Page 1
Figure 1:
General Description
Added Value of Using TSL2591
TSL2591
Light-to-Digital Converter
The TSL2591 is a very-high sensitivity light-to-digital converter
that transforms light intensity into a digital signal output
capable of direct I²C interface. The device combines one
broadband photodiode (visible plus infrared) and one
infrared-responding photodiode on a single CMOS integrated
circuit. Two integrating ADCs convert the photodiode currents
into a digital output that represents the irradiance measured
on each channel. This digital output can be input to a
microprocessor where illuminance (ambient light level) in lux
is derived using an empirical formula to approximate the
human eye response. The TSL2591 supports a traditional level
style interrupt that remains asserted until the firmware clears it.
Ordering Information and Content Guide appear at end of
datasheet.
Benefits Features
• Approximates Human Eye Response • Dual Diode
• Flexible Operation • Programmable Analog Gain and Integration Time
• Suited for Operation Behind Dark Glass • 600M:1 Dynamic Range
• Two Internal Interrupt Sources
• Low Operating Overhead
• Low Power 3.0 μA Sleep State • User Selectable Sleep Mode
• I²C Fast Mode Compatible Interface
• Programmable Upper and Lower Thresholds
• One Interrupt Includes Programmable Persistence Filter
• Data Rates up to 400 kbit/s
• Input Voltage Levels Compatible with 3.0V Bus
ams Datasheet Page 1
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Page 2
Figure 2:
Block Diagram
TSL2591 − General Description
Block Diagram
The functional blocks of this device are shown below:
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Page 3
TSL2591 − Detailed Description
Detailed Description
The TSL2591 contains two integrating analog-to-digital
converters (ADC) that integrate currents from two photodiodes.
Integration of both channels occurs simultaneously. Upon
completion of the conversion cycle, the conversion result is
transferred to the Channel 0 and Channel 1 data registers,
respectively. The transfers are double-buffered to ensure that
the integrity of the data is maintained. After the transfer, the
device automatically begins the next integration cycle.
Communication with the device is accomplished through a
standard, two-wire I²C serial bus. Consequently, the TSL2591
can be easily connected to a microcontroller or embedded
controller. No external circuitry is required for signal
conditioning. Because the output of the device is digital, the
output is effectively immune to noise when compared to an
analog signal.
The TSL2591 also supports an interrupt feature that simplifies
and improves system efficiency by eliminating the need to poll
a sensor for a light intensity value. The primary purpose of the
interrupt function is to detect a meaningful change in light
intensity. The concept of a meaningful change can be defined
by the user both in terms of light intensity and time, or
persistence, of that change in intensity. The device has the
ability to define two sets of thresholds, both above and below
the current light level. An interrupt is generated when the value
of a conversion exceeds either of these limits. One set of
th res hold s ca n be c onf igu red to trigger an interrupt only when
the ambient light exceeds them for a configurable amount of
time (persistence) while the other set can be configured to
trigger an immediate interrupt.
ams Datasheet Page 3
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Page 4
Package FN Dual Flat No-Lead (Top
Pin Assignment
SCL 1
INT 2
GND 3
6 SDA
5 V
DD
4 NC
View): Package drawing is not to scale.
TSL2591 − Pin Assignment
The TSL2591 pin assignments are described below.
Figure 3:
Pin Diagram
Figure 4:
Pin Description
Pin Number Pin Name Description
1 SCL I²C serial clock input terminal
2 INT Interrupt — open drain output (active low).
3 GND Power supply ground. All voltages are referenced to GND.
4 NC No connect — do not connect.
5
6 SDA I²C serial data I/O terminal
V
DD
Supply voltage
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Page 5
TSL2591 − Absolute Maximum Ratings
Absolute Maximum Ratings
Figure 5:
Absolute Maximum Ratings
Parameter Min Max Units Comments
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Supply voltage, V
DD
3.8 V All voltages are with respect to GND
Input terminal voltage -0.5 3.8 V
Output terminal voltage -0.5 3.8 V
Output terminal current -1 20 mA
Storage temperature range, T
stg
-40 85 ºC
ESD tolerance, human body model ±2000 V JESD22-A114-B
ESD tolerance, charge device model
(CDM)
±500 V JESD22-C101
ams Datasheet Page 5
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Page 6
TSL2591 − Electrical Characteristics
Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods. Device parameters are guaranteed
at T
= 25°C unless otherwise noted.
