10.2Standard Status Codes .....................................................................................................66
10.3OEM-Reserved Status Code Ranges ...............................................................................72
Important Safety Instructions......................................................................................73
Getting Service .............................................................................................................74
Express-HR User’s ManualPage 4
Preface
Copyright 2012 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve
reliability, design, and function and does not represent a commitment on the part of the
manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential
damages arising out of the use or inability to use the product or documentation, even if advised
of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation
through compliance with the European Union's Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental
protection is a top priority for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little impact on the
environment as possible. When products are at their end of life, our customers are encouraged to
dispose of them in accordance with the product disposal and/or recovery programs prescribed by
their nation or company.
Trademarks
AMIBIOS®8 is a registered trademark of American Megatrends, Inc. COM Express®, and
PICMG® are registered trademarks of the PCI Industrial Computer Manufacturers Group.
Product names mentioned herein are used for identification purposes only and may be
trademarks and/or registered trademarks of their respective companies.
Take note of the following conventions used throughout this manual to make sure that users
perform certain tasks and instructions properly.
Additional information, aids, and tips that help users perform tasks.
Information to prevent minor physical injury, component damage, data loss,
and/or program corruption when trying to complete a task.
Information to prevent serious physical injury, component damage, data
loss, and/or program corruption when trying to complete a specific task.
Express-HR User’s ManualPage 6
1Introduction
1.1Description
The Express-HR is a COM Express® COM.0 R2.0 Type 6 module supporting the 64-bit Intel®
Core™ i7/i5 processor with CPU, memory controller, and graphics processor on the same
chip. Based on the latest Mobile Intel® QM67 Express chipset, the Express-HR is specifically
designed for customers who need high-level processing and graphics performance in a long
product life solution.
The Express-HR features the Intel® Core™ i7/i5 processor supporting Intel® Hyper-threading
Technology (4 cores, 8 threads) and up to 16GB of DDR3 dual-channel memory at
1066/1333 MHz to provide excellent overall performance. Intel® Flexible Display Interface
and Direct Media Interface provide high speed connectivity to the Intel® QM67 Express
chipset.
Integrated HD Graphics 3000 includes features such as OpenGL 3.0, DirectX10.1, Intel®
Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video
Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs
include VGA, LVDS and three DDI ports supporting HDMI / DVT / DisplayPort or SDVO. The
Express-HR is specifically designed for customers with high-performance processing
graphics requirements who want to outsource the custom core logic of their systems for
reduced development time.
The Express-HR has dual stacked SODIMM sockets for up to 16 GB DDR3 memory. The
Intel® Mobile QM67 Express chipset integrates VGA and dual-channel 18/24-bit LVDS
display output. In addition to the onboard integrated graphics, a multiplexed PCI Express®
x16 Graphics bus is available for discrete graphics expansion or general purpose x8 or x4
PCI Express® connectivity.
The Express-HR features a single onboard Gigabit Ethernet port, up to eight USB 2.0 ports,
two SATA 6 Gb/s ports and two SATA 3 Gb/s ports with optional support for RAID 0/1/5/10.
Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with
CMOS backup, supporting embedded features such as remote console, CMOS backup,
hardware monitor, and watchdog timer.
The Express-HR is a RoHS compliant and lead-free product.
f Memory: Dual channel non-ECC 1066/1333 MHz DDR3 memory up to 16 GB in
dual SODIMM socket
f Chipset:Mobile Intel® QM67 Express
f L3 Cache: 6MB (i7-2715QE), 4MB (i7-2655LE and i7-2610UE), 3MB (i5-2515E)
f BIOS:AMI EFI with CMOS backup in 16 Mbit SPI BIOS
f Debug Interface: XDP SFF-26 extension for ICE debug
f Hardware Monitor: Supply voltages and CPU temperature
f Watchdog Timer: Programmable timer ranges to generate RESET
2.2Expansion Busses
f On Processor:
-PCI Express x16 Graphics (Gen2) bus for discrete graphics solution or General
Purpose PCI Express (2 x8 or 1 x8 with 2 x4) - see 6.2 PCI Express x16
Configuration
f On Chipset:
-8 PCI Express x1: 0/1/2/3/4/5/6 are free, 7 is occupied by GbE LAN
-LPC bus for optional connections to SIO, UART, etc.
