ADLINK Express-CBR User Manual
Express-CBR
(Computer On Module)
Reference Manual
P/N 50-1Z040-1010
Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address listed on this Notice Page.
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,
RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the
property of their respective companies.
REVISION HISTORY
Revision Reason for Change Date
1000 Initial Release June/10
1010 Updated PU/PD info in COM Express pinout tables; added BIOS Setup Menus
section to Chapter 4
Feb/11
ADLINK Technology, Incorporated
5215 Hellyer Avenue, #110
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
www.adlinktech.com
© Copyright 2010, 2011 ADLINK Technology, Incorporated
Audience
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLINK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
ii Reference Manual Express-CBR
Contents
Chapter 1 About This Manual ....................................................................................................1
Purpose of this Manual ....................................................................................................................1
References ..................................................................................................................................1
Chapter 2 Product Overview......................................................................................................3
COM Express Concept ....................................................................................................................3
COM Express Architecture ..............................................................................................................4
Product Description..........................................................................................................................4
Module Features ........................................................................................................................5
Block Diagram ............................................................................................................................7
Major Components (ICs)..................................................................................................................8
Connectors and Sockets................................................................................................................10
Specifications.................................................................................................................................12
Physical Specifications .............................................................................................................12
Power Specifications ................................................................................................................13
Environmental Specifications....................................................................................................15
Thermal/Cooling Requirements ................................................................................................15
Mechanical Specifications ........................................................................................................17
Chapter 3 Hardware ....................................................................................................................19
Overview ........................................................................................................................................19
Interrupt Channel Assignments .....................................................................................................20
Memory Map .................................................................................................................................21
I/O Address Map ...........................................................................................................................22
COM Express A-B Connector .......................................................................................................23
LPC Interface............................................................................................................................23
SATA Interface .........................................................................................................................23
USB Interface ...........................................................................................................................24
Power Interface ........................................................................................................................24
Power Management..................................................................................................................24
Video Interfaces........................................................................................................................24
VGA .....................................................................................................................................24
LVDS ...................................................................................................................................24
Audio Interface ........................................................................................................................24
Ethernet Interface ....................................................................................................................24
I²C™ Bus ..................................................................................................................................24
PCI Express™ ..........................................................................................................................25
ExpressCard™ .........................................................................................................................25
System Management Bus (SMBus) .........................................................................................25
GPIO.........................................................................................................................................25
COM Express C-D Connector ...................................................................................................28
IDE Interface.............................................................................................................................28
PCI Interface.............................................................................................................................28
PCI Express Graphics (PEG) ...................................................................................................28
SDVO........................................................................................................................................29
Watchdog Timer.............................................................................................................................32
TPM (Trusted Platform Module [Optional]) ....................................................................................32
CPU Temperature Monitor.............................................................................................................32
Express-CBR Reference Manual iii
Contents
Chapter 4 BIOS Setup .............................................................................................................. 33
Introduction.................................................................................................................................... 33
Entering BIOS Setup (VGA Display) ........................................................................................ 33
OEM Logo Utility (Splash Screen)................................................................................................. 33
Logo Image Requirements....................................................................................................... 33
BIOS Setup Menus ....................................................................................................................... 34
