ADLINK Express-IBR User Manual

Express-IBR

(Computer-on-Module)

Reference Manual

P/N 50-1Z132-1000

Notice Page

DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from time to time without obligation to notify any person of such revisions. If errors are found, please contact ADLINK at the address listed on this Notice Page.

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel, RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their respective companies.

REVISION HISTORY

Revision Reason for Change Date

1000 Initial Release Nov/12

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to design and implement prototype computer equipment.

ii Reference Manual Express-IBR

Contents

Chapter 1 About This Manual ....................................................................................................1

Purpose of this Manual ....................................................................................................................1

References ......................................................................................................................................1

Chapter 2 Product Overview .....................................................................................................3

COM Express Concept ...................................................................................................................3

COM Express Architecture ..............................................................................................................4

Product Description..........................................................................................................................5

Module Features ........................................................................................................................5

Block Diagram ............................................................................................................................8

Major Components (ICs) .................................................................................................................9

Connectors, Headers, and Sockets ...............................................................................................11

Specifications ................................................................................................................................13

Physical Specifications ............................................................................................................13

Power Specifications ................................................................................................................14

Environmental Specifications ...................................................................................................17

Thermal/Cooling Requirements ................................................................................................18

Mechanical Specifications ........................................................................................................19

Chapter 3 Hardware .................................................................................................................21

Overview ........................................................................................................................................21

CPU ...............................................................................................................................................22

Graphics ........................................................................................................................................22

Memory ..........................................................................................................................................22

Interrupt Channel Assignments .....................................................................................................23

Memory Map .................................................................................................................................24

I/O Address Map ...........................................................................................................................25

COM Express A-B Connector .......................................................................................................26

LPC Interface............................................................................................................................26

SATA Interface .........................................................................................................................26

USB 2.0 Interface .....................................................................................................................26

Power Interface ........................................................................................................................26

Power Management .................................................................................................................27

Video Interfaces .......................................................................................................................27

Audio Interface .........................................................................................................................27

Ethernet Interface ....................................................................................................................27

I²C™ Bus .................................................................................................................................27

PCI Express™ ..........................................................................................................................27

System Management Bus (SMBus) .........................................................................................28

GPIO.........................................................................................................................................28

COM Express C-D Connector .......................................................................................................31

Digital Display Interface (DDI) ..................................................................................................31

PCI Express™ ..........................................................................................................................31

PCI Express Graphics (PEG) ...................................................................................................31

SDVO .......................................................................................................................................32

USB 3.0 Interface .....................................................................................................................32

Express-IBR Reference Manual iii

Contents

Miscellaneous ............................................................................................................................... 35

Watchdog Timer....................................................................................................................... 35

TPM (Trusted Platform Module)............................................................................................... 35

Hardware Voltage and Temperature Monitor .......................................................................... 35

System Fan ............................................................................................................................. 36

Serial Console.......................................................................................................................... 36

Chapter 4 BIOS Setup .............................................................................................................. 37

Introduction ................................................................................................................................... 37

Entering BIOS Setup (Local Video Display) ............................................................................. 37

Entering BIOS Setup (Serial Port Console) ............................................................................. 37

OEM Logo Screen (Splash Screen) .............................................................................................. 38

Logo Image Requirements....................................................................................................... 38

BIOS Setup Menus ....................................................................................................................... 38

BIOS Main Setup Screen ........................................................................................................ 39

BIOS Advanced Setup Screen ................................................................................................ 40

BIOS Chipset Setup Screen..................................................................................................... 46

BIOS Boot Setup Screen ......................................................................................................... 49

BIOS Security Setup Screen ................................................................................................... 50

BIOS Save & Exit Setup Screen .............................................................................................. 51

Appendix A Technical Support .................................................................................................. 53

Index ................................................................................................................................................. 55

List of Figures

Figure 2-1. Mini, Compact, Basic and Extended Form Factors ................................................. 4

Figure 2-2. Functional Block Diagram ....................................................................................... 8

Figure 2-3. Component Locations (Top Side).......................................................................... 10

Figure 2-4. Component Locations (Bottom Side) .................................................................... 11

Figure 2-5. Connector Locations (Top Side)............................................................................ 12

Figure 2-6. Connector Locations (Bottom Side) ...................................................................... 13

