

 8 host channels with periodic OUT support

 HNP/SNP/IP inside (no need for any external resistor)

 For OTG/Host modes, a power switch is needed in case bus-powered devices are connected

3.8 Inter-integrated Sound (I2S)

Five standard I2S interfaces (multiplexed with SPI1 to SPI5) are available. They can be operated in

master or slave mode, in simplex communication modes or full duplex for I2S2 and I2S3, and can be

configured to operate with a 16-/32-bit resolution as an input or output channel. All the I2Sx audio

sampling frequencies from 8 kHz up to 192 kHz are supported. When either or both of the I2S

interfaces are configured in master mode, the master clock can be output to the external

DAC/CODEC at 256 times the sampling frequency.

All I2Sx can be served by the DMA controller.

The ALXC2X features an additional dedicated PLL for audio I2S applications. It allows error-free I2S

sampling clock accuracy without compromising on the CPU performance.

The PLL I2S configuration can be modified to manage an I2S sample rate change without disabling

the main PLL used for the CPU.

The audio PLL can be programmed with very low error to obtain sampling rates ranging from 8 kHz

to 192 kHz.

In addition to the audio PLL, a master clock input pin can be used to synchronize the I2S flow with

an external PLL (or Codec output).

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Analog filter

Digital filter

Pulse width of

suppressed spikes

>= 50ns

Programmable length from 1 to 15 I2C peripheral clock

ALXC2X DATASHEET

3.9 Inter-integrated circuit interface (I2C)

Up to three I2C bus interfaces can operate in master or slave modes. They can support standard (up

to 100 kHz) and fast (up to 400 kHz) modes. The I2C bus frequency can be increased up to 1 MHz.

They also support the 7/10-bit addressing mode and the 7-bit dual addressing mode (as slave). A

hardware CRC generation/verification is embedded.

They can be served by DMA and they support SMBus 2.0/PMBus.

The ALXC2X also include programmable analog and digital noise filters

Table 2 Comparison of I2C analog and digital filters

3.10 Analog-to-digital converter (ADC)

One 12-bit analog-to-digital converter is embedded and shares up to 16 external channels,

performing conversions in the single-shot or scan mode. In scan mode, automatic conversion is

performed on a selected group of analog inputs.

The ADC can be served by the DMA controller. An analog watchdog feature allows very precise

monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated

when the converted voltage is outside the programmed thresholds.

To synchronize A/D conversion and timers, the ADCs could be triggered by any of TIM1, TIM2, TIM3,

or TIM4 timer.

3.11 General-purpose input/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain, with or

without pull-up or pull-down), as input (floating, with or without pull-up or pull-down) or as

peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate

functions. All GPIOs are high-current-capable and have speed selection to better manage internal

noise, power consumption and electromagnetic emission.

The I/O configuration can be locked if needed by following a specific sequence in order to avoid

spurious writing to the I/Os registers.

Fast I/O handling allowing maximum I/O toggling up to 100 MHz

3.12 JTAG debug port (SWJ-DP)

The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that

enables either a serial wire debug or a JTAG probe to be connected to the target. Debug is performed

using 2 pins only instead of 5 required by the JTAG (JTAG pins could be re-use as GPIO with alternate

function): the JTAG TMS and TCK pins are shared with SWDIO and SWCLK, respectively, and a specific

sequence on the TMS pin is used to switch between JTAG-DP and SW-DP.

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Symbol

Description

Min

Max

Unit

Tg

General Operating temperature

-30

85

° C

To

Operating temperature

-40

85

° C

Ts

Storage temperature

-40

85

° C

VDDIO

IO Power supply

0

3.6

V

VDDBAT

Power supply

0

3.6

V

RFi

RF input power

0 dBm

MSL

Moisture Sensitivity Level

3

RoHS

Restriction of Hazardous Substances

Compliant

Supply Power

Max +3.6 Volt

Non-Operating Temperature

- 30° to 85° Celsius

Voltage ripple

+/- 2%

Max. Values not exceeding operating

voltage

Symbol

Min.

Typ.

Max.

Unit

VDD

3.0

3.3

3.6

V

Operating Temperature

-20° to 70° Celsius

Humidity range

Max 95%, No condensing, relative humidity

4. Specification

4.1 General Specification

The absolute maximum rating are shown in the following table:

Table 3 Range of Operation – General Specification

ALXC2X DATASHEET

4.2 Voltages

Table 4 Range of Operation-temperature

Power supply for the ALXC2X Controller will be provided by the host via the power pins.

Table 5 Range of Operation - Voltages

4.3 Temperature and humidity

Table 6 Temperature and Humidity

The maximum operating ambient temperature can be up to 85° Celsius, but exposure to absolute-

maximum-rated conditions may cause performance degradation and affect device reliability.

