Dual common source
MOSFET Power Module
D1
Q1
G1
S1
NTC1
D1
S1
G1
D2
Q2
S
G2
S2
S
S2
G2
NTC2
D2
D2
NTC2
NTC1
APTM20DUM10T
V
R
I
Application
Features
G2
S2
Benefits
= 200V
DSS
= 10mW max @ Tj = 25°C
DSon
= 175A @ Tc = 25°C
D
· AC Switches
· Switched Mode Power Supplies
· Uninterruptible Power Supplies
®
· Power MOS 7
- Low R
MOSFETs
DSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
· Kelvin source for easy drive
· Very low stray inductance
- Symmetrical design
- Lead frames for power connections
· Internal thermistor for temperature monitoring
· High level of integration
· Outstanding performance at high frequency operation
· Direct mounting to heatsink (isolated package)
· Low junction to case thermal resistance
· Solderable terminals both for power and signal fo
easy PCB mounting
· Low profile
Absolute maximum ratings
Symbol Parameter Max ratings Unit
V
Drain - Source Breakdown Voltage 200 V
DSS
ID Continuous Drain Current
Tc = 25°C 175
= 80°C 131
T
c
A
IDM Pulsed Drain current 700
VGS Gate - Source Voltage ±30 V
R
Drain - Source ON Resistance 10
DSon
mW
PD Maximum Power Dissipation Tc = 25°C 694 W
IAR Avalanche current (repetitive and non repetitive) 89 A
EAR Repetitive Avalanche Energy 50
EAS Single Pulse Avalanche Energy 2500
These Devices are sensitive to Electrostatic Discharge. Pr oper Handing Procedures Should Be Followed.
mJ
APT website –http://www.advancedpower.com
1–6
APTM20DUM10T – Rev 2 May, 2004
APTM20DUM10T
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
BV
Drain - Source Breakdown Voltage VGS = 0V, ID = 375µA 200 V
DSS
I
Zero Gate Voltage Drain Current
DSS
R
Drain – Source on Resistance VGS = 10V, ID = 87.5A
DS(on)
V
Gate Threshold Voltage VGS = VDS, ID = 5mA 3 5 V
GS(th)
I
Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±150 nA
GSS
VGS = 0V,VDS = 200V T
VGS = 0V,VDS = 160V T
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Input Capacitance 13.7
C
iss
C
Output Capacitance 4.36
oss
C
Reverse Transfer Capacitance
rss
Qg Total gate Charge 224
Qgs Gate – Source Charge 86
Qgd Gate – Drain Charge
T
Turn-on Delay Time 28
d(on)
T
Rise Time 56
r
T
Turn-off Delay Time 81
d(off)
T
Fall Time
f
E
Turn-on Switching Energy u 926
on
E
Turn-off Switching Energy v
off
E
Turn-on Switching Energy u 1216
on
E
Turn-off Switching Energy v
off
= 0V
V
GS
= 25V
V
DS
f = 1MHz
= 10V
V
GS
= 100V
V
Bus
= 150A
I
D
Inductive switching @ 125°C
= 15V
V
GS
= 133V
V
Bus
I
= 150A
D
= 2.5W
R
G
Inductive switching @ 25°C
V
= 15V, V
GS
= 150A, RG = 2.5Ω
I
D
= 133V
Bus
Inductive switching @ 125°C
V
= 15V, V
GS
= 150A, RG = 2.5Ω
I
D
= 133V
Bus
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Continuous Source current
IS
(Body diode)
VSD Diode Forward Voltage VGS = 0V, IS = - 150A 1.3 V
dv/dt Peak Diode Recovery w 5 V/ns
trr Reverse Recovery Time 284 ns
Qrr Reverse Recovery Charge
u Eon includes diode reverse recovery.
v In accordance with JEDEC standard JESD24-1.
w dv/dt numbers reflect the limitations of the circuit rather than the device itself.
£ - 175A di/dt £ 700A/µs VR £ V
I
S
= - 150A, VR = 133V
I
S
/dt = 200A/µs
di
S
Tj £ 150°C
DSS
= 25°C 150
j
= 125°C 750
j
10
0.19
94
99
910
1062
Tc = 25°C 175
Tc = 80°C 131
6.1 µC
µA
mW
nF
nC
ns
µJ
µJ
A
APT website –http://www.advancedpower.com
2–6
APTM20DUM10T – Rev 2 May, 2004