Manual Rev. 2.02
Revision Date: November 13, 2014
Part No: 50-15071-1020
Advance Technologies; Automate the World.
Revision History
RevisionRelease DateDescription of Change(s)
2.002010/09/24Initial Release
Updated RTM list, Mode Switch (SW2) definition,
2.012010/11/24
2.022014/11/13Add PMC slot -12V support note
IPMI User Guide; added NT Mode EEPROM
programming instructions
cPCI-6510
Preface
Copyright 2010-14 ADLINK Technology Inc.
This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
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Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks
of their respective companies.
Preface iii
Using this Manual
Audience and Scope
The cPCI-6510 User’s Manual is intended for hardware
technicians and systems operators with knowledge of installing,
configuring and operating industrial grade CompactPCI modules.
Manual Organization
This manual is organized as follows:
Chapter 1, Overview: Introduces the cPCI-6510, its features,
Figure 1-1: cPCI-6510 Series Block Diagram .............................. 3
Figure 2-1: Core i7-610E Power Dissipation Graph (TDP 35W) 14
Figure 2-2: Core i7-620LE Power Dissipation Graph (TDP 25W) 14
Figure 2-3: Core i7-620UE Power Dissipation Graph (TDP 18W) 15
Figure 4-1: cPCI-6510 Series Board Layout - Top Side ............ 21
Figure 4-2: cPCI-6510 Series Board Layout - Bottom Side ....... 22
Figure 4-3: cPCI-6510 Series Front Panel Layout ..................... 23
List of Figures xiii
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xivList of Figures
1Overview
1.1Introduction
The cPCI-6510 Series is a 6U CompactPCI single board computer
in single slot width (4HP) form factor supporting 32nm Intel®
Core™ i7 SV, LV, ULV processors with integrated graphics and
ECC memory controller onboard. The cPCI-6510 provides up to
8GB of dual channel DDR3-800/1066 ECC memory soldered
onboard and implements the Mobile Intel® QM57 Express Chipset
to provide a full feature set and optimal performance per watt.
The cPCI-6510 Series provides a 64bit/66MHz CompactPCI bus,
up to two PMC sites with 64-bit/133MHz PCI-X bus supporting
rear I/O (PIM), and one PCI Express x8 XMC site (shared with
inner PMC site). Featured I/O includes four PCI Express Gigabit
Ethernet ports (two on front panel, two for PICMG 2.16), two USB
ports and a CompactFlash socket. DVI-I, COM and additional USB
ports are available on the cPCI-6510V version which also provides
a SATA connector for an onboard 2.5” SATA HDD. Optional Rear
Transition Modules provide versatile additional I/O including two
additional GbE, USB, COM, High Definition Audio, and storage
interfaces such as SATA, SCSI, and SAS with RAID support. The
cPCI-6510V supports dual independent display via two DVI or one
DVI and one VGA when accompanied by the appropriate Rear
Transition Module.
For flexibility of use, the cPCI-6510 Series can be installed in a
standard CompactPCI system slot as system master, or peripheral
slot as a PCI device. Through hardware switch setting, the
cPCI-6510 optionally supports operation in system or peripheral
slots as a standalone blade. The cPCI-6510 Series is ideally
suited for military, aviation, communication and other industrial
applications.
cPCI-6510
Overview 1
1.2Features
X 6U CompactPCI SBC in 4HP width form factor
X µFC-BGA package Intel® Core™ i7 processor, up to 2.53GHz
X Mobile Intel® BD82QM57 PCH (Platform Controller Hub)
X Dual Channel DDR3 ECC SDRAM at 800 or 1066MHz sol-
dered onboard, up to 8GB
X 64-bit/66MHz CompactPCI Interface based on PCI specifica-
tions, 3.3V and 5V signaling
X Supports operation in system slot as system master or in
peripheral slot with connectivity to CompactPCI bus* (optional
isolation from CompactPCI bus)
X Dual PMC sites with 64-bit/133MHz PCI bus
X Single XMC site with PCIe x8 lane (shared with inner PMC
site)
X Up to two DVI ports for dual independent displays
X Four PCIe Gigabit Ethernet ports, two at front, two for PICMG
2.16 or RTM
X Onboard CompactFlash socket
X 2.5” SATA HDD direct connector onboard, occupies outer PMC
site
X Up to -40°C to 80°C optional extended temperature support
X RTM models available with multiple I/O options: SATA, HD
X Hardware RAID on SCSI, SAS interfaces supported (depen-
dent on RTM module)
*See “Programming NT Mode EEPROM Map” on page 59 for
instructions on how to set the PCIe-to-PCI bridge on the
NOTE:
NOTE:
cPCI-6510 to NT-mode to allow operation in a peripheral slot.
