ADVANCED POWER TECHNOLOGY 2N7227 Service Manual

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TO-254
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2N7227 400 Volt 0.315 JX2N7227*
POWER MOS IV
JEDEC REGISTERED N - CHAN N E L HIGH VOLTAGE POWER MOSFETS
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
V
I
I
DM
I
AR
P
E E
TJ,T
T
Parameter
Drain-Source Voltage Gate-Source Voltage
GS
Continuous Drain Current @ T
D
Continuous Drain Current @ TC = 100°C Pulsed Drain Current Avalanche Current Total Power Dissipation @ TC = 25°C Total Power Dissipation @ TC = 100°C
D
Linear Derating Factor Single Pulse Avalanche Energy
AS
Repetitive Avalanche Energy
AR
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering Conditions: 0.063" from Case for 10 Sec.
L
1
1
= 25°C
C
JV2N7227*
*QUALIFIED TO MIL-S-19500/592 31/7/92
2N7227
400 ±20
14
9 56 14
150
60
1.2
700
15
-55 to 150 300
UNIT
Volts
Amps
Watts
W/K
mJ
°C
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
VGS(TH)
I
DSS
I
GSS
ID(ON)
RDS(ON)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 5792 15 15 FAX: (33) 556 4797 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Gate Threshold Voltage (VDS = VGS, ID = 250µA) Zero Gate Voltage Drain Current (VDS = 0.8 V
Zero Gate Voltage Drain Current (VDS = 0.8 V Gate-Source Leakage Current (VGS = ±20V, V On State Drain Current 2 (V Drain-Source On-State Resistance 2 (VGS = 10V, ID = 9.0A) Drain-Source On-State Resistance 2 (VGS = 10V, ID = 9.0A, TC = 125°C) Drain-Source On-State Resistance 2 (VGS = 10V, ID = 14.0A)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
valanche RatedAvalanche Rate
> ID(ON) x RDS(ON) Max, VGS = 10V)
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
MIN TYP MAX
400
24
14
25
250
±100
0.315
0.680
0.415
UNIT
Volts
µA
nA
Amps
Ohms
051-4015 Rev D
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
2N7227
Symbol
C
DC
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Drain-to-Case Capacitance Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
Test Conditions
f = 1 MHz
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
VGS = 10V
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
RG = 2.35
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current Diode Forward Voltage 2 (VGS = 0V, IS = -ID [Cont.])
SD
Reverse Recovery Time (IS = -ID [Cont.], dlS/dt = 100A/µs)
rr
Reverse Recovery Charge (IS = -ID [Cont.], dlS/dt = 100A/µs)
rr
(Body Diode)
GS
= 0V
DSS
DSS
MIN TYP MAX
12 24
2400 2800
385 540 160 240 100 150
12 24 41 65 12 35 18 190 40 170 13 130
MIN TYP MAX
14 56
1.7
279 1200
3.6 9.0
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
051-4015 Rev D
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
1
Repetitive Rating: Pulse width limited by maximum junction temperature. See Transient Thermal Impedance Curve. (Fig.1)
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
Characteristic
Junction to Case Junction to Ambient
1.0
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
D=0.5
0.2
0.1
0.05
0.02
0.01 SINGLE PULSE
-4
10
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
-1
10
MIN TYP MAX
1.0 10
0.83 31
UNIT
K/W
3
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