ADLINK CoreModule 430 User Manual

CoreModule

430

(PC/104 Single Board Computer)

Reference Manual

P/N 50-1Z006-1010

Notice Page

DISCLAIMER

ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from time to time without obligation to notify any person of such revisions. If errors are found, please contact ADLINK at the address listed below on the Notice page of this document.

TRADEMARKS

CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard, MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyPanel, ReadySystem, and RuffSystem are trademarks of ADLINK Technology, Inc. All other marks are the property of their respective companies.

REVISION HISTORY

Revision Reason for Change Date

A, A Initial Release Oct/08

1.0 Added U9 chip to table 2-1; revised description of U7 chip in table 2-1; revised JP7 default to pins 2-3 in table 2-3; changed document p/n from

5001840 to 50-1Z006-1000; changed rev to 1.0

1010

Changed pitch of J4 header in Tables 2-2 and 3-5 to 0.079

rev of this document from 1.0 to 1010; changed pin 9 in Tabl e 3 -10

from 3.6/4.0V to 3.0V max; added BIOS Setup Screens section to ch 4;

replaced EOL, U14 video memory in Tab le 2- 1 with new component;

changed definition of SPI Flash device

"; changed

Oct/09

June/12

ADLINK Technology, Incorporated 5215 Hellyer Avenue, #110 San Jose, CA 95138-1007 Tel. 408 360-0200 Fax 408 360-0222

http://www.adlinktech.com

Audience

This manual provides reference only for computer design engineers, including but not limited to hardware and software designers and applications engineers. ADLNK Technology, Inc. assumes you are qualified to design and implement prototype computer equipment.

ii Reference Manual CoreModule 430

Contents

Chapter 1 About This Manual ....................................................................................................1

Purpose of this Manual ....................................................................................................................1

References ......................................................................................................................................1

Chapter 2 Product Overview.....................................................................................................3

PC/104 Architecture ........................................................................................................................3

Product Description..........................................................................................................................4

Module Features ........................................................................................................................4

Block Diagram ............................................................................................................................7

Major Components (ICs) .................................................................................................................8

Header, Connector, and Socket Definitions ..................................................................................10

Jumper Header Definitions .......................................................................................................11

Specifications.................................................................................................................................12

Physical Specifications .............................................................................................................12

Mechanical Specifications ........................................................................................................12

Power Specifications ................................................................................................................13

Environmental Specifications....................................................................................................13

Thermal/Cooling Requirements ...............................................................................................13

Chapter 3 Hardware..................................................................................................................15

Overview ........................................................................................................................................15

CPU ..............................................................................................................................................16

Graphics ........................................................................................................................................16

Memory ..........................................................................................................................................16

System Memory .......................................................................................................................16

Video Memory ..........................................................................................................................16

SPI Flash .................................................................................................................................16

Memory Map ..................................................................................................................................17

Interrupt Channel Assignments .....................................................................................................18

I/O Address Map ...........................................................................................................................19

Parallel Interface (LPT) .................................................................................................................20

Serial Interface ..............................................................................................................................21

USB Interface ................................................................................................................................23

Utility Interface ..............................................................................................................................24

Keyboard ..................................................................................................................................24

Mouse .......................................................................................................................................24

Battery ......................................................................................................................................24

Reset Switch.............................................................................................................................24

Speaker ....................................................................................................................................24

Ethernet Interface .........................................................................................................................25

Video (TTL/VGA) Interface ...........................................................................................................26

Serial Peripheral Interface (SPI) ....................................................................................................28

Low Pin Count Interface (LPC) ......................................................................................................28

Miscellaneous ................................................................................................................................28

Real Time Clock (RTC) ............................................................................................................28

User GPIO Interface ................................................................................................................29

Oops! Jumper (BIOS Recovery) ...............................................................................................29

CoreModule 430 Reference Manual iii

Contents

Remote Access ...................................................................................................................... 30

Remote Access Setup ........................................................................................................ 30

Hot (Serial) Cable .............................................................................................................. 30

Watchdog Timer....................................................................................................................... 30

Power Interface ............................................................................................................................ 31

Chapter 4 BIOS Setup .............................................................................................................. 33

Introduction.................................................................................................................................... 33

Entering BIOS Setup (Local Display) ....................................................................................... 33

