Manual Rev. 2.01
Revision Date: March 28, 2014
Part No: 50-15093-1010
Advance Technologies; Automate the World.
Revision History
RevisionRelease DateDescription of Change(s)
2.0004/03/2014Initial release
2.0128/03/2014Correct J2 pin definitions
iiRevision History
cPCI-6625
Preface
Copyright 2014 ADLINK Technology Inc.
This document contains proprietary infor mation protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufa cturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks
of their respective companies.
Preface iii
Using this Manual
Audience and Scope
The cPCI-6625 User’s Manual is intended for hardware
technicians and systems operators with knowledge of installing,
configuring and operating industrial grade CompactPCI modules.
Manual Organization
This manual is organized as follows:
Chapter 1, Overview: Introduces the cPCI-6625, its features,
block diagrams, and package contents.
Chapter 2, Specifications: Presents detailed specification
information, and power consumption.
Chapter 3, Functional Description: Describes the cPCI-6625’s
main functions.
Chapter 4, Board Interfaces: Describes the cPCI-6625 board
interfaces, pin definitions, and jumper settings.
Chapter 5, Getting Starte d: Describes the installation instructions
of the cPCI-6625.
Chapter 6, Drivers & Utilities: Describes the driver installation
procedures.
Chapter 7, BIOS Setup Utility: Describes the AMI EFI BIOS
setup utility.
Important Safety Instructions: Presents safety instructions all
users must follow for the proper setup, installation and usage of
equipment and/or software.
Getting Service: Contact information for ADLINK’s worldwide
offices.
ivPreface
cPCI-6625
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
Additional information, aids, and tips that help users perform
tasks.
NOTE:
NOTE:
Information to prevent minor physical injury, component damage, data loss, and/or program corruption when trying to com-
CAUTION:
WARNING:
plete a task.
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.
Preface v
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viPreface
cPCI-6625
Table of Contents
Revision History...................................................................... ii
Preface.................................................................................... iii
List of Tables.......................................................................... ix
List of Figures........................................................................ xi
Figure 4-3: cPCI-6625 Front Panel Layout ................................ 19
List of Figures xi
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xiiList of Figures
1Overview
1.1Introduction
This manual provides information on the ADLINK cPCI-6625
Series blades. The cPCI-6625 is a 6U CompactPCI blade in dual
slot width (8HP) form factor compliant with the PICMG 2.30 CompactPCI PlusIO standard with an ultra hard metric (UHM) J2 connector. The cPCI-6626 is a 6U CompactPCI blade in dual slot
width (8HP) form factor compliant with the CompactPCI 2.0 CompactPCI R3.0 standard with hard metric J2 connector. The design
of both blades is based on the 2nd Generation Intel® Core™
i7-2710QE and Core™ i3-2330E with Mobile Intel® HM65
Express Chipset. The cPCI-6625 and the cPCI-6626 are value 6U
CompactPCI blades that offer high speed data transfer rate and
reliability.
The cPCI-6625 Series supports dual-channel un-buffered
DDR3-1066/1333 memory up to a maximum capacity of 16GB.
Graphics is integrated in the processor and output is provided
through two VGA ports on the front panel.
The cPCI-6625 Series feature four PCI-Express Intel® 82583V
Gigabit Ethernet controllers. The Ethernet connections can be
accessed through two Ethernet ports on the front panel and two
routed to J2 connector. The cPCI-6625 and cPCI-6626 also offer
six RS-232 serial ports via three RJ-45 connectors (2 serial ports
per connector), and four Type-A USB 2.0 ports on the front panel.
Storage features of the cPCI-6625 and cPCI-6626 include a SATA
6 Gb/s direct connector interface with mounting space for a 2.5"
HDD/SSD, a SATA 6Gb/s 7-pin on board and four SATA 3Gb/s
ports signals routed to J2 connector.
cPCI-6625
The cPCI-6625 Series additionally reserves one PCI-Express x4
onboard for a layer 2 expansion card that can pr ovide maxim um of
four PCI-Express x1 via Molex 74960-3018 on the front p anel. The
cPCI-6625 and the cPCI-6626 also provide four PCI-Expre ss x1 to
the J2 connector.
The cPCI-6625 Series supports the 32-bit/33MHz CompactPCI
interface and operates in a system slot only.
