Surface Mount RF Schottky
Barrier Diodes
Technical Data
HSMS-280x Series
Features
• Surface Mount Packages
• High Breakdown Voltage
• Low FIT (Failure in Time)
Rate*
• Six-sigma Quality Level
• Single, Dual and Quad
Versions
• Tape and Reel Options
Available
• Lead-free Option Available
* For more information see the
Surface Mount Schottky Reliability
Data Sheet.
Description/Applications
These Schottky diodes are
specifically designed for both
analog and digital applications.
This series offers a wide range of
specifications and package
configurations to give the
designer wide flexibility. The
HSMS-280x series of diodes is
optimized for high voltage
applications.
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
SINGLE
3
12
#0
UNCONNECTED
PAIR
34
12
#5
SERIES
3
12
#2
RING
QUAD
34
12
#7
Package Lead Code
Identification, SOT-323
(Top View)
SINGLE
B
COMMON
ANODE
SERIES
C
COMMON
CATHODE
COMMON
ANODE
3
12
#3
BRIDGE
QUAD
34
12
#8
Package Lead Code
Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED PAIR
654
123
CATHODE QUAD
654
COMMON
CATHODE
K
COMMON
3
12
#4
UNCONNECTED
654
123
ANODE QUAD
654
TRIO
L
COMMON
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
E
F
123
M
BRIDGE
QUAD
654
123
P
123
N
RING
QUAD
654
123
R
Pin Connections and Package Marking, SOT-363
2
1
2
GUx
6
Notes:
1. Package marking provides
5
orientation and identification.
ESD WARNING:
Handling Precautions Should Be Taken
To Avoid Static Discharge.
2. See “Electrical Specifications” for
3
Absolute Maximum Ratings
4
appropriate package marking.
[1]
TC = 25°C
Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363
I
f
P
IV
T
j
T
stg
θ
jc
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TA = 25°C, Single Diode
Part Package Breakdown Forward Voltage Leakage Maximum Dynamic
Number Marking Lead Voltage Voltage VF (V) @ IR (nA) @ Capacitance Resistance
[5]
HSMS
2800 A0
2802 A2
2803 A3
2804 A4
2805 A5
2807 A7
2808 A8
280B A0
280C A2
280E A3
280F A4
280K AK
280L AL
280M H
280N N
280P AP
280R O
Test Conditions IR = 10 µAIF = 1 mA VF = 0 V IF = 5 mA
Notes:
1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.
3. Package marking code is in white.
4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
5. See section titled “Quad Capacitance.”
6. RD = RS + 5.2 Ω at 25°C and If = 5 mA.
7. Package marking code is laser marked.
Forward Current (1 µs Pulse) Amp 1 1
Peak Inverse Voltage V Same as V
BR
Same as V
BR
Junction Temperature °C 150 150
Storage Temperature °C -65 to 150 -65 to 150
Thermal Resistance
Code Code Configuration VBR (V) VF (mV) IF (mA) VR (V) CT (pF) RD (
[3]
0 Single 70 410 1.0 15 200 50 2.0 35
[3]
2 Series
[3]
3 Common Anode
[3]
4 Common Cathode
[3]
5 Unconnected Pair
[3]
7 Ring Quad
[3]
8 Bridge Quad
[7]
B Single
[7]
C Series
[7]
E Common Anode
[7]
F Common Cathode
[7]
K High Isolation
[7]
[7]
[7]
[7]
[7]
Unconnected Pair
L Unconnected Trio
M Common Cathode Quad
N Common Anode Quad
P Bridge Quad
R Ring Quad
[5]
[2]
°C/W 500 150
[4]
Maximum Maximum
Minimum Maximum Forward Reverse Typical
[5]
f = 1 MHz
ΩΩ
Ω)
ΩΩ
[6]
3
Quad Capacitance
Capacitance of Schottky diode
quads is measured using an
HP4271 LCR meter. This
instrument effectively isolates
individual diode branches from
In a quad, the diagonal capacitance is the capacitance between
points A and B as shown in the
figure below. The diagonal
capacitance is calculated using
the following formula
the others, allowing accurate
capacitance measurement of each
C
DIAGONAL
= _______ + _______
branch or each diode. The
conditions are: 20 mV R.M.S.
voltage at 1 MHz. Agilent defines
this measurement as “CM”, and it
C
1
is equivalent to the capacitance of
the diode by itself. The equivalent
diagonal and adjacent
capacitances can then be
C
C
2
calculated by the formulas given
below.
Linear Equivalent Circuit, Diode Chip
R
j
R
S
C
j
RS = series resistance (see Table of SPICE parameters)
= junction capacitance (see Table of SPICE parameters)
C
j
8.33 X 10
Rj =
I
where
I
= externally applied bias current in amps
b
I
= saturation current (see table of SPICE parameters)
s
T
= temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
b
+ I
-5
nT
s
C1 x C2 C3 x C
C1 + C2 C3 + C
C
3
C
4
The equivalent adjacent
capacitance is the capacitance
between points A and C in the
figure below. This capacitance is
calculated using the following
formula
4
4
C
ADJACENT
= C1 + ____________
1 1 1
–– + –– + ––
C2 C3C
A
This information does not apply
to cross-over quad diodes.
B
SPICE Parameters
Parameter Units HSMS-280x
B
V
C
J0
E
G
I
BV
I
S
N 1.08
R
S
P
B
P
T
M 0.5
V75
pF 1.6
eV 0.69
AE-5
A3E-8
Ω 30
V 0.65
1
4
2
4
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
100
10
1
0.1
– FORWARD CURRENT (mA)
F
I
0.01
0 0.1 0.30.2 0.5 0.60.4 0.80.7 0.9
VF – FORWARD VOLTAGE (V)
TA = +125°C
T
= +75°C
A
T
= +25°C
A
T
= –25°C
A
Figure 1. Forward Current vs.
Forward Voltage at Temperatures.
2
1.5
1
– CAPACITANCE (pF)
0.5
T
C
0
0102030 5040
VR – REVERSE VOLTAGE (V)
Figure 4. Total Capacitance vs.
Reverse Voltage.
100,000
10,000
1000
100
10
– REVERSE CURRENT (nA)
R
1
I
0102030 5040
VR – REVERSE VOLTAGE (V)
TA = +125°C
T
= +75°C
A
T
= +25°C
A
Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.
30
10
1
- FORWARD CURRENT (mA)
F
I
0.3
0.2 0.4 0.6 0.8 1.0 1.2 1.4
VF - FORWARD VOLTAGE (V)
IF (Left Scale)
∆VF (Right Scale)
Figure 5. Typical Vf Match, Pairs and
Quads.
1000
100
10
– DYNAMIC RESISTANCE (Ω)
D
R
1
0.1 1 100
IF – FORWARD CURRENT (mA)
Figure 3. Dynamic Resistance vs.
Forward Current.
30
10
1
- FORWARD VOLTAGE DIFFERENCE (mV)
F
0.3
∆V
10