Figure 2-7. i3-3217UE Peak In-Rush Current and Duration .................................................... 15

Figure 2-8. i7-3517UE Peak In-Rush Current and Duration .................................................... 15

Figure 2-9. i7-3555LE Peak In-Rush Current and Duration..................................................... 16

Figure 2-10. i7-3612QE Peak In-Rush Current and Duration.................................................... 16

Figure 2-11. i7-3615QE Peak In-Rush Current and Duration.................................................... 17

Figure 2-12. Stack Heights of Cooling Assemblies (Side Views) .............................................. 18

Figure 2-13. Mechanical Dimensions (Top Side)....................................................................... 19

Figure 3-1. Hot Cable Jumper ................................................................................................. 36

Figure 4-1. BIOS Main Setup Screen ...................................................................................... 39

Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 40

Figure 4-3. BIOS Chipset Setup Screen.................................................................................. 46

Figure 4-4. BIOS Boot Setup Screen....................................................................................... 49

Figure 4-5. BIOS Security Setup Screen ................................................................................. 50

Figure 4-6. BIOS Save & Exit Setup Screen ........................................................................... 51

iv Reference Manual Express-IBR

List of Tables

Table 2-1. COM Express Pin-out Types ...................................................................................3

Table 2-2. Major Integrated Circuit Descriptions and Functions ...............................................9

Table 2-3. Module Connector and Socket Descriptions..........................................................11

Table 2-4. Weight and Footprint Dimensions..........................................................................13

Table 2-5. Power Supply Requirements ................................................................................14

Table 2-6. Environmental Requirements.................................................................................17

Table 2-7. ADLINK Optional Cooling Solutions.......................................................................18

Table 3-1. Interrupt Channel Assignments..............................................................................23

Table 3-2. Memory Map ..........................................................................................................24

Table 3-3. I/O Address Map ....................................................................................................25

Table 3-4. SMBus Reserved Addresses .................................................................................28

Table 3-5. COM Express A-B Connector Signal Descriptions (CN6)......................................28

Table 3-6. COM Express C-D Connector Signal Descriptions (CN7) .....................................32

Table 3-7. Optional System Fan (FAN1) ................................................................................36

Table 4-1. BIOS Setup Menus ................................................................................................38

Table A-1. Technical Support Contact Information..................................................................53

Contents

Express-IBR Reference Manual v

Contents

vi Reference Manual Express-IBR

Chapter 1 About This Manual

Purpose of this Manual

This manual provides reference for designers of systems based on the Express-IBR Computer-on-Module (COM). This manual contains information that permits designers to create an embedded system based on specific design requirements.

Information provided in this reference manual includes:

• Product Overview

• Hardware Specifications

• BIOS Setup Information

• Technical Support Information

Information not provided in this reference manual includes:

• Detailed chip specifications (refer to References section of this chapter for hyperlinks to chip

specifications)

• Internal component operation

• Internal registers or signal operations

• Bus or signal timing for industry standard buses and signals

• Pin-signal definitions for industry-standard interfaces

References

The following list of references may be helpful for you to complete your custom design successfully.

Specifications

• COM Express Specification Revision 2.0

Web site: http://www.picmg.org/

• PCIe Specification Revisions 2.0 and 3.0

Web site: http://www.pcisig.com/specifications/pciexpress/base

• I

C Bus Specification Version 2.1

Specification: http://www.nxp.com/documents/other/39340011.pdf

• USB Specification Versions 2.0 and 3.0

Web site: http://www.usb.org/developers

• SATA Specification Version 3.1

Web site: http://www.sata-io.org/

• LPC Specification Version 1.1

Web site: http://www.intel.com/design/chipsets/industry/lpc.htm

• SMBus Specification Version 2.0

Specification: http://smbus.org/specs/

• TPM (Trusted Platform Module) Specification 1.2, Level 2 Revision 103

Web site: http://www.trustedcomputinggroup.org/resources/tpm_main_specification

Express-IBR Reference Manual 1

Chapter 1 About This Manual

• ADLINK Intelligent Device Interface (AIDI) Library User’s Manual (See Utilities section of Product

page)

