Ai Thinker Technology ESP32S Users Manual

ESP-32S User Manual
ESP-32S User Manual
REV 1.0
2017.3
ESP-32S User Manual
FCC STATEMENT
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
operation.
Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
Please notice that if the FCC identification number is not visible when the module is installed inside another
device, then the outside of the device into which the module is installed must also display a label referring to
the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:
2AHMR-ESP32S” any similar wording that expresses the same meaning may be used.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cmbetween the radiator & your
body. This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or
install module.
The module is limited to installation in mobile application;
A separate approval is required for all other operating configurations, including portable configurations with
respect to Part 2.1093 and difference antenna configurations.
There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part
15B requirements.
Copyright © 2017 Ai-Thinker Technology Co., Ltd. All rights reserved.
ESP-32S User Manual
Contents
1.Preface
................................................................................................................................................
1
2. Pin Definitions
....................................................................................................................................
3
2.1 Pin Layout
.................................................................................................................................
3
2.2 Pin Description
.........................................................................................................................
4
2.3 Strapping Pins
...........................................................................................................................
5
3. Functional Description
.......................................................................................................................
7
3.1 CPU and Internal Memory
........................................................................................................
7
3.2 External Flash and SRAM
..........................................................................................................
7
3.3 Crystal Oscillators
.....................................................................................................................
7
3.4 Power Consumption
.................................................................................................................
8
3.5 Peripherals and Sensors
...........................................................................................................
9
3.5.1 Peripherals and Sensors Description
.............................................................................
9
3.5.2 Peripheral Schematics
.................................................................................................
14
4. Electrical Characteristics
..................................................................................................................
15
4.1 Absolute Maximum Ratings
...................................................................................................
15
4.2 Recommended Operating Conditions
....................................................................................
15
4.3 Digital Terminal Characteristics
.............................................................................................
15
4.4 Wi-Fi Radio
.............................................................................................................................
16
4.5 Bluetooth LE Radio
.................................................................................................................
16
4.5.1 Receiver
.......................................................................................................................
16
4.5.2 Transmit
......................................................................................................................
17
4.6 Reflow Profile
.........................................................................................................................
17
5. Schematics
.......................................................................................................................................
18
ESP-32S User Manual
Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com
1.Preface
ESP-32S is a powerful, generic Wi-Fi +BT+BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music
streaming and MP3 decoding.
At the core of this module is the ESP32-D0WDQ6 chip*, which is designed to be scalable and adaptive. There
are two CPU cores that can be individually controlled or powered, and the clock frequency is adjustable from
80 MHz to 240 MHz . The user may also power off the CPU and make use of the low-power coprocessor to
constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of
peripherals, ranging from capacitive touch sensors, Hall sensors, low-noise sense amplifiers, SD card
interface, Ethernet, high speed SDIO/SPI, UART, I2S and I2C.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be
targeted, and that the module is future proof: using Wi-Fi allows a large physical range and direct connection
to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the
phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5
µA, making it suitable for battery powered and wearable electronics applications. ESP-32S supports data
rates of up to 150 Mbps, and 22 dBm output power at the PA to ensure the widest physical range. As such
the chip does offer industry-leading specifications and the best performance for electronic integration, range,
power consumption, and connectivity.
The operating system chosen for ESP32 is free RTOS with LWIP; TLS 1.2 with hardware acceleration is built in
as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually
upgrade their products even after their release.
Table 1 provides the specifications of ESP-32S.