Entering BIOS Setup (Remote Access) ................................................................................... 33

OEM Logo Utility .......................................................................................................................... 34

Logo Image Requirements....................................................................................................... 34

BIOS Setup Screens ..................................................................................................................... 35

BIOS Main Setup Screen ........................................................................................................ 35

BIOS Advanced Setup Screen................................................................................................. 36

BIOS PCIPnP Setup Screen .................................................................................................... 38

BIOS Boot Setup Screen ......................................................................................................... 40

BIOS Security Setup Screen.................................................................................................... 41

BIOS Chipset Setup Screen..................................................................................................... 42

BIOS Exit Setup Screen........................................................................................................... 45

Appendix A Technical Support .................................................................................................. 47

Index ................................................................................................................................................. 49

List of Figures

Figure 2-1. Stacking PC/104 Modules with the CoreModule 430 .............................................. 3

Figure 2-2. Block Diagram ......................................................................................................... 7

Figure 2-3. Component Locations (Top Side)............................................................................ 9

Figure 2-4. Connector Pin Identifications................................................................................. 10

Figure 2-5. Header Locations (Top Side) ................................................................................ 11

Figure 2-6. Mechanical Dimensions (Top Side)....................................................................... 12

Figure 3-1. RS-485 Serial Port Implementation....................................................................... 21

Figure 3-2. Oops! Jumper........................................................................................................29

Figure 3-3. Hot Cable Jumper ................................................................................................. 30

Figure 4-1. BIOS Main Setup Screen ...................................................................................... 35

Figure 4-2. BIOS Advanced Setup Screen .............................................................................. 36

Figure 4-3. BIOS PCIPnP Setup Screen ................................................................................. 38

Figure 4-4. BIOS Boot Setup Screen....................................................................................... 40

Figure 4-5. BIOS Security Setup Screen ................................................................................. 41

Figure 4-6. BIOS Chipset Setup Screen.................................................................................. 42

Figure 4-7. BIOS Exit Setup Screen ........................................................................................ 45

List of Tables

Table 2-1. Major Components (Chips) Descriptions and Functions ......................................... 8

Table 2-2. Header, Connector, and Socket Descriptions ....................................................... 10

Table 2-3. Jumper Settings .................................................................................................. 11

Table 2-4. Weight and Footprint Dimensions ......................................................................... 12

Table 2-5. Power Supply Requirements ................................................................................. 13

Table 2-6. Environmental Requirements ................................................................................ 13

Table 3-1. Memory Map - Vortex 86SX/DX Processor........................................................... 17

Table 3-2. Interrupt Channel Assignments ............................................................................. 18

iv Reference Manual CoreModule 430

Contents

Table 3-3. DMA Map ...............................................................................................................18

Table 3-4. I/O Address Map ....................................................................................................19

Table 3-5. Parallel (LPT) Interface Pin/Signal Descriptions (J4) .............................................20

Table 3-6. Serial Ports 1 & 2 Interface Pin/Signal Descriptions (J3, J9) .................................22

Table 3-7. Serial Ports 3 & 4 Interface Pin/Signal Descriptions (J13, J14) .............................22

Table 3-8. USB0 Interface Pin/Signal Designations (J10) ......................................................23

Table 3-9. USB1 Interface Pin/Signal Designations (J17) ......................................................23

Table 3-10. Utility Interface Pin/Signal Descriptions (J5) ..........................................................24

Table 3-11. Ethernet Interface Pin/Signal Descriptions (J2) .....................................................25

Table 3-12. Video Interface Pin/Signal Descriptions (J11)........................................................26

Table 3-13. SPI Interface Pin/Signal Descriptions (J19) ...........................................................28

Table 3-14. LPC Interface Pin/Signal Descriptions (J20)..........................................................28

Table 3-15. User GPIO Interface Pin/Signal Descriptions (J8) .................................................29

Table 3-16. Power Interface Pin/Signals (J7)............................................................................31

Table 4-1. BIOS Setup Menus ................................................................................................35

Table A-1. Technical Support Contact Information..................................................................47

CoreModule 430 Reference Manual v

Contents

vi Reference Manual CoreModule 430

Chapter 1 About This Manual

Purpose of this Manual

This manual is for designers of systems based on the CoreModule™ 430 PC/104 single board computer (SBC) module. This manual contains information that permits designers to create an embedded system based on specific design requirements.

