ADVANCED POWER TECHNOLOGY APT10M11LVR Service Manual

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APT10M11LVR
100V 100A 0.011
POWER MOS V
®
Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V
®
also achieves faster switching speeds through optimized gate layout..
• Faster Switching • 100% Avalanche Tested
• Lower Leakage • Popular TO-264 Package
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
TJ,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage Continuous Drain Current @ T Pulsed Drain Current
1 5
= 25°C
C
5
Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ T
= 25°C
C
Linear Derating Factor Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec.
1 5
Avalanche Current Repetitive Avalanche Energy Single Pulse Avalanche Energy
(Repetitive and Non-Repetitive)
1
4
APT10M1LVR
TO-264
G
100 100 400
±30 ±40
520
4.16
-55 to 150 300 100
50
2500
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 57 92 15 15 FAX: (33) 5 56 47 97 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
2 5
(V
Drain-Source On-State Resistance Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (VGS = ±30V, V
= 0V, ID = 250µA)
GS
> I
DS
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
x R
DS(on)
, VGS = 0V)
DSS
DSS
DS
Max, VGS = 10V)
)
D[Cont.]
, VGS = 0V, TC = 125°C) = 0V)
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
MIN TYP MAX
100 100
24
0.011 250
1000 ±100
UNIT
Volts
Amps Ohms
µA
nA
Volts
050-5545 Rev B
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
APT10M11LVR
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
V
VDS = 25V
f = 1 MHz
V
GS
VDD = 0.5 V
ID = 0.5 I
VGS = 15V
VDD = 0.5 V
ID = I
D[Cont.]
RG = 0.6
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current Diode Forward Voltage 2 (VGS = 0V, IS = -I
SD
Reverse Recovery Time (IS = -I
rr
Reverse Recovery Charge (I
rr
1 5
5
(Body Diode)
, dlS/dt = 100A/µs)
D[Cont.]
S
= -I
, dlS/dt = 100A/µs)
D[Cont.]
D[Cont.]
)
= 0V
GS
= 10V
D[Cont.]
DSS
@ 25°C
DSS
@ 25°C
MIN TYP MAX
8600 10300 3200 4480 1180 1770
300 450
95 145
110 165
16 32 33 66 46 70
816
MIN TYP MAX
100 400
1.3
250
2.5
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
050-5545 Rev B
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
1
Repetitive Rating: Pulse width limited by maximum T
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
3
See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case Junction to Ambient
0.3
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
4
j
D=0.5
0.2
0.1
0.05
0.02
0.01
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-4
10
SINGLE PULSE
10
RECTANGULAR PULSE DURATION (SECONDS)
-3
Starting T
5
The maximum current is limited by lead temperature.
-2
10
+25°C, L = 500µH, R
j
=
-1
10
MIN TYP MAX
0.24 40
25, Peak IL = 100A
G
=
1.0 10
UNIT
°C/W
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