Advanced Power Technology APTM 20 TDUM 16 P Service Manual

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S
Triple dual common source
MOSFET Power Module
S1/S2
D3
G3
S3
S4
G4
D4
D1
G1
S1
S2
G2
D2
G1
S1
S3/S4
S2
G2
D 3 D 5
G3
S3
S4
G4
D 1
S1/S2
D 2
S3/S4
S5/S6
D5
G5
S5
S6
G6
D6
G5
S5
S6
G6
D 6D 4
S5/S6
Application
Features
Benefits
APTM20TDUM16P
V R
I
= 200V
DSS
= 16m max @ Tj = 25°C
DSon
= 104A @ Tc = 25°C
D
AC Switches
Switched Mode Power Supplies
Uninterruptible Power Supplies
Power MOS 7® MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate c harge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symme trical design
- Lead frames for power connections
High level of integration
Outstandi ng perfor mance at hi gh freque nc y ope ration
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Very low (12mm) profile
Each leg can be easily paralleled to achieve a dual
commo n source configuration of t hree ti mes the current capability
Absolute maximum ratings
ymbol Parameter Max ratings Unit
V
Drain - Source Breakdown Voltage 200 V
DSS
ID Conti nuous Drai n Current
Tc = 25°C 104 Tc = 80°C 74
A
IDM Pulsed Drain current 416 VGS Gate - Source Voltage ±30 V
R
Drain - Source ON Resistance 16
DSon
m
PD Maximum Power Dissipation Tc = 25°C 390 W
IAR Avalanche current (repetitive and non repetitive) 100 A EAR Repetitive Avalanche Energy 50 EAS Single Pulse Avalanche Energy 3000
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures S hould Be Followed.
mJ
APT website – http://www.advancedpower.com 1
APTM20TDUM16P – Rev 0 September, 2004
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APTM20TDUM16P
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
BV
Drain - Source Breakdown Voltage VGS = 0V, ID = 250µA 200 V
DSS
I
Zero Gate Voltage Drain Current
DSS
R
Drain – Source on Resistance VGS = 10V, ID = 52A
DS(on)
V
Gate Threshold Voltage VGS = VDS, ID = 2.5mA 3 5 V
GS(th )
I
Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±100 nA
GS S
VGS = 0V,VDS = 200V T
VGS = 0V,VDS = 160V T
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
Input Capacitance 7220
is s
C
Output Capacitance 2330
oss
C
Reverse Transfer Capacitance
rss
Qg Total gate Charge 140
Qgs Gate – Source Charge 53
Qgd Gate – Drain Charge
T
Tur n- o n Delay Ti me 32
d(on)
T
Rise Time 64
r
T
Turn-off Delay Time 88
d(off)
T
Fall Time
f
E
Tur n- o n Switchi ng E nergy X 849
on
E
Turn-off Switching Energy Y
off
VGS = 0V VDS = 25V f = 1MHz
VGS = 10V V
= 100V
Bus
ID =104A
Inductive switching @ 125°C
VGS = 15V V
= 133V
Bus
ID = 104A RG = 5
Inductive switching @ 25°C
VGS = 15V, V
= 133V
Bus
ID = 104A, RG = 5929
= 25°C 250
j
= 125°C 1000
j
16
146
67
116
µA
m
pF
nC
ns
µJ
E
Tur n- o n Switchi ng E nergy X 936
on
E
Turn-off Switching Energy Y
off
Inductive switching @ 125°C
VGS = 15V, V
= 133V
Bus
ID = 104A, RG = 5
µJ
986
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Conti nuous So urce c urrent
IS
(Body diode)
Tc = 25°C 104 Tc = 80°C 74
A
VSD Diode Forward Voltage VGS = 0V, IS = - 104A 1.3 V
dv/dt Peak Diode Recovery Z 5 V/ns
trr Reverse Recovery Time Tj = 25°C 360 ns
IS = - 104A VR = 133V
Qrr Reverse Recovery Charge
diS/dt = 100A/µs
Tj = 25°C 6.7 µC
X Eon includes diode reverse recovery. Y In accordance with JEDEC standard JESD24-1. Z dv/dt numbers reflect the li mitations of the circuit rather than the device itself.