BIOS Main Setup Screen ......................................................................................................... 35
BIOS Advanced Setup Screen................................................................................................. 36
BIOS Chipset Setup Screen..................................................................................................... 41
BIOS Boot Setup Screen ......................................................................................................... 43
BIOS Security Setup Screen.................................................................................................... 44
BIOS Save & Exit Setup Screen .............................................................................................. 45
Appendix A Technical Support .................................................................................................. 47
Index .................................................................................................................................................. 49
List of Figures
Figure 2-1. Compact, Basic and Extended Form Factors.......................................................... 4
Figure 2-2. Functional Block Diagram ....................................................................................... 7
Figure 2-3. Component Locations (Top Side)............................................................................ 9
Figure 2-4. Component Locations (Bottom Side) .................................................................... 10
Figure 2-5. Connector Locations (Top Side)............................................................................ 11
Figure 2-6. Connector Locations (Bottom Side) ...................................................................... 12
Figure 2-7. Stack Heights of Cooling Assemblies (Side Views) .............................................. 16
Figure 2-8. Mechanical Dimensions (Top Side)....................................................................... 17
Figure 4-1. BIOS Main Setup Screen ...................................................................................... 35
Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 36
Figure 4-3. BIOS Chipset Setup Screen .................................................................................. 41
Figure 4-4. BIOS Boot Setup Screen....................................................................................... 43
Figure 4-5. BIOS Security Setup Screen ................................................................................. 44
Figure 4-6. BIOS Save & Exit Setup Screen ........................................................................... 45
List of Tables
Table 2-1. COM Express Pinout Types .................................................................................... 3
Table 2-2. Major Integrated Circuit Descriptions and Functions............................................... 8
Table 2-3. Module Connector and Socket Descriptions ......................................................... 10
Table 2-4. Weight and Footprint Dimensions ......................................................................... 12
Table 2-5. Power Supply Requirements (1.06 GHz CPU with CPU Turbo Mode enabled) ...13
Table 2-6. Power Supply Requirements (2.0 GHz CPU with CPU Turbo Mode enabled) ..... 13
Table 2-7. Power Supply Requirements (1.06 GHz CPU with CPU Turbo Mode disabled) ... 14
Table 2-8. Power Supply Requirements (2.0 GHz CPU with CPU Turbo Mode disabled) ..... 14
Table 2-9. Environmental Requirements ................................................................................ 15
Table 2-10. ADLINK Optional Cooling Solutions ...................................................................... 15
Table 3-1. Interrupt Channel Assignments ............................................................................. 20
Table 3-2. Memory Map ......................................................................................................... 21
Table 3-3. I/O Address Map ................................................................................................... 22
Table 3-4. SMBus Reserved Addresses ................................................................................ 25
Table 3-5. COM Express A-B Connector Signal Descriptions................................................ 25
Table 3-6. COM Express C-D Connector Signal Descriptions ............................................... 29
Table 4-1. BIOS Setup Menus................................................................................................ 34
Table A-1. Technical Support Contact Information ................................................................. 47
iv Reference Manual Express-CBR
Chapter 1 About This Manual
Purpose of this Manual
This manual is for designers of systems based on the Express-CBR (Computer On Module). This manual
contains information that permits designers to create an embedded system based on specific design
requirements.
Information provided in this reference manual includes:
• Express-CBR specifications
• Environmental requirements
• Major ICs and features implemented
• Express-CBR connector/pin numbers and definitions
• BIOS Setup information
Information not provided in this reference manual includes:
• Detailed chip specifications
• Internal component operation
• Internal registers or signal operations
• Bus or signal timing for industry standard busses and signals
• Pinout definitions for industry standard interfaces
References
The following list of references may be helpful for you to complete your custom design successfully.
Specifications
• COM Express Specification Revision 1.0
Web site: http://www.picmg.org/
• PCI Specification Revision 2.3
Web site: http://www.pcisig.com
• PCIe Specification Revision 1.1
Web site: http://www.pcisig.com/specifications/pciexpress/base
Chip Specifications
• Intel® Corporation and the Core™ i7 -600 series CPU, used for the integrated processor core and
graphics memory hub
Web site: http://www.intel.com/products/processor/corei7/mobile/techdocs.htm
• Intel Corporation and the BD82QM57 chip, used for the Platform Controller Hub
Datasheet: http://www.intel.com/Assets/PDF/datasheet/322169.pdf
= PCH
Express-CBR Reference Manual 1
Chapter 1 About This Manual
• Intel Corporation and the 82574IT chip used for the Gigabit Ethernet controller
Datasheet: h
NOTE If you are unable to locate the datasheets using the links provided, go to the
ttp://download.intel.com/design/network/datashts/82574.pdf
manufacturer’s web site where you can perform a search using the chip datasheet
number or name listed, including the extension (htm for web page, pdf for file name,
etc.)
2 Reference Manual Express-CBR
Chapter 2 Product Overview
This introduction presents general information about the COM Express™ architecture and the Express-CBR
Computer-On-Module (COM). After reading this chapter you should understand:
• COM Express concept
• COM Express architecture
• Express-CBR features
• Express-CBR functional block diagram
• Express-CBR major components
• Express-CBR connectors
• Express-CBR specifications
COM Express Concept
COM Express is an open industry standard defined specifically for COMs (Computer On Modules). Its
creation provides the ability to make a smooth transition from legacy parallel interfaces to the newest
technologies based on serial buses available today. COM Express modules are available in the following
form factors:
• Compact 95mm x 95mm
• Basic 125mm x 95mm
• Extended 155mm x 110mm
The COM Express specification 1.0 defines five different pinout types.
Table 2-1. COM Express Pinout Types
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports
Type 1 A-B Up to 6 1
Type 2 A-B C-D Up to 22 32 bit 1 1
Type 3 A-B C-D Up to 22 32 bit 3
Type 4 A-B C-D Up to 32 1 1
Type 5 A-B C-D Up to 32 3
The Express-CBR utilizes the Type 2 pinout definition, equipped with two high performance connectors that
ensure stable data throughput.
