ALE BTMOD02 User Manual
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Table of Content
1. GENERALITIES ............................................................................................................... 2
1.1 I
1.2 S
1.3 E
1.4 T
1.5 R
NTRODUCTION
............................................................................................................................................. 2
1.1.1 Overview .................................................................................................................................................. 2
1.1.2 Aim of the document ................................................................................................................................. 3
ERVICES PROVIDED BY THE FEATURE OR EQUIPMENT
XTERNAL INTERFACES
ERMINOLOGY / ABBREVIATIONS
ELATED DOCUMENTS
................................................................................................................................ 3
................................................................................................................. 5
................................................................................................................................. 6
................................................................................. 3
2. GENERAL REQUIREMENTS ........................................................................................ 7
2.1 F
2.2 S
2.3 E
EATURES
TANDARDS
..................................................................................................................................................... 7
.................................................................................................................................................. 7
2.2.1 BT related certification ............................................................................................................................ 7
NVIRONMENTAL REQUIREMENTS
................................................................................................................ 8
3. GENERAL DESCRIPTION ............................................................................................. 9
3.1 BT
3.2 BT
3.3 M
3.4 S
FUNCTION GLOBAL LOGICAL BLOC DIAGRAM
DAUGHTER BOARD BLOC DIAGRAM
ECHANICAL ASPECTS AND INTEGRATION
PECIFICATION
............................................................................................................................................ 11
......................................................................................................... 9
................................................................................................. 10
......................................................................................... 9
4. DETAILED TECHNICAL DESCRIPTION .................................................................. 12
4.1 E
4.2 R
4.3 L
4.4 S
4.5 C
LECTRONIC
............................................................................................................................................... 12
4.1.1 BT chip solution to be implemented ....................................................................................................... 12
4.1.2 Schematic ............................................................................................................................................... 13
ADIOFREQUENCY
...................................................................................................................................... 14
4.2.1 Antenna choice ....................................................................................................................................... 14
4.2.2 Immunity to external spurious and interferences ................................................................................... 15
4.2.3 Quality of supply .................................................................................................................................... 15
AYOUT
...................................................................................................................................................... 16
4.3.1 BTDB layout ........................................................................................................................................... 16
4.3.2 Place requirements of BTDB on mainboard .......................................................................................... 16
OFTWARE
ERTIFICATION
.................................................................................................................................................. 16
........................................................................................................................................... 17
4.5.1 General aspects on the “module” concept ............................................................................................ 17
5. THERMAL MANAGEMENT ........................................................................................ 18
6. RELIABILITY ................................................................................................................ 18
7. INDUSTRIAL CONSIDERATIONS .............................................................................. 18
7.1 M
7.2 R
7.3 T
7.4 M
ANUFACTURING
EQUIREMENTS
ESTABILITY
....................................................................................................................................... 18
.......................................................................................................................................... 18
............................................................................................................................................... 18
7.3.1 Testpoints................................................................................................................................................ 18
7.3.2 Test strategy ........................................................................................................................................... 19
7.3.3 Test method ............................................................................................................................................. 20
ECHANICAL ASSEMBLY / INDUSTRIAL FEASIBILITY
.................................................................................. 23
7.4.1 Board outline .......................................................................................................................................... 23
7.4.2 Board technology ................................................................................................................................... 23
7.4.3 Connections ............................................................................................................................................ 24
7.4.4 Mounting on the main board .................................................................................................................. 24
7.4.5 Shielding Mounting ................................................................................................................................ 26
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Generalities
1.1 Introduction
1.1.1 Overview
The main objectives for this board, discussed also with the marketing are:
• Get lowest cost solution to enable BT for a maximum of IP terminals
• Enable new usages like
o The phone is seen as a carkit for a smartphone
o The phone can exchange phonebook with a smartphone
o The phone can support tags through BT Low Energy
• From R&D point of view:
o The board must be small enough to be integrated easily into our ID.
o The board must integrate the antenna to avoid a re-certification for each phone
which would use it.