IS - 104A di/dt 700A/µs VR V
Tj 150°C
DSS
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APTM20TDUM16P – Rev 0 September, 2004
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APTM20TDUM16P
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
R
Junction to Case IGBT 0.32 °C/W
thJC
V
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
ISOL
TJ Operating junction temperature range -40 150
T
Storage Temperature Range -40 125
STG
TC Operating Case Temperature -40 100
Torque Mounting torque To heatsink M6 3 5 N.m
Wt Package Weight 250 g
Package outline
5 places (3:1)
°C
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APTM20TDUM16P – Rev 0 September, 2004
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Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.35
0.9
0.3
APTM20TDUM16P
0.25
0.2
0.7
0.5
0.15
0.3
0.1
0.05
Thermal Impedance (°C/W)
0.1
0.05
0
Single Pulse
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Low Voltage Output Characteristics Transfert Characteristics
350
300
VGS=15V
10V
250
200
150
100
, Drain Current (A)
D
I
50
0
0 4 8 12 16 20 24 28
V
, Drain to Source Voltage (V)
DS
9V
8.5 V
8V
7.5V
7V
6.5V
300
VDS > ID(on)xRDS(on)MAX 250µs pulse test @ < 0.5 duty cycle
250
200
150
100
, Drain Current (A)
D
I
50
TJ=25°C
TJ=125°C
0
0123 4567 8910
V
, Gate to Source Voltage (V)
GS
TJ=-55°C
R
vs Drain Current
DS(o n)
1.2
Normalized to V
=10V @ 52A
GS
1.1
1
0.9
Drain to Source ON Resistance
0.8 0 25 50 75 100 125 150
DS(on)
R
, Drain Cu rrent (A)
I
D
VGS=10 V
VGS=20V
DC Drain Current vs Case Temperature
120
100
80
60
40
, DC Drain Current (A)
20
D
I
0
25 50 75 100 125 150
T
, Case Temperature (°C)
C
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APTM20TDUM16P – Rev 0 September, 2004
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APTM20TDUM16P
g
(
)
, Drain to Source Breakdown
DSS
BV
(TH), Threshold Voltage
GS
V
Breakdown Voltage vs Temperature
1.15
1.10
1.05
Normalized
1.00
e
0.95
Volta
0.90
-50 -25 0 25 50 75 100 125 150
T
, Junction Temperature (°C)
J
Threshold Voltage vs Temperature
1.2
1.1
1.0
0.9
0.8
(Normalized)
0.7
0.6
-50 -25 0 25 50 75 100 125 150
T
, Case Temperature (°C)
C
ON resistance vs Temperature
2.5
VGS=10V
= 52A
I
D
2.0
1.5
1.0
(Normalized)
0.5
0.0
-50 -25 0 25 50 75 100 125 150
RDS(on), Drain to Source ON resistance
, Junction Temperature (°C)
T
J
Maximum Safe Operating Area
1000
limited by R
DS on
100
10
, Drain Current (A)
D
I
Single pulse T
=150°C
J
1
1 10 100 1000
, Drain to Source Voltage (V)
V
DS
100µs
1ms
10ms
100ms
Capacitance vs Drain to Source Voltage
100000
10000
Ciss
Coss
Gate Charge vs Gate to Source Voltage
14
ID=104A
12
T
=25°C
J
VDS=40V
VDS=100V
10
8
VDS=160V
6
1000
C, Capacitance (pF)
Crss
100
0 1020304050
, Drain to Source Voltage (V)
V
DS
4
2
, Gate to Source Voltage (V)
GS
V
0
0 20 40 60 80 100 120 140 160
Gate Charge (nC)
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APTM20TDUM16P – Rev 0 September, 2004
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APTM20TDUM16P
t
Delay Times vs Current
120
100
(ns)
80
60
40
20
VDS=133V
=5
R
G
T
=125°C
J
L=100µH
d(off)
and t
d(o n)
t
0
0 25 50 75 100 125 150 175
I
, Drain Current (A)
D
Switching Energy vs Current
2
VDS=133V
=5
R
G
T
=125°C
1.5
J
(mJ)
off
L=100µH
1
and E
on
E
0.5
t
E
d(off)
t
off
d(on)
Rise and Fall times vs Current
160
VDS=133V
140
120
100
(ns)
f
and t
r
t
80
60
=5
R
G
=125°C
T
J
L=100µH
t
f
t
r
40
20
0
0 25 50 75 100 125 150 175
, Drain Current (A)
I
D
Switching Energy vs Gate Resistance
3
VDS=133V
=104A
I
D
2.5
=125°C
T
J
E
on
L=100µH
2
1.5
1
Switching Energy (mJ)
E
off
E
on
0
0 25 50 75 100 125 150 175
, Drain Current (A)
I
D
Operating Frequency vs Drain Curren
300
250
200
VDS=133V D=50%
=5
R
G
=125°C
T
J
0.5
0 5 10 15 20 25 30 35 40 45 50
Gate Resistance (Ohms)
Source to Drain Diode Forward Voltage
1000
TJ=150°C
100
150
TJ=25°C
100
10
Frequency (kHz)
50
0
25 38 50 63 75 88 100
I
, Drain Current (A)
D
, Reverse Drain Current (A)
DR
I
1
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
V
, Source to Drain Voltage (V)
SD
APT re s e rve s the rig ht to c hange, wit ho ut not ice, the spe cific atio ns an d informa tio n co nta i ne d he rein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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