Design and specifications are subject to change without
•
notice.
Dolby noise reduction manufactured under license from
•
Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol
of Dolby Laboratories Licensing Corporation.
The word “BBE” and the “BBE symbol” are trademarks
•
of BBE Sound,Inc.
Under license from BBE Sound,Inc.
are trademarks
3
Page 4
PROTECTION OF EYES FROM LASER BEAM DURING SERVICING
This set employs laser. Therefore, be sure to follow carefully the
instructions below when servicing.
WARNING!
WHEN SERVICING, DO NOT APPROACH THE LASER EXIT
WITH THE EYE TOO CLOSELY. IN CASE IT IS NECESSARY TO
CONFIRM LASER BEAM EMISSION. BE SURE TO OBSERVE
FROM A DISTANCE OF MORE THAN 30cm FROM THE
SURFACE OF THE OBJECTIVE LENS ON THE OPTICAL
PICK-UP BLOCK.
Caution: Invisible laser radiation when
open and interlocks defeated avoid exposure to beam.
Advarsel:Usynling laserståling ved åbning,
når sikkerhedsafbrydere er ude af funktion.
Undgå udsættelse for stråling.
VAROITUS!
Laiteen Käyttäminen muulla kuin tässä käyttöohjeessa mainitulla tavalla saattaa altistaa käyt-täjän turvallisuusluokan 1 ylittävälle näkymättömälle lasersäteilylle.
VARNING!
Om apparaten används på annat sätt än vad som specificeras i
denna bruksanvising, kan användaren utsättas för osynling
laserstrålning, som överskrider gränsen för laserklass 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
ATTENTION
L'utilisation de commandes, réglages ou procédures autres que
ceux spécifiés peut entraîner une dangereuse exposition aux
radiations.
ADVARSEL!
Usynlig laserståling ved åbning, når sikkerhedsafbrydereer ude
af funktion. Undgå udsættelse for stråling.
This Compact Disc player is classified as a CLASS 1 LASER
product.
The CLASS 1 LASER PRODUCT label is located on the rear
exterior.
CLASS 1
KLASSE 1
LUOKAN 1
KLASS 1
LASER PRODUCT
LASER PRODUKT
LASER LAITE
LASER APPARAT
Precaution to replace Optical block
(KSM-620AAA)
Body or clothes electrostatic potential could ruin
laser diode in the optical block. Be sure ground
body and workbench, and use care the clothes
do not touch the diode.
1) After the connection, remove solder shown in
the right figure.
• Regarding connectors, they are not stocked as they are not the initial order items.
The connectors are available after they are supplied from connector manufacturers upon the order is received.
CHIP RESISTOR PART CODE
REF. NOPART NO.KANRIDESCRIPTION
NO.
L791 87-A50-027-010 COIL,1 POLE MPX(TOK)
L792 87-A50-027-010 COIL,1 POLE MPX(TOK)
L832 87-005-847-080 COIL,2.2UH(CECS)
L851 87-005-847-080 COIL,2.2UH(CECS)<EZ>
L941 87-A50-020-010 COIL,ANT LW(COI)
B 87-744-095-410 VT2+3-8 W/O SLOT CR2
C 87-B10-068-010 UTT2+3-6 W/O SLOT CR
D 8Z-CL1-034-010 S-SCREW,ZCL1
E 87-591-094-010 QIT+3-6 GOLD
F 87-067-761-010 TAPPING SCREW, BVT2+3-10
G 87-067-585-010 TAPPING SCREW, BVTT+4-6
H 87-751-095-410 VT2+3-8
I 87-067-584-010 TAPPING SCREW, BVT2+3-6
J 87-067-981-010 BVT2+3-6 BLK
NO.