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Features

Specification

WLAN Standards

IEEE802.11 b/g/n

Antenna

Ceramic Antenna

Frequency Band

2.412GHz – 2.484 GHz

ETSI: 2412MHz – 2472MHz

FCC: 2412Mhz-2462Mhz

Modulation

DSSS, CCK, OFDM, BPSK, QPSK, QAM

Support data rates

802.11b: 1, 2, 5.5, 11 (Mbps)

802.11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (Mbps)

Features

Specification

WLAN Standards

IEEE802.11 a/n

Antenna

Ceramic Antenna

Frequency Band

5.17GHz – 5.31GHz, 4.915GHz – 5.825GHz

ETSI: 5180Mhz-5240Mhz

FCC: 5180Mhz-5240Mhz, 5745Mhz-5825Mhz

Modulation

OFDM, BPSK, QPSK, QAM

Supports data rates

802.11a: 6, 9,12, 18,24,36,48,54 (Mbps)

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 (Mbps)

Mode

Conditions

Module Current

(mA)

Data Transfer Transmit TCP

10kbps data rate @baud rate = 921600 2.4G

66.49

Data Transfer Transmit TCP

10kbps data rate @ baud rate = 921600 5G

88.00

Data Transfer Transmit TCP

100kbps data rate @ baud rate = 921600 2.4G

69.34

Data Transfer Transmit TCP

100kbps data rate @ baud rate = 921600 5G

89.37

Data Transfer Transmit TCP

700kbps data rate @ baud rate = 921600 2.4G

78.31

Data Transfer Transmit TCP

700kbps data rate @ baud rate = 921600 5G

97.56

Idle

Remaining connected to AP, Power-Save mode

16.80

Sleep

Not connected to an AP

9.45

5. Wi-Fi RF Specification

5.1 RF Specification

The ALXC2X Controller complies with the following features and standards:

Table 7 2.4GHz Wireless Specification

ALXC2X DATASHEET

Table 8 5GHz Wireless Specification

5.2 Wi-Fi Power Consumption

WLAN system power consumption shows estimated typical values. Power consumption targets

referenced to VBAT @3.3V, 20°C.

Table 9 Wi-Fi Power Consumption

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5.3 Wi-Fi Sensitivity Specification

Receiver Characteristics

TYP.

Unit

PER <8%, Rx Sensitivity @ 1 Mbps DSSS

-88.1

dBm

PER < 8%, Rx Sensitivity @ 11 Mbps DSSS

-81.6

dBm

PER < 10%, Rx Sensitivity @ 6 Mbps OFDM

-83.4

dBm

PER < 10%, Rx Sensitivity @ 54 Mbps OFDM

-70.0

dBm

PER < 10%, Rx Sensitivity @ MCS0 800ns GI

-82.8

dBm

PER < 10%, Rx Sensitivity @ MCS7 800ns GI

-68.0

dBm

Receiver Characteristics

TYP.

Unit

PER <10%, Rx Sensitivity @ 6 Mbps OFDM

-81.5

dBm

PER < 10%, Rx Sensitivity @ 18 Mbps OFDM

-77.0

dBm

PER < 10%, Rx Sensitivity @ 36 Mbps OFDM

-72.5

dBm

PER < 10%, Rx Sensitivity @ 54 Mbps OFDM

-66.1

dBm

PER < 10%, Rx Sensitivity @ MCS0 20Mbps 800ns GI

-81.5

dBm

PER < 10%, Rx Sensitivity @ MCS7 20Mbps 800ns GI

-67.5

dBm

RF Characteristics

TYP.

Unit

RF TX Power@11b,11 Mbps

18.2

dBm

RF TX Power@11g,54 Mbps

16.9

dBm

RF TX Power@11n,65 Mbps

16.8

dBm

RF Characteristics

TYP.

Unit

RF TX Power@11a,54 Mbps

14.5

dBm

RF TX Power@11n,65 Mbps

14.4

dBm

Table 10 Wi-Fi 2.4GHz Receiver Sensitivity Specification

Table 11 Wi-Fi 5GHz Receiver Sensitivity Specification

ALXC2X DATASHEET

5.4 Wi-Fi RF TX Specification

Table 12 Wi-Fi 2.4GHz RF TX Power Specification

Table 13 Wi-Fi 5GHz RF TX Power Specification

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6. BT Specification

Parameter

Conditions

Minimum

Typical

Maximum

Unit

Frequency range

–

2402 – 2480

MHz

Basic rate (GFSK)

–

10

12

–

dBm

QPSK Tx Power at Bluetooth

– 7 9

–

dBm

8PSK Tx Power at Bluetooth

– 7 2

–

dBm

Power control step

– 2 4 6 dB

Parameter

Conditions

Minimum

Typical

Maximum

Unit

Frequency range

–

2402

–

2480

MHz

RX sensitivity

GFSK,0.1%BER,1Mbps

–

-93.5

–

dBm

RX sensitivity

8-DPSK,0.01%BER,3Mbps

–

-89.5

–

dBm

Mode

Module Current(mA)

Power ON

5-8mA

Advertisement

4.33-10mA

Connected

3.37-3.44mA

Download

11mA

Sleep Mode

270-370uA

Deep Sleep

175-200uA,hareware HIDOFF 29.6uA

BR/EDR Data Transfer

16-48mA

6.1 RF Specification

Table 14 Bluetooth Transmitter RF Specifications

Table 15 Bluetooth Receiver RF Specifications

ALXC2X DATASHEET

6.2 BT Power Consumption

Table 16 BT Power Consumption

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7. Dimensions

Parameter

Typical

Units

Dimensions (L x W x H)