A
Figure 6:
Recommended Operating Conditions
Symbol Parameter Min Typ Max Units
V
DD
T
A
Supply voltage 2.7 3 3.6 V
Operating free-air temperature -30 70 ºC
Figure 7:
Operating Characteristics, V
=3V, TA=25ºC (unless otherwise noted)
DD
Symbol Parameter Conditions Min Typ Max Units
I
DD
V
I
LEAK
V
V
OL
IH
Supply current
INT, SDA output low
voltage
Leakage current, SDA,
SCL, INT pins
SCL, SDA input high
voltage
IL
SCL, SDA input low
voltage
Active
Sleep state - no I²C activity
3mA sink current
6mA sink current
TSL25911 (V
TSL25913 (V
TSL25911 (V
TSL25913 (V
= VDD)0.7 V
bus
= 1.8)
bus
= VDD)0.3 V
bus
= 1.8)
bus
0
0
-5 5 μA
1.26
DD
275
2.3
325
4
0.4
0.6
DD
0.54
μA
V
V
V
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Page 7
TSL2591 − Electrical Characteristics
Figure 8:
ALS Characteristics, V
=3V, TA=25ºC, AGAIN = High, AEN=1, (unless otherwise noted)
DD
Parameter Conditions Channel Min Typ Max Units
E
= 0,
Dark ADC count
value
e
AGAIN = Max,
ATIME=000b (100ms)
CH0
CH1
0
0
20
20
(1) (2) (3)
counts
ADC integration
time step size
ADC number of
integration steps
ATIME = 000b (100ms) 95 100 105 ms
(4)
16steps
Max ADC count ATIME = 000b (100ms) 0 36863 counts
ATIME = 001b (200ms), 010b
Max ADC count
(300ms), 011b (400ms),
0 65535 counts
100b (500ms), 101b (600ms)
White light
Ee = 4.98 W/cm2
(2)
CH0
CH1
1120 1315
174
1510
counts
ATIME = 000b (100 ms)
ADC count value
λ
= 850 nm
p
Ee = 5.62 W/cm2,
(3)
CH0
CH1
1230 1447
866
1665
counts
ATIME = 000b (100 ms)
ADC count value
ratio: CH1/CH0
White light
λ
= 850 nm
p
(2)
(3)
0.092 0.132 0.172
0.558 0.598 0.638
R
e
Irradiance
responsivity
(4)
Noise
White light
(2)
ATIME = 000b (100 ms)
= 850 nm
λ
p
(3)
ATIME = 000b (100 ms)
White light
(2)
Ee = 4.98 W/cm2
ATIME = 000b (100 ms)
CH0
CH1
CH0
CH1
264.1
34.9
257.5
154.1
CH0 1 2
counts/
(W/cm
2
1 standard
deviation
)
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Page 8
TSL2591 − Electrical Characteristics
Parameter Conditions Channel Min Typ Max Units
AGAIN = Med
Gain scaling, relative
to 1× gain setting
(AGAIN = Low)
AGAIN = Max
Note(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible white LEDs
and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production
2. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.
3. The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength λ
850 nm and spectral halfwidth λ½ = 42 nm.
4. Parameter ensured by design and is not 100% tested.
CH0
CH1
CH0
CH1
CH0
CH1
22
22
360
360
8500
9100
24.5
24.5
400
400
9200
9900
27
27
440
440
9900
10700
×AGAIN = High
=
p
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Page 9
TSL2591 − Timing Characteristics
Timing Characteristics
Figure 9:
AC Electrical Characteristics, V
The timing characteristics of TSL2591 are given below.
= 3 V, TA = 25ºC (unless otherwise noted)
DD
Parameter
f
(SCL)
t
(BUF)
(HDSTA)
t
(SUSTA)
t
(SUSTO)
t
(HDDAT)
t
(SUDAT)
t
(LOW)
t
(HIGH)
t
F
t
(1)
Description Min Typ Max Units
Clock frequency (I²C only) 0 400 kHz
Bus free time between start and stop
condition
1.3 µs
Hold time after (repeated) start
condition. After this period, the first
0.6 µs
clock is generated.
