Agilent HSMS-2800, HSMS-2802, HSMS-2803, HSMS-2804, HSMS-2805 Schematic [ru]

Surface Mount RF Schottky
Barrier Diodes

Technical Data

HSMS-280x Series

Features

• Surface Mount Packages

• High Breakdown Voltage

• Low FIT (Failure in Time)
Rate*

• Six-sigma Quality Level

• Single, Dual and Quad
Versions

• Tape and Reel Options
Available

• Lead-free Option Available

* For more information see the

Surface Mount Schottky Reliability
Data Sheet.

Description/Applications

These Schottky diodes are
specifically designed for both
analog and digital applications.
This series offers a wide range of
specifications and package
configurations to give the
designer wide flexibility. The
HSMS-280x series of diodes is
optimized for high voltage
applications.

Package Lead Code Identification, SOT-23/SOT-143
(Top View)

SINGLE

3

12

#0

UNCONNECTED

PAIR

34

12

#5

SERIES

3

12

#2

RING

QUAD

34

12

#7

Package Lead Code
Identification, SOT-323
(Top View)

SINGLE

B

COMMON

ANODE

SERIES

C

COMMON

CATHODE

COMMON

ANODE

3

12

#3

BRIDGE

QUAD

34

12

#8

Package Lead Code
Identification, SOT-363
(Top View)

HIGH ISOLATION

UNCONNECTED PAIR

654

123

CATHODE QUAD

654

COMMON

CATHODE

K

COMMON

3

12

#4

UNCONNECTED

654

123

ANODE QUAD

654

TRIO

L

COMMON

Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.

E

F

123

M

BRIDGE

QUAD

654

123

P

123

N

RING

QUAD

654

123

R

Pin Connections and Package Marking, SOT-363

2

1

2

GUx

6

Notes:

1. Package marking provides

5

orientation and identification.

ESD WARNING:

Handling Precautions Should Be Taken
To Avoid Static Discharge.

2. See “Electrical Specifications” for

3

Absolute Maximum Ratings

4

appropriate package marking.

[1]

TC = 25°C

Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363

I

f

P

IV

T

j

T

stg

θ

jc

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.

Electrical Specifications TA = 25°C, Single Diode

Part Package Breakdown Forward Voltage Leakage Maximum Dynamic

Number Marking Lead Voltage Voltage VF (V) @ IR (nA) @ Capacitance Resistance

[5]

HSMS

2800 A0
2802 A2
2803 A3
2804 A4
2805 A5
2807 A7
2808 A8

280B A0
280C A2
280E A3
280F A4
280K AK

280L AL
280M H
280N N

280P AP

280R O

Test Conditions IR = 10 µAIF = 1 mA VF = 0 V IF = 5 mA

Notes:

1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.

2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.

3. Package marking code is in white.

4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.

5. See section titled “Quad Capacitance.”

6. RD = RS + 5.2 Ω at 25°C and If = 5 mA.

7. Package marking code is laser marked.

Forward Current (1 µs Pulse) Amp 1 1

Peak Inverse Voltage V Same as V

BR

Same as V

BR

Junction Temperature °C 150 150

Storage Temperature °C -65 to 150 -65 to 150

Thermal Resistance

Code Code Configuration VBR (V) VF (mV) IF (mA) VR (V) CT (pF) RD (

[3]

0 Single 70 410 1.0 15 200 50 2.0 35

[3]

2 Series

[3]

3 Common Anode

[3]

4 Common Cathode

[3]

5 Unconnected Pair

[3]

7 Ring Quad

[3]

8 Bridge Quad

[7]

B Single

[7]

C Series

[7]

E Common Anode

[7]

F Common Cathode

[7]

K High Isolation

[7]

[7]

[7]

[7]

[7]

Unconnected Pair

L Unconnected Trio
M Common Cathode Quad
N Common Anode Quad

P Bridge Quad

R Ring Quad

[5]

[2]

°C/W 500 150

[4]

Maximum Maximum

Minimum Maximum Forward Reverse Typical

[5]

f = 1 MHz

ΩΩ

Ω)

ΩΩ

[6]

3

Quad Capacitance

Capacitance of Schottky diode
quads is measured using an
HP4271 LCR meter. This
instrument effectively isolates
individual diode branches from

In a quad, the diagonal capaci­tance is the capacitance between
points A and B as shown in the
figure below. The diagonal
capacitance is calculated using
the following formula

the others, allowing accurate
capacitance measurement of each

C

DIAGONAL

= _______ + _______

branch or each diode. The
conditions are: 20 mV R.M.S.
voltage at 1 MHz. Agilent defines
this measurement as “CM”, and it

C

1

is equivalent to the capacitance of
the diode by itself. The equivalent
diagonal and adjacent
capacitances can then be

C

C

2

calculated by the formulas given
below.

