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TYPICAL PERFORMANCE CURVES
600V
APT100GN60B2
®
Utilizing the latest Field Stop and Trench Gate technologies, these IGBT's have ultra
low V
and are ideal for low frequency applications that require absolute minimum
CE(ON)
conduction loss. Easy paralleling is a result of very tight parameter distribution and
a slightly positive V
temperature coefficient. A built-in gate resistor ensures
CE(ON)
extremely reliable operation, even in the event of a short circuit fault. Low gate charge
simplifies gate drive design and minimizes losses.
• 600V Field Stop
• Trench Gate: Low V
• Easy Paralleling
• 6µs Short Circuit Capability
• Intergrated Gate Resistor: Low EMI, High Reliability
Applications: Welding, Inductive Heating, Solar Inverters, SMPS, Motor drives, UPS
CE(on)
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
APT100GN60B2G*
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
APT100GN60B2(G)
®
T-Max
®
G
C
E
C
G
E
Symbol
V
CES
V
GE
I
C1
I
C2
I
CM
SSOA
P
TJ,T
T
Parameter
Collector-Emitter Voltage
Gate-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
8
@ TC = 25°C
8
@ TC = 110°C
1
Switching Safe Operating Area @ TJ = 175°C
Total Power Dissipation
D
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
L
STATIC ELECTRICAL CHARACTERISTICS
Symbol
V
(BR)CES
V
GE(TH)
V
CE(ON)
I
CES
I
GES
R
G(int)
Characteristic / Test Conditions
Collector-Emitter Breakdown Voltage (VGE = 0V, IC = 4mA)
Gate Threshold Voltage (VCE = VGE, IC = 1mA, Tj = 25°C)
Collector-Emitter On Voltage (VGE = 15V, IC = 100A, Tj = 25°C)
Collector-Emitter On Voltage (VGE = 15V, IC = 100A, Tj = 125°C)
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 25°C)
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 125°C)
Gate-Emitter Leakage Current (VGE = ±20V)
Intergrated Gate Resistor
APT100GN60B2(G)
UNIT
600
Volts
±30
229
135
Amps
300
300A @ 600V
625
Watts
-55 to 175
300
°C
MIN TYP MAX
600
5.0 5.8 6.5
Units
Volts
1.05 1.45 1.85
2
2
25
TBD
600
2
1.87
µA
nA
Ω
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
050-7621 Rev A 10-2005
DYNAMIC CHARACTERISTICS
Symbol
C
C
oes
C
V
GEP
Q
Q
Q
SSOA
SCSOA
t
d(on)
t
t
d(off)
t
E
on1
E
on2
E
t
d(on)
t
t
d(off)
t
E
on1
E
on2
E
Characteristic
Input Capacitance
ies
Output Capacitance
Reverse Transfer Capacitance
res
Gate-to-Emitter Plateau Voltage
Total Gate Charge
g
Gate-Emitter Charge
ge
Gate-Collector ("Miller ") Charge
gc
Switching Safe Operating Area
Short Circuit Safe Operating Area
Turn-on Delay Time
Current Rise Time
r
Turn-off Delay Time
Current Fall Time
f
Turn-on Switching Energy
Turn-on Switching Energy (Diode)
Turn-off Switching Energy 6
off
Turn-on Delay Time
Current Rise Time
r
Turn-off Delay Time
Current Fall Time
f
Turn-on Switching Energy 4
Turn-on Switching Energy (Diode)
Turn-off Switching Energy
off
3
APT100GN60B2(G)
Test Conditions
Capacitance
V
= 0V, V
GE
CE
= 25V
f = 1 MHz
Gate Charge
V
= 15V
GE
V
= 300V
CE
IC = 100A
TJ = 175°C, RG = 4.3Ω 7, V
15V, L = 100µH,V
VCC = 600V, V
CE
GE
= 600V
= 15V,
TJ = 125°C, RG = 4.3Ω 7
Inductive Switching (25°C)
V
= 400V
CC
V
= 15V
GE
IC = 100A
4
5
RG = 1.0Ω
TJ = +25°C
7
MIN TYP MAX
6000
560
200
9.5
600
45
340
=
GE
300
6
31
65
310
55
4750
5095
UNIT
pF
V
nC
A
µs
ns
µJ
2675
Inductive Switching (125°C)
V
= 400V
CC
V
= 15V
GE
IC = 100A
4
55
66
RG = 1.0Ω
TJ = +125°C
7
31
65
350
85
5000
6255
3300
ns
µJ
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
R
θ
R
θ
W
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, I
3 See MIL-STD-750 Method 3471.
4 E
on1
adding to the IGBT turn-on loss. Tested in inductive switching test circuit shown in figure 21, but with a Silicon Carbide diode.
5 E
on2
loss. (See Figures 21, 22.)
6 E
off
7 RG is external gate resistance, not including R
8 Continuous current limited by package pin temperature to 100A.
APT Reserves the right to change, without notice, the specifications and information contained herein.
050-7621 Rev A 10-2005
Characteristic
Junction to Case (IGBT)
JC
Junction to Case (DIODE)
JC
Package Weight
T
includes both IGBT and FRED leakages
ces
is the clamped inductive turn-on energy of the IGBT only, without the effect of a commutating diode reverse recovery current
is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
nor gate driver impedance. (MIC4452)
G(int)
MIN TYP MAX
N/A
5.9
.21
UNIT
°C/W
gm