COLOR NAME TABLE
Basic color symbolColorBasic color symbolColorBasic color symbolColor
BBlackCCreamDOrange
GGreenHGrayLBlue
LTTransparent BlueNGoldPPink
RRedSSilverSTTitan Silver
TBrownVVioletWWhite
WTTransparent WhiteYYellowYTTransparent Yellow
LMMetallic BlueLLLight BlueGTTransparent Green
LDDark BlueDTTransparent Orange
27
Page 20
MODEL NO. FD-LM88
DISASSEMBLY INSTRUCTIONS
1.Remove the two screws.
1
2.Remove the two screws.
28
2
Page 21
3.Remove the eight screws and remove the PANEL, REAR FD.
3
4.While moving up the rear of the PANEL, TOP, remove the PANEL, TOP by pulling it to the front.
29
Page 22
5. Remove the FFC and cord. Be careful that the FFC especially cannot be removed easily.
6.Remove the screws.
6
30
Page 23
7.Remove the two FFCs.
8.Remove the claw and remove the CABI FRFD together with the entire front board.
31
Page 24
9.While moving up the CD board and the function board, remove the CD board and the function board. You can locate the
mechanism deck.
C537 87-010-400-040 CAP,E 0.47-50
C538 87-010-400-040 CAP,E 0.47-50
C539 87-010-564-040 CAP,E 0.33-50 M
C540 87-010-564-040 CAP,E 0.33-50 M
C541 87-010-401-040 CAP,E 1-50 SME
C542 87-010-401-040 CAP,E 1-50 SME
C543 87-010-154-080 CAP CHIP 10P
C583 87-010-182-080 C-CAP,S 2200P-50 K B
C584 87-010-182-080 C-CAP,S 2200P-50 K B
C591 87-010-180-080 C-CER 1500P
C592 87-010-180-080 C-CER 1500P
C603 87-010-402-040 CAP,E 2.2-50 SME
C604 87-010-402-040 CAP,E 2.2-50 SME
C605 87-010-408-040 CAP,E 47-50 SME
C607 87-010-405-040 CAP,E 10-50
C621 87-010-401-040 CAP,E 1-50 SME
C622 87-010-401-040 CAP,E 1-50 SME
C653 87-010-404-040 CAP,E 4.7-50 SME
C654 87-010-404-040 CAP,E 4.7-50 SME
C655 87-010-404-040 CAP,E 4.7-50 SME
C656 87-010-404-040 CAP,E 4.7-50 SME
C657 87-010-188-080 CAP,CHIP 6800P
C658 87-010-188-080 CAP,CHIP 6800P
C659 87-012-140-080 CAP 470P
C660 87-012-140-080 CAP 470P
• Regarding connectors, they are not stocked as they are not the initial order items.
The connectors are available after they are supplied from connector manufacturers upon the order is received.
CHIP RESISTOR PART CODE
IC, M62495FP
Rog CURRENT
DETECTOR
TERMINAL
Chip Resistor Part Coding
88
A
Resistor Code
Chip resistor
WattageTypeTolerance
1/16W10055%CJ
1/16W
1/10W
1/8W
TRANSISTOR ILLUSTRATION
2SA933
1608
2125
3216
ECBECBECB
2SA1318
2SC2001
CSD655E
CSD1489B
KTC3198
5%
5%
5%
Symbol
CJ
CJ
CJ
KTA1266
Figure
Value of resistor
Form
L
B
2SA1235
2SC3052
DTA144TK
DTC114TK
RT1N144C
Dimensions (mm)
W
E
LW t
1.00.50.35104
t
1.60.80.45
21.25 0.45
1.6
0.55
3.2
C
G
2SK2158
Resistor Code
108
118
128
D
S
: A
: A
IC, BA3880FS
IC, MM1454XFBE
VCC
LINVREFQF1QF2QF3QF4QF5
161514131211109
+
–
QSurround
BIAS
+
–
12345678
RINPNRB/QDETQF6ROUTLOUTGND
–
+
3635
Page 28
WIRING-1 (CD)
CD C.B (COMPONENT SIDE)
14
1312111098
7
6
5
432
1
A
B
C
D
E
F
G
H
I
J
3837
Page 29
CD C.B (CONDUCTOR SIDE)
1
A
B
C
D
234567
8
9
10
111213
14
E
F
G
H
EZ MODEL
I
J
4039
Page 30
SCHEMATIC DIAGRAM-1 (CD 1/2)