Linear Equivalent Circuit, Diode Chip

R

j

R

S

C

j

RS = series resistance (see Table of SPICE parameters)

= junction capacitance (see Table of SPICE parameters)

C

j

8.33 X 10

Rj =

I

where
I

= externally applied bias current in amps

b

I

= saturation current (see table of SPICE parameters)

s

T

= temperature, °K

n = ideality factor (see table of SPICE parameters)

Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.

b

+ I

-5

nT

s

C1 x C2 C3 x C

C1 + C2 C3 + C

C

3

C

4

The equivalent adjacent
capacitance is the capacitance
between points A and C in the
figure below. This capacitance is
calculated using the following
formula

4

4

C

ADJACENT

= C1 + ____________

1 1 1

–– + –– + ––

C2 C3C

A

This information does not apply
to cross-over quad diodes.

B

SPICE Parameters

Parameter Units HSMS-280x

B

V

C

J0

E

G

I

BV

I

S

N 1.08

R

S

P

B

P

T

M 0.5

V75
pF 1.6
eV 0.69

AE-5

A3E-8

Ω 30

V 0.65

1

4

2

4

Typical Performance, TC = 25°C (unless otherwise noted), Single Diode

100

10

1

0.1

– FORWARD CURRENT (mA)

F

I

0.01
0 0.1 0.30.2 0.5 0.60.4 0.80.7 0.9

VF – FORWARD VOLTAGE (V)

TA = +125°C
T

= +75°C

A

T

= +25°C

A

T

= –25°C

A

Figure 1. Forward Current vs.
Forward Voltage at Temperatures.

2

1.5

1

– CAPACITANCE (pF)

0.5

T

C

0

0102030 5040

VR – REVERSE VOLTAGE (V)

Figure 4. Total Capacitance vs.
Reverse Voltage.

100,000

10,000

1000

100

10

– REVERSE CURRENT (nA)

R

1

I

0102030 5040

VR – REVERSE VOLTAGE (V)

TA = +125°C
T

= +75°C

A

T

= +25°C

A

Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.

30

10

1

- FORWARD CURRENT (mA)

F

I

0.3

0.2 0.4 0.6 0.8 1.0 1.2 1.4

VF - FORWARD VOLTAGE (V)

IF (Left Scale)

∆VF (Right Scale)

Figure 5. Typical Vf Match, Pairs and
Quads.

1000

100

10

– DYNAMIC RESISTANCE (Ω)

D

R

1

0.1 1 100

IF – FORWARD CURRENT (mA)

Figure 3. Dynamic Resistance vs.
Forward Current.

30

10

1

- FORWARD VOLTAGE DIFFERENCE (mV)

F

0.3

∆V

10

5

Applications Information

Introduction —
Product Selection

Agilent’s family of Schottky
products provides unique solu­tions to many design problems.

The first step in choosing the right
product is to select the diode type.
All of the products in the
HSMS-280x family use the same
diode chip, and the same is true of
the HSMS-281x and HSMS-282x
families. Each family has a
different set of characteristics
which can be compared most
easily by consulting the SPICE
parameters in Table 1.

A review of these data shows that
the HSMS-280x family has the
highest breakdown voltage, but at
the expense of a high value of
series resistance (Rs). In applica­tions which do not require high
voltage the HSMS-282x family,
with a lower value of series

resistance, will offer higher
current carrying capacity and
better performance. The HSMS­281x family is a hybrid Schottky
(as is the HSMS-280x), offering
lower 1/f or flicker noise than the
HSMS-282x family.

In general, the HSMS-282x family
should be the designer’s first
choice, with the -280x family
reserved for high voltage applica­tions and the HSMS-281x family
for low flicker noise applications.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 6
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto­mated assembly equipment
without adding parasitics that
could impair the performance.

0.026

0.07

0.035

0.016

Figure 6. PCB Pad Layout
(dimensions in inches).

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout
for the miniature SOT-363 (SC-70,
6 lead) package is shown in
Figure 7 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assembly
equipment without adding
parasitics that could impair the
performance.

0.026

Table 1. Typical SPICE Parameters.

Parameter Units HSMS-280x HSMS-281x HSMS-282x

B

V

C

J0

E

G

I

BV

I

S

V75 25 15
pF 1.6 1.1 0.7
eV 0.69 0.69 0.69

A 1 E-5 1 E-5 1 E-4

A 3 E-8 4.8 E-9 2.2 E-8

N 1.08 1.08 1.08

R

S

Ω 30 10 6.0

PB (VJ) V 0.65 0.65 0.65

PT (XTI) 2 2 2

M 0.5 0.5 0.5

0.075

0.035

0.016

Figure 7. PCB Pad Layout
(dimensions in inches).