2Overview
1.3Block Diagram
Front Panel
3x USB
COM1
GbE1 GbE2
cPCI-6510
DVI-I
Soldered w/ ECC, max. 4GB
Soldered w/ ECC, max. 4GB
DDR3 800/1066
PCIe x8
Rear I/O
DMI
SATA1
COM4
IPMB 0/1
ITE8783
BMC
SIO
LPC
KB/MS
2x COM
Pericom
PI7C9X13
PCI 64b/66M
Intel® Core™ i7
PCIe x8
PCIe
Switch
PCIe x4
PCIe x4
Pericom
PI7C9X13
PCI-X 64b/133M
PMC 2
Rear I/O
2.5” HDD
XMC
PMC 1
J1/J2 J3/J4/J5
Figure 1-1: cPCI-6510 Series Block Diagram
Intel
82574L
Intel
82574L
PCIe x1 PCIe x1 TMDSA
QM57 PCH
PCIe x1 PCIe x1
Intel
82574L
GbE4
Intel
82574L
GbE3
6x USB
3x SATA
HDA
5x GPIO
RTC
PCIe x4
LVD S
RGB
SW
SATA2
SPI
TMDSB
SATA
to IDE
BIOS
CF
RGB
Overview 3
1.4Product List
Products included in the cPCI-6510 Series include:
Processor Blade
X cPCI-6510: 4HP width (single-slot) 6U CompactPCI blade
featuring single Intel® Core™i7 processor, dual channel
DDR3-800/1066 soldered onboard SDRAM with ECC,
2x PMC or 1x PMC and 1x XMC, 2x USB, 2x GbE and CF
socket
X cPCI-6510V: 4HP width (single-slot) 6U CompactPCI blade
featuring single Intel® Core™i7 processor, dual channel
DDR3-800/1066 soldered onboard SDRAM with ECC,
1x PMC/XMC, 3x USB, 2x GbE, RJ-45 COM, DVI-I, SATA
for 2.5” HDD and CF socket
Rear Transition Modules
X cPCI-R6000: 4HP width RTM with DVI-I, 2x COM, 3x USB, 2x
GbE, SCSI, 2xSATA
X cPCI-R6100: 4HP width RTM with 4x GbE, 4x USB, 2xSATA,
DVI, VGA, PS/2 KB/MS, CF & SD sockets
X cPCI-R6110: 4HP width RTM with 2x GbE, 4x USB, 3x SATA,
VGA, PS/2 KB/MS, CF, & SD sockets
X cPCI-R6200: 8HP width RTM with 2x GbE, 2x COM, 4x USB,
DVI-I, 3x SATA, Mic-in, Line-out, PS/2 KB/MS, 8x SAS
X cPCI-R6210: 4HP width RTM with 2xUSB, DVI-I, COM,
2x SATA, 2x PIM
Adapter Kit
X DB-CF-SA: CompactFlash socket kit for cPCI-R6000D &
cPCI-R6200 RTMs, including DB-6920CF adapter board, card
guide and screws to replace SATA adapter with CompactFlash
socket
4Overview
cPCI-6510
1.5Package Contents
The cPCI-6510 is packaged with the components listed below
(RTMs and adapter kits are optional). If any of the items in the
contents list are missing or damaged, retain the shipping carton
and packing material and contact the dealer for inspection. Please
obtain authorization before returning any product to ADLINK. The
packing contents of non-standard configurations may vary
depending on customer requests.
Processor Blade
X The cPCI-6510 Series Processor Blade
Z CPU, RAM will differ depending on options selected
Z Thermal module is assembled on the board
X RJ-45 to DB-9 cable for RJ-45 COM port (cPCI-6510V only)
X 2.5” SATA HDD mounting kit, including HDD bracket,
screws for HDD, and DB-6920SAT SATA adapter card
(cPCI-6510V only)
X ADLINK All-in-One CD
X User’s manual
The contents of non-standard cPCI-6510 configurations may
vary depending on customer requests.
NOTE:
NOTE:
This product must be protected from static discharge and physical shock. Never remove any of the components except at a
CAUTION:
static-free workstation. Use the anti-static bag shipped with the
product when putting the board on a surface. Wear an
anti-static wrist strap properly grounded on one of the system's
ESD ground jacks when installing or servicing system components.