Overview 1
1.2Features
X Supports quad-core Intel® Core™ i7-2710QE or dual core
Core™ i3-2330E processor
X Up to 16GB DDR3-1333 memory in two SODIMMs
X PICMG® 2.30 CompactPCI PlusIO compliant
X PCIe x4 onboard for expansion
1.3Block Diagram
Front Panel
nd
generation Core
2
i3/i7 processor
PCIe x1
PCIe to PCI
Bridge
PCI-32b/33M
VGA
GbE1
GbE2
4x PCIe x1*
PCIe Switch
B2B
PCIe x4
Intel®
DDR3-1066/1333
SODIMM, max. 8GB
DMI
FDI
RGB
SPI
BIOS
Intel
82583
Intel
82583V
2xPCIe x1
SAT A1
7-pin
J1
Figure 1-1: cPCI-6625 Series Block Diagram
USB0
USB1
USB 0/1/2/3/
HM65 PCH
Slim H DD
USB2
USB3
2x PCIe x1SAT A0
Intel
82583
Intel
82583V
2x GbE
DP to
RGB
DP
VGA
4x USB
J2
COM1
COM2
LPC
4x SATA
COM4
COM3
SIO
4x PCIe x1
COM6
COM5
Board-to-board connector reserved for 4x PCI x1 expansion to
Front Panel via daughter board. See your ADLINK representa-
NOTE:
NOTE:
tive for more information.
2Overview
1.4Product List
Products in the cPCI-6625 Series include:
Processor Blade
X cPCI-6625/2710/M4G: 8HP dual slot 6U cPCI PlusIO blade
featuring Intel Core i7-2710QE processor with one 4GB
DDR3 SODIMM; GbE x2, COM x6, VGA x2, USB x4,
onboard SATA 6Gb/s connector for 2.5" drive
X cPCI-6626/2330/M4G: 8HP dual slot 6U cPCI blade featur-
ing Intel Core i3-2330E processor with one 4GB DDR3
SODIMM; GbE x2, COM x6, VGA x2, USB x4, onboard
SATA 6Gb/s connector for 2.5" drive
cPCI-6625
Overview 3
1.5Package Contents
The cPCI-6625 is packaged with the components listed below. If
any of the items in the contents list are missing or damaged, retain
the shipping carton and packing material and contact the dealer
for inspection. Please obtain authorization before returning any
product to ADLINK. The packing contents of non-standard configurations may vary depending on customer requests.
Processor Blade
X The cPCI-6625 Series Processor Blade
Z CPU and memory specifications will differ depending on
options selected
Z Thermal module is assembled onboard
X 2.5" SATA drive accessory pack
X One RJ-45 to DB-9 COM port converter cable
X ADLINK All-in-One DVD
X User's manual
The contents of non-standard cPCI-6625 Series configurations
may vary depending on customer requests.
NOTE:
NOTE:
This product must be protected from static discharge and physical shock. Never remove any of the components except at a
CAUTION:
static-free workstation. Use the anti-static bag shipped with the
product when putting the board on a surface. Wear an
anti-static wrist strap properly grounded on one of the system's
ESD ground jacks when installing or servicing system components.
Standard 6U CompactPCI®
Board size: 233.23 mm x 160 mm
Dual slot width (8HP, 40.64 mm)
CompactPCI® HM J1, UHM J2 connectors (for cPCI-6625)
CompactPCI® HM J1, J2 connectors (for cPCI-6626)
2nd Generation Intel® Core™ processor in PGA package
with passive heatsink
• Intel® Core™ i7-2710QE, 2.1GHz,6MB LLC, 45W
• Intel® Core™ i3-2330E, 2.2GHz, 3MB LLC, 35W
Dual channel unbuffered DDR3-1066/1333 memory
Two 204-pin SODIMM sockets
Up to 16GB
PCI 32-bit/33MHz; 3.3V, 5V universal V(I/O)
Supports operation in system slot only
Four PCI-Express x1 Intel® 82583V Gigabit Ethernet
controllers
Two10/100/1000 BASE-T RJ-45 LAN ports on front panel
Two routed to J2 connector
Integrated in processor with 3D engine
2x DB-15 VGA port on front panel
Supports DirectX 10.1, OpenGL 3.0
Six RS-232 serial ports from Super I/O ITE IT8783 via three
RJ-45 connectors on front panel (two RS-232 ports on each
connector by adapter cable)
One 2.5" SATA 6 Gb/s direct connector onboard
One 7-pin SATA 6 Gb/s port onboard
Four SATA 3 Gb/s ports to J2
Four USB 2.0 ports on front panel
Four USB 2.0 signals routes to J2
One PCI-Express x4 port reserved for layer 2 daughter board
Four PCI-Express x1 ports can be converted from daughter
board
Four PCI-Express ports routed to J2
Specifications 5
Integrated in Super I/O ITE IT8783
Hardware Monitor
Monitors CPU and system temperature, DC voltages
Built-in watchdog timer
Watchdog Timer
System reset and NMI, with programmable interval, 1-65535
sec/min
BIOSAMI® EFI BIOS 64Mbit SPI flash memory
4x USB 2.0 ports (Type-A)
2x RJ-45 LAN ports
2x VGA port
Faceplate I/O
3x RS-232 COM ports in RJ-45 connectors
Storage device status LED (yellow)
Power Status LED (green)
WDT (red)
Reset button
Battery Coin cell lithium BR2032 in battery socket
VibrationOperating: 2Grms. 5 to 500Hz, each axis (with SSD)
ComplianceCE, FCC Class A
T able 2-1: cPCI-6625 Specifications
Specifications are subject to change without prior notice.