6

SMT Assembly

Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.

Agilent’s SOT diodes have been
qualified to the time-temperature
profile shown in Figure 8. This
profile is representative of an IR
reflow type of surface mount
assembly process.

After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat­ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.

The rates of change of tempera­ture for the ramp-up and cool­down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo­nents due to thermal shock. The
maximum temperature in the
reflow zone (T

) should not

MAX

exceed 235°C.

These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera­tures and times necessary to
achieve a uniform reflow of
solder.

250

200

150

100

TEMPERATURE (°C)

50

0

0

Figure 8. Surface Mount Assembly Profile.

60

Preheat

Zone

120 180 240 300

TIME (seconds)

Reflow

Zone

Cool Down

Zone

T

MAX

)

Part Number Ordering Information

)

)

No. of

Part Number Devices Container

HSMS-280x-TR2* 10000 13" Reel

HSMS-280x-TR1* 3000 7" Reel

HSMS-280x-BLK * 100 antistatic bag

x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L, M, N, P, R

For lead-free option, the part number will have the
character "G" at the end, eg. HSMS-280x-TR2G for a
10,000 lead-free reel.

Package Dimensions

Outline 23 (SOT-23)

1.02 (0.040)

PACKAGE
MARKING
CODE (XX)

0.60 (0.024)

0.45 (0.018)

0.89 (0.035)

0.10 (0.004)

0.013 (0.0005)

1

DIMENSIONS ARE IN MILLIMETERS (INCHES

3

X X X

2.04 (0.080)

1.78 (0.070)

TOP VIEW

3.06 (0.120)

2.80 (0.110)

SIDE VIEW

0.54 (0.021)

0.37 (0.015)

2

DATE CODE (X)

1.40 (0.055)

1.20 (0.047)

1.02 (0.041)

0.85 (0.033)

2.65 (0.104)

2.10 (0.083)

0.152 (0.006)

0.066 (0.003)

0.69 (0.027)

0.45 (0.018)

END VIEW

7

Outline SOT-323 (SC-70 3 Lead)

PACKAGE
MARKING
CODE (XX)

2.20 (0.087)

2.00 (0.079)

0.10 (0.004)

0.00 (0.00)

1.30 (0.051)
REF.

X X X

2.20 (0.087)

1.80 (0.071)

0.25 (0.010)

0.15 (0.006)

DIMENSIONS ARE IN MILLIMETERS (INCHES

1.35 (0.053)

1.15 (0.045)

0.650 BSC (0.025)

1.00 (0.039)

0.80 (0.031)

DATE CODE (X)

0.30 REF.

10°

0.30 (0.012)

0.10 (0.004)

0.425 (0.017)
TYP.

0.20 (0.008)

0.10 (0.004)

Outline 143 (SOT-143)

0.92 (0.036)

0.78 (0.031)

PACKAGE

MARKING

CODE (XX)

12

X X X

43

0.60 (0.024)

0.45 (0.018)

2.04 (0.080)

1.78 (0.070)

3.06 (0.120)

2.80 (0.110)

1.40 (0.055)

1.20 (0.047)

0.54 (0.021)

0.37 (0.015)

0.10 (0.004)

0.013 (0.0005)

DIMENSIONS ARE IN MILLIMETERS (INCHES)

DATE CODE (X)

1.04 (0.041)

0.85 (0.033)

2.65 (0.104)

2.10 (0.083)

0.15 (0.006)

0.09 (0.003)

0.69 (0.027)

0.45 (0.018)

Outline SOT-363 (SC-70 6 Lead)

PACKAGE
MARKING
CODE (XX)

2.20 (0.087)

2.00 (0.079)

0.10 (0.004)

0.00 (0.00)

0.25 (0.010)

0.15 (0.006)

1.30 (0.051)
REF.

X X X

2.20 (0.087)

1.80 (0.071)

DIMENSIONS ARE IN MILLIMETERS (INCHES

1.35 (0.053)

1.15 (0.045)

0.650 BSC (0.025)

1.00 (0.039)

0.80 (0.031)

DATE CODE (X)

0.30 REF.

10°

0.30 (0.012)

0.10 (0.004)

0.425 (0.017)
TYP.

0.20 (0.008)

0.10 (0.004)

8

p

W

W

W

Device Orientation

REEL

USER
FEED
DIRECTION

COVER TAPE

For Outline SOT-143

TOP VIEW

4 mm

8 mm

ABC ABC ABC ABC

Note: "AB" represents package marking code.
"C" re

resents date code.

