ADLINK CoreExpress-ECO2 User Manual

CoreExpress-ECO2

CoreExpress Module

Technical Manual

TME-CEM-ECO2-Rev0V4.doc

Revision 0.4 / January 12

LIPPERT Embedded Computers GmbH

Hans-Thoma-Str. 11

D-68163 Mannheim

http://www.lippertembedded.com/

Technical Manual CoreExpress-ECO2

Trademarks

MS-DOS, Windows, Windows 95, Windows 98, Windows NT and Windows XP a re tradem arks of Microsoft Corpor ation. PS/2 is a tra demark of International Business M a chines, Inc. Intel and Solid State Drive are trademarks of Intel C orporation. Geode is a trademark of Advan ced Micro Devices. PC/104 is a registered tradem a r k of PC/104 Consortium. All other trademarks appearing in this document are the property of th eir r es pec tiv e ow ners.

Disclaimer Contents and spe c ifications within this technical manual are subject of c hange without notice. LiPPERT Embedded Computers G m bH pr ovides no warranty with regard to this technical manual or

any other infor mation contained her e in and hereby expressly disclaims any im plie d warranties of merchantability or fitness for any particular purpos e with regard to any of the foregoing. LiPP ERT Embedded Computers GmbH assumes no liability for any damages incurred directly or indirectly from any technical or typographical er r or s or omissions contained herein or for discrepancies between the product and th e technical manual. In no event shall LiPPERT Embedded Computers GmbH be liable for any incidental, consequential, special, or exemplary damages, whether ba s ed on tort, contract or otherwise, arising out of or in conn ection with this user’s guide or any other information contained herein or th e use thereof.

TME-CEM-ECO2-Rev0V4.doc Rev 0.4

Table of Contents

1 Overview 1

1.1 Introduction .......................................................................................... 1

Features ................................................................................................... 1

Block Diagram ........................................................................................... 2

1.2 Orderi ng Information............................................................................. 3

CoreExpress-ECO2 Models .......................................................................... 3

Accessories ............................................................................................... 3

1.3 Specifications ........................................................................................ 3

Electrical Specification s .............................................................................. 3

Envir onmental Specifications ....................................................................... 4

MTBF ....................................................................................................... 4

Mechanical ................................................................................................ 4

2 Getting Started 6

2.1 Connector Locations .............................................................................. 6

2.2 Carrier Board Considerations ................................................................. 7

2.3 Hardware Setup ..................................................................................... 8

3 Module Description 9

3.1 Processor ............................................................................................... 9

3.2 Platform Controller Hub ......................................................................... 9

3.3 Watchdog .............................................................................................. 9

3.4 Graphics-Controller ................................................................................ 10

LVDS ....................................................................................................... 10

SDVO ...................................................................................................... 10

LVDS / SDVO Configuration ....................................................................... 10

3.5 Ethernet Controller ................................................................................ 11

3.6 SATA Ports ............................................................................................. 11

3.7 USB 2.0 Ports ......................................................................................... 11

3.8 Audio Interface ...................................................................................... 11

3.9 SDIO Interface....................................................................................... 11

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3.10 CAN-Bus Interface ................................................................................. 11

3.11 On Board Power Supply ......................................................................... 11

3.12 External Power-Button .......................................................................... 11

3.13 Reset-In Signal ...................................................................................... 11

3.14 External Battery ..................................................................................... 12

3.15 On Board LED indicators ........................................................................ 12

3.16 CoreExpress Bus Int erface, V2.1 ............................................................ 13

CoreExpress Connector.............................................................................. 13

4 Using the Module 19

4.1 BIOS ...................................................................................................... 19

Configuring the Phoenix BIOS .................................................................... 19

Trouble Shooting BIOS Settings .................................................................. 20

4.2 Drivers ................................................................................................... 20

4.3 LEMT Functions ...................................................................................... 21

4.4 Troubleshooting ..................................................................................... 22

5 Address Maps 23

5.1 Memory Address Map ............................................................................. 23

5.2 I/O Address Map ................................................................................... 24

5.3 Interrupts .............................................................................................. 25

5.4 DMA Channel s ........................................................................................ 26

6 Timings 27

6.1 StartUp .................................................................................................. 27

6.2 WakeUp ................................................................................................. 28

6.3 Reset ..................................................................................................... 28

Appendix A, Further Resources A Appendix B, Contact Information B Appendix C, Getting Help C Appendix D, Revision History D

TME-CEM-ECO2-Rev0V4.doc Rev 0.4 ii

1 Overview

1.1 Introduction

The CoreExpress CPU board CoreExpress-ECO2 is a powerful yet v er satile processor kernel for custom specific ba s e boards. It provides the functions of a modern standar d PC, with the interfac es brought out on the board’s plug-in c onnectors. This allow s easy scaling of the processing power to the application’s p er formance requirem ents.