Web site: http://www.adlinktech.com/PD/web/PD_Driver.php?PDNo=1164&kind=UT

• AMI BIOS Aptio TSE User’s Guide

Datasheet: http://www.ami.com/support/doc/AMI_TSE_User_Manual_PUB.pdf

Chip Specifications

• Intel Corporation and the Mobile 3rd Generation Core™ i CPU Family, featured as the integrated

processor core and graphics memory hub

Web site: http://www.intel.com/p/en_US/embedded/hwsw/hardware/core-hm76/hardware

• Intel Corporation and the BD82QM77, 7 Series Express chipset, featured as the Platform Controller

Hub (PCH)

Web site: http://www.intel.com/p/en_US/embedded/hwsw/hardware/core-hm76/hardware

• ON Semiconductor and the ADT7490-D chip, featured as the temperature monitor and fan controller

Datasheet: http://www.onsemi.com/pub_link/Collateral/ADT7490-D.PDF

• Atmel Corporation and the AT97SC3204T-U1A190, featured as the Trusted Platform Module (TPM),

integrated security module

Web sit e : http://www.atmel.com/products/Embedded/default.asp?category_id=172&family_id=620

• Atmel Corporation and the ATMEGA168V-10AU, featured as the Board Controller

Datasheet: http://www.atmel.com/dyn/resources/prod_documents/2545S.pdf

• Atmel Corporation and the AT24C02C, featured as the I2C EEPROM

Datasheet: http://www.atmel.com/Images/doc8700.pdf

• Philips Corporation and the PCA9535BS chip, featured as the GPIO generator

Datasheet: http://www.datasheetcatalog.org/datasheet/philips/PCA9535.pdf

• Intel Corporation and the 82579LM chip used for the Gigabit Ethernet PHY transceiver

Datasheet: h

NOTE If you are unable to locate the datasheets using the links provided, search the internet

ttp://download.intel.com/design/network/datashts/82579.pdf

to find the manufacturer’s web site and locate the documents you need.

2 Reference Manual Express-IBR

Chapter 2 Product Overview

This introduction presents general information about the COM Express™ architecture and the Express-IBR Computer-on-Module (COM). After reading this chapter you should understand:

• COM Express concept

• COM Express architecture

• Express-IBR Product Description

• Express-IBR Major Components

• Express-IBR Connectors, Headers, and Sockets

• Express-IBR Specifications

COM Express Concept

COM Express is an open-industry standard, defined specifically for COM boards. Its creation provides the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available today. COM Express modules are available in the following form factors:

• Mini 84mm x 55mm

• Compact 95mm x 95mm

• Basic 125mm x 95mm

• Extended 155mm x 110mm

The COM Express specification 2.0 defines seven different pinout types.

Table 2-1. COM Express Pin-out Types

Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports

Type 1 A-B Up to 6 1

Type 2 A-B C-D Up to 22 32 bit 1 1

Type 3 A-B C-D Up to 22 32 bit 3

Type 4 A-B C-D Up to 32 1 1

Type 5 A-B C-D Up to 32 3

Type 6 A-B C-D Up to 24 1

Type 10 A-B Up to 4 1

The Express-IBR utilizes the Basic form factor and the Type 6 pinout definition, featuring two high performance connectors that ensure stable data throughput. The Type 6 pinout removes the PCI interface signals and replaces them with DisplayPort and HDMI display signals, thereby expanding the range of potential video peripherals beyond the familiar VGA, LVDS, and SDVO interfaces.

The COM board integrates all core components and is mounted onto an application specific baseboard. COM boards are legacy-free designs (no Super I/O, PS/2 keyboard, and PS/2 mouse) and provide most of the functional requirements for any application. These functions include, but are not limited to a rich complement of contemporary, high-bandwidth serial interfaces such as PCI Express, SATA, USB 3.0, and Gigabit Ethernet. The robust thermal and mechanical concept of the COM board, combined with extended power management capabilities, is perfectly suited for all applications.

Express-IBR Reference Manual 3

Chapter 2 Product Overview

Mini Form Factor

Compact Form Factor

Basic Form Factor

Note: Measurements are in millimeters

Extended Form Factor

COM_FormFactors_b

Baseboard designers can utilize as little or as many of the I/O interfaces as necessary. The baseboard can therefore provide all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express modules are scalable, which means once an application has been created, the ability to diversify the product range is possible through the use of different performance class modules. Simply unplug one module and replace it with another. No redesign is necessary.