NOTE:
NOTE:
6Specifications
cPCI-6625
2.2I/O Connectivity
cPCI-6625 Processor Blade
FunctionFaceplateBoardRear J2
COM (RS-232)Y1 x6——
LANY x2—Y x2
USB 2.0Y x4—Y x4
VGAY x2——
SATA —Y
PCI Express—Y4Y x4
LEDsY5 x3——
Reset ButtonY——
Clear CMOS Button—Y—
Table 2-2: cPCI-6625 I/O Connectivity
Notes:
1. Six RS-232 ports via three RJ-45 connectors (two RS-232
ports on each connector by adapter cable)
2. One SATA 6 Gb/s direct connector for 2.5" onboard SATA drive
and one SATA 6 Gb/s 7-pin port onboard
3. Four SATA 3 Gb/s ports
4. One PCIe x4 ports reserved for L2 daughter board
5. Power (green), storage device (yellow), WDT (red)
2
x2Y3 x4
Specifications 7
2.3Power Requirements
In order to guarantee a stable functionality of the system, it is recommended to provide more power than the system requires. An
industrial power supply unit should be able to provide at least
twice as much power as the entire system requires of each
voltage. An ATX power supply unit should be able to provide at
least three times as much power as the entire system requires.
The tolerance of the voltage lines described in the CompactPCI
specification (PICMG 2.0 R3.0) is +5%/ -3% for 5, 3.3 V and ±5%
for ±12V. This specification is for power delivered to each slot and
it includes both the power supply and the backplane tolerance.
Voltage
5V+5.0 VDC+5% / -3%50 mV
3.3V+3.3 VDC+ 5% / -3%50 mV
+12V+12 VDC+5% / -5%240 mV
-12V-12 VDC+5% / -5%240 mV
V I/O (PCI I/O
Buffer Voltage)
GND
Table 2-3: CompactPCI Input Voltage Characteristics
Nominal
Value
+3.3 VDC or
+5 VDC
Tolerance
+5% / -3%50 mV
Max. Ripple
(P - P)
8Specifications
cPCI-6625
Power Consumption
This section provides information on the power consumption of the
cPCI-6625 when using Intel® 2nd generation Core processors with
8GB DDR3-1333 socket memory and ADLINK ASD26-MLC32G-CT
SSD. Power consumption at 100% CPU usage was measured by
running Intel® Thermal analysis Tool 4.3..
Quad Core Intel® Core i7-2710QE, 2.1 GHz, TDP 45W
OS/ModeCurrent 5V Current 3.3V Total Power
DOS/Idle mode3.65 A1.02 A21.62 W
Windows XP/Idle mode2.31 A1.00 A14.85 W
WinXP /100%
CPU/Memory/Graphics stress
WinXP / 100%
CPU/Memory/Graphics stress
+ Windows total system stress
by BurnIn Test
Dual Core Intel® Core i3-2330E, 2.2 GHz, TDP 35W
OS/ModeCurrent 5V Current 3.3V Total Power
DOS/Idle mode4.03 A1.00 A23.45 W
Windows XP/Idle mode2.23 A0.98 A14.38 W
WinXP /100%
CPU/Memory/Graphics stress
WinXP / 100%
CPU/Memory/Graphics stress
+ Windows total system stress
by BurnIn Test
13.35 A1.18 A70.64 W
14.55 A1.18 A76.64 W
10.30 A1.14 A55.26 W
11.44 A1.18 A61.09 W
Specifications 9
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10Specifications
3Functional Description
The following sections describe the cPCI-6625 Series features
and functions.
3.1Processors
The 2nd Generation Intel® Core™ processor family mobile are
64-bit, multi-core mobile processors built on 32- nanometer process
technology. Based on a new micro-architecture, the processor is
designed for a two-chip platform. The two-chip platform consists of a
processor and Platform Controller Hub (PCH). The platform enables
higher performance, lower cost, easier validation, and improved x-y
footprint. The processor includes Integrated Display Engine, Processor Graphics and Integrated Memory Controller.
The
table below lists the general specifications and power ratings
of the CPUs supported by the
FeaturesCore™ i7-2710QECore™ i3-2330E
No. of Cores/Threads4/82/4
Clock2.1 GHz2.2 GHz
Max. Single Core
Turbo Freq.
