ADVANCED POWER TECHNOLOGY APT1003RBLL Service Manual

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APT1003RBLL
APT1003RSLL
POWER MOS 7 R MOSFET
®
Power MOS 7 enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 and Qg. Power MOS 7
is a new generation of low loss, high voltage, N-Channel
®
®
combines lower conduction and switching losses
by significantly lowering R
DS(ON)
1000V 4A 3.00
D3PAK
TO-247
along with exceptionally fast switching speeds inherent with APT's patented metal gate structure.
• Lower Input Capacitance • Increased Power Dissipation
• Lower Miller Capacitance •Easier To Drive
• Lower Gate Charge, Qg •TO-247 or Surface Mount D
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E E
Parameter
Drain-Source Voltage Continuous Drain Current @ T
D
Pulsed Drain Current Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient Total Power Dissipation @ T
D
Linear Derating Factor Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1
(Repetitive and Non-Repetitive)
= 25°C
C
= 25°C
C
3
PAK Package
APT1003RBLL_SLL
1000
4
16 ±30 ±40 139
1.11
-55 to 150 300
4
10
425
G
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
D
S
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Drain-Source On-State Resistance Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V) Zero Gate Voltage Drain Current (V Gate-Source Leakage Current (VGS = ±30V, V Gate Threshold Voltage (VDS = VGS, ID = 1mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
2
(VGS = 10V, 2A)
= 800V, VGS = 0V, TC = 125°C)
DS
= 0V)
DS
MIN TYP MAX
1000
35
3.00 100 500
±100
UNIT
Volts
Ohms
µA
nA
Volts
050-7119 Rev A 1-2004
DYNAMIC CHARACTERISTICS APT1003RBLL_SLL
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
on
E
off
Characteristic
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge
3
Gate-Source Charge Gate-Drain ("Miller ") Charge Turn-on Delay Time Rise Time
Turn-off Delay Time Fall Time Turn-on Switching Energy
Turn-off Switching Energy Turn-on Switching Energy
Turn-off Switching Energy
Test Conditions
V
= 0V
GS
= 25V
V
DS
f = 1 MHz
V
= 10V
GS
= 500V
V
DD
= 4A @ 25°C
I
D
RESISTIVE SWITCHING
= 15V
V
GS
= 500V
V
DD
= 4A @ 25°C
I
D
= 1.6
R
G
INDUCTIVE SWITCHING @ 25°C
= 667V, V
V
DD
= 4A, RG = 5
I
D
INDUCTIVE SWITCHING @ 125°C
= 667V, V
V
DD
= 4A, RG = 5
I
D
GS
GS
= 15V
= 15V
MIN TYP MAX
694 135
25 34
5
22
8 4
25 10 13 42 40 48
UNIT
pF
nC
ns
µJ
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
S
I
SM
V
SD
t
rr
Q
rr
dv
/
dt
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage 2 (VGS = 0V, IS = -I Reverse Recovery Time (IS = -I Reverse Recovery Charge (I
Peak Diode Recovery dv/
dt
4A, dl
D
= -I
S
/dt = 100A/µs)
S
4A, dl
D
S
4A)
D
/dt = 100A/µs)
MIN TYP MAX
4
16
1.3
560
3.2 10
UNIT
Amps
Volts
ns
µC
V/ns
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
1 Repetitive Rating: Pulse width limited by maximum junction
temperature 2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case Junction to Ambient
