This document contains proprietary infor mation protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufa cturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE)
directive. Environmental protection is a top priority for ADLINK.
We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their
end of life, our customers are encouraged to dispose of them in
accordance with the product disposal and/or recovery programs
prescribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks
of their respective companies.
Preface iii
Page 4
Using this Manual
Audience and Scope
The cPCI-3970 User’s Manual is intended for hardware
technicians and systems operators with knowledge of installing,
configuring and operating industrial grade single boar d computers.
Manual Organization
This manual is organized as follows:
Chapter 1, Introduction: Introduces the cPCI-3970, its features,
mation, power consumption, and technical drawings.
Chapter 3, Functional Description: Describes the cPCI-3970
main functions.
Chapter 4, Board Interfaces: Describes the cPCI-3970 board
interfaces.
Chapter 5, Getting Started: Describes the installation of compo-
nents to the cPCI-3970 and rear transition modules.
Chapter 6, Driver Installation: Provides information on how to
install the cPCI-3970 device drivers under Windows XP.
Chapter 7, Utilities: Describes the utilities of the cPCI-3970,
including watchdog timer and Trusted Platform Module.
Chapter 8, BIOS Setup Utility: Describes basic navigation for the
AMI EFI BIOS setup utility.
Chapter 9, IPMI User Guide: Provides information on the base-
board management controller (BMC) of the Intelligent Platform
Management Interface (IPMI).
Important Safety Instructions: Presents safety instructions all
users must follow for the proper setup, installation and usage of
equipment and/or software.
Getting Service: Contact information for ADLINK’s worldwide
offices.
ivPreface
Page 5
cPCI-3970
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
Additional information, aids, and tips that help users perform
tasks.
NOTE:
NOTE:
Information to prevent minor physical injury, component damage, data loss, and/or program corruption when trying to com-
CAUTION:
WARNING:
plete a task.
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.
Preface v
Page 6
This page intentionally left blank.
viPreface
Page 7
cPCI-3970
Table of Contents
Revision History...................................................................... ii
Preface.................................................................................... iii
List of Figures........................................................................ xi
List of Tables........................................................................ xiii
The ADLINK cPCI-3970 Series is a 3U CompactPCI® PlusIO
compatible processor blade with ECC memor y up to 16GB. The
ADLINK cPCI-3970 features an Intel® Core™ i7 processor with
Mobile Intel® QM67 Express Chipset, supports Satellite mode
operation as a standalone blade in peripheral slots and IPMI for
system health monitoring.
Front panel I/O includes 2x GbE, 2x USB, VGA, and additional
2x USB, COM, KB/MS, and Line-in/out for the 8HP cPCI-3970D
model, or 2x DisplayPort, COM and USB for the cPCI-3970G version. One optional PCI 32-bit/66 MHz PMC site or PCI-Express x1
XMC site is available on the 2nd or 3rd layer. The optional Rear
Transition Module (RTM) provides 3x SATA, 2x GbE, 2x USB,
2x COM and VGA.
The cPCI-3970 is a high performance solution for factory automation and other industrial applications that require superior data
transfer capabilities and advanced computing power.
cPCI-3970
1.2Features
X 3U CompactPCI blade in 4HP, 8HP or 12HP width form factor
X Supports Intel® Core™ i7-2715QE Processor (4 cores, 6M
cache, 2.10 GHz)
X Graphics and memory controllers integrated in processor
X Compatible with PICMG 2.30 PlusIO (3x SATA, PCIe x4, 3x
USB, 2x GbE to J2)
X Dual channel DDR3-1066/1333 SDRAM with ECC via two
SODIMM sockets, up to 16GB
X 32bit/33MHz CompactPCI Interface based on PCI specifica-
tions, universal V(I/O)
X Supports Satellite mode operation as a standalone blade in
peripheral slots
X Optional 32-bit/66MHz PMC or PCIe x1 XMC site
X Supports IPMI for system health monitoring
Introduction 1
Page 16
X VGA port on front or switchable to rear I/O by BIOS setting
X Two PCIe Gigabit Ethernet egress ports
X Additional two Gigabit Ethernet ports on 80mm RTM
(cPCI-R3P00T)
X One CompactFlash socket
X Optional CFast socket for SATA interface storage (shares CF
socket site)
X Line-in and Line-out ports on front panel
X 2.5" SATA drive onboard on 8HP/12HP versions at 6 Gb/s
1.3Model Number Decoder
Blades
cPCI-ET3970 D / 655L / M4G
(A)(B)(C)(D)(E)
(A) Operating Temperature Code
Z Blank = 0ºC to +60ºC
Z ET = -20ºC to +70ºC (for CPUs with TDP below 25W only)
(B) J2 Connector Type Code
Z 0 = HM connector
Z 1 = UHM connector (PICMG 2.30 PlusIO compliant)
(C) Configuration Code
Z Blank = Single slot width with CF socket, 2x USB, 2x GbE,
VGA
Z D = Dual slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; 2x USB, COM, PS/2 KB/MS, Line-in, Line-out
and SATA on layer-2 DB-3610L2
Z G = Dual slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1, 2x DisplayPort, RJ-45 COM, PS/2 KB/MS, USB
and SATA on layer-2 DB-3970L2
2Introduction
Page 17
cPCI-3970
Z S = Dual slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; PMC/XMC site on layer-2 DB-3UMC.