Table 1: ESP-32S Specifications
Categories
Items
Specifications
Wi-Fi
Standards
FCC/CE/IC/TELEC/KCC/SRRC/NCC
Protocols
802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard
interval support
Frequency range
2.4 2.5 GHz
Bluetooth
Protocols
Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with -98 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio
CVSD and SBC
ESP-32S User Manual
Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com
Categories
Items
Specifications
Hardware
Module interface SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S, I2C, IR
GPIO, capacitive touch sensor, ADC, DAC, LNA pre-
amplier
On-chip sensor
Hall sensor, temperature sensor
On-board clock
40 MHz crystal
Operating voltage
2.2 3.6V
Operating current
Average: 80 mA
Operating temperature range
-40°C ~ 85°C *
Ambient temperature range
Normal temperature
Package size
18 mm x 25.5 mm x 2.8 mm
Software
Wi-Fi mode
Station/SoftAP/SoftAP+Station/P2P
Security
WPA/WPA2/WPA2-Enterprise/WPS
Encryption
AES/RSA/ECC/SHA
Firmware upgrade
UART Download / OTA (via network) / download and
write firmware via host
Software development
Supports Cloud Server Development / SDK for custom
firmware development
Network protocols
IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT
User configuration
AT instruction set, cloud server, Android/iOS app
ESP-32S User Manual
Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com
2. Pin Definitions
2.1 Pin Layout
Figure 1: Top and Side View of ESP-32S
Table 2: ESP-32S Dimensions
Length
Width
Height
PAD size (bottom)
Pin pitch
Shielding can height
PCBthickness
18 mm
25.5 mm
2.8± 0.1 mm
0.85 mm x 0.9 mm
1.27 mm
2 mm
±0.1mm
ESP-32S User Manual
Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com
2.2 Pin Description
ESP -32S has 39 pins. See pin definitions in Table 3.
Table 3: ESP-32S Pin Definitions
Name
No.
Type
Function
GND
1PGround
3V32P
Power supply.
EN3I
Chip-enable signal. Active high.
SENSOR_VP
4IGPI036, SENS0R_VP, ADC_H, ADC1_CH0, RTC_GPI00
SENSOR_VN
5IGPI039, SENS0R_VN, ADC1_CH3, ADC_H, RTC_GPI03
IO34
6IGPI034, ADC1_CH6, RTC_GPI04
IO35
7IGPI035, ADC1_CH7, RTC_GPI05
IO32
8
I/O
GPI032, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4
T0UCH9, RTC_GPI09
IO33
9
I/O
GPI033, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
T0UCH8, RTC_GPI08
IO25
10
I/O
GPI025, DAC_1, ADC2_CH8, RTC_GPI06, EMAC_RXD0
IO26
11
I/O
GPI026, DAC_2, ADC2_CH9, RTC_GPI07, EMAC_RXD1
IO27
12
I/O
GPI027, ADC2_CH7, T0UCH7, RTC_GPI017, EMAC_RX_DV
IO14
13
I/O
GPraMADC2_CH6, T0UCH6,MTMS, HSPHKHS2_CLK, SD_CLK,
EMAC_TXD2
IO12
14
I/O
GPI012, ADC2_CH5, T0UCH5, RTC_GPI015, MTDL HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
GND
15PGround
IO13
16
I/O
GPI013, ADC2_CH4, T0UCH4, RTC_GPI014, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
SHD/SD2*
17
I/O
GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3*
18
I/O
GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD*
19
I/O
GPIO11, SD_CMD, SPICSO, HS1_CMD, U1RTS
SCK/CLK*
20
I/O
GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0*
21
I/O
GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1*
22
I/O
GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO 15
23
I/O
GPIO15, ADC2_CH3, T0UCH3, MTD0, HSPICSO, RTC_GPI013, HS2_CMD,
SD_CMD, EMAC_RXD3
IO 224I/O
GPIO2, ADC2_CH2, T0UCH2,HSPIWP, HS2_DATA0, SD_DATA0
IO 025I/O
GPIO0, ADC2_CH1, T0UCH1, CLK_0UT1, EMAC_TX_CLK
IO 426I/O
GPIO4,ADC2_CH0,T0UCH0, RTC_GPI010, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO 16
27
I/O
GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_0UT
IO 17
28
I/O
GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_0UT_180
IO 529I/O
GPIO5, VSPICSO, HS1_DATA6, EMAC_RX_CLK
IO18
30
I/O
GPIO18, VSPHKHS1_DATA7
IO19
31
I/O
GPIO19, VSPIQ, UOCTS, EMAC—TXDO
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