Information provided in this reference manual includes:

• CoreModule 430 SBC Specifications

• Environmental requirements

• Major chips and features implemented

• CoreModule 430 SBC connector/pin numbers and definitions

• BIOS Setup information

Information not provided in this reference manual includes:

• Detailed chip specifications

• Internal component operation

• Standard interface pin-out tables

• Internal registers or signal operations

• Bus or signal timing for industry standard busses and signals

References

The following list of references may be helpful for you to complete your custom design successfully. Some of these references are also available on the Ampro By ADLINK web page. The web page was created for embedded system developers to share ADLINK’s knowledge, insight, and expertise.

Specifications

• PC/104 Specifications Revision 2.5, November 2003

For latest revision of the PC/104 specifications, contact the PC/104 Consortium, at:

Web site: http://www.pc104.org

Major Integrated Circuit (Chip) Specifications

The following chip specifications are used in the CoreModule 430 processor module:

• DMP Electronics Inc. and the Vortex 86SX/DX CPU

Web site: http://www.vortex86sx.com/

• Winbond Electronics and the W25Q16BV SPI Flash memory

Web site: http://www.winbond.com/hq/enu/ProductAndSales/ProductSearch/?partno=w25q16bv

• Samsung Electronics and DDR2 on-board System Memory

Web site: http://www.samsung.com/global/business/semiconductor/

• Hynix Semiconductor, Inc. and DDR2 on-board Video Memory

Web site: http://www.hynix.com/gl/products/consumer/consumer_info.jsp

NOTE If you are unable to locate the datasheets using the links provided, search the

internet to find the manufacturer’s web site and locate the documents you need.

CoreModule 430 Reference Manual 1

Chapter 1 About This Manual

2 Reference Manual CoreModule 430

Chapter 2 Product Overview

PC/104 Module

CoreModule 430

PC/104 Module

Stackthrough Expansion Bus Headers

4-40 nut (4)

0.6 inch spacer (4)

4-40 screw (4)

PC/104 Module

CM430stack

This introduction presents general information about the PC/104 architecture and the CoreModule 430 Single Board Computer (SBC). After reading this chapter you should understand:

• PC/104 architecture

• CoreModule 430 product description

• CoreModule 430 features

• Major components

• Header definitions

• Specifications

PC/104 Architecture

The PC/104 architecture affords a great deal of flexibility in system design. You can build a simple system using only a CoreModule Single Board Computer (SBC), with input/output devices connected to its serial or parallel ports and a Compact Flash card in the Compact Flash socket. To expand a simple CoreModule system, simply add self-stacking ADLINK MiniModules or 3rd party PC/104 expansion boards to provide additional capabilities, such as:

• Additional I/O ports

• Analog or digital I/O interfaces

PC/104 expansion modules can be stacked with the CoreModule 430 avoiding the need for card cages and backplanes. The PC/104 expansion modules can be mounted directly to the PC/104 bus connector of the CoreModule 430. PC/104-compliant modules can be stacked with an inter-board spacing of ~0.66" (16.7 mm) so that a 3-module system fits in a 3.6" x 3.8" x 2.4" space. See Figure 2-1.

One or more MiniModule products or other PC/104 modules can be installed on the CoreModule expansion connectors. When installed on the PC/104 headers, the expansion modules fit within the CoreModule outline dimensions. Most MiniModule products have stack through connectors compatible with the PC/104 Version

2.5 specification. Several modules can be stacked on the CoreModule headers. Each additional module increases the thickness of the package by 0.60" (15 mm). See Figure 2-1.

Figure 2-1. Stacking PC/104 Modules with the CoreModule 430

CoreModule 430 Reference Manual 3

Chapter 2 Product Overview

Product Description

The CoreModule 430 SBC is an exceptionally high integration, x86-based PC compatible system in the PC/104 form factor. This rugged and high quality single board system contains all the component subsystems of a PC/AT motherboard plus the equivalent of several PC/AT expansion boards.

In addition, the CoreModule 430 SBC includes a comprehensive set of system extensions and enhancements that are specifically designed for embedded systems. These enhancements ensure fail-safe embedded system operation, such as a watchdog timer. The CoreModule 430 is designed to meet the size, power consumption, temperature range, quality, and reliability demands of embedded applications. The CoreModule 430 requires a single +5V power source.

