Power MOS 7
enhancement mode power MOSFETS. Both conduction and switching
losses are addressed with Power MOS 7
and Qg. Power MOS 7
is a new generation of low loss, high voltage, N-Channel
®
®
combines lower conduction and switching losses
by significantly lowering R
DS(ON)
1000V4A3.00
D3PAK
TO-247
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
• Lower Input Capacitance• Increased Power Dissipation
• Lower Miller Capacitance•Easier To Drive
• Lower Gate Charge, Qg•TO-247 or Surface Mount D
MAXIMUM RATINGSAll Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
I
I
DM
V
V
GSM
P
TJ,T
T
I
AR
E
E
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
D
Pulsed Drain Current
Gate-Source Voltage Continuous
GS
Gate-Source Voltage Transient
Total Power Dissipation @ T
D
Linear Derating Factor
Operating and Storage Junction Temperature Range
STG
Lead Temperature: 0.063" from Case for 10 Sec.
L
Avalanche Current
Repetitive Avalanche Energy
AR
Single Pulse Avalanche Energy
AS
1
1
(Repetitive and Non-Repetitive)
= 25°C
C
= 25°C
C
1
4
3
PAK Package
APT1003RBLL_SLL
1000
4
16
±30
±40
139
1.11
-55 to 150
300
4
10
425
G
UNIT
Volts
Amps
Volts
Watts
W/°C
°C
Amps
mJ
D
S
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V)
Zero Gate Voltage Drain Current (V
Gate-Source Leakage Current (VGS = ±30V, V
Gate Threshold Voltage (VDS = VGS, ID = 1mA)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
2
(VGS = 10V, 2A)
= 800V, VGS = 0V, TC = 125°C)
DS
= 0V)
DS
MINTYPMAX
1000
35
3.00
100
500
±100
UNIT
Volts
Ohms
µA
nA
Volts
050-7119 Rev A 1-2004
DYNAMIC CHARACTERISTICSAPT1003RBLL_SLL
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
on
E
off
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate-Source Charge
Gate-Drain ("Miller ") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Switching Energy
6
Turn-off Switching Energy
Turn-on Switching Energy
6
Turn-off Switching Energy
Test Conditions
V
= 0V
GS
= 25V
V
DS
f= 1 MHz
V
= 10V
GS
= 500V
V
DD
= 4A@ 25°C
I
D
RESISTIVE SWITCHING
=15V
V
GS
=500V
V
DD
=4A@ 25°C
I
D
=1.6Ω
R
G
INDUCTIVE SWITCHING @ 25°C
=667V, V
V
DD
=4A, RG =5Ω
I
D
INDUCTIVE SWITCHING @ 125°C
=667V, V
V
DD
=4A, RG =5Ω
I
D
GS
GS
= 15V
= 15V
MINTYPMAX
694
135
25
34
5
22
8
4
25
10
13
42
40
48
UNIT
pF
nC
ns
µJ
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
S
I
SM
V
SD
t
rr
Q
rr
dv
/
dt
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
1
Pulsed Source Current
(Body Diode)
Diode Forward Voltage 2 (VGS = 0V, IS = -I
Reverse Recovery Time (IS = -I
Reverse Recovery Charge (I
Peak Diode Recovery dv/
dt
4A, dl
D
= -I
S
5
/dt = 100A/µs)
S
4A, dl
D
S
4A)
D
/dt = 100A/µs)
MINTYPMAX
4
16
1.3
560
3.2
10
UNIT
Amps
Volts
ns
µC
V/ns
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
APT Reserves the right to change, without notice, the specifications and information contained herein.
