ADLINK Express-CVC User Manual

Express-CVC

User’s Manual
Manual Revision: 2.01
Revision Date: December 12, 2014
Part Number: 50-1J043-1010

Revision History

Revision Description Date By
2.00 Initial release 2013-08-30 JC
2.01 Remove Industrial Temp. support 2014-12-12 JC

Preface

Copyright 2013-14 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

Table of Contents

Revision History ............................................................................................................ 2
Preface............................................................................................................................ 3
1. Introduction......................................................................................................... 7
2. Specifications....................................................................................................... 8
2.1. Core System...............................................................................................................................8
2.2. Expansion busses.......................................................................................................................8
2.3. Video .........................................................................................................................................8
2.4. Audio .........................................................................................................................................9
2.5. Ethernet.....................................................................................................................................9
2.6. Multi I/O and Storage................................................................................................................9
2.7. Super I/O (on Carrier using LPC -bus)........................................................................................9
2.8. GPIO...........................................................................................................................................9
2.9. SEMA Board Controller .............................................................................................................9
2.10. TPM (Trusted Platform Module) ............................................................................................ 10
2.11. Fan Control............................................................................................................................. 10
2.12. Power Specifications .............................................................................................................. 10
2.13. Mechanical and Environmental ............................................................................................. 10
2.14. Specification Compliance ....................................................................................................... 10
2.15. Functional Diagram ................................................................................................................ 11
2.16. Mechanical Drawing............................................................................................................... 12
3. COM Express Pinouts and Signal Descriptions ..............................................
3.1. AB/CD Pin Definitions............................................................................................................. 13
3.2. Signal Description Terminology.............................................................................................. 16
3.3. AB Signal Descriptions............................................................................................................ 17
13
3.3.1. Audio Signals .....................................................................................................................................17
3.3.2. Analog VGA........................................................................................................................................17
3.3.3. LVDS...................................................................................................................................................18
3.3.4. Gigabit Ethernet ................................................................................................................................18
3.3.5. Serial ATA ..........................................................................................................................................19
3.3.6. PCI Express.........................................................................................................................................20
3.3.7. Express Card ......................................................................................................................................20
3.3.8. LPC bus ..............................................................................................................................................21
3.3.9. USB ....................................................................................................................................................21
3.3.10. SPI (BIOS only) .................................................................................................................................22
3.3.11. Miscellaneous..................................................................................................................................22
3.3.12. SMBus..............................................................................................................................................23
3.3.13. I2C Bus .............................................................................................................................................23
3.3.14. General Purpose I/O (GPIO) ............................................................................................................23
3.3.15. Power And System Management....................................................................................................24
3.3.16. Power and Ground ..........................................................................................................................25
3.4. CD Signal Descriptions............................................................................................................ 26
3.4.1. PATA IDE............................................................................................................................................26
3.4.2. PCI......................................................................................................................................................27
3.4.3. PCI Express Graphics x16 (PEG) or SDVO...........................................................................................29
3.4.4. Module Type Definition.....................................................................................................................31
3.4.5. Power and Ground ............................................................................................................................31
4. Non PICMG Connectors on the Module .........................................................
32
5. System Resources.............................................................................................. 33
5.1. System Memory Map ............................................................................................................. 33
5.2. Direct Memory Access Channels............................................................................................ 33
5.3. I/O Map .................................................................................................................................. 34
5.4. Interrupt Request (IRQ) Lines................................................................................................. 35
5.5. PCI Configuration Space Map................................................................................................. 37
5.6. PCI Interrupt Routing Map ..................................................................................................... 38
5.7. SMBus..................................................................................................................................... 38
5.8. I2C bus .................................................................................................................................... 38
6. BIOS Setup .........................................................................................................39
6.1. Starting the BIOS .................................................................................................................... 39
6.1.1. Setup Menu .......................................................................................................................................40
6.1.2. Navigation .........................................................................................................................................41
6.2. Main Setup ............................................................................................................................. 44
6.2.1. System Management.........................................................................................................................45
6.3. Advanced Setup...................................................................................................................... 47
6.3.1. PCI Subsystem Settings......................................................................................................................47
6.3.2. ACPI Settings......................................................................................................................................48
6.3.3. Trusted Computing............................................................................................................................49
6.3.4. CPU Configuration .............................................................................................................................49
6.3.5. Thermal Configuration.......................................................................................................................50
6.3.6. IDE Configuration ..............................................................................................................................53
6.3.7. USB Configuration .............................................................................................................................55
6.3.8. W8362DHG Super IO Configuration ..................................................................................................56
6.3.9. Serial Port Console Redirection.........................................................................................................59
6.3.10. PPM Configuration ..........................................................................................................................61
6.4. Chipset Setup ......................................................................................................................... 62
6.4.1. Host Bridge Configuration .................................................................................................................62
6.4.2. South Bridge ......................................................................................................................................65
6.5. Boot Setup.............................................................................................................................. 68
6.6. Security Setup ........................................................................................................................ 69
6.7. Save & Exit Menu ................................................................................................................... 70
Safety Instructions ...................................................................................................... 71
Getting Service ............................................................................................................ 71

