Aeroflex UTMC UT54ACTS54, UT54ACS54 Datasheet

41 RadHard MSI Logic
UT54ACS54/UT54ACTS54
Radiation-Hardened
FEATURES
radiation-hardened CMOS
- Latchup immune
• High speed
• Low power consumption
• Available QML Q or V processes
• Flexible package
- 14-pin DIP
- 14-lead flatpack
DESCRIPTION
The UT54ACS54 and the UT54ACTS54 are 4-wide AND-OR­INVERT gates. The devices perform the Boolean function:
Y = AB+CD+EF+GH
The devices are characterized over full military temperature range of -55 C to +125 C.
FUNCTION TABLE
LOGIC SYMBOL
PINOUTS
14-Pin DIP
Top View
14-Lead Flatpack
Top View
LOGIC DIAGRAM
INPUT OUTPUT
A B C D E F G H Y H H X X X X X X L X X H H X X X X L X X X X H H X X L X X X X X X H H L
L X L X L X L X H X L X L X L X L H
(8)
Y
(1)
A
(13)
B
(2)
C
(3)
D
(4)
E
(5)
F
(9)
G
(10)
H
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and IEC Publication 617-12.
> 1&
&
&
&
1 2
3 4 5
7
6
14 13
12
11
10
8
9
A C
D E
F
NC
V
SS
V
DD
B NC NC H G Y
1 2
3 4 5
7
6
14
13 12 11 10
8
9
V
DD
B NC NC H G Y
A C
D E
F
NC
V
SS
H
G
F
E
A B
Y
C D
RadHard MSI Logic 42
UT54ACS54/UT54ACTS54
RADIATION HARDNESS SPECIFICATIONS
1
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER LIMIT UNITS
Total Dose 1.0E6 rads(Si)
SEU Threshold
2
80
MeV-cm2/mg
SEL Threshold 120
MeV-cm2/mg
Neutron Fluence 1.0E14
n/cm
2
SYMBOL PARAMETER LIMIT UNITS
V
DD
Supply voltage -0.3 to 7.0 V
V
I/O
Voltage any pin -.3 to VDD +.3 V
T
STG
Storage Temperature range -65 to +150 C
T
J
Maximum junction temperature +175 C
T
LS
Lead temperature (soldering 5 seconds) +300 C
JC
Thermal resistance junction to case 20 C/W
I
I
DC input current 10 mA
P
D
Maximum power dissipation 1 W
SYMBOL PARAMETER LIMIT UNITS
V
DD
Supply voltage 4.5 to 5.5 V
V
IN
Input voltage any pin 0 to V
DD
V
T
C
Temperature range -55 to + 125 C
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