4 Starting T
dv
5
/
dt
device itself. I
6 Eon includes diode reverse recovery. See figures 18, 20.
+25°C, L = 53.13mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
-I
S
4A
D
MIN TYP MAX
25, Peak IL = 4A
G
=
di
/
700A/µs V
dt
UNIT
0.90
°C/W
40
V
R
DSS TJ
150°C
050-7119 Rev A 1-2004
1.0
0.80
0.60
0.40
, THERMAL IMPEDANCE (°C/W)
JC
0.20
θ
Z
-5
10
0.9
0.7
0.5
0.3 SINGLE PULSE
0.1
0.05
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
-1
10
1.0
Typical Performance Curves
Junction temp. (°C)
Power
(watts)
Case temperature. (°C)
FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
16
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST
14
@ <0.5 % DUTY CYCLE
12
10
TJ = -55°C
RC MODEL
0.386
0.508
0.00336F
0.0903F
10
V
, DRAIN CURRENT (AMPERES)
D
0 5 10 15 20 25 30
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
1.40
NORMALIZED TO
V
= 10V @ 2A
GS
1.30 VGS=10V
1.20
=15 & 10V
GS
APT1003RBLL_SLL
7.5V
7V
6.5V
6V
5.5V
5V
, DRAIN CURRENT (AMPERES)
D
0123456789 012345678910
V
, GATE-TO-SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPERES)
GS
FIGURE 4, TRANSFER CHARACTERISTICS FIGURE 5, R
TJ = +25°C
TJ = +125°C
3.5
1.10
1.00
VGS=20V
0.90
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.80
DS
(ON) vs DRAIN CURRENT
1.15
DS
1.10
2.5
1.5
1.05
1.00
0.95
, DRAIN CURRENT (AMPERES) I
D
0.5
25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
2.5
, CASE TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
T
C
ID = 2A
VGS = 10V
2.0
, DRAIN-TO-SOURCE BREAKDOWN R
0.90
DSS
0.85
1.2
1.1
1.0
1.5
0.9
1.0
0.8
(NORMALIZED)
0.5
(ON), DRAIN-TO-SOURCE ON RESISTANCE I
0.0
DS
-50 -25 0 2 5 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
R
T
, JUNCTION TEMPERATURE (°C) TC, CASE TEMPERATURE (°C)
J
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
(NORMALIZED) VOLTAGE (NORMALIZED)
(TH), THRESHOLD VOLTAGE BV
0.7
GS
V
0.6
050-7119 Rev A 1-2004
16 10
OPERATION HERE
LIMITED BY RDS (ON)
4,000
APT1003RBLL_SLL
.5
, DRAIN CURRENT (AMPERES)
D
TC =+25°C TJ =+150°C SINGLE PULSE
.1
1 10 100 1000 0 10 20 30 40 50
V
DS
FIGURE 10, MAXIMUM SAFE OPERATING AREA FIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
16
12
, GATE-TO-SOURCE VOLTAGE (VOLTS) I
GS
V
0 5 10 15 20 25 30 35 40 45 50 0.3 0.5 0.7 0.9 1.1 1.3 1.5
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
25
20
15
10
VDD = 667V RG = 5 TJ = 125°C L = 100µH
(ns)
d(off)
and t
d(on)
012345678 012345678
FIGURE 14, DELAY TIMES vs CURRENT FIGURE 15, RISE AND FALL TIMES vs CURRENT
90
VDD = 667V RG = 5
80
TJ = 125°C
70
L = 100µH EON includes
60
diode reverse recovery.
50 40 30 20
SWITCHING ENERGY (µJ) t
10
012345678 05101520253035404550
FIGURE 16, SWITCHING ENERGY vs CURRENT FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
050-7119 Rev A 1-2004
1,000
100µS
100
C
iss
C
oss
1mS
10mS
C
rss
10
, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
ID = 4A
100
VDS= 200V
T
=+150°C
J
T
VDS= 500V
Q
, TOTAL GATE CHARGE (nC) VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
VDS= 800V
10
, REVERSE DRAIN CURRENT (AMPERES) C, CAPACITANCE (pF)
DR
I
70
t
d(off)
60
50
40
(ns)
f
30
and t
r
=+25°C
J
VDD = 667V RG = 5 TJ = 125°C L = 100µH
t
f
20
t
d(on)
10
t
r
(A) ID (A)
I
D
140
VDD = 667V ID = 4A
120
E
off
TJ = 125°C L = 100µH
EON includes
100
diode reverse recovery.
E
on
80
60
E
off
E
on
40
SWITCHING ENERGY (µJ) t
20
I
(A) RG, GATE RESISTANCE (Ohms)
D
Typical Performance Curves
APT1003RBLL_SLL
10%
Gate Voltage
t
d(on)
t
r
5%
90%
10%
Drain Current
5%
Drain Voltage
Switching Energy
Figure 18, Turn-on Switching Waveforms and Definitions
APT15DF100
V
V
DD
I
CE
C
TJ125°C
90%
t
d(off)
90%
t
f
10%
Gate Voltage
Drain Voltage
0
Drain Current
TJ125°C
Switching Energy
Figure 19, Turn-off Switching Waveforms and Definitions
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
TO-247 Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
20.80 (.819)
Drain
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
Dimensions in Millimeters and (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
5.45 (.215) BSC 2-Plcs.
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate Drain Source
Drain
(Heat Sink)
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
{3 Plcs}
1.22 (.048)
1.32 (.052)
15.95 (.628)
16.05(.632)
Revised
Dimensions in Millimeters (Inches)
4/18/95
1.04 (.041)
1.15(.045)
13.79 (.543)
13.99(.551)
1.27 (.050)
1.40 (.055)
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC {2 Plcs.}
Source
Drain
Gate
13.41 (.528)
13.51(.532)
Revised 8/29/97
3.81 (.150)
4.06 (.160) (Base of Lead)
Heat Sink (Drain) and Leads are Plated
11.51 (.453)
11.61 (.457)
050-7119 Rev A 1-2004
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