Z P =Triple slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; 2x USB, COM, PS/2 KB/MS, Line-in, Line-out
and SATA on layer-2 DB-3610L2; PMC/XMC site on layer-3
DB-3UMC
Z U = Triple slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; 2x DisplayPort, RJ-45 COM, PS/2 KB/MS, USB
and SATA on layer 2 DB-3970L2 ; PMC/XMC site on laye r-3
DB-3UMC
Z Q = Dual Slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; no I/O on layer-2. (for Core i7-2715QE an d Core
i52515E processor only)
Z L = Dual Slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; 2x GbE, DB-9 COM, USB and SATA ports on
layer-2 DB-LAN2-S
Z M = Dual slot width with CF socket, 2x USB, 2x GbE, VGA
on layer-1; 100-pin density connector for audio, 2x DVI, 2x
USB, KB/MS, 2x COM and SA TA ports on layer-2 DB-Max
Z Other = ODM/OEM project code
(D) CPU Code
Z 715Q = Quad core Intel® i7-2715QE processor
Z 655L = Low voltage dual core Intel® i7-2655LE processor
Z 610U = Ultra low voltage dual core Intel® i7-2610UE pro-
cessor
Z 515E = Dual core Intel® i5-2515E processor
(E) Memory Size Code
Z M2G = 2x 1GB DDR3-1333 SO-CDIMM
Z M4G = 2x 2GB DDR3-1333 SO-CDIMM
Z M8G = 2x 4GB DDR3-1333 SO-CDIMM
Z M16G = 2x 8GB DDR3-1333 SO-CDIMM
(dependent on availability of memory modules)
Introduction 3
Page 18
RTMs
cPCI- R3P00 T
(A)
(A) Model Code
Z Blank = dual slot width, 50mm depth 3U R TM with 2x COM,
Z T = dual slot width, 80mm depth 3U RTM with 2x COM, 2x
USB, 3x SATA, VGA, 2x GbE (independent from processor
blade)
4Introduction
Page 19
cPCI-3970
1.4Package Contents
The cPCI-3970 is packaged with the following components. If any
of the following items are missing or damaged, retain the shipping
carton and packing material and contact the dealer for inspection.
Please obtain authorization before returning any product to
ADLINK. The packing contents of cPCI-3970 Series non-standard
configurations will vary depending on customer requests.
CPU module
X The cPCI-3970 Series Processor Blade
Z CPU and memory specifications will differ depending on
options selected
Z Thermal module is assembled on the board
X Y-cable for PS/2 combo port (8HP/12HP version only)
X 2.5" HDD accessory pack (8HP/12HP version only)
X RJ-45 to DB-9 COM adapter cable (cPCI-3970G version only)
X RS-422/485 DB-9-to-DB-9 dongle (cPCI-3970G version only)
X DisplayPort to DVI adapter cable (cPCI-3970G version only)
X ADLINK All-in-One DVD
X User’s manual
No I/O cables are included with the cPCI-3970M version.
NOTE:
NOTE:
Rear Transition Module
X cPCI-R3P00 or cPCI-R3P00T RTM
X RS-422/485 DB-9-to-DB-9 dongle
Optional Accessories
X DB-3CFAST adapter for CFast socket (P/N 91-37560-0000)
X DisplayPort to DVI adapter cable (P/N 30-01120-0000)
X DisplayPort to VGA adapter cable (P/N 30-01119-0000)
X DisplayPort to HDMI adapter cable (P/N 30-01121-0000)
X I/O cable for cPCI-3970M high density connector (contact
your ADLINK sales representative for order code)
Introduction 5
Page 20
NOTE:
NOTE:
CAUTION:
The contents of non-standard cPCI-3970 configurations may
vary depending on the customer’s requirements.
This product must be protected from static discharge and phys-
ical shock. Never remove any of the components except at a
static-free workstation. Use the anti-static bag shipped with the
product when putting the board on a surface. Wear an
anti-static wrist strap properly grounded on one of the system's
ESD ground jacks when installing or servicing system compo-
T able 2-1: cPCI-3970 Processor Blade Specifications
1. When using the cPCI-R3P00 RTM, LAN1/2 from the 82574L controllers
can be routed via J2 to the RTM. When using the cPCI-R3P00T RTM,
the cPCI-3970 front panel GbE ports change to LAN3/4 and the
cPCI-R3P00T GbE ports are LAN1/2 due to PCI-Express root port
sequence requirements of the PCH.
2. The storage device limits the operational vibration tolerance.
When the application requires higher specification for
anti-vibration, it is recommended to use a flash storage device.
3. ADLINK-certified thermal design. The thermal performance is dependent on the chassis cooling design. Sufficient forced air-flow is required
(see “Thermal Requirements” on page 22). Temperature limits of
optional mass storage devices may also affect the thermal specification.
4. A DB-9-to-DB-9 dongle to convert the cPCI-3970G RS-422/485 pin definitions to common pin definitions is included in the package
(“cPCI-3970G/U Serial Ports” on page 44).