f LPC bus, SMBus (system), I2C (user)
Express-HR User’s ManualPage 8
2.3Video
f Core: HD Graphics 3000 at 650–1300 MHz
f Integrated Graphics Features:
- DirectX 10.1 and OpenGL 3.0
- Intel Clear Video HD Technology
- Advanced Scheduler 2.0, 1.0, XPDM support
- DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode
f VGA Interface: Analog VGA support up to QXGA, 300MHz DAC
f LVDS Interface: Dual channel 18/24-bit
f Digital Display Interface (DDI): Three DDI ports supporting HDMI / DVI / DisplayPort or
SDVO (see Note below regarding DisplayPort). A maximum of two simultaneous display
outputs are supported. SDVO is available on DDI1 only. See 6.1 Digital Display Interface
for information on configuring the DDI output.
DisplayPort
DisplayPort is a VESA interface standard for digital display. It defines a new licensefree, royalty-free, state-of-the-art digital audio/video interconnect, intended to be
used primarily between a computer and its display monitor, or a computer and a
home theater system. It features 1.62 Gb/s and 2.7 Gb/s transfer rates over 1, 2 or 4
data lanes, 8b 10b coding, Hot-Plug detect support and HDCP support. Embedded
DisplayPort (eDP) does not offer all features of standard DisplayPort because
embedded applications do not require features such as link training, hot plug
detection or logo testing. The eDP standard supports one data pair supporting XGA
(1024x768) over two wires. Optionally 4 wires can be used for two data pairs to
support 1280x1024.
2.4Audio
f Chipset: Integrated in Intel® PCH QM67
f Audio Codec: on Express-BASE6 (ALC888)
2.5LAN
f Chipset: Intel® Gigabit LAN PHY WG82579LM
f Interface: 10/100/1000 Mbps Ethernet
f SATA: Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s with support for
RAID 0,1,5,10
f USB: Supports up to eight ports USB 2.0
f SSD: Optional SATA based Solid State Disk, 8/16/32 GB
2.7Super I/O
f Connected to LPC bus on carrier if needed
2.8TPM (T rusted Platform Module)
f Chipset: Infineon SLB9635TT1.2
f Type: TPM 1.2
2.9Power Specifications
f Input Power: AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%)
f Power States: supporting S0, S1, S3, S4, S5
f Smart Battery Support: yes
Express-HR User’s ManualPage 10
2.10Power Consumption
The 12V measurement is power to the module only (excluding carrier board
power draw). The 5Vsb measurement (in S3/S5 mode) includes both module
power consumption plus active 5Vsb powered peripherals (such as PS/2 and
USB) on the carrier that are needed for wakeup. Although all voltages were
measured, only 12 V and 5 VSB are relevant because they are the only ones
used by the Express module. The Idle power level was measured under
Windows XP with no applications running (login screen). Max Load was
measured under Windows XP running BurnIn software. Measurements were
made with two 4GB 1066 MHz DDR3 SODIMM memory modules installed.