4241
Page 31
SCHEMATIC DIAGRAM-2 (CD 2/2)
EZ MODEL
IC201
LC866560W-5M02FD
UNIT
4443
Page 32
WIRING-2 (TAPE)
1
A
B
C
D
234567
8
9
10
111213
14
E
F
G
H
I
J
K
4645
Page 33
WIRING-3 (KEY)
1
A
B
C
D
234567
8
9
10
111213
14
E
F
G
H
I
J
K
4847
Page 34
WIRING-4 (FUNC)
1
A
B
C
D
234567
8
9
10
111213
14
E
F
G
TO/FROM
H
I
TAPE C.B
CN302
DECK C.B
1
11
SW2
SW1
J
K
3
1
2
SW4
PH2PH1
SW3
5049
Page 35
SCHEMATIC DIAGRAM-3 (TAPE/FUNC/KEY)
M1
M2
DECK
C.B
SW3
SW2
SW1
PH1
PH2
SW4
5251
Page 36
TEST MODE
ELECTRICAL ADJUSTMENT
1. CD Test Mode
1-1. How to Start Up the CD Test Mode
While pressing the “CD OPEN/CLOSE” button, connect the AC plug to the power outlet.
When the CD test mode is started up, When the CD test mode starts up, all displays turn on.
Note: When the PANEL, TOP has been removed for each CHAS, GEAR, be sure to short pin-4 and pin-5 of the connector CN3 on
the CD board in order to recognize that the CD lid is closed.
1-2. Releasing the CD Test Mode
Remove the shorting between pin-4 and pin-5 of the connector CN3 on the CD board to return to the original setup.
Then press the POWER button or the FUNCTION button, or remove the AC plug from the power outlet to release the CD test
mode.
1-3. Function Description of the Test Mode
MODE
Start mode
Search mode
Play mode
Traverse mode
Sled mode
Note: If the focus search operation is continued for 10 minutes or longer, heating of the driver IC is accumulated to trigger the
protection circuit that will stop operation of the CD system. .Turn off the main power and re-start operation about 10 minutes
later.
Operation
Starting up the
test mode
9
2
;
6
5
Indication on display
CD TEST
CD
Track No. and
playing time are
displayed
Track No. and
playing time flash
CD TEST
Function
Continuous focus searching.
The pickup lens repeats the fullswing up-down motion * Note
Normal playback.
When the TOC reading is not
possible, the same movement as
in the search mode.
Playback PAUSE mode
The pickup moves to the
innermost track
The pickup moves to the
outermost track
Contents
Check APC circuit.
Laser current measurement.
Focus error waveform check.
Note: • Connect a probe (10: 1) of the oscilloscope test point
for adjustment.
• Connect ground (-) terminal of oscilloscope probe to
TP3 (VREF) for all adjustment.
1. Focus Bias Adjustment
Make the focus bias adjustment when replacing and repairing
the optical block.
Oscilloscope
(DC range)
TP1 (RF)
TP2 (VREF)
1) Connect an oscilloscope to test points TP1 (RF) and TP2
(VREF).
2) Turn on the power switch.
3) Insert test disc TCD-782 (YEDS-18) and play back the
second program.
4) Adjust SFR103 so that RF signal of the test point TP1 (RF) is
MAX and CLEARREST.
+
–
TP1
(RF)
1
TP2
(VREF)
IC1
TP3
(TE)
2. Tracking Balance Check
TP3 (TE)
TP2 (VREF)
1) Connect an oscilloscope to test points TP3 (TE) and TP2
(VREF).
2) Start up the CD test mode.
3) Insert the test disc TCD-782 (YEDS-18) and enter the
traverse mode of the CD test mode.