The CoreModule 430 SBC is particularly well suited to either embedded or portable applications. Its flexibility makes system design quick and easy. It can be stacked with ADLINK MiniModules or other PC/104-compliant expansion boards, or it can be used as the computing engine in a fully customized application.

Module Features

• CPU



Provides x86 based DMP Vortex SX (300 MHz) or DX (800 MHz) microprocessor



Provides integrated Northbridge and Southbridge



Fully supports PC compatible architecture



Provides 8 kB Unified Instruction and Data Cache



Provides Parallel Processing Integrated Floating Point Unit (only in DX version)



Provides Low Power and System Management Modes

• Memory



Provides up to 256 MB standard DDR2 system RAM (soldered on the board)



Provides up to 32 MB standard DDR2 video RAM (soldered on the board)



Supports Memory Bus Speeds of 166 MHz on the SX CPU and 333 MHz on the DX CPU

• PC/104 Bus Interface



Provides standard PC/104 connector



Supports clock speeds up to 8 MHz ISA

• IDE Interface



Provides one IDE channel



Supports two enhanced IDE devices



Provides Fast ATA-capable interface for high-speed PIO modes (PIO modes 0 to 4)



Supports ATAPI and DVD peripherals



Supports IDE native and ATA compatibility modes

• Compact Flash Socket



Provides Compact Flash socket (Type I or II)



Supports IDE Compact Flash cards



Attached to Primary IDE bus

4 Reference Manual CoreModule 430

Chapter 2 Product Overview

• Serial Ports



Provides two 10-pin headers and four buffered RS-232 serial ports with full handshaking and modem capability



Provides 16C550 or 16C552 UARTs, each with a built-in 16-byte FIFO buffer



Supports RS-232 or RS-485 operation on ports 1 and 2



Supports programmable word length, stop bits, and parity



Supports 16-bit programmable baud-rate generator and an interrupt generator

• Parallel Port (LPT)



Provides parallel port header



Supports standard printer port



Supports IEEE standard 1284 protocols, including SPP, EPP, and ECP modes



Supports 16 byte FIFO for ECP mode

• Ethernet



Supports IEEE 802.3 10BaseT/100BaseT compatible physical layer



Supports Auto-negotiation for speed, duplex mode, and flow control



Supports full duplex or half-duplex mode

• Full-duplex mode supports transmit and receive frames simultaneously

• Supports IEEE 802.3x Flow control in full duplex mode

• Half-duplex mode supports enhanced proprietary collision reduction mode

• Utility Interface



PS/2 Keyboard and Mouse Interface



Supports external battery for Real Time Clock operation



Supports standard external 8 speaker interface



Supports external reset switch

• USB Ports



Provides one root USB hub



Provides two USB ports



Supports USB v2.0 and Universal UHCI v1.1

• Video (TTL/VGA) Display

Enhanced 2D graphics controller



Supports BitBLT implementation for all 256 raster operations for Windows support



Provides hardware command queue



Supports all BLT transparency modes

• Bitmap transparency

• Pattern transparency

• Source transparency

• Destination transparency



Supports rectangle clipping



Supports fast line draw engine with styled pattern

CoreModule 430 Reference Manual 5

Chapter 2 Product Overview



Supports fast rectangle fill engine



Supports 64x64x2 bit-mapped mono hardware cursor



Supports 256MB frame buffer with linear addressing

VGA Interface (DB15)



VGA Controller with 135 MHz triple RAMDACs for 1280 x 1024 x 75 Hz display



Supports 24-bit pixel depth



Interlaced or non-interlaced output

TTL Interface



Supports VESA Flat Panel Display interface



Supports programmable panel size up to 1600x1200 pixel display resolution



Supports internal CRT controller for display mode settings



Supports 12-, 18-, and dual 12-bit interface (1 Pixel/Clock)



Supports 3.3V or 5V LCD panels; jumper selectable

• Miscellaneous



Provides Real Time Clock and CMOS RAM, with support for battery-free operation



Provides General Purpose I/O (GPIO) interface



Supports Oops! Jumper (BIOS Recovery)



Supports Remote Access (Console Redirection)



Supports customizable Splash Screen



Supports Watchdog Timer (WDT)