10Specifications
Page 25
2.2cPCI-R3P00(T) RTM Specifications
MechanicalBoard Size
• cPCI-R3P00: 100mm x 50mm
• cPCI-R3P00T: 100mm x 80mm
Dual-slot (8HP, 40.64mm)
(optional single slot upon request )
Gigabit
Ethernet
Serial Ports• Two serial ports on I/O panel from pin header
Storage
Interface
Faceplate I/O• 2x USB 2.0 ports
1. cPCI-R3P00T GbE ports are LAN1/2 due to PCI-Express root port
sequence requirements of the PCH; cPCI-3970 front panel GbE
ports change to LAN3/4 when using the cPCI-R3P00T.
2. A DB-9-to-DB-9 dongle to convert the cPCI-R3P00 RS-422/485
pin definitions to common pin definitions is in cluded i n the p ackage
(“COM5 Connector (DB-9)” on page 47).
• cPCI-R3P00: T w o GbE ports switched from front panel by
BIOS setting (LAN1/2)
• cPCI-R3P00T: Two GbE ports from independent Intel
82580DB GbE controller
1
• COM5 converted from USB supporting RS-232/422/485
• COM4 provides RS-232 Tx, Rx signals only
• Three 7-pin Serial ATA ports
• 2x 10/100/1000BASE-T Ethernet ports
• Analog DB-15 VGA port
• 2x COM ports
T able 2-2: cPCI-R3P00(T) RTM Specifications
cPCI-3970
2
Specifications are subject to change without prior notice.
1. Switched from front ports for cPCI-R3P00, ports independent from
front panel for cPCI-R3P00T.
2. Switched from front port.
Yx3
Specifications 19
Page 34
2.5Power Requirements
In order to guarantee a stable functionality of the system, it is recommended to provide more power than the system requires. An
industrial power supply unit should be able to provide at least
twice as much power as the entire system requires of each
voltage. An ATX power supply unit s hould be able to provide at
least three times as much power as the entire system requires of
each voltage.
The tolerance of the voltage lines described in the CompactPCI
specification (PICMG 2.0 R3.0) is +5%/-3% for 5, 3.3 V and ±5%
for ±12V. This specification is for power delivered to each slot and
it includes both the power supply and the backplane tolerance.
Voltage
5V+5.0 VDC+5% / -3%50 mV
3.3V+3.3 VDC+5% / -3%50 mV
+12V+12 VDC+5% / -5%240 mV
-12V-12 VDC+5% / -5%240 mV
V I/O (PCI I/O
Buffer Voltage)
GND
Nominal
Value
+3.3 VDC or
+5 VDC
Tolerance
+5% / -3%50 mV
Max. Ripple
(P - P)
20Specifications
Page 35
cPCI-3970
Power Consumption
This section provides information on the power consumption of
cPCI-3970 Series when using the Intel® Core™ i7 processors with
2x 4GB DDR3-1066 SO-CDIMM memory and onboard 64GB SATA
flash disk. The cPCI-3970 is powered by 5V and 3.3V. Power consumption at 100% CPU usage was measured using the Intel Thermal Analysis Tool (TA T).
Intel® Core™i7-2715QE
OS/ModeCurrent 5VCurrent 3.3V Total Power
DOS/Idle mode5.81 A0.69 A31.3W
Windows XP/Idle mode4.94 A0.69 A27.0 W
Windows® XP, CPU 100% Usage13.1 A0.68 A67.5 W
Intel® Core™i7-2655LE
OS/ModeCurrent 5VCurrent 3.3V Total Power
DOS/Idle mode3.97 A0.73 A21.4 W
Windows XP/Idle mode3.56 A0.71 A20.1 W
Windows® XP, CPU 100% Usage6.97 A0.71 A37.2 W
Intel® Core™i7-2610UE
OS/ModeCurrent 5VCurrent 3.3V Total Power
DOS/Idle mode2.89 A0.73 A16.8 W
Windows XP/Idle mode2.54 A0.73 A15.1 W
Windows® XP, CPU 100% Usage5.01 A0.73 A 27.4 W
Intel® Core™i5-2515LE
OS/ModeCurrent 5VCurrent 3.3V Total Power
DOS/Idle mode4.52 A0.71 A24.9 W
Windows XP/Idle mode4.47 A0.71 A24.7 W
Windows® XP, CPU 100% Usage8.72 A0.71 A45.9 W
Specifications 21
Page 36
2.6Thermal Requirements
Cooling of the CompactPCI blade and its components is provided
by the thermal module (passive heat sink) and is dep endent on sufficient airflow from the chassis. The amount of thermal energy that
can by dissipated from the board is dependent on the ambient air
temperature and the airflow rate of the chassis. Please refer to the
separate document cPCI-3970 Power Dissipation Guidelines
which gives information on the upper limits of operating conditions
and the maximum ambient air temperature as a function of airflow
rate for a given level of power consumption for the cPCI-3970
blade.
22Specifications
Page 37
3Functional Description
The following sections describe the cPCI-3970 Series features
and functions.
3.1Processors
The 2nd Generation Intel® Core™ processor family mobile is the
next generation of 64-bit, multi-core mobile processor built on 32nanometer process technology. Based on a new micro-architecture,
the processor is designed for a two-chip platform. The two-chip platform consists of a processor and Platform Controller Hub (PCH). The
platform enables higher performance, lower cost, easier validation,
and improved x-y footprint. The processor includes Integrated Display Engine, Processor Graphics and Integrated Memory Controller.
The cPCI-3970 Series supports the Intel® Core™ i7/i5 processors.