Repeated start condition setup time 0.6 µs
Stop condition setup time 0.6 µs
Data hold time 0 µs
Data setup time 100 ns
SCL clock low period 1.3 µs
SCL clock high period 0.6 µs
Clock/data fall time 300 ns
t
R
C
i
Note(s):
1. Specified by design and characterization; not production tested.
Clock/data rise time 300 ns
Input pin capacitance 10 pF
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Page 10
Figure 10:
Timing Diagrams
Parameter Measurement Information
TSL2591 − Tim ing Diagrams
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Page 11
TSL2591 − Typical Operating Characteristics
Typical Operating Characteristics
CH0
CH1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
300 400 500 600 700 800 900 1000 1100
λ - Wavelength - nm
Normalized Responsivity
CH0
CH1
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90
Incedent Angle - º
Response - Normalized to 0º
Spectral Responsivity: Two channel
response allows for tunable illuminance
(lux) calculation regardless of
transmissivity of glass.
Figure 11:
Spectral Responsivity
White LED Angular Response: Near
cosine angular response for broadband
white light sources.
ams Datasheet Page 11
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Figure 12:
White Normalized Responsivity vs. Angular Displacement
Page 12
vs. VDD and Temp: Effect of supply
5°C
25°C
50°C
75°C
0.9
0.95
1
1.05
1.1
1.15
1.2
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6
VDD - Source Voltage - V
IDD - Active Current Normalized @ 3V, 25ºC
Ch 0
Ch 1
90%
95%
100%
105%
110%
0 10203040506070
Temperature - ºC
Response - Normalized to 25ºC
I
DD
voltage and temperature on active
current.
Figure 13:
Normalized I
TSL2591 − Typical Operating Characteristics
vs. VDD and Temperature
DD
White LED Response vs. Temp: Effect of
temperature on the device response for
a broadband white light source.
Figure 14:
Response to White LED vs. Temperature
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Page 13
TSL2591 − Register Description
Register Description
Figure 15:
Register Description
The device is controlled and monitored by registers accessed
through the I²C serial interface. These registers provide for a
variety of control functions and can be read to deter mine results
of the ADC conversions. The register set is summarized in
Figure 15.
Address Register Name R/W Register Function
-- COMMAND W Specifies Register Address 0x00
0x00 ENABLE R/W Enables states and interrupts 0x00
0x01 CONFIG R/W ALS gain and integration time configuration 0x00
0x04 AILTL R/W ALS interrupt low threshold low byte 0x00
0x05 AILTH R/W ALS interrupt low threshold high byte 0x00
0x06 AIHTL R/W ALS interrupt high threshold low byte 0x00
0x07 AIHTH R/W ALS interrupt high threshold high byte 0x00
0x08 NPAILTL R/W No Persist ALS interrupt low threshold low byte 0x00
0x09 NPAILTH R/W No Persist ALS interrupt low threshold high byte 0x00
0x0A NPAIHTL R/W No Persist ALS interrupt high threshold low byte 0x00
0x0B NPAIHTH R/W
No Persist ALS interrupt high threshold high
byte
Reset
Value
0x00
0x0C PERSIST R/W Interrupt persistence filter 0x00
0x11 PID R Package ID --
0x12 ID R Device ID ID
0x13 STATUS R Device status 0x00
0x14 C0DATAL R CH0 ADC low data byte 0x00
0x15 C0DATAH R CH0 ADC high data byte 0x00
0x16 C1DATAL R CH1 ADC low data byte 0x00
0x17 C1DATAH R CH1 ADC high data byte 0x00
Note(s):
2
1. Devices with a primary I
quickly read in a single block I
C address of 0x29 also have a secondary I2C address of 0x28 that can be used for read only registers to
2
C transaction.
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Page 14
TSL2591 − Register Description
Command Register
The COMMAND register specifies the address of the target
register for future read and write operations, as well as issues
special function commands.