1. Introduction

The Express-CVCis a low power, low cost, COM Express Type 2, COM.0 R2.1 module in Compact form factor that is specially designed to facilitate speedy development of semi custom designs. The COM Express standard embodies the convergence of the latest technology standards based on serial differential signaling such as PCI Express, USB 2.0, SATA and LVDS implemented on a compact size Computer on Module. Signals are brought out through two 220-pin board-to-board connectors that permit data transmission rates of up to 5GHz. Mounting holes connect the module with a custom-made, application specific carrier boards which provide protection from shock and vibration.
The Express-CVCis positioned as an entry level COM Express module for systems that require a small footprint with dual core computing power and DDR3 memory. It is ideal for applications that require Floating Point CPU performance with average graphics support and moderate power consumption levels, such as Robotics, Industrial control and Data Communications.
The module supports three different types of a 32nm process Intel® Atom™ processors : Intel® Atom™ N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel® Atom™ N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel® Atom™ D2700 processor (1M Cache, 2.13 GHz) with 10W TDP.
The Intel® Atom™ processor integrates a graphics processing unit (GPU) has twice the performance as earlier generation Atom GPU and provides CRT and single channel LVDS. The Intel® Atom™ processors all support daul cores and Hyper-Threading Technology with 2­threads per core allowing the Express-CVC to provide excellent performance for multi-tasking or multi OS applications.
The Intel® NM10 PCH allows connection of up to three additional PCI Express x1 ports, while supporting the LAN controller on the 4th port. The module comes with a single onboard Gigabit Ethernet port and one SATA ports. It has legacy support for a single parallel IDE channel, 32-bit PCI and LPC.
The Express-CVC comes equipped with AMI UEFI BIOS supporting embedded features such as: Remote Console, CMOS backup in 16Mbit SPI BIOS, CPU and System Monitoring and Watchdog Timer

2. Specifications

2.1. Core System

¾ CPU: Intel® Atom® Processor, 2-core with Integrated Graphics, FCBGA559 type
Dual-Core Intel® Atom™ Processor N2600 1.66Gz (1MB L2 cache, 3.5W)
Dual-Core Intel® Atom™ Processor N2800 1.86Gz (1MB L2 cache, 6.5W)
Dual-Core Intel® Atom™ Processor D2550 1.86Gz (1MB L2 cache, 10W)
¾ Cache: 1MB to 16MB LLC cache depending on CPU type ¾ Memory: Single SODIMM socket supporting non-ECC DDR3 at 1066 MHz on N2800 and D2550 (max. 4 GB),
at 800 MHz on N2600 (max. 2GB)
¾ Chipset: Intel® NM10 Express Chipset ¾ BIOS: Dual BIOS AMI APTIO UEFI in 16 Mbit SPI flash ¾ Hardware Monitor: Supply voltages and CPU temperature ¾ Fan Control: mini connector on module ¾ Debug Interface: XDP SFF-26 extension for ICE debug

2.2. Expansion busses

¾ PCI Express Gen 1.0 Ports 4 x1 from PCH
(one lane occupied by GbE LAN controller) Three free PCIe x 1 on AB port 0, 1 and 2
¾ LPC bus, SPI bus (BIOS only) ¾ SMBus (system) , I2C (user)

2.3. Video

¾ Integrated in Processor: Integrated PowerVR SGX 545 Graphics supporting dual independent displays ¾ Graphics Core Speed : 640 MHz (D2550 & N2800) and 400 MHz (N2600) ¾ Feature Support:
1080p HD Video
Playback, Blu-ray 20
DirectX 9
MPEG2 hardware decode
¾ Multi Display Support: 2 independent displays ¾ Display Types
VGA Interface support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536)
eDP/DP: converted to Dual channel 18/24-bit LVDS with Chrontel CH7511
DP: connector on module type

2.4. Audio

¾ Integrated: Intel® HD Audio integrated in NM10 ¾ Audio Codec: Realtek ALC888 or 886 on Express-BASE

2.5. Ethernet

¾ Controller: Intel® Ethernet Controller I210 ¾ Connection: PCIe x1 ¾ Interface: 10/100/1000 GbE connection

2.6. Multi I/O and Storage

¾ USB ports: 8 ports USB 1.1/2.0 ¾ SATA ports: 1 ports SATA 3 Gb/s (SATA0)
optional 2 ports SATA 3 Gb/s (SATA0, SATA1) by removing PATA solution
¾ PATA port: single PATA port through Jmicron JM330 SATA to PATA Bridge

