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APT10M25BVR
100V 75A 0.025Ω
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement
mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout.
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Popular TO-247 Package
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
1 5
= 25°C
C
5
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
= 25°C
C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
1 5
(Repetitive and Non-Repetitive)
1
4
APT10M25BVR
TO-247
G
100
75
300
±30
±40
300
2.4
-55 to 150
300
75
30
1500
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2 5
(V
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (V
Gate Threshold Voltage (V
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
= VGS, ID = 1.0mA)
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
DS
D(on)
2
(VGS = 10V, 0.5 I
= V
DS
= 0.8 V
DS
= ±30V, V
GS
x R
DS(on)
, VGS = 0V)
DSS
DSS
DS
Max, VGS = 10V)
)
D[Cont.]
, VGS = 0V, TC = 125°C)
= 0V)
MIN TYP MAX
100
75
0.025
250
1000
±100
24
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33) 557921515 FAX: (33) 5 56 47 9761
UNIT
Volts
Amps
Ohms
µA
nA
Volts
050-5513 Rev A
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
APT10M25BVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
V
DS
f = 1 MHz
VGS = 10V
V
= 0.5 V
DD
ID = 0.5 I
V
GS
V
= 0.5 V
DD
ID = I
D[Cont.]
R
G
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current
Diode Forward Voltage
SD
Reverse Recovery Time (I
rr
Reverse Recovery Charge (I
rr
1 5
2
(VGS = 0V, IS = -I
S
5
(Body Diode)
= -I
S
= -I
, dlS/dt = 100A/µs)
D[Cont.]
, dlS/dt = 100A/µs)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 25V
D[Cont.]
= 15V
= 1.6Ω
DSS
@ 25°C
DSS
@ 25°C
MIN TYP MAX
4300 5160
1600 2240
650 975
150 225
28 42
75 115
13 26
22 44
40 60
10 20
MIN TYP MAX
75
300
1.3
150
1.0
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
050-5513 Rev A
THERMAL CHARACTERISTICS
Symbol
R
R
1
Repetitive Rating: Pulse width limited by maximum T
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
3
See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
θJC
Junction to Ambient
θJA
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
4
j
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
Starting Tj = +25°C, L = 0.53mH, RG = 25Ω, Peak IL = 75A
5
The maximum current is limited by lead temperature.
-2
10
-1
10
MIN TYP MAX
0.42
40
1.0 10
UNIT
°C/W