7654321 0
CMD TRANSACTION ADDR/SF
Fields Bits Description
CMD 7
TRANSACTION 6:5
Select Command Register. Must write as 1 when addressing
COMMAND register.
Select type of transaction to follow in subsequent data transfers
FIELD VALUE DESCRIPTION
00 Reserved - Do not use
01 Normal Operation
10 Reserved – Do not use
11 Special Function – See description below
Address field/special function field. Depending on the transaction
type, see above, this field either specifies a special function
command or selects the specific control-status-data register for
subsequent read and write transactions. The field values listed
below apply only to special function commands.
FIELD VALUE DESCRIPTION
00100 Interrupt set – forces an interrupt
00110 Clears ALS interrupt
ADDR/SF 4:0
00111 Clears ALS and no persist ALS interrupt
01010 Clears no persist ALS interrupt
other Reserved – Do not write
The interrupt set special function command sets the interrupt bits
in the status register (0x13). For the interrupt to be visible on the
INT pin, one of the interrupt enable bits in the enable register
(0x00) must be asserted.
The interrupt set special function must be cleared with an interrupt
clear special function. The ALS interrupt clear special functions
clear any pending interrupt(s) and are self-clearing.
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TSL2591 − Register Description
Enable Register (0x00)
The ENABLE register is used to power the device on/off, enable
functions and interrupts.
7654321 0
NPIEN SAI Reserved AIEN Reserved AEN PON
Fields Bits Description
NPIEN 7
SAI 6
No Persist Interrupt Enable. When asserted NP Threshold
conditions will generate an interrupt, bypassing the persist filter.
Sleep after interrupt. When asserted, the device will power down at
the end of an ALS cycle if an interrupt has been generated.
Reserved 5 Reserved. Write as 0.
AIEN 4
ALS Interrupt Enable. When asserted permits ALS interrupts to be
generated, subject to the persist filter.
Reserved 3:2 Reserved. Write as 0.
AEN 1
ALS Enable. This field activates ALS function. Writing a one
activates the ALS. Writing a zero disables the ALS.
Power ON. This field activates the internal oscillator to permit the
PON 0
timers and ADC channels to operate. Writing a one activates the
oscillator. Writing a zero disables the oscillator.
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Page 16
TSL2591 − Register Description
Control Register (0x01)
The CONTROL register is used to configure the ALS gain and
integration time. In addition, a system reset is provided. Upon
power up, the CONTROL register resets to 0x00.
7654321 0
SRESET Reserved AGAIN Reserved AT IM E
Fields Bits Description
SRESET 7
System reset. When asserted, the device will reset equivalent to a
power-on reset. SRESET is self-clearing.
Reserved 6 Reserved. Write as 0.
ALS gain sets the gain of the internal integration amplifiers for both
photodiode channels.
FIELD VALUE DESCRIPTION
AGAIN 5:4
00 Low gain mode
01 Medium gain mode
10 High gain mode
11 Maximum gain mode
Reserved 3 Reserved. Write as 0.
ALS time sets the internal ADC integration time for both
photodiode channels.
FIELD VALUE INTEGRATION TIME MAX COUNT
000 100 ms 36863
ATI ME 2:0
001 200 ms 65535
010 300 ms 65535
011 400 ms 65535
100 500 ms 65535
101 600 ms 65535
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Page 17
TSL2591 − Register Description
ALS Interrupt Threshold Register (0x04 − 0x0B)
The ALS interrupt threshold registers provide the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, an
interrupt is asserted on the interrupt pin.
If the C0DATA exceeds the persist thresholds (registers: 0x04 –
0x07) for the number of persist cycles configured in the PERSIST
register an interrupt will be triggered. If the C0DATA exceeds
the no-persist thresholds (registers: 0x08 – 0x0B) an interrupt
will be triggered immediately following the end of the current
integration.
Note that while the interrupt is observable in the STATUS
register (0x13), it is visible only on the INT pin when AIEN or
NPIEN are enabled in the ENABLE register (0x00).
Upon power up, the interrupt threshold registers default to
0x00.