Overview 5
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6Overview
2Specifications
2.1cPCI-6510 Specifications
PICMG® 2.0 CompactPCI® Rev. 3.0
CompactPCI
Standard
Mechanical
Processor
ChipsetIntel® QM57 Platform Controller Hub (PCH)
Memory
CompactPCI Bus
PMC/XMC
Graphics
Ethernet
PICMG® 2.1 Hot Swap Specification Rev.2.0
PICMG® 2.9 System Management Bus Rev. 1.0
PICMG® 2.16 Packet Switching Backplane Rev.1.0
Dual channel DDR3-800/1066 soldered onboard SDRAM
with un-buffered ECC
DDR3-800 for Core™i7-620UE processor
DDR3-1067 for Core™i7-610E/620LE processors
Maximum 8GB capacity
PCI 64-bit/ 66MHz; V(I/O) 3.3V and 5V signaling
Supports operation in system slot or in peripheral slot with
connectivity to CompactPCI bus (Universal Mode)
Optional Satellite mode by switch setting
Two PCI 64-bit/133MHz PMC sites, V(I/O) 3.3V (contact
ADLINK for 5V support)
One PCIe x8 XMC site (shared with inner PMC site)
Integrated in Intel® Core™i7 processor
One DVI-I port on front panel of cPCI-6510V provides digital
and analog signals.
Analog RGB signal to front or rear by switch selection
Second DVI port routed to rear
Supports dual independent display
Analog RGB up to QXGA
Four PCIe x1 Intel® 82574L GbE controllers
Two 10/100/1000BASE-T egress ports
Two 10/100/1000BASE-T ports on rear panel, optional
PICMG 2.16 support by switch selection
cPCI-6510
1
Specifications 7
One 16C550 compatible RJ-45 RS-232 port on front panel
Serial Ports
(cPCI-6510V only)
Two serial ports routed to rear I/O
Storage
Interfaces
2.5” SATA HDD direct connector onboard (cPCI-6510V only)
CompactFlash Type II socket onboard
1
BIOSAMI® EFI BIOS 64Mbit SPI flash memory
Supports PICMG® 2.9 secondary system management bus
IPMI functions implemented as defined by IPMI Spec. v1.5;
IPMI Interface
ATmega128L-8AU Baseboard Management Controller
(BMC) with 128KB programmable in-system flash, 4KB
EEPROM, and 4KB internal SDRAM
cPCI-6510:
2x USB 2.0 ports
2x 10/100/1000BASE-T Ethernet ports
2x PMC and one XMC slots
Faceplate I/O
cPCI-6510V:
3x USB 2.0 ports
2x 10/100/1000BASE-T Ethernet ports
PMC/XMC slot
RJ-45 Serial port
DVI-I port (digital and analog)
Microsoft® Windows® 7 Ultimate
Microsoft® Windows® Vista Enterprise
Supported OS
Microsoft® Windows® XP Professional SP3
Fedora™ 12
Other OS support upon request
Operating: 1.88Grms. 5 to 500Hz, each axis (without HDD)
ComplianceCE EN55022, FCC Class A
T able 2-1: cPCI-6510 Specifications
8Specifications
Notes:
1. 7.4 "Programming NT Mode EEPROM Map" on page 59 for
instructions on how to set the PCIe-to-PCI bridge on the
cPCI-6510 to Non-Transparent mode to allow operation in a
peripheral slot.
2. ADLINK-certified thermal design. The thermal performance is
dependent on the chassis cooling design. Sufficient forced airflow is required (see 2.4 "Thermal Requirements" on page 13).
Temperature limit of optional mass storage devices may affect
the thermal specification.
3. The hard drive limits the operational vibration tolerance. When
application requires higher specification for anti-vibration, it is
recommended to use a solid state drive (SSD) or CompactFlash card.
Specifications are subject to change without prior notice.
NOTE:
NOTE:
cPCI-6510
Specifications 9
2.2I/O Connectivity
cPCI-6510 Processor Blade
Function
GbE2—2—
USB 2.02—2—
COM——1
DVI-I—— 1
PMC—2—1
XMC—1—1
Serial ATA———1 (2.5” HDD)
CompactFlash—1—1
Table 2-2: cPCI-6510 I/O Connectivity
cPCI-6510cPCI-6510V
FaceplateBoardFaceplateBoard
(RJ-45)—
10Specifications
cPCI-6510
2.3Power Requirements
In order to guarantee a stable functionality of the system, it is rec-
ommended to provide more power than the system requires. An
industrial power supply unit should be able to provide at least
twice as much power as the entire system requires of each
voltage. An ATX power supply unit should be able to provide at
least three times as much power as the entire system requires.
The tolerance of the voltage lines described in the CompactPCI
specification (PICMG 2.0 R3.0) is +5%/ -3% for 5, 3.3 V and ±5%
for ±12V. This specification is for power delivered to each slot and
it includes both the power supply and the backplane tolerance.