4) Confirm that the traverse waveform on an oscilloscope is
vertically symmetrical as shown in the figure below.
5) After confirming the waveform, release the CD test mode.
VREF
SFR130
CN2
R2
Oscilloscope
(DC range)
+
–
A
B
A=B
VOLT/DIV: 20mV
TIME/DIV: 1mS
EYE PATTERN
must be CLEAR and MAX.
VOLT/DIV: 0.5V
TIME/DIV: 0.5µS
MAX
1.8±0.1 Vp-p
0V
3. Laser Current Check
The current of the laser signal can be checked with the
voltages on both sides of R2 (voltage across 10 ).
The difference for the specified value shown on the label
must be within ± 6.0mA.
Laser current Iop =
5453
KSS-213F
15165
SG442
44.2mA
Voltage across R2
10Ω
Page 37
ELECTRICAL ADJUSTMENT
TAPE C.B
SFR351
SFR352
< DECK SECTION >
1. Record/Playback Frequency Response Characteristics Adjustment
Adjustment conditions
Settings:• Test tape: TTA-602
• Test point: LINE OUT (J701)
• Input signal: 1kHz/10kHz, AUX IN (J501)
• Adjustment locations: FORWARD direction ..... SFR351(Lch), SFR352 (Rch)
• Adjustment locations: REVERSE direction ....... SFR451 (Lch), SFR452 (Rch)
* Adjustment can be performed from the bottom of the cabinet.
Method: 1) Input the 1kHz signal and adjust the input signal level for -20 dB.
2) Set the XR-M88 into the record mode and record the 1kHz and 10kHz signals alternately.
3) Play back the segment that is recorded in step 2) and adjust SFR351 and SFR352 so that both the
1kHz and 10kHz signals have the same level within 0 dB +3/-4dB.
4) Perform the same adjustment by adjusting SFR451 and SFR452 in the REVERSE mode in the
same way.
SFR451
IC301
SFR452
55
Page 38
IC DESCRIPTION
IC, LC866560W-5M02FD
Pin No.Pin NameI/ODescription
1
2
O-MACMD
____________
I-SCMD
O
Command output to slave microprocessor.
I
Command input from slave microprocessor.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20, 21
22
23
O-ARDY
O-SREQ
I-MREQ
O-SURROUND
O-SRST
O-VOLCTL
P36
O-COIN
_____________
O-CKSFT
________
RST
I-DRF
I-SQOUT
VSS1
CF1
CF2
VDD1
____________
I-HOLD
I-KEY1, I-KEY2
AN3
AN4
—
—
Serial data send/receive preparation completion output for MD UNIT control. (TAPE
O
REC MUTE output).
Serial data transfer request for MD UNIT control. (FWD/RWD switching output
O
during TAPE PLAY/REC).
I
Serial data transfer request for MD UNIT control. (REC/PB switching output).
O
QSURROUND ON/OFF output.
O
Reset signal output to slave microprocessor.
O
Connected to VOL/P.EQ IC M62439SP pin-! CONT.
O
NC.
O
Connected to CD DSP LC78622E pin-56 COIN and CD ASP LA9240M pin-52 DAT.
O
Clock shift output. “L” at clock shift.
I
Microprocessor reset.
I
Connected to CD ASP LA9240M pin-54 DRF.
I
Connected to CD DSP LC78622E pin-55 SQOUT.
GND.
I
5.76 MHz. Connected to oscillator.
O
Microprocessor power supply. (µ-com 5V).
I
Hold state detection. (A/D).
I
KEY AD data input.
I
DECA MECA state detection input. (AD).
I
TAPE MUSIC SENSOR input. (A/D).
24
25
26
27
28
29
30-45
46
47-49
50
51
52
53-55
56
57
58
59
I-CDDSW
I-SPE
P87
I-WRQ
P72
I-RMC
T0-T15
VDD3
MODE1-MODE3
T.U.R
VP
I-SUP.R
PC5-PC7
I-AMST
I-AM10K
I-LW
I-SW
—
—
—
I
CD DOOR OPEN/CLOSE state detection input. (AD).