28.0 x 14.3 x 2.2

mm

Dimensions tolerances (L x W x H)

±0.2

mm

7.1 Physical Dimensions

Table 17 Physical Dimensions

7.2 Top View

ALXC2X DATASHEET

Figure 2 ALXC2X (Ceramic Antenna) Top View

7.3 PCB Footprint (Top View)

Figure 3 ALXC2X Pad Dimensions (Top View)

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8. Recommended Reflow Profile

Referred to IPC/JEDEC Standard

Peak Temperature < 250 ° C

Number of Times <= 2Times

ALXC2X DATASHEET

Figure 4 Reflow Profile

9. RoHS Declaration

To the best of our present knowledge, given our supplier declarations, this product does not contain

any substance that is banned by EU RoHS Directive 2011/65/EU and its amendment directives – XRF.

RoHS restricted substances are list below.

 Cadmium (Cd)

 Lead (Pb)

 Mercury (Hg)

 Hexavalent Chromium (Cr(VI))

 Polybrominated biphenyls (PBBs)

 Polybrominated diphenylether (PBDEs)

Alinket Proprietary & Confidential Information

E-mail: [e-mail] Website: http://www.alinket.com

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ALXC20A

2.4G/5G WiFi + BT/BLE 4.0 Combo Controller, On-Board Antenna

- ADC

Analog-to-Digital Converter

- AES

Audio Engineering Society

- ARM

Advanced RISC Machines

- CCK

Complementary Code Keying

- CMOS

Complementary Metal Oxide Semiconductor

- CPU

Central Processing Unit

- CRC

Cyclic Redundancy Code

- DMA

Direct Memory Access

- DSS

Direct Sequence Spread Spectrum

- EAP

Extension Authentication Protocol

- EVK

Evaluation Kit

- GPIO

General-Purpose Input-Output

- HNP

Host Negotiation Protocol

- I2C

Inter-Integrated Circuit

- IoT

Internet of Things

- I2S

Inter-IC Sound

- IC

Integrated Circuit

- IEEE

Institute of Electrical and Electronics Engineers

- ISM

Industrial

- IP

Internet Protocol

- JTAG

Joint Test Action Group

- LQFP

Low-profile Quad Flat Package

- MAC

Medium Access Control

- MSL

Moisture Sensitivity Level

- OFDM

Orthogonal Frequency Division Multiplexing

ALXC2X DATASHEET

10. Order Information

Table 18 Order Information

11. Technical Support Contact

For technical support, please mail [e-mail], or call 021-61048128.

Alinket Electronic Technology (Shanghai) Co., Ltd.

Floor 4, No.10, Lane 198, Zhangheng Road, Shanghai, 201204 P. R. China

Acronyms and Abbreviations

The following list of acronyms and abbreviations may appear in this document.

Alinket Proprietary & Confidential Information

E-mail: [e-mail] Website: http://www.alinket.com

ALXC2X DATASHEET

- OTG

On-The-Go

- PER

Packet Error Rate

- PLL

Phase Locked Logic

- PMU

Phasor Measurement Unit

- PWM

Pulse Width Modulation

- RC

Real Clock

- RTC

Real Time Clock

- RF

Radio Frequency

- ROHS

Restriction of Hazardous Substances

- SKU

Stock Keeping Unit

- SPI

Serial Peripheral Interface

- SRAM

Static Random Access Memory

- SRP

Session Request Protocol

- TLS

Transport Layer Security

- TCP

Transmission Control Protocol

- TKIP

Temporal Key Integrity Protocol

- USBH

Universal Serial Bus Host Mode

- USBD

Universal Serial Bus Device Mode

- UDP

User Datagram Protocol

- UART

universal asynchronous receiver/transmitter

- WAPI

WLAN Authentication and Privacy Infrastructure

- WiFi

Wireless Fidelity

- WLAN

Wireless Local Area Network

- WPA

Wi-Fi Protected Access

Notice:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)

This device may not cause harmful interference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

To satisfy FCC RF Exposure requirements for this transmission devices, a separation distance of 20cm
or more should be maintained between the antenna of this device and persons during operation. To
ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used
for this transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter. Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
The modular transmitter must be equipped with either a permanently affixed label or must be

capable of electronically displaying its FCC identification number：

(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC
identification number, and, if the FCC identification number is not visible when the module is installed
inside another device, then the outside of the device into which the module is installed must also
display a label referring to the enclosed module. This exterior label can use wording such as the
following: “Contains Transmitter Module FCC ID:2AELJ-ALXCOMBA.” Any similar wording that
expresses the same meaning may be used. The Grantee may either provide such a label, an example
of which must be included in the application for equipment authorization, or, must provide adequate
instructions along with the module which explain this requirement. In the latter case, a copy of these
instructions must be included in the application for equipment authorization.

E-mail: [e-mail] Website: http://www.alinket.com

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