Voltage
5V+5.0 VDC+5% / -3%50 mV
3.3V+3.3 VDC+5% / -3%50 mV
+12V+12 VDC+5% / -5%240 mV
-12V-12 VDC+5% / -5%240 mV
V I/O (PCI I/O
Buffer Voltage)
GND
Table 2-3: Comp actPCI Input Voltage Characteristics
Nominal
Value
+3.3 VDC or
+5 VDC
Tolerance
+5% / -3%50 mV
Max. Ripple
(P - P)
Specifications 11
Power Consumption
This section provides information on the power consumption of the
cPCI-6510 Series with different CPUs, 2GB DDR3-800/1066 soldered memory, and 100GB SATA HDD. The system was tested in
Idle Mode and Full Load Mode under Windows XP running Burn-in
Test 6.0. The cPCI-6510 is powered by 5V and 3.3V.
Idle Mode under Windows XP
CPUCore™ i7 610ECore™ i7 620LECore™ i7 620UE
Voltage
+3.34.1913.824.1218.413.8512.71
Total19.5123.7617.96
100% CPU Usage under Windows XP
CPUCore™ i7 610ECore™ i7 620LECore™ i7 620UE
Voltage
+3.36.0920.105.8319.255.3117.52
Total42.3137.0827.87
Current
(V)
+51.145.691.075.351.055.25
(V)
+54.4422.213.5717.832.0710.35
(A)
Table 2-4: Idle Mode Power Consumption
Current
(A)
Power
(W)
Power
(W)
Current
(A)
Current
(A)
Power
(W)
Power
(W)
Current
(A)
Current
(A)
Power
(W)
Power
(W)
T able 2-5: 100% CPU Usage Power Consumption
12Specifications
cPCI-6510
2.4Thermal Requirements
This section provides information on the thermal requirements of
the cPCI-6510 Series. Cooling of the board and its components is
provided by the thermal module (passive heatsink) and is dependent on sufficient airflow from the chassis.
The amount of thermal energy that can by dissipated from the
board is dependent on the ambient air temperature and the airflow
rate of the chassis. To provide the user with guidelines for the
upper limits of operating conditions for the cPCI-6510, the following sections give information on the maximum ambient air temperature as a function of airflow rate for a given level of power
consumption.
Power Dissipation Graphs
The graphs shown below illustrate the level of CPU power dissipation that can be maintained dependent on ambient air temperature
and airflow rate. One graph is provided for each CPU supported
by the cPCI-6510. The curves on each graph indicate the upper
limits of operating conditions under which the CPU will not be
affected by its thermal management and protection systems at a
given percentage of the CPU’s thermal design power (TDP).
The CPU’s thermal management and protection systems begin to
take effect when the CPU temperature exceeds the maximum
junction temperature (T
perature and airflow rate are in the ranges below the TDP curves
on the graphs, the CPU temperature will remain below T
the CPU will be able to operate at full performance (i.e. not limited
by thermal management).
The power dissipation graphs show two curves:
=105°C). When the ambient air tem-
j,Max
j,Max
and
X 100% TDP
X 75% TDP
The detailed specifications for each processor can be found in
Section 3.1 "Processor" on page 17.
Specifications 13
Intel® Core™ i7-610E
80
70
60
50
40
30
20
Max. Air Inlet Temp. (°C)
10
0
4 6 9 12151821242730
Airflow Rate (CFM)
100% TDP75% TDP
Figure 2-1: Core i7-610E Power Dissipation Graph (TDP 35W)
Intel® Core™ i7-620LE
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
Max. Air Inlet Temp. (°C)
10.0
0.0
4 6 9 12151821242730
Airflow Rate (CFM)
100% TDP75% TDP
Figure 2-2: Core i7-620LE Power Dissipation Graph (TDP 25W)
14Specifications
Intel® Core™ i7-620UE
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
Max. Air Inlet Temp. (°C)
10.0
0.0
46912151821242730
Airflow Rate (CFM)
100% TDP75% TDP
Figure 2-3: Core i7-620UE Power Diss ipation Graph (TDP 18W)
cPCI-6510
Specifications 15
Thermal Management Features
When the CPU temperature exceeds its maximum junction temperature (T
reduce power consumption (and thus performance) in an attempt
to reduce the core junction temperature. Use of the CPU’s thermal
management features is intended for short periods of time when
running power intensive applications. If the system is operated
under conditions below the TDP curves above, activation of the
thermal management features will be minimal and reduction in
CPU performance will be minor.
However, if the operating conditions are outside the limits set out
above, the CPU temperature may exceed T
periods, resulting in noticeable performance loss and reduced reliability of the processor.
In extreme situations, the thermal management features may be
incapable of cooling the processor. If the CPU temperature
exceeds approximately 130°C, a catastrophic cooling failure will
be detected and the processor will automatically shut down to prevent physical damage to the processor.
WARNING:
), the CPU’s thermal management features will
j,Max
for prolonged
j,Max
Prolonged operation above the CPU’s maximum junction temperature (Tj,Max=105°C) may damage the CPU and/or reduce
its long term reliability. Be sure to follow the thermal guidelines
set out in this document.
16Specifications
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