The
table below lists the general specifications and power ratings
of the CPUs supported by the
cPCI-3970 Series
.
cPCI-3970
Features
Clock2.1GHz2.2GHz1.5GHz2.5GHz
Max. Single Core
Turbo Freq.
Last Level Cache6MB4MB4MB3MB
No. of Core(s)4222
Max. Power (TDP1)
T
junction, MAX
Functional Description 23
2
1. The highest expected sustainable power while running known
power intensive applications. TDP is not the maximum power
that the processor can dissipate.
2. The maximum supported operating temperature.
Core™ i7-
2715QE
3GHz2.9GHZ2.4GHz3.2GHz
45W25W17W35W
100ºC100ºC100ºC100ºC
Core™ i7-
2655LE
Core™ i7-
2610UE
Core™ i5-
2515E
Page 38
Supported Technologies
X Intel® Virtualization Technology for Directed I/O (Intel®
VT-d)
X Intel® Virtualization Technology (Intel® VT-x)
X Intel® Hyper-Threading Technology
X Intel® 64 Architecture
X Execute Disable Bit
X Intel® Turbo Boost Technology
Interfaces
X Two channels of DDR3 memory with a maximum of one
SO-DIMM per channel
X Memory DDR3 data transfer rates of 1066 MT/s,
1333 MT/s, and 1600 MT/s
X 64-bit wide channels
X DDR3 I/O Volt age of 1.5 V
X 1Gb, 2Gb, and 4Gb DDR3 DRAM technologies are sup-
ported for x8 and x16 devices
X The PCI Express port(s) are fully-compliant with the PCI
Express Base Specification, Revision 2.0.
X 5 GT/s point-to-point DMI interface to PCH is supported
X The Processor Graphics contains a refresh of the sixth gen-
eration graphics core enabling substantial gains in performance and lower power consumption.
X DX10.1, DX10, DX9 support
X OGL 3.0 support
X FDI carries display traffic from the Processor Graphics in
the processor to the legacy display connectors in the PCH
24Functional Description
Page 39
cPCI-3970
3.2Platform Controller Hub
The QM67 PCH provides extensive I/O support. functions and
capabilities include:
X PCI Express Base Specification, Revision 2.0 support for up
to eight ports with transfers up to 5 GT/s
X ACPI Power Management Logic Support, Revision 4.0a
X Enhanced DMA controller, interrupt controller, and timer
functions
X Integrated Serial ATA host controllers with independent
DMA operation on up to six ports
X USB host interface with two EHCI high-speed USB 2.0 Host
controllers and two rate
X matching hubs provide support for up to fourteen USB 2.0
ports
X Integrated 10/100/1000 Gigabit Ethernet MAC with System
Defense
X System Management Bus (SMBus) Specification, Version
2.0 with additional support for I2C devices
X Supports Intel® High Definition Audio (Intel® HD Audio)
X Supports Intel® Rapid Storage Technology (Intel® RST)
X Supports Intel® Virtualization Technology for Directed I/O
(Intel® VT-d)
X Integrated Clock Controller
X Analog and Digital Display ports
X Low Pin Count (LPC) interface
X Firmware Hub (FWH) interface support
X Serial Peripheral Interface (SPI) support
3.3PMC/XMC
The cPCI-3970P/U/S models support one PMC or XMC site for
front panel I/O expansion. The PMC site provides a maximum
32-bit/66MHz PCI bus link using a Pericom PI7C9X110
PCI-Express-to-PCI bridge and PCI-Express x1 link. The PMC site
supports +3.3V signaling only. The XMC site provides a PCI
Express x1 lane.
Functional Description 25
Page 40
3.4Intel® Turbo Boost Technology
Intel Turbo Boost Technology is a feature that allows the processor
to opportunistically and automatically run faster than its rated
operating core and/or render clock frequency when there is sufficient power headroom, and the product is within specified temperature and current limits. The Intel Turbo Boost Technology feature
is designed to increase performance of both multi-threaded and
single-threaded workloads. The processor supports a Turbo mode
where the processor can use the thermal capacity associated with
package and run at power levels higher than TDP power forshort durations. This improves the system responsiveness for
short, bursty usage conditions.
Turbo Mode availability is independent of the number of active
cores; however, the Turbo Mode frequency is dynamic and dependent on the instantaneous application power load, the number of
active cores, user configurable settings, operating environment,
and system design. If the power, current, or thermal limit is
reached, the processor will automatically reduce the frequency to
stay with its TDP limit.
3.5Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology allows an execution core to
function as two logical processors. While some execution
resources (such as caches, execution units, and buses) are
shared, each logical processor has its own architectura l state with
its own set of general-purpose registers and control registers. This
feature must be enabled using the BIOS and requires operating
system support. Intel recommends enabling Hyper-Threading
Technology with Microsoft Windows 7, Vista, and XP, and disabling Hyper-Threading Technology using the BIOS for all prev ious versions of Windows operating systems.
3.6Trusted Platform Module
The cPCI-3970 integrates the Infineon SLB 9635 TT 1.2 Trusted
Platform Module (TPM), a security controller with cryptographic
functionality that provides users a secure en vironment in e-commerce transactions and Internet communications.
26Functional Description
Page 41
cPCI-3970
The key features the TPM provides ar e:
X Hardware hash accelerator for SHA-1 algorithm.
X Advanced Crypto Engine (ACE) for asymmetric key opera-
tions (up to 2048-bit key length) to make hardware protection.
