ADVANCED POWER TECHNOLOGY APT10040B2VFR Service Manual

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APT10040B2VFR

APT10040LVFR

1000V 25A 0.400W

POWER MOS V

®

FREDFET

Power MOS V® is a new generation of high voltage N-Channel enhancement

B2VFR

T-MAX™

TO-264

mode power MOSFETs. This new technology minimizes the JFET effect,
increases packing density and reduces the on-resistance. Power MOS V

®

also achieves faster switching speeds through optimized gate layout.

LVFR

• Identical Specifications: T-MAX™ or TO-264 Package

• Lower Leakage • Faster Switching

G

D

• Fast Recovery Body Diode • 100% Avalanche Tested

S

MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.

Symbol

V

DSS

I

D

I

DM

V

GS

V

GSM

P

D

TJ,T

STG

T

L

I

AR

E

AR

E

AS

Parameter

Drain-Source Voltage
Continuous Drain Current @ T
Pulsed Drain Current
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
Repetitive Avalanche Energy

ADVANCED TECHNICAL

Single Pulse Avalanche Energy

1

1

(Repetitive and Non-Repetitive)

= 25°C

C

= 25°C

C

1

4

INFORMATION

APT10040

1000

25
100
±30
±40
625

5.0

-55 to 150
300

33
50

3000

UNIT

Volts

Amps

Volts

Watts

W/°C

°C

Amps

mJ

STATIC ELECTRICAL CHARACTERISTICS

Symbol

BV

I

D(on)

R

DS(on)

I

DSS

I

GSS

V

GS(th)

USA 405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: [phone] FAX: [phone]
EUROPE Chemin de Magret F-33700 Merignac - France Phone: [phone] FAX: [phone]

Characteristic / Test Conditions

Drain-Source Breakdown Voltage (V

DSS

On State Drain Current
Drain-Source On-State Resistance

Zero Gate Voltage Drain Current (VDS = V
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 2.5mA)

CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

2

(V

DS

APT Website - http://www.advancedpower.com

= 0V, ID = 250µA)

GS

> I

x R

D(on)

2

(VGS = 10V, 0.5 I

DSS

= 0.8 V

DS

Max, VGS = 10V)

DS(on)

D[Cont.]

, VGS = 0V)

, VGS = 0V, TC = 125°C)

DSS

= 0V)

DS

)

MIN TYP MAX

1000

25

24

0.40
250

1000
±100

UNIT

Volts

Amps
Ohms

µA

nA

Volts

050-5908 rev- 12-99

DYNAMIC CHARACTERISTICS APT10040 B2VFR - LVFR

Symbol

C

iss

C

oss

C

rss

Q

g

Q

gs

Q

gd

td(on)

t

r

td(off)

t

f

Characteristic

Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge

3

Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time

Test Conditions

V

= 0V

GS

VDS = 25V

f = 1 MHz

VGS = 10V

V

= 0.5 V

DD

ID = I

[Cont.] @ 25°C

D

V

= 15V

GS

= 0.5 V

V

DD

ID = I

[Cont.] @ 25°C

D

= 0.6W

R

G

DSS

DSS

MIN TYP MAX

7700

690
330
380

33

196

18
14
66

9

UNIT

pF

nC

ns

SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS

Symbol

I

I

SM

V

dv

t

Q

I

RRM

Characteristic / Test Conditions

Continuous Source Current (Body Diode)

S

Pulsed Source Current
Diode Forward Voltage

SD

Peak Diode Recovery dv/

/

dt

ADVANCED TECHNICAL

1

(Body Diode)

2

dt

Reverse Recovery Time

rr

= -ID [Cont.], di/dt = 100A/µs)

(I

S

Reverse Recovery Charge

rr

(IS = -ID [Cont.], di/dt = 100A/µs)
Peak Recovery Current

(IS = -ID [Cont.], di/dt = 100A/µs)

(VGS = 0V, IS = -ID [Cont.])

5

INFORMATION

T

= 25°C 320

j

T

= 125°C 650

j

T

= 25°C 1.9

j

T

= 125°C 5.4

j

T

= 25°C 13

j

T

= 125°C 21

j

THERMAL CHARACTERISTICS

Symbol

R

qJC

R

qJA

1

Repetitive Rating: Pulse width limited by maximum junction
temperature.

2

Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%

APT Reserves the right to change, without notice, the specifications and information contained herein.

Characteristic

Junction to Case
Junction to Ambient

3

See MIL-STD-750 Method 3471

4

Starting T

5

IS £ -ID [Cont.],

+25°C, L = 9.60mH, R

j

=

di

/

= 100A/µs, T

dt

MIN TYP MAX

25

100

1.3
5

MIN TYP MAX

0.20
40

25W, Peak IL = 25A

G

=

150°C, R

j

£

= 2.0W, VR = 200V.

G

UNIT

Amps

Volts

V/ns

ns

µC

Amps

UNIT

°C/W

TO-264 (L) Package OutlineT-MAX™ (B2) Package Outline

4.69 (.185)

5.31 (.209)

1.49 (.059)

2.49 (.098)

20.80 (.819)

21.46 (.845)

Collector

(.177) Max.

0.40 (.016)

0.79 (.031)

19.81 (.780)

20.32 (.800)

1.01 (.040)

1.40 (.055)

2.21 (.087)

2.59 (.102)

These dimensions are equal to the TO-247 without the mounting hole.

APT's devices are covered by one or more of the following U.S.patents: 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336

050-5908 rev- 12-99

5.45 (.215) BSC

4.50

2-Plcs.

15.49 (.610)

16.26 (.640)

5.38 (.212)

6.20 (.244)

2.87 (.113)

3.12 (.123)

1.65 (.065)

2.13 (.084)

Gate
Collector
Emitter

5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058

Collector

4.60 (.181)

5.21 (.205)

1.80 (.071)

2.01 (.079)

25.48 (1.003)

26.49 (1.043)

19.81 (.780)

21.39 (.842)

0.48 (.019)

0.84 (.033)

2.59 (.102)

3.00 (.118)

Dimensions in Millimeters and (Inches)Dimensions in Millimeters and (Inches)

5.79 (.228)

6.20 (.244)

2.29 (.090)

2.69 (.106)

0.76 (.030)

1.30 (.051)

2.79 (.110)

3.18 (.125)

5.45 (.215) BSC
2-Plcs.

19.51 (.768)

20.50 (.807)

3.10 (.122)

3.48 (.137)

2.29 (.090)

2.69 (.106)

Gate
Collector
Emitter