2.7. Super I/O (on Carrier using LPC -bus)

¾ Chipset: Winbond W83627HG-AW AND W83627DHG-P
With keyboard A20 and Keyboard RESET line
¾ Parallel Port: LPT1 ¾ Serial Ports: COM1/COM2

2.8. GPIO

¾ Chipset: NXP PCA9535 ¾ GPO: 4 ports ¾ GPI: 4 ports with interrupt

2.9. SEMA Board Controller

¾ Power Features
o ATX/AT mode control o ECO mode support o Emergency Shutdown o Power Status Monitoring and Signalling o Voltage and Current monitoring o Current Monitor
¾ Flat Panel Control ¾ General Purpose I2C ¾ Dual Failsafe BIOS ¾ Watchdog Timer ¾ Smart Fan Control

2.10. TPM (Trusted Platform Module)

¾ Chipset: Atmel AT97SC3204T, LPC type (optional) ¾ Type: TPM 1.2

2.11. Fan Control

¾ Control Source: Temperature Sensor ¾ Location : 4-pin Mini connector on module: 5V for smart fan

2.12. Power Specifications

¾ Power Modes: AT and ATX mode (AT mode controlled by SEMA BC) ¾ Wide Voltage Input: ATX mode : 5~20V & 5Vsb +/- 5% or AT mode : 5 ~20V ¾ Power Management: ACPI 3.0 compliant, Smart Battery support. ¾ Power States: supports C1-C6, S0, S1, S3, S4, S5 ¾ S5 Eco Mode: minimal power during S5 (all wake-up functions disabled)

2.13. Mechanical and Environmental

¾ Standard Operating Temperature: 0 to 60°C

2.14. Specification Compliance

¾ PICMG COM.0: Rev 2.1 Type 2, ¾ Size : Compact size 95 x 95 mm

2.15. Functional Diagram

VGA
LVDS 24-bit
SATA 3Gb/s (port 0)
S
A
T
A
CH7511
3
(
s
/
b
G
3x PCIe x1
(port 0,1,2)
r
o
p
t
i210
8x USB 2.0
HDA Audio
)
1
eDP/DP
DP
PCIe x1
(port 3)
N2600 N2800 D2550
DMI
NM10
800/1067 MHz 1~4 GB DDR3
SATA
JM330
PATA IDE
PCI Bus
ATMEL
AT97SC3204
4x GP0
4x GPI
SMbus
PCA9535
GP I2C
DDC I2C
s
C
L
P
b
u
SPI_CS0 SPI_CS1
SPI_CS#
SPI

2.16. Mechanical Drawing

3. COM Express Pinouts and Signal Descriptions

The following information is a summary of the most important information regarding pinout and signal description in the official PICMG COM.0 Rev 2.0 (soon 2.1)
The pinout is noted here to emphazise issues that have not been followed in the past. The following might have small inacuaracies so in case of doubt the offical design guide of PICMG should be consulted.