I
Spare level detection. (A/D).
I
NC.
I
Connected to CD DSP LC78622E pin-53 WRQ.
I
NC.
I
Remote control signal input.
NC.
Microprocessor power supply. (µ-com 5V).
I
DECK MECA state detection input.
I
Rotation detection of TAKE UP REEL of DECK MECA.
Connected to negative polarity power supply -VFL for FL.
I
Rotation detection of TAKE UP REEL of DECK MECA.
I
NC.
I
I
INITIAL DIODE MATRIX input.
I
I
56
Page 39
Pin No.Pin NameI/ODescription
60
61
62
63
64
65
66-71
72
73
74, 75
76, 77
78
79, 80
81
82
83, 84
85
I-OIRT
I-RDS
_________
I-BBE
_______________
I-DOLBY
_______
I-TAPE/MD
_____________
I-DEMO
PE2-PE7
VDD4
PF0
PF1, PF2
PF3, PF4
_____________________
I-DOOR DET
PF6, PF7
O-CDDOPEN
O-CDDCLOSE
PG2, PG3
O-BBEA
I
I
I
INITIAL DIODE MATRIX input.
I
I
I
NC.
I
Microprocessor power supply. (µ-com 5V).
—
DECK MECA MAIN MOTOR control output.
O
DECK MECA SUB control output.
O
NC.
—
Over-current detection input to the CD DOOR MOTOR.
I
NC.
—
CD DOOR OPEN control output.
O
CD DOOR CLOSE control output.
O
NC.
—
O
BBE LEVEL switching output.
86
O-BBEB
O
87
88
89
90
91
92
93
94
95
96
97
98
99
100
O-CD
_______________
O-MDRST
VSS2
VDD2
O-RWC
____________
O-CQCK
O-L.O.M
P07
O-SIN
I-SOUT
I-ACLK
O-MASO
___________
I-MASI
O-MACLK
Power supply control output of CD block.
O
MD UNIT 7ZG-9A reset signal output.
O
GND.
—
Microprocessor power supply. (µ-com 5V).
—
Connected to CD DSP LC78622E pin-59 RWC and CD ASP LA9240M pin-53 CF.
O
Connected to CD DSP LC78622E pin-57 CQCK and CD ASP LA9240M pin-51 CL.
O
LINE OUT MUTE output.
O
NC.
—
Serial data output for MD UNIT control.
O
Serial data input for MD UNIT control.(FWD REC BIAS control output).
I
Serial clock input for MD UNIT control. (RWD REC BIAS control output).
I
Serial data output to slave microprocessor.
O
Serial data input from slave microprocessor.
I
Transfer clock output to slave microprocessor.
O
____________
57
Page 40
IC, LA9241ML
Pin No.Pin NameI/ODescription
1
FIN2
Pin to which external pickup photo diode is connected. RF signal is created by adding
I
with the FIN1 pin signal. FE signal is created by subtracting from the FIN1 pin signal.
10
11
12
13
14
15
16
2
3
4
5
6
7
8
9
FIN1
E
F
TB
TE–
TE
TESI
SCI
TH
TA
TD–
TD
JP
TO
FD
I
Pin to which external pickup photo diode is connected.
Pin to which external pickup photo diode is connected. TE signal is created by
I
subtracting from the F pin signal.
I
Pin to which external pickup photo diode is connected.
I
DC component of the TE signal is input.
I
Pin to which external resistor setting the TE signal gain is connected between the TE pin.
O
TE signal output pin.
TES “Track Error Sense” comparator input pin. TE signal is passed through a band-
I
pass filter then input.
I
Shock detection signal input pin.
I
Tracking gain time constant setting pin.
O
TA amplifier output pin.
Pin to which external tracking phase compensation constants are connected between
I
the TD and VR pins.
I
Tracking phase compensation setting pin.
