AGERE D2525P884, D2525P883, D2525P882, D2525P881, D2525P880 Datasheet

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Data Sheet March 2000
Wavelength-Selected D2525P
Isolated DFB Laser Module with PMF
The 1.5 µ m D2525P Laser Module is available in a 14-pin, her­metic, butterfly package.
Features
ITU wavelengths available from
1529.55 nm —1610.06 nm
Integrated optical isolator
High-performance, multiquantum-well (MQW), distributed-feedback (DFB) laser
Industry-standard, 14-pin butterfly package
Hermetic package
InGaAs, PIN photodetector back-facet monitor
Polarization-maintaining fiber pigtail
For use with lithium niobate modulators
High reliability
Narrow linewidth
High optical power available
Applications
Telecommunications — SONET/SDH OC-48/STM-16, OC-192/STM-64 — Extended and ultralong reach — Undersea systems — Dense WDM systems
Digital video
Description
The D2525P family of DFB laser modules is designed to be used with a lithium niobate external modulator (see Table 4). The laser module features a polarization-maintaining fiber (PMF) pigtail, enabling it to be directly connected to a modulator without the need of a polarization controller. The PMF maintains the polarization of the output light to a consistent ori­entation. This allows the D2525P to be used as a CW light source for systems requiring extremely low chirp such as undersea or 10 Gbits/s systems. The module contains a multiquantum-well (MQW), distributed­feedback (DFB) laser. This device nominally has an output power of 10 mW. The wavelength of the laser can be temperature-tuned for more precise wave­length selection by adjusting the temperature of the internal thermoelectric cooler.
Wavelength-Selected D2525P Data Sheet Isolated DFB Laser Module with PMF March 2000
22
Lucent Technologies Inc.
Description
(continued)
Controlled Feedback
The module contains an internal optical isolator that sup­presses optical feedback in laser-based, fiber-optic sys­tems. Light reflected back to the laser is attenuated a minimum of 30 dB.
Controlled T emperature
An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature of 25
°
C
for case temperatures from –40
°
C to +70 ° C. The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the back­facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in conjunction with control circuitry , can control optical po w er launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain consistent laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic, metal/ ceramic butterfly package that incorporates a bias tee that separates the dc-bias path from the RF input. The RF input has a nominal 25
impedance.
The laser module is equipped with
Fujikura
* polarization­maintaining fiber (PMF). The fiber is PANDA type and is the same fiber that is used on Lucent Technologies Microelec­tronics Group’s lithium niobate modulators. It has a mode field diameter of 10.5
µ
m, a cladding diameter of 123 µ m—
128
µ
m, and a loose tube jacketed fiber 900 µ m in diame-
ter. The pigtail is terminated with an
ST
®
ferrule
. Figure 1
shows the orientation of polarization in the fiber. Lucent’s optoelectronic components are being qualified to
rigorous internal standards that are consistent with
Telcor-
dia T echnologies
TR-NWT-000468. All design and manu-
facturing operations are
ISO
§
9001 certified. The module is
being fully qualified for central office applications.
*
Fujikura
is a registered trademark of Fujikura Ltd.
† The
ST
ferrule key is not aligned to slow axis of fiber. Connector is
intended for testing purposes only.
T elcordia Technologies
is a trademark of Bell Communications
Research, Inc.
§
ISO
is a registered trademark of The International Organization for
Standardization.
Figure 1. Polarization-Maintaining Fiber
Pin Information
1. A positive current through the thermoelectric heat pump cools the laser.
2. Both leads should be grounded for optimum performance.
Top view.
Figure 2. Circuit Schematic
Table 1. Pin Descriptions
Pin Name
1 Thermistor 2 Thermistor 3 Laser dc Bias (Cathode) (–) 4 Back-facet Monitor Anode (–) 5 Back-facet Monitor Cathode (+) 6 Thermoelectric Cooler (+)
1
7 Thermoelectric Cooler (–)
1
8 Case Ground
9 Case Ground 10 Case Ground 11 Laser Anode (+)
2
12 RF Laser Input Cathode (–) 13 Laser Anode (+)
2
14 Case Ground
1-771(C).a
CORE STRESS ROD
PRINCIPAL POLARIZATION AXIS
CLADDING INNER COATING
(SILICON & ACRYLATE) OUTER COATING
(ACRYLATE OR NYLON)
1-567
TEC
L1
160 nH
ISOLATOR
R1 20
PACKAGE
GROUNDS
–++ – –
+–+
7654 321
8 9 10 11 12 13
TH
10 k
14
Data Sheet Wavelength-Selected D2525P March 2000 Isolated DFB Laser Module with PMF
3
Lucent Technologies Inc.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso­lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.
* Does not apply to shipping container.
Parameter Symbol Min Max Unit
Laser Reverse Voltage V
RLMAX
—2 V
dc Forward Current I
FLMAX
225 mA
Operating Case Temperature Range T
C
–40 70
°
C
Storage Case Temperature Range* T
stg
–40 70
°
C
Photodiode Reverse Voltage V
RPDMAX
—10 V
Photodiode Forward Current I
FPDMAX
—2 mA
Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module from power supply switching transients, follow this turn-on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take proper precautions during both han­dling and testing. Follow guidelines such as JEDEC Publication No. 108-A (Dec. 1988).
Lucent employs a human-body model (HBM) for ESD­susceptibility testing and protection-design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard HBM (resistance = 1.5 k Ω , capacitance = 100 pF) is widely used and, therefore, can be used for comparison pur­poses. The HBM ESD threshold presented here was obtained using these circuit parameters:
Mounting Instructions
The minimum fiber bend radius is 1.50 in. To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in size. The surface finish of the heat sink should be better than 32 µ in. (0.8 µ m), and the surface flatness must be better than 0.001 in. (25.4 µ m). Using ther­mal conductive grease is optional; however, thermal performance can be improved by up to 5% if conduc­tive grease is applied between the bottom flange and the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see Out­line Diagram). The Fillister head diameter must not exceed 0.140 in. (3.55 mm). Do not apply more than 1 in.-lb. of torque to the screws.
Note: Dimensions are in inches and (millimeters).
Figure 3. Fillister Head Screw
Parameter Value Unit
Human-body Model >400 V
0.118 (3.00)
0.062 (1.58)
0.140 (3.56)
0.031 (0.79)
0.129 (3.28) R
0.086 (2.18)
0.041 (1.04)
1-532(C)
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