3.1. AB/CD Pin Definitions

The Express-CVC is a Type 2 module supporting PCI and PATA IDE on the CD connector.
All pins in the specification are described including those not supported on the Express-CVC.
Those not supported on the Express-CVC module are crossed out
Row A Row B Row C Row D
Pin Name Pin Name Pin Name Pin Name
A1 GND (FIXED) B1 GND (FIXED) C1 GND FIXED) D1 GND FIXED) A2 GBE0_MDI3- B2 GBE0_ACT# C2 IDE_D7 D2 IDE_D5 A3 GBE0_MDI3+ B3 LPC_FRAME# C3 IDE_D6 D3 IDE_D10 A4 GBE0_LINK100# B4 LPC_AD0 C4 IDE_D3 D4 IDE_D11 A5 GBE0_LINK1000# B5 LPC_AD1 C5 IDE_D15 D5 IDE_D12 A6 GBE0_MDI2- B6 LPC_AD2 C6 IDE_D8 D6 IDE_D4 A7 GBE0_MDI2+ B7 LPC_AD3 C7 IDE_D9 D7 IDE_D0 A8 GBE0_LINK# B8 LPC_DRQ0# C8 IDE_D2 D8 IDE_REQ A9 GBE0_MDI1- B9 LPC_DRQ1# C9 IDE_D13 D9 IDE_IOW# A10 GBE0_MDI1+ B10 LPC_CLK C10 IDE_D1 D10 IDE_ACK# A11 GND (FIXED) B11 GND (FIXED) C11 GND (FIXED) D11 GND (FIXED) A12 GBE0_MDI0- B12 PWRBTN# C12 IDE_D14 D12 IDE_IRQ A13 GBE0_MDI0+ B13 SMB_CK C13 IDE_IORDY D13 IDE_A0 A14 GBE0_CTREF B14 SMB_DAT C14 IDE_IOR# D14 IDE_A1 A15 SUS_S3# B15 SMB_ALERT# C15 PCI_PME# D15 IDE_A2 A16 SATA0_TX+ B16 SATA1_TX+ C16 PCI_GNT2# D16 IDE_CS1# A17 SATA0_TX- B17 SATA1_TX- C17 PCI_REQ2# D17 IDE_CS3# A18 SUS_S4# B18 SUS_STAT# C18 PCI_GNT1# D18 IDE_RESET# A19 SATA0_RX+ B19 SATA1_RX+ C19 PCI_REQ1# D19 PCI_GNT3# A20 SATA0_RX- B20 SATA1_RX- C20 PCI_GNT0# D20 PCI_REQ3# A21 GND (FIXED) B21 GND (FIXED) C21 GND (FIXED) D21 GND (FIXED) A22 SATA2_TX+ B22 SATA3_TX+ C22 PCI_REQ0# D22 PCI_AD1 A23 SATA2_TX- B23 SATA3_TX- C23 PCI_RESET# D23 PCI_AD3 A24 SUS_S5# B24 PWR_OK C24 PCI_AD0 D24 PCI_AD5 A25 SATA2_RX+ B25 SATA3_RX+ C25 PCI_AD2 D25 PCI_AD7 A26 SATA2_RX- B26 SATA3_RX- C26 PCI_AD4 D26 PCI_C/BE0# A27 BATLOW# B27 WDT C27 PCI_AD6 D27 PCI_AD9 A28 (S)ATA_ACT# B28 AC/HDA_SDIN2 C28 PCI_AD8 D28 PCI_AD11 A29 AC/HDA_SYNC B29 AC/HDA_SDIN1 C29 PCI_AD10 D29 PCI_AD13 A30 AC/HDA_RST# B30 AC/HDA_SDIN0 C30 PCI_AD12 D30 PCI_AD15 A31 GND (FIXED) B31 GND (FIXED) C31 GND (FIXED) D31 GND (FIXED) A32 AC/HDA_BITCLK B32 SPKR C32 PCI_AD14 D32 PCI_PAR A33 AC/HDA_SDOUT B33 I2C_CK C33 PCI_C/BE1# D33 PCI_SERR# A34 BIOS_DIS0# B34 I2C_DAT C34 PCI_PERR# D34 PCI_STOP# A35 THRMTRIP# B35 THRM# C35 PCI_LOCK# D35 PCI_TRDY#
A36 USB6- B36 USB7- C36 PCI_DEVSEL# D36 PCI_FRAME# A37 USB6+ B37 USB7+ C37 PCI_IRDY# D37 PCI_AD16 A38 USB_6_7_OC# B38 USB_4_5_OC# C38 PCI_C/BE2# D38 PCI_AD18 A39 USB4- B39 USB5- C39 PCI_AD17 D39 PCI_AD20 A40 USB4+ B40 USB5+ C40 PCI_AD19 D40 PCI_AD22 A41 GND (FIXED) B41 GND (FIXED) C41 GND (FIXED) D41 GND (FIXED) A42 USB2- B42 USB3- C42 PCI_AD21 D42 PCI_AD24 A43 USB2+ B43 USB3+ C43 PCI_AD23 D43 PCI_AD26 A44 USB_2_3_OC# B44 USB_0_1_OC# C44 PCI_C/BE3# D44 PCI_AD28 A45 USB0- B45 USB1- C45 PCI_AD25 D45 PCI_AD30 A46 USB0+ B46 USB1+ C46 PCI_AD27 D46 PCI_IRQC# A47 VCC_RTC B47 EXCD1_PERST# C47 PCI_AD29 D47 PCI_IRQD# A48 EXCD0_PERST# B48 EXCD1_CPPE# C48 PCI_AD31 D48 PCI_CLKRUN# A49 EXCD0_CPPE# B49 SYS_RESET# C49 PCI_IRQA# D49 PCI_M66EN GND) A50 LPC_SERIRQ B50 CB_RESET# C50 PCI_IRQB# D50 PCI_CLK A51 GND (FIXED) B51 GND (FIXED) C51 GND (FIXED) D51 GND (FIXED) A52 PCIE_TX5+ B52 