I
Tracking jump signal (kick pulse) amplitude setting pin.
O
Tracking control signal output pin.
O
Focusing control signal output pin.
17
18
19
20
21
22
23
24
25
26
27
28
29
30, 31
FD–
FA
FA–
FE
FE–
AGND
NC
SP
SPG
SP–
SPD
SLEQ
SLD
SL–, SL+
—
—
Pin to which external focusing phase compensation constants are connected between
I
the FD and FA pins.
Pin to which external focusing phase compensation constants are connected between
I
the FD– and FA– pins.
Pin to which external focusing phase compensation constants are connected between
I
the FA and FE pins.
O
FE signal output pin.
I
Pin to which external FE signal gain setting resistor is connected between the FE pin.
Analog signal GND.
No connection.
O
Single ended output of the CV+ and CV– pin input signal.
I
Pin to which external spindle gain setting resistor in 12 cm mode is connected.
Pin to which external spindle phase compensation constants are connected together
I
with SPD pin.
O
Spindle control signal output pin.
I
Pin to which external sled phase compensation constants are connected.
O
Sled control signal output pin.
I
Sled advance signal input pin from microprocessor.
32, 33
34
35
JP–, JP+
TGL
TOFF
I
Tracking jump signal input pin from DSP.
I
Tracking gain control signal input from DSP. Low gain when TGL = H.
I
Tracking off control signal input pin from DSP. Off when TOFF = H.
58
Page 41
Pin No.Pin NameI/ODescription
36
TES
O
Pin from which TES signal is output to DSP.
37
38
39, 40
41
42
43
44
45
46
47
48
49
50
51
52
HFL
SLOF
CV–, CV+
RFSM
RFS–
SLC
SLI
DGND
FSC
TBC
NC
DEF
CLK
CL
DAT
“High Frequency Level” is used to judge whether the main beam position is on top of
O
bit or on top of mirror.
I
Sled servo off control input pin.
I
CLV error signal input pin from DSP.
O
RF output pin.
RF gain setting and EFM signal 3T compensation constant setting pin together with
I
RFSM pin.
“Slice Level Control” is the output pin which controls the RF signal data slice level by
O
DSP.
I
Input pin which control the data slice level by the DSP.
—
Digital system GND.
O
Output pin to which external focus search smoothing capacitor is connected.
I
“Tracking Balance Control” EF balance variable range setting pin.
—
No connection.
O
Disc defect detector output pin.
I
Reference clock input pin. 4.23 MHz of the DSP is input.
Pin to which external bypass capacitor for reference voltage is connected.
O
Reference voltage output pin.
I
Disc defect detector time constant setting pin.
I
Pin to which external capacitor for RF signal peak holding is connected.
I
Pin to which external capacitor for RF signal bottom holding is connected.
O
APC circuit output pin.
I
APC circuit input pin.
—
RF system Vcc pin.
59
Page 42
IC, LC78622ED
Pin No.Pin NameI/ODescription
1
2
3
4
5
DEFI
TAI
PDO
VVSS
ISET
—
I
Defect sense signal (DEF) input pin. (Connect to 0V when not used).
I
O
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Phase comparator output pin to control external VCO.
GND pin for built-in VCO. Be sure to connect to 0V.
For PLL.
I
Pin to which external resistor adjusting the PD0 output current.
6
7
8
9
10
11
12, 13
14
15
16
17
18
19, 20
21
22
23
24-28
29
VVDD
FR
VSS
EFMO
EFMIN
TEST2
CLV+, CLV–
___
V/P
HFL
TES
TOFF
TGL
JP+, JP–
PCK
FSEQ
VDD
SL+ - PUIN
EMPH
—
—
O
O
O
O
O
O
O
O
—
I/O
O
Power supply pin for built-in VCO.
I
Pin for VCO frequency range adjustment.
Digital system GND. Be sure to connect to 0V.
EFM signal output pin.
For slice level control.
I
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
EFM signal input pin.