CARRIER

TAPE

END VIE

For Outlines SOT-23, -323

TOP VIEW

4 mm

8 mm

ABC ABC ABC ABC

Note: "AB" represents package marking code.
"C" represents date code.

For Outline SOT-363

TOP VIEW

4 mm

8 mm

ABC ABC ABC ABC

Note: "AB" represents package marking code.
"C" represents date code.

END VIE

END VIE

Tape Dimensions and Product Orientation

For Outline SOT-23

P

P

0

t1

D

P

2

D

1

9

E

F

W

9° MAX

A

0

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

CAVITY

PERFORATION

CARRIER TAPE

DISTANCE
BETWEEN
CENTERLINE

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

DIAMETER
PITCH
POSITION

WIDTH
THICKNESS

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

For Outline SOT-143

P

P

0

t

1

Ko

8° MAX

A

3.15 ± 0.10

0

B

2.77 ± 0.10

0

1.22 ± 0.10

K

0

4.00 ± 0.10

P

1.00 + 0.05

D

1

D

1.50 + 0.10

P

4.00 ± 0.10

0

E

1.75 ± 0.10

Wt18.00 + 0.30 – 0.10

0.229 ± 0.013

F

3.50 ± 0.05

P

2.00 ± 0.05

2

D

P

2

13.5° MAX

B

0

0.124 ± 0.004

0.109 ± 0.004

0.048 ± 0.004

0.157 ± 0.004

0.039 ± 0.002

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

0.315 + 0.012 – 0.004

0.009 ± 0.0005

0.138 ± 0.002

0.079 ± 0.002

D

1

E

F

W

A

CAVITY

PERFORATION

CARRIER TAPE

DISTANCE

9° MAX 9° MAX

0

K

0

B

0

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

DIAMETER
PITCH
POSITION

WIDTH
THICKNESS

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

A

3.19 ± 0.10

0

B

2.80 ± 0.10

0

K

1.31 ± 0.10

0

P

4.00 ± 0.10

D

1.00 + 0.25

1

D

1.50 + 0.10

P

4.00 ± 0.10

0

E

1.75 ± 0.10

Wt18.00 + 0.30 – 0.10

0.254 ± 0.013

3.50 ± 0.05

F

2.00 ± 0.05

P

2

0.126 ± 0.004

0.110 ± 0.004

0.052 ± 0.004

0.157 ± 0.004

0.039 + 0.010

0.059 + 0.004

0.157 ± 0.004

0.069 ± 0.004

0.315+ 0.012 – 0.004

0.0100 ± 0.0005

0.138 ± 0.002

0.079 ± 0.002

Tape Dimensions and Product Orientation

For Outlines SOT-323, -363

P

P

0

C

t

(CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)

1

D

P

2

E

F

W

D

1

CAVITY

PERFORATION

CARRIER TAPE

COVER TAPE

DISTANCE

ANGLE

An

A

0

DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)

LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER

DIAMETER
PITCH
POSITION

WIDTH
THICKNESS

WIDTH
TAPE THICKNESS

CAVITY TO PERFORATION
(WIDTH DIRECTION)

CAVITY TO PERFORATION
(LENGTH DIRECTION)

FOR SOT-323 (SC70-3 LEAD) An 8°C MAX

FOR SOT-363 (SC70-6 LEAD) 10°C MAX

A

2.40 ± 0.10

0

2.40 ± 0.10

B

0

1.20 ± 0.10

K

0

4.00 ± 0.10

P

1.00 + 0.25

D

1

D

1.55 ± 0.05

P

4.00 ± 0.10

0

1.75 ± 0.10

E

W

8.00 ± 0.30

t

0.254 ± 0.02

1

C

5.4 ± 0.10

T

0.062 ± 0.001

t

3.50 ± 0.05

F

2.00 ± 0.05

P

2

0.094 ± 0.004

0.094 ± 0.004

0.047 ± 0.004

0.157 ± 0.004

0.039 + 0.010

0.061 ± 0.002

0.157 ± 0.004

0.069 ± 0.004

0.315 ± 0.012

0.0100 ± 0.0008

0.205 ± 0.004

0.0025 ± 0.00004

0.138 ± 0.002

0.079 ± 0.002

K

0

An

B

0

www.agilent.com/semiconductors

For product information and a complete list of
distributors, please go to our web site.

For technical assistance call:

Americas/Canada: [phone] or
[phone]

Europe: [phone]

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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5968-7960E
March 24, 2004
5989-0474EN