X Tick counter to extend the time requir ed to decipher th e key.
In addition to an encryption key created by the user, the TPM also
provides security features to protect the TPM itself:
X Over/Under-voltage detection to monitor the system stabil-
ity. If the voltage fluctuates dramatically, this function can
block the data transfer and lock the chip.
X Low/High frequency sensor to detect the IC clock fre-
quency. If the frequency fluctuates dramatically, this function can block the data transfer and lock the chip.
X Reset filter to filter reset signal in order to break the time se t
by tick counter is received.
X Memory encryption to protect memory.
X Physical shield in the IC to protect the die from intruding or
hacking by matching the data transferred on the 2 layer
metal shield on the IC. If the data is not matched, the IC
may be blocked.
The TPM does not support operation below 0ºC. Below this
temperature, the system may not boot. As a result, the
NOTE:
NOTE:
Extended Temperature version cPCI-ET3970 is not available
with TPM.
3.7Battery
The cPCI-3970 is equipped with a 3.0V "coin cell" lithium battery
for the Real Time Clock (RTC). The battery socket is equipped on
the DB-3CAST/DB-3CF daughter board. The lithium battery must
be replaced with an identical battery or a battery type recommended by the manufacturer. A Rayovac BR2032 with -40°C to
+85°C operating temperature support is equipped on board by
default. The coin cell battery can be replaced with a Gold Cap type
by request.
Functional Description 27
Page 42
3.8BIOS Recovery
The cPCI-3970 Series features AMI® EFI BIOS with BIOS recovery. If the BIOS becomes corrupted and you are unable to boot
your system, follow the instructions in Section 7.3“BIOS Recovery”
on page 101.
28Functional Description
Page 43
4Board Interfaces
This chapter illustrates the board layout, connector pin
assignments, and jumper settings to familiarize users with the
cPCI-3970 Series.
This section describes the final as sembly layout of the single slot
cPCI-3970 Blade.
BT1
JP1
Heatsink
CF1
DB-3CFAST
Figure 4-2: cPCI-3970 Blade Assembly Layout
BT1BatteryCF1CF or CFast socket
JP1Clear CMOS JumperJ2cPCI J2 (UHM/HM)
30Board Interfaces
Page 45
cPCI-3970
4.3cPCI-3970D Blade Assembly Layout
The dual-slot width cPCI-3970D Blade is comprised of the
cPCI-3970 single-slot main board and the DB-36 10L2 r i ser ca rd to
expand I/O connectivity with PS/2, COM, 2x USB ports, Line-in,
and Line-out ports .
COM1
USB2
USB3
SATA0
PS/2
CN6
CN8
CN7
2.5” SATA HDD
COM1DB-9 COM portCN7DB-3UMC connector
USB2/3USB connectorsCN6Line-in port
PS2PS/2 KB/Ms Combo port CN8Line-out port
SATA022-pin SATA connector
Figure 4-3: cPCI-3970D Blade Assembly Layout
DB-3610L2
Board Interfaces 31
Page 46
4.4cPCI-3970G Blade Assembly Layout
The dual-slot width cPCI-3970D Blade is comprised of the
cPCI-3970 single-slot main board and the DB-3970L2 riser card to
expand I/O connectivity with PS/2, COM, USB ports, and 2x DisplayPorts.
DP1
DP2
COM1
PS2
USB9
COM2
CN2
SATA0
2.5” SATA HDD
COM1RJ-45 COM portCN2DB-3UMC connector
COM210-pin COM portDP1/2DisplayPort connectors
USB9USB connectorPS2PS/2 KB/MS Combo port
SATA022-pin SATA connector
Figure 4-4: cPCI-3970G Blade Assembly Layout
DB-3970L2
32Board Interfaces
Page 47
cPCI-3970
4.5cPCI-3970, cPCI-3970D, cPCI-3970 G Faceplate
cPCI-3970
Reset Button
cPCI-3970D
Reset Button
cPCI-3970G
Power LED
COM1
Power LED
DisplayPorts
WDT LED
USB 2.0
WDT LED
VGA
HDD LED
Overheat LED
PS/2
KB/MS
HDD LED O verheat LED
PS/2
COM1
KB/MS
0.2 BSU 2/1 EbG
GP LED
Line-in
Line-out
GP LED
USB 2.0
Reset Button
Power LED
WDT LED
HDD LED
Overheat LED
GP LED
Figure 4-5: cPCI-3970, cPCI-3970D, cPCI-3970G Front Panel Layout
(See cPCI-3970 Processor Blade Specifications, Note 1 on page 10 for LAN1/2 info.)
