Advanced Power Technology APT APT10090SFLL, APT10090BFLL Datasheet

APT10090BFLL
APT10090SFLL
1000V 12A 0.900W
POWER MOS 7
TM
FREDFET
Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 and Qg. Power MOS 7
TM
combines lower conduction and switching losses
TM
by significantly lowering R
DS(ON)
along with exceptionally fast switching speeds inherent with APT's
BFLL
D3PAK
TO-247
SFLL
patented metal gate structure.
• Lower Input Capacitance • Increased Power Dissipation
• Lower Miller Capacitance •Easier To Drive
3
• Lower Gate Charge, Qg •TO-247 or Surface Mount D
FAST RECOVERY BODY DIODE
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E E
Parameter
Drain-Source Voltage Continuous Drain Current @ T
D
Pulsed Drain Current Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C
D
Linear Derating Factor Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current Repetitive Avalanche Energy
AR AS
ADVANCE TECHNICAL
Single Pulse Avalanche Energy
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
1
4
INFORMATION
PAK Package
G
APT10090
1000
12
48 ±30 ±40 300
2.4
-55 to 150 300
12 30
1210
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA 405 S.W. Columbia Street Bend, Oregon 97702 -1035 Phone: (541) 382-8028 FAX: (541) 388-0364 EUROPE Chemin de Magret F-33700 Merignac - France Phone: (33) 5 57 92 15 15 FAX: (33) 5 56 47 97 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
2
(V
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
MIN TYP MAX
1000
12
35
0.90 250
1000 ±100
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-7041 Rev A 8-2001
DYNAMIC CHARACTERISTICS
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
V
GS
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
RG = 0.6W
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
= 0V
= 15V
DSS
DSS
APT10090 BFLL - SFLL
MIN TYP MAX
2040
338
67 78 12 52 10
5
26
8
UNIT
pF
nC
ns
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
ADVANCE TECHNICAL
1
(Body Diode)
2
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µs) Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µs)
(VGS = 0V, IS = -ID [Cont.])
5
dt
INFORMATION
T
= 25°C 200
j
T
= 125°C 350
j
T
= 25°C 0.7
j
T
= 125°C 2.0
j
T
= 25°C 10
j
T
= 125°C 15
j
THERMAL CHARACTERISTICS
Symbol
R R
1
Repetitive Rating: Pulse width limited by maximum junction temperature.
2
Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
qJC
Junction to Ambient
qJA
3
See MIL-STD-750 Method 3471
4
Starting T
5dv
/
dt
device itself. I
+25°C, L = 16.8mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
£ -I
S
MIN TYP MAX
MIN TYP MAX
G
di
/
£ 700A/µs V
D[Cont.
dt
]
12 48
1.3 18
0.42 40
25W, Peak IL = 12A
=
£ V
R
DSS
T
UNIT
Amps
Volts
V/ns
ns
µC
Amps
UNIT
°C/W
£ 150°C
J
TO-247 Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
20.80 (.819)
Drain
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-7041 Rev A 8-2001
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
Dimensions in Millimeters and (Inches)
5.45 (.215) BSC 2-Plcs.
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate Drain Source
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
Drain
(Heat Sink)
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
{3 Plcs}
1.22 (.048)
1.32 (.052)
15.95 (.628)
16.05 (.632)
Dimensions in Millimeters (Inches)
Revised
4/18/95
13.79 (.543)
13.99 (.551)
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC {2 Plcs.}
Source
Drain
Gate
1.04 (.041)
1.15 (.045)
1.27 (.050)
1.40 (.055)
13.41 (.528)
13.51 (.532)
Revised 8/29/97
3.81 (.150)
4.06 (.160) (Base of Lead)
Heat Sink (Drain) and Leads are Plated
11.51 (.453)
11.61 (.457)
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