Advanced Power Technology APT ARF1501 Datasheet

DGSS

RF POWER MOSFET

DSS

ARF1500

BeO 135-05

GSS

SS

ARF1501

D

G

S

N - CHANNEL ENHANCEMENT MODE 250V 1500W 40MHz

The ARF1501 is an RF power transistor designed for very high power scientific, commercial, medical and industrial RF
power generator and amplifier applications up to 40 MHz.

 Specified 300 Volt, 27.12 MHz Characteristics:

 Output Power = 900 Watts.
 Gain = 17dB (Class C)
 Efficiency > 75%

MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.

 High Performance Power RF Package.
 Very High Breakdown for Improved Ruggedness.
 Low Thermal Resistance.
 Nitride Passivated Die for Improved Reliability.

Symbol

V

DSS

V

DGO

I

V

P

TJ,T

T

Parameter

Drain-Source Voltage

Drain-Gate Voltage

Continuous Drain Current @ T

D

Gate-Source Voltage

GS

Total Device Dissipation @ T

D

Operating and Storage Junction Temperature Range

STG

Lead Temperature: 0.063" from Case for 10 Sec.

L

= 25°C

C

= 25°C

C

STATIC ELECTRICAL CHARACTERISTICS

Symbol

BV
V

DS

I

DSS

I

GSS

g

V

isolation

V

GS

Characteristic / Test Conditions

Drain-Source Breakdown Voltage (V

DSS

On State Drain Voltage

(ON)

1

(I

= 15A, VGS = 10V)

(ON)

D

Zero Gate Voltage Drain Current (V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Forward Transconductance (V

fs

RMS Voltage
Gate Threshold Voltage (VDS = VGS, ID = 50mA)

(TH)

(60Hz Sinewave from terminals to mounting surface for 1 minute)

DS

DS

DS

= 25V, ID = 12.5A)

= 0V, ID = 250 µA)

GS

= V

, VGS = 0V)

DSS

= 0.8 V

, VGS = 0V, TC = 125°C)

DSS

= 0V)

DS

ARF 1500

UNIT

1000

1000

Volts

30

±30

1500

Amps

Volts

Watts

-55 to 200

300

MIN TYP MAX

°C

UNIT

1000

Volts

9

100

1000

±400

3 5.3

2500

µA

nA

mhos

Volts

35

Volts

THERMAL CHARACTERISTICS

Symbol

R

R

USA: 405 S.W. Columbia Street Bend, Oregon 97702 -1035 Phone: [phone] FAX: [phone]

EUROPE: Chemin de Magret F-33700 Merignac - France Phone: [phone] FAX: [phone]

Characteristic (per package unless otherwise noted)

Junction to Case

θJC

Case to Sink

θCS

CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

(Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.)

APT Website - http://www.advancedpower.com

MIN TYP MAX

0.09

0.12

UNIT

°C/W

050-5982 Rev - 10-01

DYNAMIC CHARACTERISTICS

ARF1501

Symbol

C

iss

C

oss

C

rss

t

d(on)

t

r

t

d(off)

t

f

Characteristic

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-on Delay Time

Rise Time

Turn-off Delay Time

Fall Time

Test Conditions

V

= 0V

GS

VDS = 150V

f = 1 MHz

VGS = 15V

VDD = 0.5 V

ID = I

D[Cont.]

R

= 1.6 Ω

G

@ 25°C

DSS

FUNCTIONAL CHARACTERISTICS

Symbol

G

η
ψ

1

Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.

APT Reserves the right to change, without notice, the specifications and information contained herein.

PS

Characteristic

Common Source Amplifier Power Gain

Drain Efficiency

Electrical Ruggedness VSWR 20:1

Test Conditions

f = 27.12 MHz

= 0V VDD = 300V

V

GS

= 900W

P

out

MIN TYP MAX

UNIT

3600 5900

280 520

pF

108 200

715

510

ns

23 40

12 25

MIN TYP MAX

17 19

70 75

UNIT

dB

%

No Degradation in Output Power

G

dims: inches

ARF 1500

Heat Sink

1.065

D

S

.160

.045

.005

Clamp

Compliant
layer

D

SS

D SS

ARF1500

BeO 135-05

G

G

.207 .207.375

.105 typ.

Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting

surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance
between junctions and case mounting surface is 0.12 ˚C/W. When installed, an addi­tional thermal impedance of 0.09 ˚C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat­sink should incorporate a copper heat spreader to obtain best results.

The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.

.500

1.065

SS

SS

.500

HAZARDOUS MATERIAL

WARNING

The ceramic portion of the
device between leads and
mounting surface is beryllium
oxide. Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area. These devices
must never be thrown away with
general industrial or domestic
waste.

050-5982 Rev - 10-01