Board Interfaces 33
Page 48
4.6cPCI-3970S, cPCI-3970P, cPCI-3970U Front Panel
cPCI-3970S
ˣˠ˖˂˫ˠ˖
cPCI-3970P
ˣˠ˖˂˫ˠ˖
cPCI-3970U
ˣˠ˖˂˫ˠ˖
Figure 4-6: cPCI-3970S, cPCI-3970P, cPCI-3970U Front Panel Layout
34Board Interfaces
Page 49
4.7
cPCI-3970L, cPCI-3970M, cPCI-3970Q Front Panel
cPCI-3970L
cPCI-3970M
cPCI-3970
cPCI-3970Q
Figure 4-7: cPCI-3970L, cPCI-3970M, cPCI-3970Q Front Panel Layout
Board Interfaces 35
Page 50
System LEDs
LEDColorConditionIndication
Power1
1
WDT
Green/
Red
Orange
OFFSystem is off
Red System Power ready (PWGD)
GreenPost OK
OFFNo Watchdog event
BlinkingWatchdog event alert
HDD
Overheat
Blue
1
Red
OFFNo CF/CFast/SATA HDD activity
Blinking
OFF
ON
Data read/write in process for CF/CFast/
SATA HDD
CPU T
CPU T
temperature is under 100ºC
junction
temperature exceeds 100ºC
junction
GP
(General
Purpose)
1
Yellow
OFFNo activity
ON/BlinkingDefined by user
Table 4-1: cPCI-3970 Front Panel System LED Descriptions
1. Power, WDT, Overheat, GP LEDs are connected to GPIO pins
of IPMC.
36Board Interfaces
Page 51
4.8cPCI-R3P00 RTM Board Layout
cPCI-3970
rJ2
SATA2
SATA3
SATA4
COM4
COM5* RS-232/422/485 port
COM5
LAN1/2
USB1
USB10
VGA1
LAN1/2Dual Ethernet ports
(converted from USB)
COM4RS-232 port (Tx, Rx only)VGA1VGA port
SATA2/3/4 SATA portsUSB1/10 USB ports
rJ2CompactPCI connector
Figure 4-8: cPCI-R3P00 RTM Board Layout
*COM5 is incorrectly labeled COM3 on the A1 vers. PCB silkscreen.
NOTE:
NOTE:
Board Interfaces 37
Page 52
4.9cPCI-R3P00T RTM Board Layout
rJ2
SATA2
SATA4
SATA3
COM4
COM5* RS-232/422/485 port
COM5
LAN1/2
USB1
USB10
VGA1
LAN1/2Dual Ethernet ports
(converted from USB)
COM4RS-232 port (Tx, Rx only)VGA1VGA port
SATA2/3/4 SATA portsUSB1/10 USB ports
rJ2CompactPCI connector
Figure 4-9: cPCI-R3P00 RTM Board Layout
*COM5 is incorrectly labeled COM3 on the A1 vers. PCB silkscreen.
These switches set the cPCI-3970D/P COM1 to RS-232 full
modem, RS-422, RS-485, or RS-485+ half-duplex mode.
Switches SW1~SW4 are located on the top edge of the
DB-3610L2 board. RS-232 full modem is set by default.
The cPCI-3970 Load BIOS Default Jumper is located on the
DB-3CF/CFast daughter board. To load the default BIOS settings,
short pins 2-3 on JP1, then reinstall the jumper cap to pins 1-2.
BIOS SettingConnectionJP1
Normal1 – 2
Load default BIOS2 – 3
Table 4-33: Load BIOS Default Jumper Settings
XMC VPWR Select Jumper on DB-3UMC (JPX1)
This jumper is located on the DB-3UMC board near JN1/2 and
selects the XMC VPWR setting. 5V is set by default.
This page intentionally left blank.
ModeConnectionJPX1
+5V (Default)1 – 2
+12V2 – 3
Table 4-34: XMC VPWR Select Jumper Settings
PMC V(I/O) Select Jumper on DB-3UMC (JPX2)
This jumper is located on the DB-3UMC board near JN1/2 and
selects the PMC V(I/O) setting. 3.3V is set by default.
ModeConnectionJPX2
+5V1 – 2
+3.3V (Default)2 – 3
Table 4-35: PMC V(I/O) Select Jumper Settings
66Board Interfaces
Page 81
5Getting Started
This chapter describes the following installation procedur es fo r the
cPCI-3970 and rear transition module:
X CPU and Heatsink
X Memory modules
X 2.5" SATA storage drive
X CompactFlash card
X CFast card
X PCI Mezzanine Card
X Processor blade installation to chassis
X RTM installation to chassis
5.1CPU and Heatsink
The cPCI-3970 Series come with CPU and heatsink pre-installed.
Removal of heatsink/CPU by users is not recommended. Please
contact your ADLINK service representative for assistance.
cPCI-3970
Getting Started 67
Page 82
5.2Memory Module Installation
The cPCI-3970 Series supports DDR3-1066/1333 ECC memory
modules via two stacked-type SO-CDIMM sockets. The
SO-CDIMM modules have a 204-pin footprint and are notched to
facilitate correct installation in the SO-DIMM sockets. At least one
memory module will be pre-installed in the lower socket as shown
below.
The front panel and the layer-2 daughter board (DB-3610L2,
DB-3970L2) must be removed before installing memory mod-
NOTE:
NOTE:
68Getting Started
ules to the cPCI-3970D/G 2-slot version (see “Removing the
Layer-2 Daughter Board” on page 73), and both layer-2 and
layer 3 daughter boards should be removed before installing
to the cPCI-3970P/U 3-slot version (see “Removing the
Layer-3 Daughter Board” on page 72).
Page 83
Installing the Memory Modules
Align the notch in the memory module with the key on the
SO-CDIMM slot. Press down on the module until is it is properly seated in the socket.
key
cPCI-3970
Getting Started 69
Page 84
5.3SATA Drive Installation
The cPCI-3970D/G 2-slot version and cPCI-3970P/U 3-slot version
provide space to install a slim type 2.5" Serial-ATA storage drive.
