Ai Thinker Technology ESP 13 User manual

ESP-13 User Manaul

1. Preambles

ESP-13 WiFi module is developed by Ai-Thinker Co.,Ltd, core processor ESP8266 in smaller

sizes of the module encapsulates Tensilica L106 integrates industry-leading ultra low power 32-bit

MCU micro, with the 16-bit short mode, clock speed support 80 MHz, 160 MHz, supports the

RTOS, integrated Wi-Fi MAC/BB/RF/PA/LNA, on-board antennas.

The module supports standard IEEE802.11 b/g/n agreement, complete TCP/IP protocol stack.

Users can use the add modules to an existing device networking, or building a separate network

controller.

ESP8266 is high integration wireless SOCs, designed for space and power constrained mobile

platform designers. It provides unsurpassed ability to embed Wi-Fi capabilities within other

systems, or to function as a standalone

application, with the lowest cost, and minimal space requirement.

Figure 1 ESP8266EX Functional Block Diagram

ESP8266EX offers a complete and self-contained Wi-Fi networking solution; it can be used to

host the application or to offload Wi-Fi networking functions from another application processor.

When ESP8266EX hosts the application, it boots up directly from an external flash. In has

integrated cache to improve the performance of the system in such applications.

Alternately, serving as a Wi-Fi adapter, wireless internet access can be added to any micro

controllerbased design with simple connectivity (SPI/SDIO or I2C/UART interface).

ESP8266EX is among the most integrated WiFi chip in the industry; it integrates the antenna

switches, RF balun, power amplifier, low noise receive amplifier, filters, power management

modules, it requires minimal external circuitry, and the entire solution, including front-end

module, is designed to occupy minimal PCB area.

ESP8266EX also integrates an enhanced version of Tensilica’s L106 Diamond series 32-bit

processor, with on-chip SRAM, besides the Wi-Fi functionalities. ESP8266EX is often integrated

with external sensors and other application specific devices through its GPIOs; codes for such

applications are provided in examples in the SDK.

2.Features

• Support 802.11 b/g/n

• Integrated low power 32-bit MCU

• Integrated 10-bit ADC

• Integrated TCP/IP protocol stack

• Integrated TR switch, balun, LNA, power amplifier and matching network

• Integrated PLL, regulators, and power management units

• Supports antenna diversity

• Wi-Fi 2.4 GHz, support WPA/WPA2

• Support STA/AP/STA+AP operation modes

• Support Smart Link Function for both Android and iOS devices

• SDIO 2.0, (H) SPI, UART, I2C, I2S, IRDA, PWM, GPIO

• STBC, 1x1 MIMO, 2x1 MIMO

• A-MPDU & A-MSDU aggregation and 0.4s guard interval

• Deep sleep power <10uA, Power down leakage current < 5uA

• Wake up and transmit packets in < 2ms

• Standby power consumption of < 1.0mW (DTIM3)

• Onboard 3dBi gain PCB antenna

• Operating temperature range -20°C~+85°C