Intel Smart Cache6 MB3 MB
DMI5 GT/s5 GT/s
Max. Power (TDP1)
T
junction, MAX
1. The highest expected sustainable power while running known
power intensive applications. TDP is not the maximum power
that the processor can dissipate.
2. Maximum junction temperature (T
ported operating temperature.
2
cPCI-6625 Series
3 GHzNA
45 W35 W
100ºC100ºC
, Max). The maximum sup-
j
.
cPCI-6625
Functional Description 11
Supported Technologies
FeaturesCore™ i7-2710QECore™ i3-2330E
Intel® Turbo Boost
Technology
Intel® Hyper-Threading
Technology
Intel® vPro Technology Ye sNo
Intel® Virtualization
Technology (VT-x)
Intel® Virtualization
Technology for Directed I/O
(Intel® VT-d)
Intel® Trusted Execution
Technology
Intel® 64 ArchitectureYesYes
Thermal Monitoring
Technologies
2.0No
YesYes
YesYes
YesNo
YesNo
YesYes
12Functional Description
Interfaces
X Two channels of DDR3 memory with a maximum of one
SO-DIMM per channel
X Memory DDR3 data transfer rates of 1066 MT/s and 1333
MT/s
X 64-bit wide channels
X DDR3 I/O Voltage of 1.5 V
X 1Gb, 2Gb, and 4Gb DDR3 DRAM technologies are sup-
ported for x8 and x16 devices
X Using 4Gb device technologies, the largest memory capac-
ity possible is 16 GB, assuming dual-channel mode with two
x8, dual-ranked, un-buffered, non-ECC,
X SO-DIMM memory configuration
X The PCI Express port(s) are fully-compliant with the
PCI-Express Base Specification, Revision 2.0
X 5 GT/s point-to-point DMI interface to PCH is supported
X The Processor Graphics contains a refresh of the sixth gen-
eration graphics core enabling substantial gains in performance and lower power consumptio n.
X DX10.1, DX10, DX9 support
X OGL 3.0 support
X FDI carries display traffic from the Processor Graphics in
the processor to the legacy display connectors in the PCH
cPCI-6625
Functional Description 13
3.2Platform Controller Hub
The HM65 PCH provides extensive I/O support. Functions and
capabilities include:
X PCI Express Base Specification, Revision 2.0 suppor t for up
to eight ports with transfers up to 5 GT/s
X ACPI Power Management Logic Support, Revision 4.0a
X Enhanced DMA controller, interrupt controller, and timer
functions
X Integrated Serial ATA host controllers with independent
DMA operation on up to six ports
X USB host interface with two EHCI high-speed USB 2.0 Host
controllers and two rate matching hubs provide support for
up to fourteen USB 2.0 ports
X Integrated 10/100/1000 Gigabit Ethernet MAC with System
Defense
X System Management Bus (SMBus) Specification, Version
2.0 with additional support for I2C devices
X Supports Intel® High Definition Audio (Intel® HD Audio)
X Supports Intel® Rapid Storage Technology (Intel® RST)
X Supports Intel® Virtualization Technology for Directed I/O
(Intel® VT-d)
X Integrated Clock Controller
X Analog and Digital Display ports
X Low Pin Count (LPC) interface
X Firmware Hub (FWH) interface support
X Serial Peripheral Interface (SPI) support
14Functional Description
cPCI-6625
3.3Intel® Turbo Boost T echnology
(Core™ i7-2710QE only)
Intel Turbo Boost Technology is a feature that allows the processor
to opportunistically and automatically run faster than its rated
operating core and/or render clock frequency when there is sufficient power headroom, and the product is within specified temperature and current limits. The Intel Turbo Boost Technology feature
is designed to increase performance of both multi-threaded and
single-threaded workloads. The processor supports a Turbo mode
where the processor can use t he th e rma l ca pacity as soc i at ed wit h
package and run at power levels higher than TDP power forshort durations. This improves the system responsiveness for
short, bursty usage conditions.
Turbo Mode availability is independent of the number of active
cores; however, the Turbo Mode frequency is d yn ami c and d epe ndent on the instantaneous application power load, the number of
active cores, user configurable settings, operating environment,
and system design. If the power, current, or thermal limit is
reached, the processor will automatically reduce the frequency to
stay with its TDP limit.
3.4Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology allows an execution core to
function as two logical processors. While some execution
resources (such as caches, execution units, and buses) are
shared, each logical processor has its own architectural state with
its own set of general-purpose registers and control reg iste rs. This
feature must be enabled using the BIOS and requires operating
system support. Intel recommends enabling Hyper-Threading
Technology with Microsoft Windows 7, Vista, and XP, and disabling Hyper-Threading Technology using the BIOS for all pr evious versions of Windows operating systems.
Functional Description 15
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