Aeroflex UTMC UT8Q512, UT7Q512 Datasheet

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UTXQ512 SRAM Frequently Asked Questions

Introduction:

The UTXQ512 are high-performance CMOS asynchronous static RAMs organized as 512K words by 8 bits. The following
are questions frequently asked regarding these devices. Detailed information on these devices can be found in the UTXQ512
Data Sheets.

Questions and Answers:

Question 1:)

Are the I/O of the 3.3V device compatible (interoperable) at 5V I/O?

Answer 1:)

- 5V is not compatible with 3.3 (100ns)

- 3V is not compatible with 5.0 (25ns)

Question 2:)

What are the die sizes for the 3.3V as the 5V?

Answer 2:)

- 5V UT7Q512 - 250mils x 430mils (100ns) - 32-lead ceramic flatpack

- 3V UT8Q512 - 264mils x 57mils (25ns) - 36-lead ceramic flatpack

- 3V and 5V UT9Q512 - 264mils x 57mils (25ns) - 36-lead ceramic flatpack

Question 3:)

Please provide the die size for the UT8Q512, 3.3V dice and the UT7Q512, 5.0V dice.

Answer 3:)

264mils x 572mils (see Figure 2 )

Question 4:)

If you cannot immediately provide die maps, please at least describe where the bond pads are on the die, i.e. are they
all at the top and bottom (along the short side only), or are there bond pads all around the die on all four sides.

Answer 4:)

Bonding on all 4 sides (see Figures 1 and 2)

Question 5:)

QML-T Flow, what does this offer?

Answer 5:)

QCOTS Flow (see the QML T Screening FAQs)
100% Aracor wafer screening

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2 test structures per wafer (100% wafers per lot)
2 wafer per lot mapped for assessment of intra wafer variability
Sample Cobalt screening
5 samples per lot (90% probability with 90% confidence level)
Structural analysis
Contact/Via/Poly
QML assembly (Group A, C, E, D3 and D4)
SMD procurement vehicle
Value added
Wafer street cleaning, eliminates pealing metal and shorts
Wafer Lot Assurance
Radiation performance (SEE and Total Dose)
Reliability assessment (Oxide integrity)
Fit Rate target < 10

Question 6:)

Do we get 100% visual inspection on the die?

Answer 6:)

Yes, Visual per Aeroflex UTMC’s QML Q (low magnification)

Question 7:)

Is the visual inspection performed Class A for Space.

Answer 7:)

Yes, Visual per Aeroflex UTMC’s QML Q (low magnification)

Question 8:)

Have all the die received 100% electrical probing?

Answer 8:)

At room temperature, by die supplier

Question 9:)

At what temperature has the die been probed? Ambient and Hot?

Answer 9:)

At room, by die supplier, not at hot

Question 10:)

Has SEM or Wafer Lot Acceptance been performed on the lot?

Answer 10:)

Yes, per Aeroflex UTMC’s QML T flow