查询2N7227供应商
D
G
TO-254
S
2N7227 400 Volt 0.315Ω
JX2N7227*
POWER MOS IV
TM
JEDEC REGISTERED N - CHAN N E L HIGH VOLTAGE POWER MOSFETS
MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified.
Symbol
V
DSS
V
I
I
DM
I
AR
P
E
E
TJ,T
T
Parameter
Drain-Source Voltage
Gate-Source Voltage
GS
Continuous Drain Current @ T
D
Continuous Drain Current @ TC = 100°C
Pulsed Drain Current
Avalanche Current
Total Power Dissipation @ TC = 25°C
Total Power Dissipation @ TC = 100°C
D
Linear Derating Factor
Single Pulse Avalanche Energy
AS
Repetitive Avalanche Energy
AR
Operating and Storage Junction Temperature Range
STG
Max. Lead Temp. for Soldering Conditions: 0.063" from Case for 10 Sec.
L
1
1
= 25°C
C
JV2N7227*
*QUALIFIED TO MIL-S-19500/592 31/7/92
2N7227
400
±20
14
9
56
14
150
60
1.2
700
15
-55 to 150
300
UNIT
Volts
Amps
Watts
W/K
mJ
°C
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
VGS(TH)
I
DSS
I
GSS
ID(ON)
RDS(ON)
USA
405 S.W. Columbia Street Bend, Oregon 97702-1035 Phone: (541) 382-8028 FAX: (541) 388-0364
EUROPE
Avenue J.F. Kennedy Bât B4 Parc Cadéra Nord F-33700 Merignac - France Phone: (33)5 5792 15 15 FAX: (33) 556 4797 61
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
DSS
Gate Threshold Voltage (VDS = VGS, ID = 250µA)
Zero Gate Voltage Drain Current (VDS = 0.8 V
Zero Gate Voltage Drain Current (VDS = 0.8 V
Gate-Source Leakage Current (VGS = ±20V, V
On State Drain Current 2 (V
Drain-Source On-State Resistance 2 (VGS = 10V, ID = 9.0A)
Drain-Source On-State Resistance 2 (VGS = 10V, ID = 9.0A, TC = 125°C)
Drain-Source On-State Resistance 2 (VGS = 10V, ID = 14.0A)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
valanche RatedAvalanche Rate
> ID(ON) x RDS(ON) Max, VGS = 10V)
DS
APT Website - http://www.advancedpower.com
= 0V, ID = 250µA)
GS
, VGS = 0V)
DSS
, VGS = 0V, TC = 125°C)
DSS
= 0V)
DS
MIN TYP MAX
400
24
14
25
250
±100
0.315
0.680
0.415
UNIT
Volts
µA
nA
Amps
Ohms
051-4015 Rev D
DYNAMIC CHARACTERISTICS
Note:
Duty Factor D =
t
1
/
t
2
Peak TJ = PDM x Z
θJC
+ T
C
t
1
t
2
P
DM
2N7227
Symbol
C
DC
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
td(on)
t
r
td(off)
t
f
Characteristic
Drain-to-Case Capacitance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
f = 1 MHz
V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
VGS = 10V
VDD = 0.5 V
ID = ID [Cont.] @ 25°C
RG = 2.35Ω
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
I
SM
V
t
Q
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
S
1
Pulsed Source Current
Diode Forward Voltage 2 (VGS = 0V, IS = -ID [Cont.])
SD
Reverse Recovery Time (IS = -ID [Cont.], dlS/dt = 100A/µs)
rr
Reverse Recovery Charge (IS = -ID [Cont.], dlS/dt = 100A/µs)
rr
(Body Diode)
GS
= 0V
DSS
DSS
MIN TYP MAX
12 24
2400 2800
385 540
160 240
100 150
12 24
41 65
12 35
18 190
40 170
13 130
MIN TYP MAX
14
56
1.7
279 1200
3.6 9.0
UNIT
pF
nC
ns
UNIT
Amps
Volts
ns
µC
051-4015 Rev D
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
1
Repetitive Rating: Pulse width limited by maximum junction temperature. See Transient Thermal Impedance Curve. (Fig.1)
2
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
Characteristic
Junction to Case
Junction to Ambient
1.0
0.5
0.1
0.05
0.01
0.005
, THERMAL IMPEDANCE (°C/W)
JC
θ
Z
0.001
-5
10
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
D=0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
-4
10
-3
10
RECTANGULAR PULSE DURATION (SECONDS)
-2
10
-1
10
MIN TYP MAX
1.0 10
0.83
31
UNIT
K/W
3