Provides 16 Mbits of virtual floppy drive capacity

6 Reference Manual CoreModule 430

Chapter 2 Product Overview

SPI Header

SPI Flash

(Virtual Floppy)

USB0 and USB1

Header

Ethernet

Transformer

10/100 Ethernet

Header

CRT and TTL

Header

DDR2

Video Memory

DDR2

System Memory

DDR2

System Memory

SiS

Volari

Z9s

PCI Graphics

Controller

DMP Vortex

86DX/SX

CPU

GPIOs (8)

Header

PCI Bus

Parallel (LPT)

Header

PC/104 Connector

Compact Flash

Socket

44-Pin IDE

Header

ISA Bus

Utility Interface

Header

LPC

Header

RTC

COM3 & COM4

Header

COM1 & COM2

Header

RS232

Transceiver (X2)

RS422/485

Transceiver (X1)

COM1 & COM2

Header

RS232

Transceiver (X1)

CM430blkdiag_c

Block Diagram

Figure 2-2 shows the functional components of the module.

Figure 2-2. Block Diagram

CoreModule 430 Reference Manual 7

Chapter 2 Product Overview

Major Components (ICs)

Table 2-1 describes the major integrated circuits (ICs) on the CoreModule 430, and Figure 2-3 shows the

locations of the major ICs on the board.

Table 2-1. Major Components (Chips) Descriptions and Functions

Chip Type Mfg. Model Description Function

CPU (U1) DMP

Electronics, Inc.

PCI Graphics Controller (U13)

DDR2 System Memory (U2 and U3)

DDR2 Vid eo Memory (U14)

RS232 Transceiver (U4 - on back of the board)

RS232 Transceiver (U5)

SPI Flash (U6)

RS232 Transceiver (U7)

RS422/485 Transceiver (U9 - on back of the board)

Ethernet Transfomer (U12)

SiS Corporation

Fluctuating Fluctuating On-board DDR2

Analog Devices

Winbond W25Q16BV Serial Peripheral

Analog Devices

Linear LTC1334CG#PBF RS422/485 Transceiver

Pulse H1102NL-T 10/100BaseT Ethernet

Vortex 86SX/DX x86 32-bit processor Integrates

Processor Core, Memory Controller, and I/O Hub

Volari Z9S PCI graphics controller Integrates 2D

Engine and PCI controller

Provides high128Mx8 System memory

32Mx16 Video memory

ADM213EARSZ RS232 Transceiver for

COM3

ADM213EARSZ RS232 Transceiver for

COM4

Interface 16 Mbit Flash Memory

ADM213EARSZ RS232 Transceiver for

COM1 and COM2

for COM1 and COM2

Magnetics

speed data

transfer

Provides high-

speed data

transfer

Transmits and

receives RS232

signals for COM3

Transmits and

receives RS232

signals for COM4

Stores data in

flash memory,

emulating a

floppy drive

Transmits and

receives RS232

signals for COM1

and COM2

Transmits and

receives

RS422/485

signals for COM1

and COM2

Provides

electrical isolation

for Ethernet

controller

contained in the

CPU

8 Reference Manual CoreModule 430

Chapter 2 Product Overview

U14

U13

CM430_comp_top_c

U12

Key: U1 - CPU U2 - DDR2 SDRAM - System Memory U3 - DDR2 SDRAM - System Memory U5 - RS232 Transceiver - COM4 U6 - SPI Flash - Data Storage U7 - RS232 Transceiver - COM1 and COM2 U12 - 10/100 Ethernet Transformer U13 - PCI Graphics Controller U14 - DDR2 SDRAM - Video Memory

NOTE Pin 1 is shown as a black pin (square or round) on vertical headers or connectors

in all illustrations. Black dots on right-angle headers or connectors indicate pin

Figure 2-3. Component Locations (Top Side)

CoreModule 430 Reference Manual 9

Chapter 2 Product Overview

20-pin, two rows, Consecutive, (1, 11)

234

678910

124

15 1120

20-pin, two rows, Odd/Even, (1, 2)

CM430_ConNum_a

Header, Connector, and Socket Definitions

Table 2-2 describes the headers shown in Figure 2-5.