Disc motor control output. Three level output is possible using command.
Rough servo or phase control automatic selection monitoring output pin. Rough servo
at H. Phase servo at L.
I
Track detect signal input pin. Schmidt input.
I
Tracking error signal input pin. Schmidt input.
Tracking OFF output pin.
Tracking gain selection output pin. Gain boost at L.
Track jump control signal output pin. Three level output is possible using command.
EFM data playback clock monitoring pin 4.3218 MHz when phase is locked in.
Sync signal detection output pin. H when the sync signal which is detected from EFM
signal and thesync signal which is internally generated agree.
Digital system power supply pin.
The pin is controlled by the serial data
command from microprocessor. When
General purpose input/output pin 1 to 5.
the pin is not used, set the pin to the input
terminal and connect to 0V, or alternately
set the pin to output terminal and leave
the pin open.
De-emphasis monitor output pin. De-emphasis disc is being played back at H.
30
31
32, 33
34
35
36
37
38
39
40
41
42
C2F
DOUT
TEST3, TEST4
N.C.
MUTEL
LVDD
LCHO
LVSS
RVSS
RCHO
RVDD
MUTER
—
—
—
—
—
O
C2 flag output pin.
O
DIGITAL OUT output pin. (EIAJ format).
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Not used. Set the pin to open.
O
L-channel 1-bit DAC.
O
L-channel mute output pin.
L-channel power supply pin.
L-channel output pin.
L-channel GND. Be sure to connect to 0V.
R-channel GND. Be sure to connect to 0V.
O
R-channel output pin.
R-channel 1-bit DAC.
R-channel power supply pin.
O
R-channel mute output pin.
60
Page 43
Pin No.Pin NameI/ODescription
43
44
45
46
47
XVDD
XOUT
XIN
XVSS
SBSY
—
Crystal oscillator power supply pin.
O
Pin to which external 16.9344 MHz crystal oscillator is connected.
I
—
Crystal oscillator GND pin. Be sure to connect to 0V.
O
Subcode block sync signal output pin.
IC BLOCK DIAGRAM
IC, BA5936
Rog CURRENT
DETECTOR
TERMINAL
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
EFLG
PW
SFSY
SBCK
FSX
WRQ
RWC
SQOUT
COIN
___________
CQCK
________
RES
TST11
16M
4.2M
TEST5
______
CS
TEST1
O
C1, C2, single and dual correction monitoring pin.
O
Subcode P, Q, R, S, T, U and W output pin.
O
Subcode frame sync signal output pin. Falls down when subcode enters standby.
Subcode read clock input pin. Schmidt input. (Be sure to connected to 0V when not
I
in use.)
Pin outputting the 7.35 kHz sync signal which is generated by dividing frequency of
O
crystal oscillator.
O
Subcode Q output standby output pin.
I
Read/write control input pin. Schmidt input.
O
Subcode Q output pin.
I
Command input pin from microprocessor.
I
Command input read clock or subcode read input clock from SQOUT pin
I
LC78622 reset input pin. Set this pin to L once when the main power is turned on.
O
Test signal output pin. Use this pin as open (normally L output).
O
16.9344 MHz output pin.
O
4.2336 MHz output pin.
I
Test signal input pin with built-in pull-down resistor. Be sure to connect to 0V.
Chip select signal input pin with built-in pull-down resistor. Be sure to connect to 0V
I
while it is not controlling.
I
Test signal input pin without built-in pull-down resistor. Be sure to connect to 0V.
IC, M62495FP
IC, BA3880FS
Note: The same potential must be applied to the respective power supply terminals. (VDD, VVDD, LVDD, RVDD, XVDD)
21 S1-970-020-140 REC SENSOR R
22 S1-970-020-150 CR DETECTIVE PLATE HOLDER
23 S1-970-093-010 SUB MOTOR ASSY
24 S1-970-103-010 MAIN MOTOR ASSY
25 S1-970-100-020 M CONNECTOR ASSY
NO.