The COM (Computer On Module) integrates all the core components and is mounted onto an application
specific baseboard. COM modules are legacy-free designs (no Super I/O, PS/2 keyboard, and PS/2 mouse)
and provide most of the functional requirements for any application. These functions include, but are not
limited to a rich complement of contemporary, high bandwidth serial interfaces such as PCI Express, Serial
ATA, USB 2.0, and Gigabit Ethernet. The Type 2 pinout provides the ability to offer 32-bit PCI, Parallel
ATA, and LPC options thereby expanding the range of potential peripherals. The robust thermal and
mechanical concept, combined with extended power management capabilities, is perfectly suited for all
applications.
Baseboard designers can utilize as little or as many of the I/O interfaces as necessary. The baseboard can
therefore provide all the interface connectors required to attach the system to the application specific
peripherals. This versatility allows the designer to create a dense and optimized package, which results in a
more reliable product while simplifying system integration. Most importantly, COM Express modules are
scalable, which means once an application has been created there is the ability to diversify the product range
through the use of different performance class or form factor modules. Simply unplug one module and
replace it with another. No redesign is necessary.
Express-CBR Reference Manual 3
Chapter 2 Product Overview
COM Express Architecture
The COM Express specification was developed by the PCI Industrial Computer Manufacturing Group
(PICMG) in close collaboration with many leading companies across the embedded industry in order to find
an implementation solution to handle upcoming new high speed serial I/Os, processors, and chipsets. COM
Express specifies three form factors, as well as five different types of connector pinouts.
The three form factors are referred to as Compact, Basic, and Extended. The Compact form factor is
95mm x 95mm designed to match the requirements of small applications. The Basic module footprint is
125mm x 95mm and focuses on space-constrained, low power systems which typically do not contain more
than one horizontal mounted SODIMM. The Extended footprint is slightly larger at 155mm x 110mm and
supports up to two full-size, vertically mounted DIMM modules to accommodate larger memory
configurations for high-performance CPUs, chipsets and multiprocessor systems. The placement of the
shielded 220-pin connectors and the mounting holes are identical between these three footprints.
Figure 2-1. Compact, Basic and Extended Form Factors
Product Description
The Express-CBR is an exceptionally high integration, high performance, rugged Intel Core™ i7 processor
based system compatible with the COM Express standard. This rugged and high quality module system
contains all the component subsystems of an ATX motherboard.
The Intel Core i7 incorporates a dual processor core with an integrated Graphics and Memory Hub (GMH),
providing a low-power, high-performance processor, a memory controller for up to 8GB of SODIMM
memory, and a graphics controller for LVDS, VGA, and PCI Express graphics (PEG) signals.
The Intel BD82QM57 chipset provides controllers for the Platform Controller Hub (PCH) featuring eight
USB ports, four SATA ports, eight GPIO ports, one Ultra DMA 33/66/100 IDE controller supporting two
IDE drives, and one Gigabit Ethernet interface (external magnetics required).
Expansion for additional system functions is possible on the Express-CBR through the PCI, PCIe, and LPC
expansion buses. The PCI bus operates at a clock speed of 33MHz.
The Express-CBR is particularly well suited to either embedded or portable applications and meets the size,
power consumption, temperature range, quality, and reliability demands of embedded system applications.