PCIE_RX5+ C52 PEG_RX0+ D52 PEG_TX0+ A53 PCIE_TX5- B53 PCIE_RX5- C53 PEG_RX0- D53 PEG_TX0- A54 GPI0 B54 GPO1 C54 TYPE0# D54 PEG_LANE_RV# A55 PCIE_TX4+ B55 PCIE_RX4+ C55 PEG_RX1+ D55 PEG_TX1+ A56 PCIE_TX4- B56 PCIE_RX4- C56 PEG_RX1- D56 PEG_TX1- A57 GND B57 GPO2 C57 TYPE1# D57 TYPE2# A58 PCIE_TX3+ B58 PCIE_RX3+ C58 PEG_RX2+ D58 PEG_TX2+ A59 PCIE_TX3- B59 PCIE_RX3- C59 PEG_RX2- D59 PEG_TX2- A60 GND (FIXED) B60 GND (FIXED) C60 GND (FIXED) D60 GND (FIXED) A61 PCIE_TX2+ B61 PCIE_RX2+ C61 PEG_RX3+ D61 PEG_TX3+ A62 PCIE_TX2- B62 PCIE_RX2- C62 PEG_RX3- D62 PEG_TX3- A63 GPI1 B63 GPO3 C63 RSVD D63 RSVD A64 PCIE_TX1+ B64 PCIE_RX1+ C64 RSVD D64 RSVD A65 PCIE_TX1- B65 PCIE_RX1- C65 PEG_RX4+ D65 PEG_TX4+ A66 GND B66 WAKE0# C66 PEG_RX4- D66 PEG_TX4- A67 GPI2 B67 WAKE1# C67 RSVD D67 GND A68 PCIE_TX0+ B68 PCIE_RX0+ C68 PEG_RX5+ D68 PEG_TX5+ A69 PCIE_TX0- B69 PCIE_RX0- C69 PEG_RX5- D69 PEG_TX5- A70 GND (FIXED) B70 GND (FIXED) C70 GND (FIXED) D70 GND (FIXED) A71 LVDS_A0+ B71 LVDS_B0+ C71 PEG_RX6+ D71 PEG_TX6+ A72 LVDS_A0- B72 LVDS_B0- C72 PEG_RX6- D72 PEG_TX6- A73 LVDS_A1+ B73 LVDS_B1+ C73 SDVO_DATA D73 SDVO_CLK A74 LVDS_A1- B74 LVDS_B1- C74 PEG_RX7+ D74 PEG_TX7+ A75 LVDS_A2+ B75 LVDS_B2+ C75 PEG_RX7- D75 PEG_TX7- A76 LVDS_A2- B76 LVDS_B2- C76 GND D76 GND A77 LVDS_VDD_EN B77 LVDS_B3+ C77 RSVD D77 IDE_CBLID# A78 LVDS_A3+ B78 LVDS_B3- C78 PEG_RX8+ D78 PEG_TX8+ A79 LVDS_A3- B79 LVDS_BKLT_EN C79 PEG_RX8- D79 PEG_TX8- A80 GND (FIXED) B80 GND (FIXED) C80 GND (FIXED) D80 GND (FIXED) A81 LVDS_A_CK+ B81 LVDS_B_CK+ C81 PEG_RX9+ D81 PEG_TX9+ A82 LVDS_A_CK- B82 LVDS_B_CK- C82 PEG_RX9- D82 PEG_TX9- A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRL C83 RSVD D83 RSVD A84 LVDS_I2C_DAT B84 VCC_5V_SBY C84 GND D84 GND A85 GPI3 B85 VCC_5V_SBY C85 PEG_RX10+ D85 PEG_TX10+
A86 KBD_RST# B86 VCC_5V_SBY C86 PEG_RX10- D86 PEG_TX10- A87 KBD_A20GATE B87 VCC_5V_SBY C87 GND D87 GND A88 PCIE0_CK_REF+ B88 BIOS_DIS1# C88 PEG_RX11+ D88 PEG_TX11+ A89 PCIE0_CK_REF- B89 VGA_RED C89 PEG_RX11- D89 PEG_TX11- A90 GND (FIXED) B90 GND (FIXED) C90 GND (FIXED) D90 GND (FIXED) A91 SPI_POWER B91 VGA_GRN C91 PEG_RX12+ D91 PEG_TX12+ A92 SPI_MISO B92 VGA_BLU C92 PEG_RX12- D92 PEG_TX12- A93 GPO0 B93 VGA_HSYNC C93 GND D93 GND A94 SPI_CLK B94 VGA_VSYNC C94 PEG_RX13+ D94 PEG_TX13+ A95 SPI_MOSI B95 VGA_I2C_CK C95 PEG_RX13- D95 PEG_TX13- A96 GND B96 VGA_I2C_DAT C96 GND D96 GND A97 TYPE10# B97 SPI_CS# C97 RSVD D97 PEG_ENABLE# A98 RSVD B98 RSVD C98 PEG_RX14+ D98 PEG_TX14+ A99 RSVD B99 RSVD C99 PEG_RX14- D99 PEG_TX14- A100 GND (FIXED) B100 GND (FIXED) C100 GND (FIXED) D100 GND (FIXED) A101 RSVD B101 RSVD C101 PEG_RX15+ D101 PEG_TX15+ A102 RSVD B102 RSVD C102 PEG_RX15- D102 PEG_TX15- A103 RSVD B103 RSVD C103 GND D103 GND A104 VCC_12V B104 VCC_12V C104 VCC_12V D104 VCC_12V A105 VCC_12V B105 VCC_12V C105 VCC_12V D105 VCC_12V A106 VCC_12V B106 VCC_12V C106 VCC_12V D106 VCC_12V A107 VCC_12V B107 VCC_12V C107 VCC_12V D107 VCC_12V A108 VCC_12V B108 VCC_12V C108 VCC_12V D108 VCC_12V A109 VCC_12V B109 VCC_12V C109 VCC_12V D109 VCC_12V A110 GND (FIXED) B110 GND (FIXED) C110 GND (FIXED) D110 GND (FIXED)