COM Express Architecture

The COM Express specification was developed by the PCI Industrial Computer Manufacturing Group (PICMG) in close collaboration with many leading companies across the embedded industry in order to find an implementation solution to handle upcoming new high-speed serial I/Os, processors, and chipsets. COM Express specifies four form factors, as well as seven different types of connector pinouts.

The four form factors are referred to as Mini, Compact, Basic, and Extended. The Mini form factor targets battery powered, mobile, and handheld system designs and features a footprint of just 84mm x 55mm. The Compact form factor is 95mm x 95mm, designed to match the requirements of small applications. The Basic module footprint is 125mm x 95mm and focuses on space-constrained, low power systems which typically do not contain more than one horizontal mounted SODIMM. The Extended footprint is slightly larger at 155mm x 110mm and supports up to two full-size, vertically mounted DIMM modules to accommodate larger memory configurations for high-performance CPUs, chipsets, and multiprocessor systems. The placement of the shielded 220-pin connectors and the mounting holes are identical between these four footprints.

Figure 2-1. Mini, Compact, Basic and Extended Form Factors

4 Reference Manual Express-IBR

Chapter 2 Product Overview

Product Description

The Express-IBR is an exceptionally high integration, high performance, rugged Intel Core™ processor based system compatible with the COM Express standard. This rugged and high quality module system contains all the component subsystems of an ATX motherboard.

The Intel Core processor incorporates a multi processor core with an integrated Graphics Memory Hub (GMH), providing a high-performance processor, a memory controller for up to 16GB of SODIMM memory, and a graphics controller for LVDS, VGA, PCI Express graphics (PEG), SDVO, DisplayPort, and HDMI signals driven by the PCH.

The Intel BD82QM77 chipset provides controllers for the Platform Controller Hub (PCH) featuring eight USB 2.0 ports, four USB 3.0 ports, four SATA ports, eight GPIO ports, and one Gigabit Ethernet interface (external magnetics required).

Expansion for additional system functions is possible on the Express-IBR through the PCIe, LPC, and I²C expansion buses. The PCIe, LPC, and I²C buses operate at clock speeds of 100MHz, 33MHz, and 3.4MHz, respectively.

The Express-IBR is particularly well suited for either embedded or portable applications and meets the size, power consumption, temperature range, quality, and reliability demands of embedded system applications.

Module Features

• CPU



Intel 1.8GHz (i3-3217UE), 1.7GHz (i7-3517UE), 2.1GHz (i7-3612QE), 2.3GHz (i7-3615QE), or

2.5GHz (i7-3555LE) 3rd Generation Core i series processors



DMI (Direct Media Interface) with 2 GB/s of bandwidth in each direction



FDI (Flexible Display Interface) for carrying display traffic to the PCH



Internal 256KB L2 cache



Enhanced Intel SpeedStep® Technology (EIST)

• Memory



Two standard 204-pin DDR3 SODIMM sockets



Supports +1.5V DDR3, 1333/1600MHz RAM up to 16GB total capacity



Supports only ECC, un-buffered memory

• Expansion Buses



PCIe between CPU/PCH and COM Express connectors



LPC (Low Pin Count) for LPC devices



I2C for fast mode I2C devices

• COM Express Interface



SATA Interface

• Provides four SATA ports

• Supports up to 6 Gb/s transfer speed on two ports

• Supports up to 3 Gb/s transfer speed on all ports

• Supports Native Command Queuing

• Provides Auto Activate for DMA

• Supports Hot Plug features

Express-IBR Reference Manual 5

Chapter 2 Product Overview



HD Audio

• Provides Intel HD Audio controller

• Supports Audio Docking

• Provides 32-bit sample depth

• Supports sample rates up to 192kHz



USB Port Interface

• Supports two root USB hubs

• Supports four USB 3.0 ports

• Supports eight EHCI USB 2.0 ports

• Supports legacy UHCI USB 1.1 signals

• Supports Per-Port-Disable



Ethernet Interface

• Provides Intel 82579LM Ethernet PHY transceiver chip

• Supports one Gigabit Ethernet port

• Supports IEEE 802.3, 802.3u, 802.3z, and 802.3ab compatible physical layers

• Supports Auto-negotiation for speed, duplex mode, and flow control

• Supports half duplex at 10/100Mb/s or full duplex at 10/100/1000Mb/s

- Full-duplex mode supports transmit and receive frames simultaneously

- Supports IEEE 802.3x flow control in full duplex mode

- Half-duplex mode supports enhanced proprietary collision reduction mode



Video Interfaces (VGA/LVDS/PEG/SDVO/DisplayPort/HDMI)

