Advanced Monolithic Systems, Inc. 6680B Sierra Lane, Dublin, CA 94568 Phone (925) 556-9090 Fax (925) 556-9140
AMS2931
ELECTRICAL CHARACTERISTICS
Electrical Characteristics at V
IN
=14V, V
OUT
=3V IO =10mA, TJ=25°C, R1 =27k, C2 = 100µF unless otherwise specified.
PARAMETER CONDITIONS
(Note 2)
Min.
AMS2931C
Typ.
Max.
Units
Adjustable Version
Reference Voltage
1.14 1.20 1.26 V
IO ≤ 100 mA, -40°C ≤T
J
≤ 125°C, R1=27k,
Measured from V
OUT
to Adjust Pin
1.08 1.32
V
Output Voltage Range 3 24 V
Line Regulation
V
OUT
+ 0.6V ≤VIN ≤ 26V
.02 1.5 mV/V
Load Regulation
5mA ≤IO ≤ 100 mA
0.3 1 %
Dropout Voltage
I
O
≤ 10 mA
I
O
= 100 mA
0.05
0.3
0.2
0.6
V
V
Quiescent Current I
O
= 10 mA
I
O
= 100 mA
During Shutdown RL = 500Ω
0.4
15
0.8
1
1
mA
mA
mA
Output Noise Voltage 10Hz-100kHz 100
µV
rms
/V
Output Impedance 100mADC and 10mA
rms
,100Hz=10kHz 40
mΩ
Long Term Stability T =1000hr 0.4 %/1000hr
Ripple Rejection fO = 120Hz 0.02 %/V
Maximum Operational Input
Voltage
26 33 V
Maximum Line Transient
IO = 10mA, Reference Voltage ≤ 1.5V
T = 1ms, τ ≤100ms
60 70 V
Reverse Polarity Input Voltage,
D/C
RL = 500Ω, VO ≥ -0.3V
-15 -30 V
Reverse Polarity Input Voltage,
Transient
RL = 500Ω, T = 1ms, τ ≤100ms
-50 -80 V
On/Off Threshold Voltage
On
Off
VO = 3V
3.25
2.0
2.2
1.2 V
V
On/Off Threshold Current 20 50
µA
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2: See Circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for
TA = TJ = 25°C.
Note 4: The junction-to-ambient thermal resistance are as follows: 195°C/W for the TO-92 (N) package, 160°C/W for the molded plastic SO-8 (S), 50°C/W for the
TO-220 package and 73°C/W for the TO-263 package. If the TO-220 package is used with a heat sink, θJA is the sum of the package thermal resistance junction-tocase of 3°C/W and the thermal resistance added by the heat sink and the thermal interface. The thermal resistance of the TO-263 package can be reduced by
increasing the PCB copper area thermally connected to the package: using 0.5 square inches of copper area, ϕ JA is 50°C/W; with 1 square inch of copper area ϕ JA is
37°C/W; and with 1.6 or more square inches of copper area ϕ JA is 32°C/W.