Intel® Core™ i7-2715QE 2.1 GHz
Power State+12V+5V
Idle (Windows XP login)0.88 VN.S.10.56 W
Max. Load (Windows XP - BurnIn)6.56 VN.S.78.72 W
S1 (standby powered on)0.81 VN.S.9.72 W
S3 (suspend to RAM)-0.49 V2.45 W
S5 (soft off)-0.37 V1.85 W
SB
Power Consumption
Intel® Core i7-2655LE 2.2 GHz
Power State+12V+5V
Idle (Windows XP login)0.77 VN.S.9.24 W
Max. Load (Windows XP - BurnIn)4.06 VN.S.48.72 W
S1 (standby powered on)0.73 VN.S.8.76 W
S3 (suspend to RAM)-0.48 V2.4 W
S5 (soft off)-0.37 V1.85 W
SB
Power Consumption
Intel® Core™ i7-2610UE 1.5 GHz
Power State+12V+5V
Idle (Windows XP login)0.77AN.S.9.24W
Max. Load (Windows XP - BurnIn)2.86 AN.S.34.32 W
S1 (standby powered on)0.73 AN.S.8.76 W
S3 (suspend to RAM)-0.48 A2.4 W
S5 (soft off)-0.37 A1.85W
Idle (Windows XP login)0.83 VN.S.9.96 W
Max. Load (Windows XP - BurnIn)4.55 VN.S.54.6 W
S1 (standby powered on)0.77 VN.S.9.24 W
S3 (suspend to RAM)-0.49 V2.45 W
S5 (soft off)-0.37 V1.85 W
CMOS Battery Power Consumption
Current (+3V)Power
1.3 µA0.00000429 W
2.11Operating Systems
fStandard Support
- Windows XP 32/64-bit
- Windows Vista 32/64-bit
- Windows Server 2003/2008
SB
Power Consumption
fExtended Support (BSP)
- Embedded XP WES2009 BSP
- Embedded Win7
- Vxworks 6.x
- Linux 2.6.xx
- AIDI Library for Windows XP(e), Windows 7 32/64-bit and Linux
2.12Mechanical and Environmental
f Form Factor : PICMG COM.0 R2, COM Express™ Basic form factor
f Type : PICMG COM.0 R2, COM Express™ Type 6 pinout
f Dimensions: 95 x 125 mm
f Standard Operating Temperature: 0°C to 60°C
f Relative Humidity: up to 90% at 60°C
Express-HR User’s ManualPage 12
3Function Diagram
Processor
SODIMM 2
1066/1333 MHz
1~8 GB DDR3
VGA
Dual channel 24-bit LVDS
6x PCIe x1
(port 0~5)
AB
GbE
82579
HD Audio
2x SATA 6 Gb/s (channel 0/1)
2x SATA 3 Gb/s (channel 2/3)
All tolerances ± 0.05 mm
Other tolerances ± 0.2 mm
Express-HR User’s ManualPage 14
5Pinout and Signal Descriptions
5.1COM Express® Type 6 compatible pinout
All signals on AB and CD connectors of the Express-HR comply with pinouts and conventions
used in the original “PICMG® COM.0 R2.0: COM Express® Module Base Specification”.
AB Connector
1 Gigabit Ethernet port
LPC and SPI bus
4 Serial A T A channels
High Definition Audio
8 USB 2.0 ports
6 PCI Express Lanes x1
Dual 24-bit LVDS channels
Analog VGA
8 GPIO pins
SMBus and I2C bus
Fan Control Signals
+12V primary power input
+5V standby and 3V RTC
95mm.
125mm.
CD Connector
USB3.0
addtional signals to upgrade
4 USB ports on AB to USB230
2 PCI Express Lanes x1
3 DDI Channels
Displayport/HDMI/DVI and SDVO
PCI Express x16 for Graphics
or General purpose PCIe
CD
AB
The above function mappings are a generic description of COM
Express pinouts, and not necessarily supported on the module
described in this manual.