The board confor m s to the CoreExpress specification 2.1 (by SFF-SIG) for COM (Computer On Module), which was created to support modern chipsets w ith PCI Express in te r fa c e s .

The CoreExpress-ECO2 features an Intel® Atom™ E6xx Series Processor and an integrated graphics and display contr oller.

Troubleshootin g is e a sy with supervis ion LEDs for status code signalization on the module. The CoreExpress-ECO2 can optionally be used in th e extended temperature range of -40°C ...

+85°C. Using the especially designed heat spreader and a suitable c ooling concept, the module can even be passively cooled without the n eed for a cooling fa n.

Features

CPU

• Intel® Atom™ Pr oc es s or E6xx Series with 0.6 / 1.0 / 1.3 / 1.6 GHz

Main Memory

• 512MB, 1GB, 2GB DDR2 RAM, 667 / 800 MHz

Chipset

• Intel® Platform Controller Hu b (PCH) EG20T

Graphics & Display

• SDVO

• LVDS

Interfaces

• 6 x USB 2.0 host

• 1 x USB 2.0 client

• 1x RGMII (to be connected to E th er net PHY, e.g. Realtek RTL8211CL or Micrel KSZ9021RN)

• 2 x Serial ATA Gen2

• Intel High Def inition Audio via exter nal codec

• PCI Express bus specification Rev. 1.0a , three x1 lanes (option additional PCI e x1 lane

instead of PCH usage)

• SDVO

• 18/24 Bit LVDS single channel

• 1x SDIO (8 Bit)

• CAN protocol version 2.0B

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Other configur a tions are possible on request.

Block Diagram

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1.2 Ordering Information

CoreExpress-ECO2 Models

Temperature range -20°C … +60°C

813-0012-10 E620T, 0.6 GHz, 512MB 813-0013-10 E640T, 1.0 GHz, 1GB 813-0014-10 E640T, 1.3 GHz, 1GB 813-0018-10 E680T, 1.6 GHz, 2GB

Temperature range -40°C … +85°C

913-0012-10 E620T, 0.6 GHz, 512MB 913-0013-10 E640T, 1.0 GHz, 1GB 913-0014-10 E640T, 1.3 GHz, 1GB 913-0018-10 E660T, 1.6 GHz, 2GB

Accessories

There are some options ava ilable for the CoreExpress-ECO2. Plea se check their availability before ordering.

Order number Description

765-0042-10 Heat sink, passive, CoreExpress-ECO2, up to 60°C ambient temperature 751-0001-10 Carrier board for CoreExpress-ECO2 708-0012-10 Developer's Kit, CoreExpress-ECO2, 1.3 GHz, 1 GB DDR2, 0° .. 50°C 708-0012-11 Developer's Kit, CoreExpress-ECO2, 1.6 GHz, 2 GB DDR2, 0° .. 50°C

1.3 Specifications

Electrical Specifications

Supply voltage +5 DC Rise time < 5 ms Supply voltage r ipple ± 5 % Supply current

CPU Idle Maximum

E620T E640T 1.10A / 5.50W 1.55A / 7.75W

Approx. 1.0A / 5.0W

t.b.d.

E660T 1.10A / 5.50W 1.40A / 7.0W E680T 1.25A / 6.25W 1.65A / 8.25W

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Environmental Specificat ions

Operating:

Temperature range 0 … 60 °C (commercial version)

-20 … 60 °C (industrial version)

-40 … 85 °C (extended version)

Temperature change max. 10K / 30 minutes Humidity (relative) 10 … 90 % (non-condensing) Pressure 450 … 1100 hPa

Non-Operating/Storage/Transport:

Temperature range -40 … 85 °C Temperature change max. 10K / 30 minutes Humidity (relative) 5 … 95 % (non-condensing) Pressure 450 … 1100 hPa

MTBF

MTBF at 25°C 228.412 hours

Mechanical

Dimensions (LxW) 65 mm x 58 mm Height 12,4 mm measured from topside of the carrier PCB (with passive

heatsink).

Weight approx. 80 g without h e a ts ink Mounting 4 mounting holes

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Top

Bottom

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2 Getting Started

2.1 Connector Loc ations

Except for the CoreExpress connector at the bottom side of the PCB, the CoreExpress-ECO2 has no connectors.

Top

SPI service connector