4 Reference Manual Express-CBR
Chapter 2 Product Overview
Module Features
• CPU
♦
Intel 1.06GHz or 2.0GHz LV, Core i7 -600 series processor
♦
DMI (Direct Media Interface) with 1 GB/s of bandwidth in each direction
♦
Internal 4MB L2 cache
♦
Enhanced Intel SpeedStep® Technology (EIST)
• Memory
♦
Two standard 204-pin DDR3 SODIMM sockets
♦
Supports +1.5V DDR3, 800/1066MHz RAM up to 8 GB total
♦
Supports non-ECC, unbuffered memory
• Interface Buses
♦
PCI between PCH and COM Express A-B connector
♦
PCIe between PCH and COM Express C-D connector
♦
DMI (Direct Media Interface) between processor and PCH
♦
FDI (Flexible Display Interface) between graphics controller and PCH
♦
LPC (Low Pin Count) for LPC devices
♦
I2C for fast mode I2C devices
• COM Express Interface
♦
IDE Interface
• Supports one enhanced IDE device
• Supports single master mode
• Supports Ultra DMA 100/66/33 in master mode
• Supports ATAPI and DVD peripherals
• Supports IDE native and ATA compatibility modes
♦
SATA Interface
• Provides four SATA ports
• Supports Native Command Queuing
• Provides Auto Activate for DMA
• Supports Hot Plug features
♦
HD Audio
• Provides Intel HD Audio controller
• Provides 32-bit sample depth
• Supports sample rates up to 192kHz
♦
USB Port Interface
• Supports two root USB hubs
• Supports eight USB ports
• Supports USB V2.0
Express-CBR Reference Manual 5
Chapter 2 Product Overview
♦
Ethernet Interface
• Intel 82574IT Ethernet controller chip
• Supports one Gigabit Ethernet port
• Supports IEEE 802.3 compatible physical layer
• Supports Auto-negotiation for speed, duplex mode, and flow control
• Supports full-duplex or half-duplex modes
- Full-duplex mode supports transmit and receive frames simultaneously
- Supports IEEE 802.3x flow control in full duplex mode
- Half-duplex mode supports enhanced proprietary collision reduction mode
• Video Interfaces (VGA/LVDS/PEG)
• Support VGA (up to 2048 x 1536 bpp at 75Hz)
• 24-bit flat panel outputs (LVDS)
• Digital Display Interface (SDVO B)
• PCI Express Graphics (PEG) Interface
• Miscellaneous
♦
Real Time Clock (RTC) with external replaceable battery
♦
Watchdog Timer (WDT)
♦
TPM (Trusted Platform Module) - Optional
♦
CPU Temperature Monitor
♦
Logo Screen Utility (Splash)
6 Reference Manual Express-CBR
Chapter 2 Product Overview
Block Diagram
Figure 2-2 shows the functional components of the module.
800/1066MHz,
CPU
Intel Core i7
1.06 and 2.0 GHz
(with integrated Processor Core
and Graphics Memory Hub)
1.5V, 8GB Max.
Channel - A
Sockets (2)
Channel - B
PCIe Graphics, X8/eDP - PEG
DDR3
SODIMM
VBattery (RTC)
HDA Link
SATA (4)
LVDS (2)
LVDS
VGA
TPM - [Optional]
LPC
Intel - HDA Link
I2C
COM Express Connector - Rows A and B
X1 PCIe (6) SMBus
USB 2.0 (8)
LPC
VGA
SATA (4)
X1 PCIe (6)
USB
VBATT (RTC)
SMBus
Board
Controller
GPIO
PWR
Management
I2C
GPIO (8)
PWR Mgmt
DMI (4)
BD82QM57
SPI Flash
Gb Ethernet
12V Input
5V Standby
PCH
Intel
FDI
SDVO B
PCI (32bit/33MHz)
SATA (1)
X1 PCIe (1)
Gigabit Ethernet - MDI
COM Express Connector - Rows C and D
SATA to PATA
Controller
JMicron
JMD330
Gigabit Ethernet
Intel
82574IT
IDE
PEG
IDE
PCI
12V Input
Express-CBR_BlkDiag_b
Figure 2-2. Functional Block Diagram
Express-CBR Reference Manual 7
Chapter 2 Product Overview
Major Components (ICs)
Table 2-2 lists the major integrated circuits on the Express-CBR, including a brief description of each IC.
Figures 2-3 and 2-4 show the locations of the major ICs.
Table 2-2. Major Integrated Circuit Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U1) Intel Core i7 1.06GHz and 2.0GHz
512KB L2 cache
processors
PCH (Platform
Controller Hub
[U3])
Ethernet Controller
(U10)
SATA to PATA
Controller (U12)
TPM (Trusted
Platform Module
[U35]) - Optional
Board Controller
(U27)
Intel BD82QM57
(PCH)
Intel 82574IT Ethernet Controller – This
JMicron JMD330APC1-
QIBD
Infineon SLB9635TT1.2 Provides security
Atmel ATMEGA168V-
10AU
Southbridge I/O
controller functions
chip provides Gigabit
Ethernet function
Provides function for
converting SATA signals
to PATA signals
functions
Caution: Boards with the
TPM option, feature only
one temperature range
from -20° to +70°C.
Provides control for I²C,
Watchdog Timer, and
LVDS functions
Integrated CPU,
memory, and
video
I/O functions
Ethernet
Signal
Conversion
Security
Micro
Controller
8 Reference Manual Express-CBR
Chapter 2 Product Overview
Key:
U1 - CPU
U3 - PCH
U10 - Ethernet Controller
U12 - SATA to PATA Controller
U35 - TPM [Optional]
U1
U3
U12
Figure 2-3. Component Locations (Top Side)
U35
U10
Express-CBR_comp_top_side_a
Express-CBR Reference Manual 9
Chapter 2 Product Overview
Key:
U27 - Board Controller
Figure 2-4. Component Locations (Bottom Side)
Connectors and Sockets
Table 2-3 describes the connectors and sockets shown in Figures 2-5 and 2-6.