• Support the DisplayPort standard

• Support Graphics Performance Modulation Technology

• Support Intel Smart 2D Display Technology

• Support Graphics Render C-State

• Support Intel Seamless Display Refresh Rate Switching with eDP

• Provide an integrated RAMDAC with 32-bit color

• Provide digital HSYNC and VSYNC signals

• Support one SDVO port through Digital Port B at 200 MP/s (Megapixels/second)

• Support DisplayPort resolutions up to 2560x1600 pixels at 60Hz

• Support HDMI (with reduced blanking) resolutions up to 2560x1600 pixels at 60Hz

• Support VGA resolutions up to 2560x1600Hz pixels at 60Hz

• Support LVDS resolutions up to 1920x1200 pixels at 60Hz

• Provide 24-bit dual-channel LVDS output

• Support PCI Express Graphics (PEG)

6 Reference Manual Express-IBR

Chapter 2 Product Overview

• Miscellaneous



Real Time Clock (RTC) with external replaceable battery



Watchdog Timer (WDT)



TPM (Trusted Platform Module)



Hardware Voltage and Temperature Monitor



Logo Screen (Splash)



Serial Port Console

Express-IBR Reference Manual 7

Chapter 2 Product Overview

Express-IBR_blkdiag_a

COM Express Connector - Rows A and B

COM Express Connector - Rows C and D

CPU

Intel Core

i3-3217UE 1.8GHz (17W), i7-3517UE 1.7GHz (17W), i7-3555LE 2.5GHz (25W), i7-3612QE 2.1GHz (35W), i7-3615QE 2.3GHz (45W)

(with integrated Processor Core

and Graphics Memory Hub)

DDR3

SODIMM

Socket

DDR3

SODIMM

Socket

FDI

DMI

1333/1600MHz,

1.5V, 16GB Max. (Total)

PCH Intel

BD82QM77

(Southbridge)

Gigabit

Ethernet

Intel

82579LM

PCIe x1 (6) SMBus

LVDS (24-bit, dual channel)

Intel - HD Audio Link

SATA (4)

PCIe x1 (1), Lane 8

PCIe x1 (1), Lane 7

PCIe x1 (1)

PCIe x1 (6), Lanes 1-6

USB 2.0 (8)

USB 3.0 (4)

LPC

SMBus

VBATT (RTC)

I2C

LVDS DDC I2C

WDT

Board

Controller

I2C EEPROM

GPIO

Generator

Hardware

Monitor

SPI

TPM

SDVO / DisplayPort / HDMI (DDI1)

DisplayPort / HDMI (DDI2)

DisplayPort / HDMI (DDI3)

GPIO

GLAN

PCIe x16 Graphics (1) [PEG], 1x16; 2x8; 1x8 & 2x4

VGA

Channel - A

Channel - B

12V Input

5V Standby

SDVO / DP / HDMI DP / HDMI

PCIe x16 (1) [PEG]

Gb Ethernet

I2C

GPIO (8)

USB 2.0 (8)

USB 3.0 (4)

LPC

VGA

VBATT WDT

HD Audio

SPI

SATA (4)

LVDS

Debug Port

BIOS

PWR Management

Block Diagram

Figure 2-2 provides a functional representation of the module.

Figure 2-2. Functional Block Diagram

8 Reference Manual Express-IBR

Chapter 2 Product Overview

Major Components (ICs)

Table 2- 2 lists the major integrated circuits on the Express-IBR, including a brief description of each IC. Figures 2-3 and 2-4 show the locations of the major ICs.