Characteristic
Junction to Case
Junction to Ambient
4 Starting T
dv
5
/
dt
device itself. I
6 Eon includes diode reverse recovery. See figures 18, 20.
+25°C, L = 53.13mH, R
j
=
numbers reflect the limitations of the test circuit rather than the
≤ -I
S
4A
D
MINTYPMAX
25Ω, Peak IL = 4A
G
=
di
/
≤ 700A/µsV
dt
UNIT
0.90
°C/W
40
≤V
R
DSS TJ
≤ 150°C
050-7119 Rev A 1-2004
1.0
0.80
0.60
0.40
, THERMAL IMPEDANCE (°C/W)
JC
0.20
θ
Z
0
-5
10
0.9
0.7
0.5
0.3
SINGLE PULSE
0.1
0.05
-4
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGEFIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
25
20
15
10
VDD = 667V
RG = 5Ω
TJ = 125°C
L = 100µH
(ns)
d(off)
and t
d(on)
5
0
012345678012345678
FIGURE 14, DELAY TIMES vs CURRENTFIGURE 15, RISE AND FALL TIMES vs CURRENT
90
VDD = 667V
RG = 5Ω
80
TJ = 125°C
70
L = 100µH
EON includes
60
diode reverse recovery.
50
40
30
20
SWITCHING ENERGY (µJ)t
10
0
01234567805101520253035404550
FIGURE 16, SWITCHING ENERGY vs CURRENTFIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
050-7119 Rev A 1-2004
1,000
100µS
100
C
iss
C
oss
1mS
10mS
C
rss
10
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
ID = 4A
100
VDS= 200V
T
=+150°C
J
T
VDS= 500V
Q
, TOTAL GATE CHARGE (nC)VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
g
VDS= 800V
10
, REVERSE DRAIN CURRENT (AMPERES)C, CAPACITANCE (pF)
1
DR
I
70
t
d(off)
60
50
40
(ns)
f
30
and t
r
=+25°C
J
VDD = 667V
RG = 5Ω
TJ = 125°C
L = 100µH
t
f
20
t
d(on)
10
t
r
0
(A)ID (A)
I
D
140
VDD = 667V
ID = 4A
120
E
off
TJ = 125°C
L = 100µH
EON includes
100
diode reverse recovery.
E
on
80
60
E
off
E
on
40
SWITCHING ENERGY (µJ)t
20
0
I
(A)RG, GATE RESISTANCE (Ohms)
D
Typical Performance Curves
APT1003RBLL_SLL
10%
Gate Voltage
t
d(on)
t
r
5%
90%
10%
Drain Current
5%
Drain Voltage
Switching Energy
Figure 18, Turn-on Switching Waveforms and Definitions
APT15DF100
V
V
DD
I
CE
C
TJ125°C
90%
t
d(off)
90%
t
f
10%
Gate Voltage
Drain Voltage
0
Drain Current
TJ125°C
Switching Energy
Figure 19, Turn-off Switching Waveforms and Definitions
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
TO-247 Package Outline
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
20.80 (.819)
Drain
0.40 (.016)
0.79 (.031)
2.21 (.087)
2.59 (.102)
21.46 (.845)
4.50 (.177) Max.
19.81 (.780)
20.32 (.800)
1.01 (.040)
1.40 (.055)
Dimensions in Millimeters and (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
5.45 (.215) BSC
2-Plcs.
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
3.50 (.138)
3.81 (.150)
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
Gate
Drain
Source
Drain
(Heat Sink)
D3PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
0.46 (.018)
0.56 (.022)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
{3 Plcs}
1.22 (.048)
1.32 (.052)
15.95 (.628)
16.05(.632)
Revised
Dimensions in Millimeters (Inches)
4/18/95
1.04 (.041)
1.15(.045)
13.79 (.543)
13.99(.551)
1.27 (.050)
1.40 (.055)
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC
{2 Plcs.}
Source
Drain
Gate
13.41 (.528)
13.51(.532)
Revised
8/29/97
3.81 (.150)
4.06 (.160)
(Base of Lead)
Heat Sink (Drain)
and Leads
are Plated
11.51 (.453)
11.61 (.457)
050-7119 Rev A 1-2004
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