For this project, a pre-study has been done. See reference [1].
The choice is to do a daughter board with the chip CC2564C from Texas Instruments, with an
integrated antenna on the layout (Printed antenna).
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
Please note that changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates, uses
and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
not permitted
—Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
—Consult the dealer or an experienced radio/TV technician for help.
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage;
(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
CAN ICES-3 (B)/NMB-3(B)
1.1.2 Aim of the document
A pre-study has been done, in order to define the best choices for the whole solution, going from
antenna to the BT management software in the phone.
This document is intended to give all the technical inputs in order to make a BT daughter board
which will be used on the Alcatel-Lucent IP Phones.
A first step will be to use it on 8068s and 8078s, but we should care to make it possible to be used
also on nextgen phones and other projects.
1.2 Services provided by the feature or equipment
The BTDB will give a BT4.2 connectivity to the product where it is mounted into. The main reasons
of this daughter board are to have:
• A common function usable on several phones without the need of RF expertise and full
BT qualification
• A cost effective solution
1.3 External Interfaces
The interface signals are listed hereafter:
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Pin N° Name Function Type Voltage
5 GND
Keep feet on the ground.
Power
0V
6 HCI_RX
HS UART Receive up to
4Mbps
I
/PU 1.8V
1 GND
Keep feet on the ground. Power 0V
2 VDD_IO Direct path supply for 1.8V I/O pads. Power 1.8V
3 GND Keep feet on the ground. Power 0V
4 SLOW_CLK 32.768KHz +/- 250ppm I 1.8V
7 TX_DBG TI internal debug messages. Not used. O /PU 1.8V
8 HCI_CTS
HS UART flow control: data from BTDB to
Host allowed when low
I /PU 1.8V
9 GND Keep feet on the ground. Power 0V
10 GND Keep feet on the ground. Power 0V
11 HCI_RTS
HS UART flow control: data from host to
BTDB allowed when low
O /PU* 1.8V
12 HCI_TX HS UART Transmit up to 4Mbps O/PU* 1.8V
13 GND Keep feet on the ground. Power 0V
14 PCM_SYNC Frame synchro for audio data I/O /PD 1.8V
15 PCM_CLK Clock for audio data I/O /PD 1.8V
16 PCM_OUT Output of audio data. Maybe in tristate O /PD 1.8V
17 PCM_IN Input of audio data I 1.8V
18-23 GND
Keep feet on the ground. Power 0V
Disables BT chip when low (Pull down)
24 ENABLE
and performs internal reset of CC2564.
I /PD 1.8V
Minimum low state duration: 5ms
25 GND Keep feet on the ground. Power 0V
26 VDD_IN General supply I 2.2V-4.8V
27 GND
Keep feet on the ground. Power 0V
PU* : Pull-Up enabled only during ShutDown and DeepSleep phases (.
These correspond to the metal cut-holes. See chapter 7.4.3.
The VDD_IN pin can accept 2.2V to 4.8V. Typical value is 2.5V or 3.3V, but this depends on the
motherboard.
Check the CC2564C datasheet for more information.
The UART has by default the following characteristics (can be reprogrammed to up to 4Mbps)
not permitted
Check the CC2564C datasheet for more information.
This cabling supposes that the Host is in DTE mode. In case of DCE host, RTS and CTS are
straight, and not crossed.
CAUTION:
Only the following interfaces are fail safe (can stand an applied voltage when the device interface, or
the device is not powered (VDDio or VDDin not provided):
AUD_FSYNC, AUD_CLK, AUD_IN, AUD_OUT, SLOW_CLK
This means that the motherboard must not apply a voltage on HCI_RX, HCI_TX, HCI_CTS or
HCI_RTS pins before the VDDio is supplied. Even when VDDio is present, it is not allowed to
ENABLE the chip if VDDin is not present. See specification of CC2564 for more details.