5.2Carrier Board Design Guide
The PICMG COM Express Carrier Design Guide is a
160-page document that provides information on
designing a custom carrier board for COM Express
modules. The design guide includes reference
schematics for the external circuitry required to
implement the various COM Express peripheral
functions, explains how to extend the supported buses,
and how to add additional peripherals and expansion
slots to a COM Express-based system. You can
download the document Carrier Design Guide at:
http://www.adlinktech.com/ccps/picmg_comdg_100.pdf
A1GNDGroundPWR-A2GBE0_MDI3-Ethernet Media Dependent Interface -I/O - DP-A3GBE0_MDI3+Ethernet Media Dependent Interface +I/O - DP-A4GBE0_LIN K100# Ethe rnet Speed LED (100Mb)OD-On at 100Mb/s
A5GBE0_LINK1000 # Ethernet Speed LED (1000Mb)OD-On at 1000Mb/s
A6GBE0_MDI2-Ethernet Media Dependent Interface -I/O - DP-A7GBE0_MDI2+Ethernet Media Dependent Interface +I/O - DP-A8GBE0_LI NK#LAN Link LEDO-3.3-
SATA0_TX+ | SATA 0 Transmi t Data +O - DP-SATA0_TX- | SATA 0 Transmit Data -O - DP-PM_SLP_S#4O-3.3-SATA0_RX+ | SATA 0 Receive Data +I - DP-SATA0_RX - | SATA 0 Receive Data -I - DP-GroundPWR-SATA2_TX+ | SATA 2 Transmi t Data +O - DP-SATA2_TX- | SATA 2 Transmit Data -O - DP-PM_SLP_S#5O-3.3-SATA2_RX+ | SATA 2 Receive Data +I - DP-SATA2_RX- | SATA 2 Recei ve Data -I - DP-PM_BATLOW# | Battery LowI-3.3PU 8k2 3.3VsbATA_LED# | SATA LEDO-3.3PU 10k 3.3V
AC_SYNC | AC'97 SyncO-3 .3-int. PD 20k in QM57
AC_RST# | AC'97 ResetO-3.3-int. PD 20k in QM5 7
GroundPWRAC_BITCLK | AC'97 ClockO-3.3-int. PD 20k in QM57
AC_S D A TA O UT | AC '9 7 Da taO-3 .3-int . PD 20k in QM 57
BIOS_DISABLE#I-3.3PU 10k 3.3VsbPM_THRMTRIP#_CONO-3 .3PU 33 0 3.3VUSB_PN6 | USB Data – Port6I/O - DP-int. PD 20k in QM57
USB_PP6 | USB Data + Por t6I / O - DP-int. PD 20k in QM57
USB_OC#_6_7 | USB OverCurrent Port 6/ 7I-3.3PU 10k 3.3VsbUSB_PN4 | USB Data - Port4I/O - DP-int. PD 20k in QM57
USB_PP4 | USB Data + Por t4I / O - DP-int. PD 20k in QM57
GroundPWR-USB_PN2 | USB Data - Port2I/O - DP-int. PD 20k in QM57
USB_PP2 | USB Data + Por t2I / O - DP-int. PD 20k in QM57
USB_OC#_2_3 | USB OverCurrent Port 2/ 3I-3.3PU 10k 3.3Vsb
USB_PN0 | USB Data - Port0I/O - DP-int. PD 20k in QM57
USB_PP0 | USB Data + Por t0I / O - DP-int. PD 20k in QM57
V_BATPWR-Express Card Suppo rt [0 ]|card resetO- 3.3PU 10k 3.3 VsbExpress Card Support [0]| capable requestI-3.3PU 10k 3.3VINT_S ER IRQ | Serial In terrupt Requ estIO-3. 3PU 10k 3. 3VGroundPWR-PCI Express 5 Transmit +O - DP-PCI Express 5 Transmit -O - DP-General Purpose Input 0I-3.3PU 10k 3.3VsbPCI Express 4 Transmit +O - DP--
PCI Express 4 Transmit -O - DP-GroundPWR-PCI Express 3 Transmit +O - DP-PCI Express 3 Transmit -O - DP-GroundPWR-PCI Express 2 Transmit +O - DP-PCI Express 2 Transmit -O - DP-General Purpose Input 1I-3.3PU 10k 3.3VsbPCI Express 1 Transmit +O - DP-PCI Express 1 Transmit -O - DP-GroundPWR-General Purpose Input 2I-3.3PU 10k 3.3VsbPCI Express 0 +O - DP-PCI Express 0 -O - DP-GroundPWR-LVDS_AP0 | LVDS Chann el AO - DP-LVDS_AN0 | LVDS Channel AO - DP-LVDS_AP1 | LVDS Chann el AO - DP-LVDS_AN1 | LVDS Channel AO - DP-LVDS_AP2 | LVDS Chann el AO - DP-LVDS_AN2 | LVDS Channel AO - DP-LVDS_VDDEN | LVDS Panel PowerO-2,5PD 10kLVDS_AP3 | LVDS Chann el AO - DP-LVDS_AN3 | LVDS Channel AO - DP-GroundPWR-LVDS_CLKAP | LVDS Channel AO - DP-LVDS_CLKAN | LVDS Channel AO - DP-LVDS_DDCPCLK | JILI I2C ClockIO-3.3PU 2k 2 3. 3VLVDS_DDCPDATA | JILI I2C DataIO-3.3PU 2k2 3. 3VGeneral Purpose Input 3I-3.3PU 10k 3.3VsbNCNCNCNCCLK_PCI E_REF PO - DP-CLK_PCI E_REF NO - DP-GroundPWR-Power supply for Carr i er Board SPIO-3.3--
IO-General Purpose Output 0O-3.3PU 10k 3.3VsbClock from Module to Carrier SPIIO-Data out from Module to Carrier SPIIO-Trus te d P l atform ModuleIO-3.3-Module type ID pin 10NC-serial port transmitterNC-seri a l port re ceiverNC-GroundPWR-serial port transmitterNC-seri a l port re ceiverNC-LID button.
Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-GroundPWR--
B1GNDGroundPWR-B2GBE0_ACT#LAN_ACTLE D# | Et hernet Acti vi ty LEDODPU 1k 3. 3VB3LPC_FRAME#LPC_FRAME# | LPC Frame Ind icatorO-3.3-B4LPC_AD0LPC_AD0 | LPC Adr ess & DATA BusI O-3.3B5LPC_AD1LPC_AD1 | LPC Adr ess & DATA BusI O-3.3B6LPC_AD2LPC_AD2 | LPC Adr ess & DATA BusI O-3.3B7LPC_AD3LPC_AD3 | LPC Adr ess & DATA BusI O-3.3B8L PC_DRQ0#SIO_DR Q#0 | LPC Se ri al DMA Request 0I -3.3-int. PU 20k in QM57
B9L PC_DRQ1#SIO_DR Q#1 | LPC Se ri al DMA Request 1I -3.3-int. PU 20k in QM57
B10LPC_CLKCLK_SIOEXTPCIO-3.3-B11GNDGroundI-3.3-B12PWR BTN#Power ButtonI-5PU 10k 3.3VsbB13SMB_CKSMBUS Clo ckO-3 .3PU 2k 2 3.3 V sbB14SMB_DATSMBUS DataIO-3. 3PU 2k2 3.3VsbB15SM B _A L ER T #SMB _A LER T #I-3.3PU 10 k 3.3V sbB16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
B50
B51
B52
B53
B54
B55
SATA1_TX+
SATA1_T XSUS_STAT#
SATA1_RX+
SATA1_RX-
GND
SATA3_TX+
SATA3_T X-
PWR_OK
SATA3_RX+
SATA3_RX-
WDT
AC_SDIN2
AC_SDIN1
AC_SDIN0
GND
SPKR
I2C_CK
I2C_DAT
THRM#
USB7-
USB7+
USB_4_5_OC#
USB5-
USB5+
GND
USB3-
USB3+
USB_0_1_OC#
USB1-
USB1+
EXCD1_PER ST#
EXCD1_CPPE#
SYS_RESE T#
CB_RESET#
GND
PCIE5_RX+
PCIE5_RX-
GPO1
PCIE4_RX+
SATA1_TX+ | SATA 1 Transmi t Data +O - DP-SATA1_TX- | SATA 1 Transmit Data -O - DP-PM_S U S _ ST A T#O-3 .3-SATA1_RX+ | SATA 1 Receive Data +I - DP-SATA1_RX - | SATA 1 Receive Data -I - DP-GroundPWR-SATA3_TX+ | SATA 3 Transmi t Data +O - DP-SATA3_TX- | SATA 3 Transmit Data -O - DP-Po w er OKI,3.3PU 10k 3.3VsbSATA3_RX+ | SATA 3 Receive Data +I - DP-SATA3_RX - | SATA 3 Receive Data -I - DP-Watch Dog TimerO-3.3AC_SDATAIN2I-3.3-int. PD 20k in QM57
AC_SDATAIN1I-3.3-int. PD 20k in QM57
AC_SDATAIN0I-3.3-int. PD 20k in QM57
GroundPWRAC_SPK RO-3.3-i nt . PD 20k in QM57
I2C L KO-3 .3PU 10k 3.3VI2 D A TIO-3.3PU 10 k 3 .3VPM THRM # CO N | Over Tempera t ureI -3.3USB_PN7 | USB Data – Port7I/O - DP -int. PD 20k in QM57
USB_PP 7 | USB Data + Port7I/O - DP -int. PD 20k in QM57
USB_OC#_4_5 | USB OverCurrent PortI-3.3PU 10k 3.3Vsb
USB_PN5 | USB Data- Port5I/O - DP -int. PD 20k in QM57
USB_PP 5 | USB Data+ Port5I/O - DP -int . PD 20k in QM57
GroundI-3.3-USB_PN3 | USB Data- Port3I/O - DP -int. PD 20k in QM57