Table 2-2. Major Integrated Circuit Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U1) Intel Core i Series

(i3-3217UE, i7-3517UE, i7-3555LE, i7-3612QE, and i7-3615QE)

PCH (Platform Controller Hub [U3])

Hardware Monitor (U6) [on bottom side; see Figure 2-4

on page 11]

TPM (Trusted Platform Module [U7])

Board Controller (U8) [on bottom side; see

Figure 2-4 on page 11]

GPIO Generator (U9)

Intel BD82QM77

(PCH)

ON Semiconductor

Atmel AT97SC3204-

Atmel ATMEGA168V-

Philips PCA9535BS Module providing 16

ADT7490-D Remote Voltage and

U1A90

10AU

1.8GHz (17W),

1.7GHz (17W),

2.5GHz (25W),

2.1GHz (35W), and

2.3GHz (45W) processors with up to 8MB L3 cache

I/O hub providing Southbridge functions (standard I/O functions)

Temperature Monitor and Fan Controller

Complete turnkey system that integrates industry-leading Atmel AV R  micro-controller architecture, Atmel EEPROM technology, and Atmel Security technology on a single chip

Micro controller for board functions

including I²C, Watchdog Timer, and LV DS

bits of GPIO expansion for I²C/SMBus

applications

Provides integrated processor core, memory hub, and graphics hub

Provides I/O interfaces such as USB, SATA, and video

Provides system thermal protection

Provides an integrated, protected, nonvolatile solution for strong public key security, intellectual property protection, system integrity, authentication, and secure communications

Optimizes power consumption versus processor speed

Provides additional digital control lines

Express-IBR Reference Manual 9

Chapter 2 Product Overview

U46

Key: U1 - CPU U3 - PCH U7 - TPM U9 - GPIO Generator U46 - Gb Ethernet

Express-IBR_Top_Comp_a

Table 2-2. Major Integrated Circuit Descriptions and Functions (Continued)

I²C EEPROM (U42)

Atmel AT24C02C-

XHM-T

2-wire, 2Kb Serial EEPROM

Provides storage for module board status and identification

through the I²C pins on the COM Express interface (B33–I2C_CK and B34–I2C_DAT)

Gigabit Ethernet PHY Transceiver (U46)

Intel 82579LM Ethernet PHY

transceiver for 10T/100TX/1000T Gigabit Ethernet function

Provides a standard IEEE

802.3 Ethernet interface for Ethernet transfer rate up to 1000 Mb/s

Figure 2-3. Component Locations (Top Side)

10 Reference Manual Express-IBR

Chapter 2 Product Overview

Express-IBR_Bottom_Comp_a

Key: U6 - Hardware Monitor U8 - Board Controller U42 - I²C EEPROM

U42

Figure 2-4. Component Locations (Bottom Side)

Connectors, Headers, and Sockets

Table 2- 3 describes the connectors, headers, and sockets shown in Figures 2-5 and 2-6.

Table 2-3. Module Connector and Socket Descriptions

Jack/Plug # Board

Access

J5 – Memory Top 204-pin socket for un-buffered, ECC DDR3 SODIMM -

J6 – Memory Top 204-pin socket for un-buffered, ECC DDR3 SODIMM -

CN1 – XDP Debug (see

Bottom 26-pin, 0.020" (0.50mm) right-angle debug port connector

Figure 2-6 on page 13.)

CN4 – LPC Debug Top 10-pin, .050" (1.27mm) female debug port header for

CN6 – COM Express A-B

Bottom 220-pin standard connector for Northbridge Video and

(see Figure 2-6 on page 13.)

Description

Channel A

Channel B

for the CPU and PCH

issues such as Port 80 POST errors

Southbridge I/O functions

Express-IBR Reference Manual 11

Chapter 2 Product Overview

Pin 1

Pin 2

Pin 4

1 2

Pin 3

SW1 Configuration Switch

CN4

FAN1

Key: J5 - Channel A SODIMM socket J6 - Channel B SODIMM socket FAN1 - CPU Fan CN4 - LPC

Express-IBR_Top_Conn_a

Table 2-3. Module Connector and Socket Descriptions (Continued)

CN7 – COM Express C-D (see Figure 2-6 on page 13.)