3.2. Signal Description Terminology

The following terms are used in the COM Express AB/CD Signal Descriptions below.
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
I 3.3V Input 3.3V tolerant
I 5V Input 5V tolerant
O 3.3V Output 3.3V signal level
O 5V Output 5V signal level
I/O 3.3V Bi-directional signal 3.3V tolerant
I/O 5V Bi-directional signal 5V tolerant
I/O 3.3Vsb Input 3.3V tolerant active in standby state
P Power Input/Output
REF Reference voltage output that may be sourced from a module power plane.
PDS Pull-down strap. This is an output pin on the module that is either tied to GND or not connected.
The signal is used to indicate the PICMG module type to the Carrier Board.
PU ADLINK implemented pull-up resistor on module
PD ADLINK implemented pull-down resistor on module

3.3. AB Signal Descriptions

3.3.1. Audio Signals

Signal Pin Description I/O PU/PD Comment
AC_RST# / HDA_RST#
AC_SYNC / HDA_SYNC
AC_BITCLK / HDA_BITCLK
AC _SDOUT / HDA_SDOUT
AC _SDIN[2:0] HDA_SDIN[2:0]
A30 Reset output to CODEC, active low. O 3.3VSB
A29 Sample-synchronization signal to the CODEC(s). O 3.3V
A32 Serial data clock generated by the external
CODEC(s).
A33 Serial TDM data output to the CODEC. O 3.3V
B28­B30
Serial TDM data inputs from up to 3 CODECs. I/O 3.3VSB
I/O 3.3V

3.3.2. Analog VGA

Signal Pin Description I/O PU/PD Comment
VGA_RED B89 Red for monitor.
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
VGA_GRN B91 Green for monitor.
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
O Analog If VGA is used than signal should be
pulled to GND by 150 on the carrier
O Analog If VGA is used than signal should be
pulled to GND by 150 on the carrier
VGA_BLU B92 Blue for monitor.
Analog DAC output, designed to drive a
37.5-Ohm equivalent load.
VGA_HSYNC B93 Horizontal sync output to VGA monitor O 3.3V
VGA_VSYNC B94 Vertical sync output to VGA monitor O 3.3V
VGA_I2C_CK B95 DDC clock line (I²C port dedicated to identify
VGA monitor capabilities)
VGA_I2C_DAT B96 DDC data line. I/O OD 3.3V PU 2k2 3.3V
O Analog If VGA is used than signal should be
I/O OD 3.3V PU 2k2 3.3V
pulled to GND by 150 on the carrier

3.3.3. LVDS

Signal Pin Description I/O PU/PD Comment
LVDS_A0+ LVDS_A0- LVDS_A1+ LVDS_A1- LVDS_A2+ LVDS_A2- LVDS_A3+ LVDS_A3-
LVDS_A_CK+ LVDS_A_CK-
LVDS_B0+ LVDS_B0- LVDS_B1+ LVDS_B1- LVDS_B2+ LVDS_B2- LVDS_B3+ LVDS_B3-
LVDS_B_CK+ LVDS_B_CK-
LVDS_VDD_EN A77 LVDS panel power enable O 3.3V
LVDS_BKLT_EN B79 LVDS panel backlight enable O 3.3V
LVDS_BKLT_CTRL B83 LVDS panel backlight brightness control O 3.3V
A71 A72 A73 A74 A75 A76 A78 A79
A81 A82
B71 B72 B73 B74 B75 B76 B77 B78
B81 B82
LVDS Channel A differential pairs O LVDS
LVDS Channel A differential clock O LVDS
LVDS Channel B differential pairs O LVDS
LVDS Channel B differential clock O LVDS
LVDS_I2C_CK A83 DDC lines used for flat panel detection and control. O 3.3V PU 2k2 3.3V
LVDS_I2C_DAT A84 DDC lines used for flat panel detection and control. I/O 3.3V
PU 2k2 3.3V