Table 2-3. Module Connector and Socket Descriptions
Jack/Plug # Board
Access
J5 – Memory Top 204-pin socket for DDR3 SODIMM
J6 – Memory Top 204-pin socket for DDR3 SODIMM
J4 – COM Express A-B (see
Bottom 220-pin connector for Northbridge Video and Southbridge
Figure 2-6 on page 12.)
J4 – COM Express C-D (see
Bottom 220-pin connector for Northbridge Video and Southbridge
Figure 2-6 on page 12.)
Description
I/O functions.
I/O functions.
U27
Express-CBR_comp_bottom_side_a
10 Reference Manual Express-CBR
Chapter 2 Product Overview
Key:
J5 - DDR3 SODIMM Socket
J6 - DDR3 SODIMM Socket
J6
J5
Figure 2-5. Connector Locations (Top Side)
Express-CBR_conn_top_side_a
Express-CBR Reference Manual 11
Chapter 2 Product Overview
Key:
J4A - COM Express pins A1-A110
J4B - COM Express pins B1-B110
J4C - COM Express pins C1-C110
J4D - COM Express pins D1-D110
J4
AB
CD
Figure 2-6. Connector Locations (Bottom Side)
Specifications
Physical Specifications
Table 2-4 lists the physical dimensions of the module.
Table 2-4. Weight and Footprint Dimensions
Item Dimension
Weight 0.09 kg (0.20 lb)
Height (overall) 9.20 mm (0.36 inches)
Board thickness 2.362 mm (0.093 inches)
Width 95.00 mm (3.74 inches)
Length 125.00 mm (4.92 inches)
Express-CBR_conn_bottom_side_a
NOTE Overall height is measured from the
upper board surface to the highest
permanent component on the upper
board surface. This measurement does
not include the cooling solution, which
can vary. The cooling solution could
increase this dimension.
12 Reference Manual Express-CBR
Chapter 2 Product Overview
Power Specifications
Tables 2-5 through 2-8 show the power requirements for the Express-CBR with 1.06 and 2.0 GHz CPU and
a 430 watt power supply. Tables 2-5 and 2-6 describe the board with CPU Turbo Mode enabled. Tables 2-7
and 2-8 describe the board with CPU Turbo Mode disabled.
Table 2-5. Power Supply Requirements (1.06 GHz CPU with CPU Turbo Mode enabled)
Parameter Baseboard: COM Express (EBX) Baseboard: COM Express (ATX
Types 1 and 2)
Input Type
(430 watt power
supply)
In-rush Voltage &
Current
Typical Idle Power
(DOS 6.2)
Typical Idle Power
(Windows XP)
BIT Voltage &
Current
S3 Mode 0.940A (4.700W) N/A 0.650A (3.250W) N/A
S5 Mode 0.610A (3.050W) N/A 0.490A (2.450W) N/A
+5V Standby +12V Regulated DC +5V Standby +12V Regulated DC
2.550A 5.800A 2.150A 7.700A
0.200A (1.000W) 1.300A (15.600W) 0.020A (0.100W) 1.550A (18.600W)
0.200A (1.000W) 1.000A (12.000W) 0.020A (0.100W) 1.350A (16.200W)
0.205A (1.020W) 1.650A (19.800W) 0.490A (2.450W) 2.100A (25.200W)
Table 2-6. Power Supply Requirements (2.0 GHz CPU with CPU Turbo Mode enabled)
Parameter Baseboard: COM Express (EBX) Baseboard: COM Express (ATX
Types 1 and 2)
Input Type
+5V Standby +12V Regulated DC +5V Standby +12V Regulated DC
(430 watt power
supply)
In-rush Voltage &
2.650A 5.950A 2.250A 7.700A
Current
Typical Idle
0.200A (1.000W) 1.550A (18.600W) 0.030A (0.150W) 1.850A (21.600W)
Power (DOS 6.2)
Typical Idle
0.200A (1.000W) 1.300A (15.600W) 0.020A (0.100W) 1.500A (18.000W)
Power (Windows
XP)
BIT Voltage &
0.205A (1.020W) 2.600A (31.200W) 0.500A (2.500W) 2.650A (28.800W)
Current
S3 Mode 0.940A (4.700W) N/A 0.650A (3.250W) N/A
S5 Mode 0.610A (3.050W) N/A 0.490A (2.450W) N/A
Express-CBR Reference Manual 13
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