Register Address Bits Description
AILTL 0x04 7:0 ALS low threshold lower byte
AILTH 0x05 7:0 ALS low threshold upper byte
AIHTL 0x06 7:0 ALS high threshold lower byte
AIHTH 0x07 7:0 ALS high threshold upper byte
NPAILTL 0x08 7:0 No Persist ALS low threshold lower byte
NPAILTH 0x09 7:0 No Persist ALS low threshold upper byte
NPAIHTL 0x0A 7:0 No Persist ALS high threshold lower byte
NPAIHTH 0x0B 7:0 No Persist ALS high threshold upper byte
ams Datasheet Page 17
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Page 18
TSL2591 − Register Description
PERSIST Register (0x0C)
The Interrupt persistence filter sets the number of consecutive
out-of-range ALS cycles necessary to generate an interrupt.
Out-of-range is determined by comparing C0DATA (0x14 and
0x15) to the interrupt threshold registers (0x04 - 0x07). Note
that the no-persist ALS interrupt is not affected by the interrupt
persistence filter. Upon power up, the interrupt persistence
filter register resets to 0x00.
76543210
Reserved APERS
Field Bits Description
Reserved 7:4 Reserved. Write as 0.
ALS interrupt persistence filter
FIELD VALUE PERSISTENCE
APERS 3:0
0000 Every ALS cycle generates an interrupt
0001 Any value outside of threshold range
0010 2 consecutive values out of range
0011 3 consecutive values out of range
0100 5 consecutive values out of range
0101 10 consecutive values out of range
0110 15 consecutive values out of range
0111 20 consecutive values out of range
1000 25 consecutive values out of range
1001 30 consecutive values out of range
1010 35 consecutive values out of range
1011 40 consecutive values out of range
1100 45 consecutive values out of range
1101 50 consecutive values out of range
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1110 55 consecutive values out of range
1111 60 consecutive values out of range
Page 19
TSL2591 − Register Description
PID Register (0x11)
ID Register (0x12)
The PID register provides an identification of the devices
package. This register is a read-only register whose value never
changes.
76543210
Reserved PACKAGEID Reserved
Field Bits Description
Reserved 7:6 Reserved.
PID 5:4 Package Identification = 00
Reserved 3:0 Reserved.
The ID register provides the device identification. This register
is a read-only register whose value never changes.
76543210
ID
Field Bits Description
ID 7:0 Device Identification = 0x50
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Page 20
TSL2591 − Register Description
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
76543210
Reserved NPINTR AINT Reserved AVAL ID
Field Bits Description
Reserved 7:6 Reserved. Write at zero.
NPINTR 5
AINT 4
No-persist Interrupt. Indicates that the device has encountered a
no-persist interrupt condition.
ALS Interrupt. Indicates that the device is asserting an ALS
interrupt.
Reserved 3:1 Reserved.
AVAL ID 0
ALS Valid. Indicates that the ADC channels have completed an
integration cycle since the AEN bit was asserted.
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Page 21
TSL2591 − Register Description
ALS Data Register (0x14 - 0x17)
ALS data is stored as two 16-bit values; one for each channel.
When the lower byte of either channel is read, the upper byte
of the same channel is latched into a shadow register. The
shadow register ensures that both bytes are the result of the
same ALS integration cycle, even if additional integration cycles
occur between the lower byte and upper byte register readings.
Each channel independently operates the upper byte shadow
register. So to minimize the potential for skew between CH0
and CH1 data, it is recommended to read all four ADC bytes in
sequence.
Register Address Bits Description
C0DATAL 0x14 7:0 ALS CH0 data low byte
C0DATAH 0x15 7:0 ALS CH0 data high byte
C1DATAL 0x16 7:0 ALS CH1 data low byte
C1DATAH 0x17 7:0 ALS CH1 data high byte
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Page 22
Figure 16:
Application Information
TSL2591
Typical Application Hardware Circuit
TSL2591 − Application Information
Figure 16 shows a typical hardware application circuit. A 1-F
low-ESR decoupling capacitor should be placed as close as
possible to the V
DD
pin. V
voltage, which is equal to V
in this figure refers to the I²C bus
BUS
.
DD
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-k
resistors. A 10-k pull-up resistor (RPI) can be used for the
interrupt line.