3.3.4. Gigabit Ethernet

Gigabit Ethernet Pin Description I/O PU/PD Comment
GBE0_MDI0+ GBE0_MDI0- GBE0_MDI1+ GBE0_MDI1­GBE0_MDI2+ GBE0_MDI2- GBE0_MDI3+ GBE0_MDI3-
GBE0_ACT# B2 Gigabit Ethernet Controller 0 activity indicator, active low.
GBE0_LINK# A8 Gigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100# A4 Gigabit Ethernet Controller 0 100Mbit/sec link indicator, active low.
GBE0_LINK1000# A5 Gigabit Ethernet Controller 0 1000Mbit/sec link indicator, active low.
A13 A11 A10 A9 A7 A6 A3 A2
Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0, 1, 2, 3. The MDI can operate in 1000, 100, and 10Mbit/sec modes. Some pairs are unused in some modes according to the following:
1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/- MDI[1]+/- B1_DB+/- RX+/- RX+/- MDI[2]+/- B1_DC+/­MDI[3]+/- B1_DD+/-
I/O Analog Twisted
pair signals for external transformer .
OD 3.3VSB PU 1k 3.3V
OD 3.3VSB
OD 3.3VSB
OD 3.3VSB
GBE0_CTREF A14 Reference voltage for Carrier Board Ethernet channel 1 and 2
magnetics center tap. The reference voltage is determined by the requirements of the Module PHY and may be as low as 0V and as high as 3.3V. The reference voltage output shall be current limited on the Module. In the case in which the reference is shorted to ground, the current shall be 250 mA or less.
GND min
3.3V max

3.3.5. Serial ATA

Signal Pin Description I/O PU/PD Comment
SATA0_TX+ SATA0_TX-
SATA0_RX+ SATA0_RX-
SATA1_TX+ SATA1_TX-
SATA1_RX+ SATA1_RX-
SATA2_TX+ SATA2_TX-
SATA2_RX+ SATA2_RX-
SATA3_TX+ SATA3_TX-
SATA3_RX+ SATA3_RX-
(S)ATA_ACT# A28 ATA (parallel and serial) or SAS activity
A16
Serial ATA channel 0, Transmit Output
A17
differential pair.
A19
Serial ATA channel 0, Receive Input
A20
differential pair.
B16
Serial ATA channel 1, Transmit Output
B17
differential pair.
B19
Serial ATA channel 1, Receive Input
B20
differential pair.
A22
Serial ATA channel 2, Transmit Output
A23
differential pair.
A25
Serial ATA channel 2, Receive Input
A26
differential pair.
B22
Serial ATA channel 3, Transmit Output
B23
differential pair.
B25
Serial ATA channel 3, Receive Input
B26
differential pair.
indicator, active low.
O SATA AC coupled on Module
I SATA AC coupled on Module
O SATA AC coupled on Module
I SATA AC coupled on Module
O SATA Not supported
I SATA Not supported
O SATA Not supported
I SATA Not supported
O 3.3V

3.3.6. PCI Express

Signal Pin Description I/O PU/PD Comment
PCIE_TX0+ PCIE_TX0-
PCIE_RX0+ PCIE_RX0-
PCIE_TX1+ PCIE_TX1-
PCIE_RX1+ PCIE_RX1-
PCIE_TX2+ PCIE_TX2-
PCIE_RX2+ PCIE_RX2-
PCIE_TX3+ PCIE_TX3-
PCIE_RX3+ PCIE_RX3-
PCIE_TX4+ PCIE_TX4-
PCIE_RX4+ PCIE_RX4-
A68 A69
B68 B69
A64 A65
B64 B65
A61 A62
B61 B62
A58 A59
B58 B59
A55 A56
B55 B56
PCI Express channel 0, Transmit Output differential pair.
PCI Express channel 0, Receive Input differential pair.
PCI Express channel 1, Transmit Output differential pair.
PCI Express channel 1, Receive Input differential pair.
PCI Express channel 2, Transmit Output differential pair.
PCI Express channel 2, Receive Input differential pair.
PCI Express channel 3, Transmit Output differential pair.
PCI Express channel 3, Receive Input differential pair.
PCI Express channel 4, Transmit Output differential pair.
PCI Express channel 4, Receive Input differential pair.
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE AC coupled on Module
I PCIE AC coupled off Module
O PCIE
I PCIE Not supported
O PCIE Not supported
I PCIE Not supported
Not supported
PCIE_TX5+ PCIE_TX5-
PCIE_RX5+ PCIE_RX5-
PCIE_CLK_REF+ PCIE_CLK_REF-
A52 A53
B52
B53
A88 A89
PCI Express channel 5, Transmit Output differential pair.
PCI Express channel 5, Receive Input differential pair.
PCI Express Reference Clock output for all PCI Express and PCI Express Graphics Lanes.
O PCIE Not supported
I PCIE Not supported
O PCIE