Table 2-2. Header, Connector, and Socket Descriptions

Jack/Plug # Access Description

P1A/1B & P1C/1D – PC/104 Bus

J2 – Ethernet Top 8-pin, 0.100" (2.54mm), right-angle header for Ethernet interface

J3 – Serial 1 (COM1) Top 10-pin, 0.100" (2.54mm), right-angle header for Serial 1 interface

J4 – Parallel (LPT) Top 26-pin, 0.079" (2mm), right-angle header for Parallel interface

J5 – Utility Top 10-pin, 0.100" (2.54mm), right-angle header for Utility interface

J6 – IDE Top 44-pin, 0.079" (2mm) header for IDE interface

J7 – Power Top 10-pin, 0.100" (2.54mm), right-angle header for Power

J8 – GPIO (User) Top 10-pin, 0.079" (2mm) header for User defined GPIO signals

J9 – Serial 2 (COM2) Top 10-pin, 0.100" (2.54mm), right-angle header for Serial 2 interface

J10 – USB0 Top 5-pin, 0.100" (2.54mm), right-angle header for USB0 interface

J11 – Video Top 44-pin, 0.079" (2mm), right-angle header for LCD/CRT interface

J12 – Compact Flash Bottom 50-pin, 0.050" (1.27mm) socket for Type I or II Compact Flash

J13 – Serial 4 (COM4) Top 10-pin, 0.100" (2.54mm) header for Serial 4 interface

J14 – Serial 3 (COM3) Top 10-pin, 0.100" (2.54mm) header for Serial 3 interface

J15 – DNP Top Do not populate

J17 – USB1 Top 5-pin, 0.079" (2mm) header for USB1 interface

J19 – SPI Top 6-pin, 0.100" (2.54mm) header used for SPI Flash programming

J20 – LPC Top 10-pin, 0.079" (2mm) header for LPC signals

Top/ Bottom

104-pin, 0.100" (2.54mm) connectors for PC/104 (ISA) bus

connection

cards

NOTE The pinout tables in Chapter 3 of this manual identify pin sequence using the

following methods: A 10-pin header with two rows of pins, using odd/even numbering, where pin 2 is directly across from pin 1, is noted as 10-pin, 2 rows, odd/ even (1, 2). Alternately, a 20-pin connector using consecutive numbering, where pin 11 is directly across from pin 1, is noted in this way: 20-pin, 2 rows, consecutive (1,

11). The second number in the parenthesis is always directly across from pin 1. See

Figure 2-4.

Figure 2-4. Connector Pin Identifications

10 Reference Manual CoreModule 430

Chapter 2 Product Overview

CM430_conn_top_c

J17

J13

J14

J11

J10

J19

J20

JP2

JP1

JP8

JP5

JP6

JP7

Key: J2 - Fast Ethernet J3 - COM1 J4 - Parallel J5 - Utility J6 - IDE J7 - Power J8 - GPIO J9 - COM2 J10 - USB0 J11 - TTL and VGA Video J13 - COM4 J14 - COM3 J17 - USB1 J19 - SPI 16 Mbit Data Storage JP1 - See jumper table JP2 - See jumper table JP5 - See jumper table JP6 - See jumper table JP7 - See jumper table JP8 - See jumper table P1 - PC/104

Jumper Header Definitions

Table 2-3. Jumper Settings

CoreModule 430 Reference Manual 11

Figure 2-5. Header Locations (Top Side)

Table 2-3 describes the jumper headers shown in Figure 2-5.

(Removed) Default setting

Jumper # Installed Removed/Installed

JP1 – Serial Port 2 Termination

JP2 – Serial Port 1 Termination

JP5 – Backlight

Enable RS-485 Termination (Pins 1-2) Disable RS-485 Termination

+5 Volts (Pins 1-2) +12 Volts (Pins 2-3) Default

Voltage Select

JP6 – Flat Panel Voltage Select

JP7 – Compact Flash

+3.3 Volts (Pins 1-2) Default +5 Volts (Pins 2-3)

+5 Volts (Pins 1-2) +3.3 Volts (Pins 2-3) Default

Voltage Select

JP8 – IDE Select Enable HDD master, CF slave (Pins 1-2)

Default

Note: All jumper headers use 0.079" (2mm) pitch.

Enable HDD slave, CF master (Pins 2-3)

+ 39 hidden pages

ADLINK CoreModule 430 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Notice Page