Aeroflex UTMC UT54ACTS139, UT54ACS139 Datasheet
77 RadHard MSI Logic
UT54ACS139/UT54ACTS139
Radiation-Hardened
FEATURES
radiation-hardened CMOS
- Latchup immune
• High speed
• Low power consumption
• Single 5 volt supply
• Available QML Q or V processes
• Flexible package
- 16-pin DIP
- 16-lead flatpack
DESCRIPTION
The UT54ACS139 and the UT54ACTS139 are designed to be
used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times.
The devices consist of two individual two-line to four-line decoders in a single package. The active-low enable input can be
used as a data line in demultiplexing applications.
The devices are characterized over full military temperature
range of -55 C to +125 C.
FUNCTION TABLE
PINOUTS
16-Pin DIP
Top View
16-Lead Flatpack
Top View
LOGIC DIAGRAM
ENABLE
INPUTS
SELECT
INPUTS
OUTPUT
G B A Y0 Y1 Y2 Y3
H X X H H H H
L L L L H H H
L L H H L H H
L H L H H L H
L H H H H H L
1
2
3
4
5
7
6
16
15
14
13
12
10
11
IG
1A
1B
1Y0
1Y1
1Y2
1Y3
V
DD
2G
2A
2B
2Y0
2Y1
2Y2
8 9
V
SS
2Y3
1
2
3
4
5
7
6
16
15
14
13
12
10
11
V
DD
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
2G
2A
2B
2Y0
2Y1
2Y2
V
SS
2Y3
8 9
1Y0
1Y1
1Y2
1Y3
DATA
(4)
(5)
(6)
(7)
(1)
(2)
(3)
1G
1B
SELECT
2Y0
2Y1
2Y2
2Y3
(12)
(11)
(10)
(9)
(15)
(14)
(13)
2G
2B
SELECT
1A
2A
RadHard MSI Logic 78
UT54ACS139/UT54ACTS139
LOGIC SYMBOL
RADIATION HARDNESS SPECIFICATIONS
1
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
PARAMETER LIMIT UNITS
Total Dose 1.0E6 rads(Si)
SEU Threshold
2
80
MeV-cm2/mg
SEL Threshold 120
MeV-cm2/mg
Neutron Fluence 1.0E14
n/cm
2
(9)
2Y3
(2)
1A
(3)
1B
(1)
1G
(14)
2A
(13)
2B
(15)
2G
2
1
(10)
2Y2
(11)
2Y1
(12)
2Y0
(7)
1Y3
(6)
1Y2
(5)
1Y1
(4)
1Y0
X/Y
EN
1
2
0
3
(2)
1A
(3)
1B
(1)
1G
(14)
2A
(13)
2B
(15)
2G
1
0
DMUX
1
2
0
3
(9)
2Y3
(10)
2Y2
(11)
2Y1
(12)
2Y0
(7)
1Y3
(6)
1Y2
(5)
1Y1
(4)
1Y0
Note:
1. Logic symbols in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
G
0
3
---
SYMBOL PARAMETER LIMIT UNITS
V
DD
Supply voltage -0.3 to 7.0 V
V
I/O
Voltage any pin -.3 to VDD +.3 V
T
STG
Storage Temperature range -65 to +150 C
T
J
Maximum junction temperature +175 C
T
LS
Lead temperature (soldering 5 seconds) +300 C
JC
Thermal resistance junction to case 20 C/W
I
I
DC input current 10 mA
P
D
Maximum power dissipation 1 W
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