The SLOW_CLK source must be stable within 2ms after the ENABLE LOW to HIGH transition.
ENABLE
Note: FAST CLOCK must be stable within 20ms of nSHUTD(ENABLE) going high. But according to TI FAE’s feedback,
the 20ms limit only applies to TCXO. Crystal is used in BTDB, which doesn’t need to follow the 20ms limit.
1.4 Terminology / Abbreviations
BTDB: BlueTooth Daughter Board
BT: BlueTooth
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LE: Low Energy
1.5 Related Documents
Alcatel documents
[1] Bluetooth: Pre-study of a low cost solution for
BT in Desktop Phones
[2] 8088 Hardware external specification 3AK_29000_0080_EDZZA
[3] ESD CSBU R&D - PB Design/Layout rules 8AL 51074 0003 DSZZA
[4] NOE3G INDUSTRIAL REQUIREMENTS
External documents
[5] All TI documents for CC2564 (upload) 3AK_29_CC256X_BLUETOOTH_02278
[6]
Document Reference number
3AK_29000_0041_BEZZA
3BN 69030 1403 MCASA
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2. General Requirements
2.1 Features
The board must provide the following features:
• Give dual mode BT connectivity (Classic & Low Energy), so BT4.1
• Integrate the antenna, done with copper tracks on the PCB
• Interface to the motherboard with UART and PCM, USB not required.
• Permit a very low cost solution.
• Give ease of re-use for other products (simple process, no RF expertise).
2.2 Standards
2.2.1 BT related certification
On the Bluetooth.org website, the existing certifications of BT solutions are listed.
The certification strategy will be as follows:
• Make a certification for the board, with embedded low part of the BT stack, and antenna
• Make a product certification, where the BTDB is in the Phone. Here we can take benefit
of the module certification
• Following the first product certification (ex: NOE3GEE), the next products which use the
BTDB will need minimum or no certification, on condition that the used upper BT stack (in
host processor) is the same as the one of NOE3GEE.
It is necessary to make a BT qualification for the BTDB with its antenna.
This will qualify:
• The hardware, radio parts
• The Lower part of the BT stack (below HCI interface) located in the BT chip
• The Upper part of the BT stack, which runs on the Host processor.
This is why, if we re-use this board, a big part of the certification does not need to be done.
See chapter 4.5.1 for discussion about the “module” aspect for BT certification.
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2.3 Environmental requirements
These are the same as for the terminal for which this board is intended. The tests are made on the
daughter board mounted in a final product, so they are part of the product qualification.
This BTDB board cannot be co-located with other transmitters. If mount this board on final product,
Should add FCC ID and IC information in the product label (FCC ID: OL3BTMOD02, IC: 1737DBTMOD02).
For a host manufacture’s using a certified modular, if (1) the module’s FCC ID is not visible when
installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is
visible; then an additional permanent label referring to the enclosed module: “Contains Transmitter
Module FCC ID: OL3BTMOD02, IC: 1737D-BTMOD02” or “Contains FCC ID: OL3BTMOD02,
Contains IC: 1737D-BTMOD02” must be used. The host OEM user manual must also contain clear
instructions on how end users can find and/or access the module and the FCC ID.
This equipment complies with radio frequency exposure limits set forth by the Innovation, Science
and Economic Development Canada for an uncontrolled environment.
This equipment should be installed and operated with a minimum distance of 15mm between the
device and the user or bystanders.
This device must not be co-located or operating in conjunction with any other antenna or transmitter.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par la
Innovation, Sciences et Développement économique Canada pour un environnement non contrôlé.
Cet équipement doit être installé et utilisé avec un minimum de 15mm de distance entre le dispositif
et l'utilisateur ou des tiers.
Ce dispositif ne doit pas être utilisé à proximité d’une autre antenne ou d’un autre émetteur.
For details see for example the Smart Deskphone 8088 HW external specification (see ref [2])
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