Bottom 220-pin standard connector for Northbridge Video and

Southbridge I/O functions

FAN1 – System Fan Top 3-pin, 0.049" (1.25mm) right-angle shrouded header

controlled by the Hardware Monitor for CPU and PCH cooling

SW1 – PCIe x16 Lane Configuration Switch (see

Figure 2-6 on page 13.)

Bottom 4-pin dip switch for selecting CPU PCIe x16 lane

configurations

Switch Positions

Lane Configurations Pin 1, Pin 2 (off, off) = 1x8, 2x4 Pin 1, Pin 3 (off, on) = Reserved Pin 4, Pin 2 (on, off) = 2x8 Pin 4, Pin 3 (on, on) = 1x16 [Default]

Figure 2-5. Connector Locations (Top Side)

12 Reference Manual Express-IBR

NOTE Pin 1 is shown as a black square on connectors in all illustrations.

Chapter 2 Product Overview

Express-IBR_Bottom_Conn_a

Key: CN1 - XDP CN6 - COM Express A1-A110 and B1-B110 CN7 - COM Express C1-C110 and D1-D110 SW1 - PCI Express x16 Configuration Switch

C D

CN7

CN1

SW1

CN6

A B

1 2

Specifications

Physical Specifications

Table 2- 4 lists the physical dimensions of the module.

Table 2-4. Weight and Footprint Dimensions

Item Dimension

Weight 0.14 kg (0.30 lb)

Height (overall) 9.20mm (0.36 inches)

Board thickness 2.362mm (0.093 inches)

Width 95.00mm (3.74 inches)

Length 125.00mm (4.92 inches)

Figure 2-6. Connector Locations (Bottom Side)

NOTE Overall height is measured from the

upper board surface to the highest permanent component on the upper board surface. This measurement does not include the cooling solutions. The heights of the board with the cooling solutions are 36.58mm for the passive heatsink (without fan), 46.74mm for the active heat sink (with fan) and 10.92mm for the heat spreader. See Figure 2-12.

Express-IBR Reference Manual 13

Chapter 2 Product Overview

Power Specifications

Table 2- 5 provides the power requirements for the Express-IBR with 1.7, 1.8, 2.1, 2.3, and 2.5 GHz CPUs

and a 430 watt power supply.

Table 2-5. Power Supply Requirements

Parameter 1.8 GHz CPU

(i3-3217UE)

Input Type (430 watt power supply)

In-Rush Peak Current and Duration

Idle Current & Power (Windows 7)

BIT Current & Power

S1 Mode Current & Power

S3 Mode Current & Power

Note: These measurements are of power consumed only by the module and do not include power

consumed by the baseboard.

Operating configurations:

+12V Regulated DC

See Figure 2-7 See Figure 2-8 See Figure 2-9 See Figure 2-10 See Figure 2-11

0.54A (6.42W)

1.23A (14.74W)

0.03A (0.14W)

0.24A (1.19W)

1.7 GHz CPU (i7-3517UE)

+12V Regulated DC

0.55A (6.59W)

1.88A (22.54W)

0.06A (0.29W)

0.24A (1.19W)

2.5 GHz CPU (i7-3555LE)

+12V Regulated DC

0.54A (6.45W)

2.02A (24.21W)

0.02A (0.11W)

0.24A (1.18W)

2.1 GHz CPU (i7-3612QE)

+12V Regulated DC

0.62A (7.39W)

3.06A (36.75W)

0.03A (0.15W)

0.24A (1.19W)

2.3 GHz CPU (i7-3615QE)

+12V Regulated DC

0.59A (7.08W)

3.52A (42.20W)

0.04A (0.22W)

0.24A (1.18W)

• In-rush operating configuration includes Express-BASE6 baseboard, CRT monitor, 4GB DDR3-1333

RAM with ECC. (Caution: A +5V standby input is applied to the baseboard before the +12V input for the In-Rush measurement is applied separately to the module.)

• Idle (Windows 7) operating configuration includes the in-rush configuration as well as one SATA 3.5"

hard drive, and PS2 keyboard and mouse.

• BIT (Burn-In-Test) operating configuration is the same as the Idle configuration.

• S1 (Standby) operating configuration is the same as Idle configuration.

• S3 (Suspend) operating configuration is the same as Idle configuration.

14 Reference Manual Express-IBR

+ 44 hidden pages

ADLINK Express-IBR User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Notice Page