Installing a SATA Drive - cPCI-3970D/G(P/U)
1. Drive mounting brackets and screws are provided in the
accessory kit. Secure the brackets to the SATA drive
with the four M3 screws provided.
2. Align the SATA drive assembly with the onboard SATA
connector on the cPCI-3970 as shown and push it in
until it is properly seated. Secure the drive assemb ly to
the layer-2 daughter board (DB-3610L2 or DB-3970L2)
as shown using the four M2.5 screws provided.
70Getting Started
Page 85
cPCI-3970
5.4CompactFlash Installation
The CompactFlash socket is located on the DB-3CF daughter
board mounted on layer-1. To install a CF card, orient the card so
that the bottom side is facing up and align with the CF socket as
shown. Insert the CF card into the socket until it is fully seated and
flush with the ejector button.
Getting Started 71
Page 86
5.5Converting from CF to CFast Slot
DB-3CFAST is an optional accessory for the cPCI-3970 series. To
change the CF1 slot from CompactFlash to CFast, follow the
instructions below. For cPCI-3970 models with 2 or 3 slots, the
layer-2 and layer-3 daughter boards and front panel must first be
removed. For single slot models skip ahead to Installing the
DB-3CFAST Daughter Board
Removing the Layer-3 Daughter Board
For "P/U" models, follow the instructions below to remove the
layer-3 daughter board. For "D/G" 2-slot models, skip ahead to
Removing the Layer-2 Daughter Board
1. Remove the two screws on either side of the PMX/XMC
slot on the "P/U" front panel.
cPCI-3970P
below.
ˣˠ˖˂˫ˠ˖
below.
cPCI-3970U
ˣˠ˖˂˫ˠ˖
2. Remove the 4 screws securing the DB-3UMC daughter
board to the layer-2 daughter board.
3. Lift the DB-3UMC daughter board from the cPCI-3970
assembly.
72Getting Started
Page 87
Removing the Layer-2 Daughter Board
1. Remove the screws on the front panel as shown below
(6 screws on "D/P" model, 5 screws on the "G/U" model).
cPCI-3970D
cPCI-3970
cPCI-3970G
2. Remove the screw next to the handle on the solder side
of the cPCI-3970.
Getting Started 73
Page 88
3. Remove the 5 screws securing the DB-3970L2 or
DB-3610L2 layer-2 daughter board to the blade assembly.
4. Remove the front panel from the blade assembly.
5. Lift the DB-3970L2 or DB-3610L2 daughter board to
remove it from the blade assembly.
74Getting Started
Page 89
Installing the DB-3CFAST Daughter Board
1. Remove the three screws securing the DB-3CF daugh-
ter board as shown and lift it from the blade assembly.
2. Install the DB-3CFAST daughter board by aligning it with
the board-to-board connector (CN2) on the cPCI-3970
main board and pressing down firmly.
cPCI-3970
Getting Started 75
Page 90
3. Secure the DB-3CFAST by tightening the three screws
shown below.
4. Reinstall the layer-2 daughter board, front panel and
layer-3 daughter board as required by reversing the
steps described above.
76Getting Started
Page 91
cPCI-3970
5.6PMC/XMC Card In stallation
The cPCI-3970P/U provides one PMC/XMC slot designed to support 3.3V or 5V V(I/O) (default 3.3V) and 5V or 12V VPWR (default
5V). Before you install the PMC/XMC card on the cPCI-3970P/U,
please make sure that the PMC V(I/O) jumper JPX2 and XMC
VPWR jumper JPX1 have been correctly set (see page 66).
1.
To install a PMC/XMC card on the cPCI-3970P/U, the front
panel and layer-3 DB-3UMC daughter board must first be
disassembled. To remove the front panel, loosen
securing it to the blade assembly as shown,
additional screw under the ejector handle.
cPCI-3970P
ˣˠ˖˂˫ˠ˖
the screws
including one
cPCI-3970U
Getting Started 77
ˣˠ˖˂˫ˠ˖
Page 92
2. Remove the DB-3UMC daughter board from the blade
assembly by unscrewing the four screws securing it to
the layer-2 daughter board as shown below.
3.3V Key
3. There is a 3.3V key on board by default, if the PMC/XM C
card you wish to install is 5V signaling, please remove
the key and set the PMC V(I/O) jumper JPX2 to the 5V
setting (see “PMC V(I/O) Select Jumper on DB-3UMC
(JPX2)” on page 66).
78Getting Started
Page 93
cPCI-3970
4. Align the male connectors of the PMC/XM C card (com-
ponent-side down) to the female connectors of the
DB-3UMC and press down.
5. Secure the PMC/XMC card to the DB-3UMC by attach-
ing four screws (provided with the card) from the underside of the daughter board.
Getting Started 79
Page 94
6. Align the male board-to-board connector (CN1) of the
PMC/XMC assembly to the female board-to-board connector (CN7) of the layer-2 daughter board and press down.
7. Secure the PMC/XMC assembly to the layer-2 daughter
board using the four screws removed in Step 2 above.
8. Remove the PMC filler faceplate from the front panel.
9. Install the front panel to the cPCI-3970P/U by reversing
Step 1.
80Getting Started
Page 95
cPCI-3970
5.7Installing the cPCI-3970 to the Chassis
The cPCI-3970 may be installed in a system or peripheral slot of a
3U CompactPCI chassis. These instructions are for reference
only. Refer to the user guide that comes with the chassis for more
information.
