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APT10078BFLL
APT10078SFLL
1000V 14A 0.780W
POWER MOS 7
TM
FREDFET
Power MOS 7TM is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
losses are addressed with Power MOS 7
and Qg. Power MOS 7
TM
combines lower conduction and switching losses
TM
by significantly lowering R
DS(ON)
along with exceptionally fast switching speeds inherent with APT's
BFLL
D3PAK
TO-247
SFLL
patented metal gate structure.
• Lower Input Capacitance • Increased Power Dissipation
• Lower Miller Capacitance •Easier To Drive
3
• Lower Gate Charge, Qg •TO-247 or Surface Mount D
•
FAST RECOVERY BODY DIODE
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E
E
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
D
Pulsed Drain Current
Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient
Total Power Dissipation @ TC = 25°C
D
Linear Derating Factor
Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current
Repetitive Avalanche Energy
AR
AS
ADVANCE TECHNICAL
Single Pulse Avalanche Energy
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
1
4
INFORMATION
PAK Package
G
APT10078
1000
14
56
±30
±40
400
3.2
-55 to 150
300
14
30
1300
D
S
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
I
D(on)
R
DS(on)
I
DSS
I
GSS
V
GS(th)
USA 405 S.W. Columbia Street Bend, Oregon 97702 -1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE Chemin de Magret F-33700 Merignac - France Phone: (33) 5 57 92 15 15 FAX: (33) 5 56 47 97 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
On State Drain Current
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 1mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
2
(V
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
> I
x R
D(on)
2
(VGS = 10V, 0.5 I
= 0.8 V
DS
Max, VGS = 10V)
DS(on)
D[Cont.]
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
)
MIN TYP MAX
1000
14
35
0.78
250
1000
±100
UNIT
Volts
Amps
Ohms
µA
nA
Volts
050-7040 Rev A 8-2001
DYNAMIC CHARACTERISTICS
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
V
GS
VDD = 0.5 V
ID = I
[Cont.] @ 25°C
D
RG = 1.6W
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
= 0V
= 15V
DSS
DSS
APT10078 BFLL - SFLL
MIN TYP MAX
2480
410
82
95
15
63
10
5
20
7
UNIT
pF
nC
ns
Symbol
I
I
SM
V
dv
t
Q
I
RRM
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
Pulsed Source Current
Diode Forward Voltage
SD
Peak Diode Recovery dv/
/
dt
ADVANCE TECHNICAL
1
(Body Diode)
2
Reverse Recovery Time
rr
= -ID [Cont.], di/dt = 100A/µs)
(I
S
Reverse Recovery Charge
rr
(IS = -ID [Cont.], di/dt = 100A/µs)
Peak Recovery Current
(IS = -ID [Cont.], di/dt = 100A/µs)
(VGS = 0V, IS = -ID [Cont.])
5
dt
INFORMATION
T
= 25°C 200
j
T
= 125°C 350
j
T
= 25°C 0.7
j
T
= 125°C 1.8
j
T
= 25°C 11
j
T
= 125°C 17
j
THERMAL CHARACTERISTICS
Symbol
R
R
1
Repetitive Rating: Pulse width limited by maximum junction
temperature.
2
Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
qJC
Junction to Ambient
qJA
3
See MIL-STD-750 Method 3471
4
Starting T
5dv
/
dt
device itself. I
+25°C, L = 13.26mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
£ -I
S
D[Cont.
MIN TYP MAX
MIN TYP MAX
25W, Peak IL = 14A
G
=
di
/
£ 700A/µs V
dt
]
R
£ V
14
56
1.3
18
0.31
40
DSS
T
UNIT
Amps
Volts
V/ns
ns
µC
Amps
UNIT
°C/W
£ 150°C
J
TO-247 Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
20.80 (.819)
Drain
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336
050-7040 Rev A 8-2001
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
Dimensions in Millimeters and (Inches)
5.45 (.215) BSC
2-Plcs.
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source
5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058
Drain
(Heat Sink)
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
{3 Plcs}
1.22 (.048)
1.32 (.052)
15.95 (.628)
16.05 (.632)
Dimensions in Millimeters (Inches)
Revised
4/18/95
13.79 (.543)
13.99 (.551)
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC
{2 Plcs.}
Source
Drain
Gate
1.04 (.041)
1.15 (.045)
1.27 (.050)
1.40 (.055)
13.41 (.528)
13.51 (.532)
Revised
8/29/97
3.81 (.150)
4.06 (.160)
(Base of Lead)
Heat Sink (Drain)
and Leads
are Plated
11.51 (.453)
11.61 (.457)