Power MOS 7
enhancement mode power MOSFETS. Both conduction and switching
losses are addressed with Power MOS 7
and Qg. Power MOS 7
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
is a new generation of low loss, high voltage, N-Channel
®
®
combines lower conduction and switching losses
by significantly lowering R
DS(ON)
G
ISOTO P
S
S
D
SOT-227
"UL Recognized"
®
ΩΩ
Ω
ΩΩ
• Lower Input Capacitance• Increased Power Dissipation
• Lower Miller Capacitance• Easier To Drive
• Lower Gate Charge, Qg• Popular SOT-227 Package
•
FAST RECOVERY BODY DIODE
MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E
E
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
D
Pulsed Drain Current
Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient
Total Power Dissipation @ T
D
Linear Derating Factor
Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current
Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
= 25°C
C
1
4
APT12057JFLL
1200
19
76
±30
±40
520
4.17
-55 to 150
300
19
50
3000
G
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
D
S
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = 1200V, VGS = 0V)
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
2
(VGS = 10V, 9.5A)
= 960V, VGS = 0V, TC = 125°C)
DS
= 0V)
DS
MINTYPMAX
1200
35
0.570
250
1000
±100
UNIT
Volts
Ohms
µA
nA
Volts
050-7085 Rev C 7-2004
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
050-7085 Rev C 7-2004
DYNAMIC CHARACTERISTICS
Symbol
C
C
oss
C
Q
Q
Q
t
d(on)
t
t
d(off)
t
E
E
E
E
Characteristic
Input Capacitance
iss
Output Capacitance
Reverse Transfer Capacitance
rss
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain ("Miller ") Charge
gd
Turn-on Delay Time
Rise Time
r
Turn-off Delay Time
Fall Time
f
Turn-on Switching Energy
on
Turn-off Switching Energy
off
Turn-on Switching Energy
on
Turn-off Switching Energy
off
Test Conditions
V
= 0V
GS
= 25V
V
DS
f
= 1 MHz
3
6
6
INDUCTIVE SWITCHING @ 25°C
INDUCTIVE SWITCHING @ 125°C
V
= 10V
GS
= 600V
V
DD
= 19A@ 25°C
I
D
RESISTIVE SWITCHING
V
=15V
GS
=600V
V
DD
=19A@ 25°C
I
D
=0.6Ω
R
G
V
=800V, V
DD
=19A, RG =5Ω
I
D
V
=800V V
DD
=19A, RG =5Ω
I
D
GS
GS
= 15V
= 15V
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage
SD
/
Peak Diode Recovery dv/
dt
Reverse Recovery Time
rr
= -19A, di/dt = 100A/µs)
(I
S
(Body Diode)
2
dt
Reverse Recovery Charge
rr
(IS = -19A, di/dt = 100A/µs)
Peak Recovery Current
(IS = -19A, di/dt = 100A/µs)
(VGS = 0V, IS = -19A)
5
T
= 25°C320
j
T
= 125°C650
j
T
= 25°C2.0
j
T
= 125°C7.0
j
T
= 25°C13
j
T
= 125°C22
j
THERMAL CHARACTERISTICS
Symbol
R
R
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θJC
Junction to Ambient
θJA
0.25
0.9
0.20
0.7
0.15
0.5
0.10
0.3
, THERMAL IMPEDANCE (°C/W)
0.05
θJC
Z
0
10
0.1
0.05
-5
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
4 Starting T
dv
5
/
dt
device itself. I
6 Eon includes diode reverse recovery. See figures 18, 20.
SINGLE PULSE
-4
10
RECTANGULAR PULSE DURATION (SECONDS)
-3
10
+25°C, L = 16.62mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
, JUNCTION TEMPERATURE (°C)TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATUREFIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
(NORMALIZED)VOLTAGE (NORMALIZED)
0.8
(TH), THRESHOLD VOLTAGEBV
0.7
GS
V
0.6
050-7085 Rev C 7-2004
76
OPERATION HERE
LIMITED BY R
(ON)
DS
100µS
20,000
10,000
5,000
10
1,000
5
500
, DRAIN CURRENT (AMPERES)
TC =+25°C
D
1mS
TJ =+150°C
SINGLE PULSE
1
110100120001020304050
10mS
100
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREAFIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
16
ID = 19A
200
100
12
8
VDS=100V
VDS=250V
VDS=400V
T
=+150°C
J
T
J
=+25°C
10
APT12057JFLL
C
iss
C
oss
C
rss
4
, GATE-TO-SOURCE VOLTAGE (VOLTS)I
GS
0
V
0501001502002503000.30.50.70.91.11.31.5
Q
, TOTAL GATE CHARGE (nC)VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
, REVERSE DRAIN CURRENT (AMPERES)C, CAPACITANCE (pF)
DR
1
I
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGEFIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
160
t
140
d(off)
120
(ns)
d(off)
and t
d(on)
80
60
40
RG = 5Ω
TJ = 125°C
L = 100µH
VDD = 800V
100
20
t
0
10203040501020304050
d(on)
ID (A)ID (A)
(ns)
f
and t
r
70
60
50
40
30
20
10
0
VDD = 800V
RG = 5Ω
TJ = 125°C
L = 100µH
t
f
t
r
FIGURE 14, DELAY TIMES vs CURRENTFIGURE 15, RISE AND FALL TIMES vs CURRENT
3500
VDD = 800V
RG = 5Ω
3000
TJ = 125°C
L = 100µH
2500
EON includes
diode reverse recovery.
2000
1500
E
on
3500
VDD = 800V
ID = 19A
3000
TJ = 125°C
L = 100µH
2500
EON includes
diode reverse recovery.
2000
1500
E
off
E
on
1000
SWITCHING ENERGY (µJ)t
500
0
10203040500 5 10 15 20 25 30 35 40 45 50
FIGURE 16, SWITCHING ENERGY vs CURRENTFIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
050-7085 Rev C 7-2004
1000
E
off
SWITCHING ENERGY (µJ)t
500
0
I
(A)RG, GATE RESISTANCE (Ohms)
D
APT12057JFLLTypical Performance Curves
Gate Voltage
10%
t
d(on)
t
r
90%
5%
10%
Drain Current
5%
Drain Voltage
Switching Energy
Figure 18, Turn-on Switching Waveforms and Definitions
APT30DF120
V
V
DD
I
DS
D
TJ125°C
90%
T
125°C
t
d(off)
Gate Voltage
t
f
J
Drain Voltage
90%
10%
0
Drain Current
Switching Energy
Figure 19, Turn-off Switching Waveforms and Definitions
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
31.5 (1.240)
31.7 (1.248)
r = 4.0 (.157)
(2 places)
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
8.9 (.350)
7.8 (.307)
8.2 (.322)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165)
(2 places)
9.6 (.378)
0.75 (.030)
0.85 (.033)
Hex Nut M4
(4 places)
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
®
ISOTOP
is a Registered Trademark of SGS Thomson.
3.3 (.129)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
3.6 (.143)
* Source Drain
* Source
Dimensions in Millimeters and (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
1.95 (.077)
2.14 (.084)
*
Source terminals are shorted
internally. Current handling
capability is equal for either
Source terminal.
Gate
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
050-7085 Rev C 7-2004
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