3.3.7. Express Card

Signal Pin Description I/O PU/PD Comment
EXCD0_CPPE# EXCD1_CPPE#
EXCD0_PERST# EXCD1_PERST#
A49 B48
A48 B47
PCI ExpressCard: PCI Express capable card request I 3.3V PU 10k 3.3V
PCI ExpressCard: reset O 3.3V

3.3.8. LPC bus

Signal Pin Description I/O PU/PD Comment
LPC_AD[0:3] B4-B7 LPC multiplexed address, command and data bus I/O 3.3V
LPC_FRAME# B3 LPC frame indicates the start of an LPC cycle O 3.3V
LPC_DRQ0# LPC_DRQ1#
LPC_SERIRQ A50 LPC serial interrupt I/O OD 3.3V PU 8k2 3.3V
LPC_CLK B10 LPC clock output - 33MHz nominal O 3.3V
B8 B9
LPC serial DMA request I 3.3V

3.3.9. USB

Signal Pin Description I/O PU/PD Comment
USB0+ USB0-
USB1+ USB1-
USB2+ USB2-
USB3+ USB3-
USB4+ USB4-
USB5+ USB5-
A46
USB differential data pairs for Port 0 I/O 3.3VSB USB 1.1/ 2.0 compliant
A45
B46
USB differential data pairs for Port 1 I/O 3.3VSB USB 1.1/ 2.0 compliant
B45
A43
USB differential data pairs for Port 1 I/O 3.3VSB USB 1.1/ 2.0 compliant
A42
B43
USB differential data pairs for Port 2 I/O 3.3VSB USB 1.1/ 2.0 compliant
B42
A40
USB differential data pairs for Port 3 I/O 3.3VSB USB 1.1/ 2.0 compliant
A39
B40
USB differential data pairs for Port 4 I/O 3.3VSB USB 1.1/ 2.0 compliant
B39
USB6+ USB6-
USB7+ USB7-
USB_0_1_OC# B44 USB over-current sense, USB ports 0 and 1. A pull-up
USB_2_3_OC# A44 USB over-current sense, USB ports 2 and 3. A pull-up
USB_4_5_OC# B38 USB over-current sense, USB ports 4 and 5. A pull-up
USB_6_7_OC# A38 USB over-current sense, USB ports 6 and 7. A pull-up
A37
USB differential data pairs for Port 5 I/O 3.3VSB USB 1.1/ 2.0 compliant
A36
B37
USB differential data pairs for Port 6 I/O 3.3VSB USB 1.1/ 2.0 compliant
B36
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low. .
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive this line low.
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier
I 3.3VSB PU 10k 3.3VSB Do not pull high on carrier

3.3.10. SPI (BIOS only)

Signal Pin Description I/O PU/PD Comment
SPI_CS# B97 Chip select for Carrier Board SPI BIOS Flash. O 3.3VSB
SPI_MISO A92 Data in to module from carrier board SPI BIOS flash. I 3.3VSB
SPI_MOSI A95 Data out from module to carrier board SPI BIOS flash. O 3.3VSB
SPI_CLK A94 Clock from module to carrier board SPI BIOS flash. O 3.3VSB
SPI_POWER A91 Power supply for Carrier Board SPI – sourced from Module
– nominally 3.3V. The Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier
BIOS_DIS0# A34 Selection strap to determine the BIOS boot device. I PU 10K 3.3V Carrier shall pull to GND
BIOS_DIS1# B88 Selection strap to determine the BIOS boot device. I PU 10K 3.3V Carrier shall pull to GND
O P 3.3VSB
or leave not connected
or leave not connected

3.3.11. Miscellaneous

Signal Pin Description I/O PU/PD Comment
SPKR B32 Output for audio enunciator, the “speaker” in PC-AT
systems
WDT B27 Output indicating that a watchdog time-out event has
occurred.
KBD_RST# A86 Input to module from (optional) external keyboard
controller that can force a reset. Pulled high on the module. This is a legacy artifact of the PC-AT.
O 3.3V
O 3.3V
I 3.3V PU 10K 3.3V
KBD_A20GATE A87 Input to module from (optional) external keyboard
controller that can be used to control the CPU A20 gate line. The A20GATE restricts the memory access to the bottom megabyte and is a legacy artifact of the PC-AT. Pulled low on the module.
THRM# B35 Input from off-module temp sensor indicating an over-temp
situation.
THERMTRIP# A35 Active low output indicating that the CPU has entered
thermal shutdown.
TPM_PP11 C83 Trusted Platform Module (TPM) Physical Presence pin.
Active high. TPM chip has an internal pull down. This signal is used to indicate Physical Presence to the TPM.
I 3.3V PU 10K 3.3V
I 3.3V
O 3.3V
I 3.3V PD 3.3V If TPM not installed on
module than remove PD
3.3V
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