1. Be sure to select the correct slot depending on the oper-
ational purpose of the module. The system power may
now be powered on or off.
2. Remove the blank face cover from the selected slot, if
necessary.
3. Press down on the release catches of the cPCI-3970
ejector handles.
4. Remove the black plastic caps securing the mounting
screws to the front panel.
5. Align the module’s top and bottom edges to the chassis
card guides, and then carefully slide the module into the
chassis. A slight resistance may be felt when inserting
the module. If the resistance it too strong, check if there
are bent pins on the backplane or if the board’s connector pins are not properly aligned with connectors on the
backplane. Then push the board until it is completely
flush with the chassis.
6. Push the ejector handles outwards to secure the module
in place, and then fasten the screws on the module front
panel.
7. Connect the cables and peripherals to the board, and
then turn the chassis on if necessary.
Getting Started 81
Page 96
5.8RT M Installation - cPCI-R3P00(T)
The installation and removal procedures for a RTM are the same
as those for CompactPCI boards. Because they are shorter than
front boards, pay careful attention when inserting or removing
RTMs.
Refer to previous sections for peripheral connectivity of all
I/O ports on the RTM. When installing the cPCI-3970 Series and
related RTMs, make sure the RTM is the correct matching model.
You must install the correct RTM to enable functions (I/O interfaces) on the rear panel. Installation of non-compatible RTMs
NOTE:
NOTE:
may damage the system board and/or other RTMs.
82Getting Started
Page 97
6Driver Installation
The cPCI-3970 drivers are available from the ADLINK All-In-One
DVD at X:\cPCI\cPCI-3970\, or from the ADLINK website
(http://www.adlinktech.com). ADLINK provides validated drivers for Windows XP Professional and Windows 7. We recommend
using these drivers to ensure compatibility. The VxWorks BSP can
be downloaded from the cPCI-3970 product page on the ADLINK
website
6.1cPCI-3970 Drivers
The following describes the cPCI-3970 driver installation procedures for Windows XP.
1. Install the Windows operating system before installing any
driver. Most standard I/O device drivers are installed during
Windows installation.
In order to enable AHCI mode, you must pre-install the Intel®
Rapid Storage Technology driver using the F6 installation
NOTE:
NOTE:
method described in
2. Install the chipset driver by extracting and running the pro-
gram in ...\Chipset\Intel_Chipset_Device_Software
_AllOS_9.2.0.1015.zip.
…\AHCI\F6Readme.txt.
cPCI-3970
3. Install the Microsoft .NET Framework utilities (required for the
graphics utility) by extracting and running the program in
...\Chipset\Microsoft_Net_Framework_v3.5_SP1.zip.
4. Install the grap hics driver and utilities by extracting and run-
ning the program in ...\Graphics\Intel_HD_Graphics_Family_WinXP_6.14.10.5313.zip.
5. Install the LAN drivers by extracting and running the program
in …\LAN\Intel_82574L_Gigabit_Network_WINXP_11.4.7.0.zip.
6. Install the In tel Rapid Storage Technology Utility by extract-
ing and running the program in …\AHCI\
Intel_Rapid_Storage_Technology_10.1.0.1008.zip
.
7. Install the TPM driver by extracting and r unning the program in
8. Install the audio driver and utilities by extracting and running
the program in …\Audio\RealTek_High_Definition_Audio_WINXP_5.10.0.6029.zip.
9. Install the Intel® Management Engine Interface driver to
remove the "question mark" from Other Devices in Windows
Device Manager.
The cPCI-3970 does not support Intel® Active Management
Technology. The purpose of installing this driver is to remove
NOTE:
NOTE:
the ""question mark" from Windows Device Manager.
Z R-click on My Computer, select Manage, and open the
Device Manager.
Z Under Other Devices you will see a "question mark" next
to PCI Simple Communication Controller. R-click on
PCI
Simple Communication Controller and click on Update
Driver to start the Hardware Update Wizard.
Z When asked to let Windows Update search for software ,
select "No, not at this time" and click
84Driver Installation
Next.
Page 99
cPCI-3970
Z Select "Install from a list or specific location (Advanced)"
and click
Z Extract the contents of …\cPCI-3970\Chipset\Intel
Next.
_Management_Engine_Interface_AllOS_7.0.0.1144.zip.
Select "Search for the best driver in these locations" and
"Include this location in the search". Click
Browse and navigate to the folder "MEI" where you extracted the contents of
the zip file, and then click
OK. Click Next to continue.
Z When driver installation has completed, click Finish to
close the wizard.
Driver Installation 85
Page 100
6.2USB-to-Serial Co nverter Driver (RTM)
The COM5 serial port on the cPCI-R3P00(T) is converted from the
USB3 port by a USB-to-serial converter (see “cPCI-R3P00 RTM”
on page 17). To install the driver for the converter, follow the procedure below. The installation consists of two parts: USB SerialConverter and USB Serial Port.
1. R-click on
Device Manager.
2. Under Other Devices you will see a "question mark" next to
FT2332R USB UART. R-click on
click on
3. When asked to let Windows Update search fo r softwar e, select
"No, not at this time" and click
My Computer, select Manage, and open the
FT2332R USB UART and
Update Driver to start the Hardware Update Wizard.
Next.
86Driver Installation
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