Aeroflex UTMC UT54ACTS244, UT54ACS244 Datasheet

UT54ACS244/UT54ACTS244
Radiation-Hardened Octal Buffers & Line Drivers, Three-State Outputs
FEATURES
Three-state outputs drive bus lines or buffer memory address
registers
radiation-hardened CMOS
- 20-pin DIP
- 20-lead flatpack
DESCRIPTION
The UT54ACS244 and the UT54ACTS244 are non-inverting octal buffer and line drivers which improve the performance and density of three-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The devices are characterized over full military temperature range of -55 C to +125 C.
FUNCTION TABLE
INPUTS OUTPUT
1G, 2G A Y
L L L L H H
H X Z
PINOUTS
1G 1A1 2Y4 1A2
2Y3 1A3 2Y2 1A4 2A2 2Y1 1Y4
V
SS
20-Pin DIP
Top View
1 20
1G
SS
2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11
1A1 2Y4 1A2 2Y3 1A3
2Y2 1A4 2A2 2Y1 1Y4
V
V
DD
2G 1Y1 2A4 1Y2 2A3
1Y3
2A1
20-Lead Flatpack
Top View
1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11
V
DD
2G 1Y1 2A4 1Y2 2A3 1Y3
2A1
LOGIC SYMBOL
(1)
1G EN
(2)
1A1
(4)
1A2
(6)
1A3
(8)
1A4
(19)
2G EN
(11)
2A1
(13)
2A2
(15)
2A3
(17)
2A4
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
(18) (16) (14) (12)
(9) (7) (5) (3)
1Y1 1Y2 1Y3 1Y4
2Y1 2Y2 2Y3 2Y4
159 RadHard MSI Logic
LOGIC DIAGRAM
UT54ACS244/UT54ACTS244
(1)
1G
1A1
1A2
1A3
1A4
(2)
(4)
(6)
(8)
(18)
(16)
(14)
(12)
1Y1
1Y2
1Y3
1Y4
RADIATION HARDNESS SPECIFICATIONS
PARAMETER LIMIT UNITS
Total Dose 1.0E6 rads(Si)
SEU Threshold
2
SEL Threshold 120
Neutron Fluence 1.0E14
(19)
2G
(11)
2A1
(13)
2A2
(15)
2A3
(17)
2A4
1
80
(9)
2Y1
(7)
2Y2
(5)
2Y3
(3)
2Y4
MeV-cm2/mg MeV-cm2/mg
2
n/cm
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL PARAMETER LIMIT UNITS
V
DD
V
I/O
T
STG
T
J
T
LS
JC
I
I
P
D
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Maximum junction temperature +175 C
Lead temperature (soldering 5 seconds) +300 C
Thermal resistance junction to case 20 C/W
Supply voltage -0.3 to 7.0 V
Voltage any pin -.3 to VDD +.3 V
Storage Temperature range -65 to +150 C
DC input current 10 mA
Maximum power dissipation 1 W
RadHard MSI Logic 160
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