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Page 23
TSL2591 − PCB Pad Layout
PCB Pad Layout
Suggested land pattern based on the IPC−7351B Generic
Requirements for Surface Mount Design and Land Pattern
Standard (2010) for the small outline no-lead (SON) package is
shown in Figure 17.
Figure 17:
Suggested FN Package PCB Layout (Top View)
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
ams Datasheet Page 23
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Page 24
Figure 18:
Package Drawings & Markings
FN Package – Dual Flat No-Lead Packaging Configuration
TSL2591 − Package Drawings & Markings
Note(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerence of ±75 μm.
3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
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Page 25
TSL2591 − Mechanical Data
Mechanical Data
Figure 19:
FN Package Carrier Tape and Reel Information
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing A
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481 - B.
6. In accordance with EIA Standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet Page 25
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, BO and KO are defined in ANSI EIA Standard 481-B 2001.
O
Page 26
TSL2591 − Soldering Information
Soldering Information
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (s)
Temperature (5C)
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 20:
Solder Reflow Profile
Parameter Reference Device
Average temperature gradient in preheating 2.5 ºC/s
Soak time
Time above 217 ºC (T
Time above 230 ºC (T
Time above T
peak
)t
1
)t
2
- 10 ºC (T3)t
Peak temperature in reflow
t
T
soak
1
2
3
peak
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260 ºC
Temperature gradient in cooling Max -5 ºC/s
Figure 21:
Solder Reflow Profile Graph
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Page 27
TSL2591 − Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The FN package has been assigned a moisture sensitivity level
of MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
ams Datasheet Page 27
[v2-04] 2018-Jun-05 Document Feedback
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
Page 28
TSL2591 − Ordering & Contact Information
Ordering & Contact Information
Figure 22:
Ordering Information
Ordering Code Address Interface Delivery Form
TSL25911FN 0x29
TSL25913FN 0x29
I²C V
I²C V
Buy our products or get free samples online at:
www.ams.com/Product
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/Contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
= VDD Interface
bus
= 1.8V
bus
ODFN-6
ODFN-6
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 28 ams Datasheet
Document Feedback [v2-04] 2018-Jun-05
Page 29
TSL2591 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet Page 29
[v2-04] 2018-Jun-05 Document Feedback
Page 30
TSL2591 − Copy rights & Dis claimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 30 ams Datasheet
Document Feedback [v2-04] 2018-Jun-05
Page 31
TSL2591 − Document Status
Document Status
Document Status Product Status Definition
Information in this datasheet is based on product ideas in
Product Preview Pre-Development
Preliminary Datasheet Pre-Production
Datasheet Production
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet Page 31
[v2-04] 2018-Jun-05 Document Feedback
Page 32
TSL2591 − Revision Information
Revision Information
Changes from 2-03 (2018-Apr-30) to current revision 2-04 (2018-Jun-05) Page
Updated Figure 5 5
Updated text under Electrical Characteristics 6
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 32 ams Datasheet
Document Feedback [v2-04] 2018-Jun-05
Page 33
TSL2591 − Content Guide
Content Guide
1 General Description
2 Block Diagram
3 Detailed Description
4 Pin Assignment
5Absolute Maximum Ratings
6 Electrical Characteristics
9 Timing Characteristics
10 Timing Diagrams
11 Typical Operating Characteristics
13 Register Description
14 Command Register
15 Enable Register (0x00)
16 Control Register (0x01)
17 ALS Interrupt Threshold Register (0x04 − 0x0B)
18 PERSIST Register (0x0C)
19 PID Register (0x11)
19 ID Register (0x12)
20 Status Register (0x13)
21 ALS Data Register (0x14 - 0x17)
22 Application Information
23 PCB Pad Layout
24 Package Drawings & Markings
25 Mechanical Data
26 Soldering Information
27 Storage Information
27 Moisture Sensitivity
27 Shelf Life
27 Floor Life
27 Rebaking Instructions
28 Ordering & Contact Information
29 RoHS Compliant & ams Green Statement
30 Copyrights & Disclaimer
31 Document Status
32 Revision Information
ams Datasheet Page 33
[v2-04] 2018-Jun-05 Document Feedback
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