USB_PP 3 | USB Data+ Port3I/O - DP -int . PD 20k in QM57
USB_OC#_0_1 | USB OverCurrent PortI-3.3PU 10k 3.3VsbUSB_PN1 | USB Data- Port1I/O - DP -int. PD 20k in QM57
USB_PP 1 | USB Data+ Port1I/O - DP -int . PD 20k in QM57
Express Card Support [1]|card resetO-3.3P U 10k 3.3VsbExpress Card Support [1]| capable c.I-3.3PU 10k 3.3VETX_SYS_RESET# | Reset InputI-3. 3Pull up +3.3V internally
PCI_ RS T # | PCI B us ResetO-3 .3-GroundPWR-PCI Ex press 5 Reciev e +I - DP-PCI Ex press 5 Receiv e -I - DP-Gene r a l Pu rp os e O ut pu t 1O-3 .3PU 10 k 3.3 V sbPCI Ex press 4 Reciev e +I - DP--
SLEEP#
VCC_12 V
VCC_12 V
VCC_12 V
VCC_12 V
VCC_12 V
VCC_12 V
GND
PCI Ex press 4 Receiv e -I - DP-Gene r a l Pu rp os e O ut pu t 2O-3 .3PU 10 k 3.3 V sbPCI Ex press 3 Reciev e +I - DP-PCI Ex press 3 Receiv e -I - DP-GroundPWR-PCI Ex press 2 Receiv e +I - DP-PCI Ex press 2 Receiv e -I - DP-Gene r a l Pu rp os e O ut pu t 3O-3 .3PU 10 k 3.3 V sbPCI Ex press 1 Receiv e +I - DP-PCI Ex press 1 Receiv e -I - DP-PCIE_WAKEI#I-3.3PU 1k 3.3VsbWAKE1#I-3.3PU 10k 3.3VsbPCI Ex press 0 Receiv e +I - DP-PCI Ex press 0 Receiv e -I - DP-GroundPWR-LVDS_BP0 | LVDS Chann el B Data0+O - DP-LVDS_BN0 | LVDS Channel B Data0-O - DP-LVDS_BP1 | LVDS Chann el B Data1+O - DP-LVDS_BN1 | LVDS Channel B Data1-O - DP-LVDS_BP2 | LVDS Chann el B Data2+O - DP-LVDS_BN2 | LVDS Channel B Data2-O - DP-LVDS_BP3 | LVDS Chann el B Data3+O - DP-LVDS_BN3 | LVDS Channel B Data3-O - DP-LVDS Panel Backlight EnableO-3.3PD 100k GroundPWR-LVDS_CLKBP | LVDS Channel BO - DP-LVDS_CLKBM | LVDS Channel BO - DP-Ba ck lig ht Brightne ssO-3 .3PD 100k 5V StandbyPWR-5V StandbyPWR-5V StandbyPWR-5V StandbyPWR-Selection straps to determine BIOS boot deviceI-3.3-Analog V ideo RGB-REDOA PD 150RGroundPWR-Analog V ideo RGB-GREENOA PD 150RAnalog V ideo RGB-BLUEOA PD 150RAnalog V ideo H-SyncO-3.3-Analog Video V-SyncO-3.3-Display Data Channel - ClockO-3.3Display Data Channel - DataIO-3. 3Chip select for Carrier Board SPIO-3.3-NC
NC
GroundPWR-Fan speed control.O-3.3-Fan tachometer input forfan with 2 pulse outputI-3.3-Sleep button.I-3.3-Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-Power 12VPWR-GroundPWR--