REF. NOPART NO.KANRIDESCRIPTION
NO.
26 S1-950-140-030 WIRE CLUMPER
27 S1-970-113-010 FL CAPSTAN ASSY
28 S1-970-110-060 MAIN BELT(G)
29 S1-970-120-010 CASE LIFTER B
30 S1-970-120-160 CASSETTE CASE R
31 S1-970-120-040 P.S ACTUATOR PLATE
32 S1-970-120-050 P.S SPRING
33 S1-970-120-030 PACK SLIDER
34 S1-950-080-220 RELL CAP
35 S1-970-080-120 REEL WING SPRING
36 S1-970-083-020 REEL ASSY(K)
37 S1-970-133-070 REEL PWB ASSY
A 87-267-545-310 CAMERA TAPPING SCREW S 2.0-2.5
B 87-263-033-010 SCREW,2.0-4.0
C 87-351-547-410 S TAPING SCREW(FOR CAMERA)M2-3
D 87-B10-255-010 TAMS SCREW M2-3
E 86-544-439-010 P.WASHER(CUT)0.85-2.8-0.25
F S9-W06-500-400 P.WASHER(CUT)1.55-3.5-0.5
G 87-081-978-010 P.WASHER 2.1-3.5-0.2
H 87-067-529-010 P.WASHER 2.1-3.5-0.35
I S1-821-120-230 PK COLLAR SCREW A
J S9-W06-400-700 HLW WASHER(CUT)2.1-4.0-0.35
D
F
34
35
36
22
J
7
F
1
9
E
8
19
18
B
11
G
37
6
10
3
4
5
A
H
27
12
2
16
14
17
I
28
6665
Page 46
CD MECHANISM EXPLODED VIEW 1/1
MODEL NO. SX-LM200
SPEAKER DISASSEMBLY INSTRUCTIONS
Type.1
Type.4
Insert a flat-bladed screwdriver into the position indicated by the
arrows and remove the panel. Remove the screws of each speaker
unit andthen remove the speaker units.
A
C
TOOLS
1 Plastic head hammer
2 (-) flat head screwdriver
3 Cut chisel
6
7
1
123
2
5
Type.2
Remove the grill frame and four pieces of rubber caps by pulling
out with a flat-bladed screwdriver. Remove the screws from hold
where installed rubber caps. Insert a flat-bladed screwdriver into
the position indicated by the arrows and remove the panel. Re-
3
move the screws of each speaker unit and then remove the speaker
units.
How to Remove the PANEL, FR
1.Insert the (-) flat head screwdriver tip into the gap
between the PANEL, FR and the PANEL, SPKR. Tap
the head of the (-) flat head screwdriver with the plastic
hammer head, and create the clearance as shown in Fig-1.
2.Insert the cut chisel in the clearance, and tap the head of
the cut chisel with plastic hammer as shown in Fig-2, to
remove the PANEL, FR.
3.Place the speaker horizontally. Tap head of the cut
chisel with plastic hammer as shown in Fig-3, and
remove the PANEL, FR completely.
6 92-646-914-010 LACK SPRING
7 92-646-913-010 HOLDER
A 92-646-352-010 TAPPING SCREW B2-8
B 92-627-668-010 SCREW M2-2.5
C 92-646-358-110 TAPPING SCREW B1.7-4
Type.3
Insert a flat-bladed screwdriver into the position indicated by the
arrows and remove the panel. Turn the speaker unit to counterclockwise direction while inserting a flat-bladed screwdriver into
4
one of the hollows arround speaker unit, and then remove the speaker
unit. After replacing the speaker unit, install it turnning to clockwise direction unitil "click" sound comes out.
Fig-1Fig-2
Fig-3
How to Attach the PANEL, FR
Attach the PANEL, FR to the PANEL, SPKR. Tap the four
corners of the PANEL, FR with the plastic hammer to fit the
PANEL, FR into the PANEL, SPKR completely.