Power MOS 7
enhancement mode power MOSFETS. Both conduction and switching
losses are addressed with Power MOS 7
and Qg. Power MOS 7
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
is a new generation of low loss, high voltage, N-Channel
®
®
combines lower conduction and switching losses
by significantly lowering R
DS(ON)
G
ISOTO P
S
S
D
SOT-227
"UL Recognized"
®
ΩΩ
Ω
ΩΩ
• Lower Input Capacitance• Increased Power Dissipation
• Lower Miller Capacitance• Easier To Drive
• Lower Gate Charge, Qg• Popular SOT-227 Package
•
FAST RECOVERY BODY DIODE
MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E
E
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
D
Pulsed Drain Current
Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient
Total Power Dissipation @ T
D
Linear Derating Factor
Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current
Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
= 25°C
C
1
4
APT11058JFLL
1100
18
72
±30
±40
463
3.70
-55 to 150
300
18
50
2500
G
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
D
S
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = 1100V, VGS = 0V)
Zero Gate Voltage Drain Current (VDS = 880V, VGS = 0V, TC = 125°C)
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
2
(VGS = 10V, ID = 9A)
= 0V)
DS
MINTYPMAX
1100
35
0.580
250
1000
±100
UNIT
Volts
Ohms
µA
nA
Volts
050-7183 Rev A 4-2004
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
Symbol
C
C
C
Q
Q
Q
t
d(on)
t
d(off)
E
E
E
E
Characteristic
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer Capacitance
rss
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain ("Miller ") Charge
gd
Turn-on Delay Time
t
Rise Time
r
Turn-off Delay Time
t
Fall Time
f
Turn-on Switching Energy
on
Turn-off Switching Energy
off
Turn-on Switching Energy
on
Turn-off Switching Energy
off
Test Conditions
V
= 0V
GS
= 25V
V
DS
f= 1 MHz
3
6
6
INDUCTIVE SWITCHING @ 25°C
INDUCTIVE SWITCHING @ 125°C
V
= 10V
GS
= 550V
V
DD
= 18A@ 25°C
I
D
RESISTIVE SWITCHING
=15V
V
GS
=550V
V
DD
=18A@ 25°C
I
D
=0.6Ω
R
G
V
=733V, V
DD
=18A, RG =5Ω
I
D
V
=733V V
DD
=18A, RG =5Ω
I
D
GS
GS
= 15V
= 15V
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
(Body Diode)
2
dt
Reverse Recovery Time
rr
= -18A, di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -18A, di/dt = 100A/µs)
Peak Recovery Current
(IS = -18A, di/dt = 100A/µs)
(VGS = 0V, IS = -18A)
5
T
= 25°C300
j
T
= 125°C600
j
T
= 25°C1.7
j
T
= 125°C4.47
j
T
= 25°C11.4
j
T
= 125°C16.4
j
THERMAL CHARACTERISTICS
Symbol
R
R
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θJC
Junction to Ambient
θJA
4 Starting T
dv
5
/
dt
device itself. I
6 Eon includes diode reverse recovery. See figures 18, 20.
+25°C, L = 15.43mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
≤ -I
S
18A
D
MINTYPMAX
4135
680
120
160
20
105
16
8
40
12
700
210
1450
270
MINTYPMAX
MINTYPMAX
25Ω, Peak IL = 18A
G
=
di
/
≤ 700A/µsV
dt
R
APT11058JFLL
18
Amps
72
1.3
18
Amps
0.27
40
≤V
T
≤ 150°C
DSS
J
UNIT
pF
nC
ns
µ
J
UNIT
Volts
V/ns
ns
µC
UNIT
°C/W
050-7183 Rev A 4-2004
0.30
0.25
0.20
0.15
0.10
, THERMAL IMPEDANCE (°C/W)
JC
θ
0.05
Z
0
-5
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
, JUNCTION TEMPERATURE (°C)TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATUREFIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
(NORMALIZED)VOLTAGE (NORMALIZED)
0.7
(TH), THRESHOLD VOLTAGEBV
GS
0.6
V
0.5
050-7183 Rev A 4-2004
72
OPERATION HERE
LIMITED BY RDS (ON)
100µS
20,000
10,000
APT11058JFLL
C
iss
10
5
, DRAIN CURRENT (AMPERES)
D
TC =+25°C
TJ =+150°C
SINGLE PULSE
1
110100110001020304050
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
V
DS
FIGURE 10, MAXIMUM SAFE OPERATING AREAFIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
16
ID = 18A
1mS
10mS
100
10
200
C
oss
C
rss
100
VDS= 220V
12
1,000
T
=+150°C
J
8
VDS= 550V
T
J
=+25°C
10
VDS= 880V
4
, GATE-TO-SOURCE VOLTAGE (VOLTS)I
GS
V
0
040801201602000.30.50.70.91.11.31.5
Q
, TOTAL GATE CHARGE (nC)VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
, REVERSE DRAIN CURRENT (AMPERES)C, CAPACITANCE (pF)
DR
1
I
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGEFIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
120
100
t
d(off)
70
60
(ns)
d(off)
60
RG = 5Ω
TJ = 125°C
L = 100µH
VDD = 733V
80
and t
40
d(on)
20
0
0510152025303505101520253035
FIGURE 14, DELAY TIMES vs CURRENTFIGURE 15, RISE AND FALL TIMES vs CURRENT
2500
VDD = 733V
RG = 5Ω
TJ = 125°C
2000
L = 100µH
EON includes
diode reverse recovery.
1500
1000
SWITCHING ENERGY (µJ)t
500
0
051015202530350 5 10 15 20 25 30 35 40 45 50
FIGURE 16, SWITCHING ENERGY vs CURRENTFIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
050-7183 Rev A 4-2004
50
40
(ns)
f
and t
r
30
20
VDD = 733V
RG = 5Ω
TJ = 125°C
L = 100µH
10
t
d(on)
0
ID (A)ID (A)
2500
2000
E
on
1500
E
on
1000
SWITCHING ENERGY (µJ)t
E
off
500
0
I
(A)RG, GATE RESISTANCE (Ohms)
D
t
f
t
r
E
off
VDD = 733V
ID = 20A
TJ = 125°C
L = 100µH
EON includes
diode reverse recovery.
Typical Performance Curves
APT11058JFLL
10%
Gate Voltage
t
d(on)
t
5%
Switching Energy
90%
r
10%
Drain Current
5%
Drain Voltage
Figure 18, Turn-on Switching Waveforms and Definitions
APT30DF120
V
V
DD
I
CE
C
T
125°C
J
90%
t
d(off)
90%
t
f
Switching Energy
Gate Voltage
Drain Voltage
10%
0
Drain Current
TJ125°C
Figure 19, Turn-off Switching Waveforms and Definitions
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
r = 4.0 (.157)
(2 places)
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
4.0 (.157)
4.2 (.165)
(2 places)
12.2 (.480)
8.9 (.350)
9.6 (.378)
0.75 (.030)
0.85 (.033)
Hex Nut M4
(4 places)
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
3.3 (.129)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
3.6 (.143)
* Source Drain
* Source
®
ISOTOP
is a Registered Trademark of SGS Thomson.
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
Dimensions in Millimeters and (Inches)
1.95 (.077)
2.14 (.084)
*
Source terminals are shorted
internally. Current handling
capability is equal for either
Source terminal.
Gate
050-7183 Rev A 4-2004
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.