Product Specification
Part Name: OEL Display Module
Part ID: UG-2832HSWEG02
Doc No.: SAS1-B026-B
Customer:
Approved by
From: Univision Technology Inc.
Approved by
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc..
8, Kebei RD 2, Science Park, Chu-Nan, Taiwan 350, R.O.C.
Notes:
1. Please contact Univision Technology Inc. before assigning your product based on this
module specification
2. The information contained herein is presented merely to indicate the characteristics and
performance of our products. No responsibility is assumed by Univision Technology
Inc. for any intellectual property claims or other problems that may result from
application based on the module described herein.
RReevviisseedd HHiissttoorryy
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
Doc. No: SAS1-B026-B
.
Part Number Revision Revision Content Revised on
UG-2832HSWEG02 A New September 1, 2009
Page 1 SSeeccttiioonn 11..33
Update Memory Mapping
Page 6 SSeeccttiioonn 22
Update Absolute Maximum Ratings
Integrate Lifetime Characteristics with
Absolute Maximum Ratings
Page 7 SSeeccttiioonn 33..11 && 33..22
UG-2832HSWEG02 B
Modify Optics Characteristics Description
Modify C.I.E.
(0.32±0.04, 0.33±0.04)Î(0.29±0.04, 0.31±0.04)
Update DC Characteristics
July 20, 2010
Page 8 SSeeccttiioonn 33..33
Revise AC Characteristics
Page 11 SSeeccttiioonn 55..11
Update Reliability Test Conditions
i
NNoottiiccee::
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
Doc. No: SAS1-B026-B
.
No part of this material may be reproduces or duplicated in any form or by any means
without the written permission of Univision Technology Inc. Univision Technology Inc.
reserves the right to make changes to this material without notice. Univision Technology
Inc. does not assume any liability of any kind arising out of any inaccuracies contained in this
material or due to its application or use in any product or circuit and, further, there is no
representation that this material is applicable to products requiring high level reliability, such
as, medical products. Moreover, no license to any intellectual property rights is granted by
implication or otherwise, and there is no representation or warranty that anything made in
accordance with this material will be free from any patent or copyright infringement of a
third party. This material or portions thereof may contain technology or the subject relating
to strategic products under the control of Foreign Exchange and Foreign Trade Law of
Taiwan and may require an export license from the Ministry of International Trade and
Industry or other approval from another government agency.
© Univision Technology Inc. 2010, All rights reserved.
All other product names mentioned herein are trademarks and/or registered trademarks of
their respective companies.
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
Contents
Contents
RReevviissiioonn HHiissttoorry
NNoottiicce
e...................................................................................................................ii
CCoonntteenntts
11.. BBaassiicc SSppeecciiffiiccaattiio
1.1 Display Specifications .................................................................................................1
1.2 Mechanical Specifications...........................................................................................1
1.3 Active Area / Memory Mapping & Pixel Construction...............................................1
1.4 Mechanical Drawing....................................................................................................2
1.5 Pin Definition...............................................................................................................3
1.6 Block Diagram.............................................................................................................4
22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggs
33.. OOppttiiccss && EElleeccttrriiccaall C
3.1 Optics Characteristics ..................................................................................................7
3.2 DC Characteristics.......................................................................................................7
3.3 AC Characteristics.......................................................................................................8
y................................................................................................... i
s..............................................................................................................iii
onnss ..................................................................................1~5
1.6.1 VCC Supplied Externally....................................................................................4
1.6.2 VCC Generated by Internal DC/DC Circuit........................................................5
s.......................................................................... 6
Chhaarraacctteerriissttiiccss........................................................................
Doc. No: SAS1-B026-B
.
..............................................77~~88
44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioon
4.1 Commands ...................................................................................................................9
4.2 Power down and Power up Sequence..........................................................................9
4.2.1 Power up Sequence............................................................................................9
4.2.2 Power down Sequence.......................................................................................9
4.3 Reset Circuit.................................................................................................................9
4.4 Actual Application Example......................................................................................10
55.. RReelliiaabbiilliitty
5.1 Contents of Reliability Tests......................................................................................11
5.2 Failure Check Standard..............................................................................................11
y.......................................................................................................11
66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonns
6.1 Environment Required...............................................................................................12
6.2 Sampling Plan............................................................................................................12
6.3 Criteria & Acceptab le Quality Level .........................................................................12
6.3.1 Cosmetic Check (Display Off) in Non-Active Area........................................12
6.3.2 Cosmetic Check (Display Off) in Active Area.................................................15
6.3.3 Pattern Check (Display On) in Active Area.....................................................16
77.. PPaacckkaaggee SSppeecciiffiiccaattiioonns
n .........................................................................9~10
s..............................................12~16
s ................................................................................ 17
88.. PPrreeccaauuttiioonnss WWhheenn UUssiinngg TThheessee OOEELL DDiissppllaayy MMoodduullees
8.1 Handling Precautions.................................................................................................18
8.2 Storage Precautions....................................................................................................19
8.3 Designing Precautions ...............................................................................................19
s.......................18~20
iii
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
8.4 Precautions when disposing of the OEL display modules.........................................20
Doc. No: SAS1-B026-B
.
8.5 Other Precautions.......................................................................................................20
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
11.. BBaassiicc SSppeecciiffiiccaattiioonnss
1.1 Display Specifications
1) Display Mode: Passive Matrix
2) Display Color: Monochrome (White)
3) Drive Duty: 1/32 Duty
1.2 Mechanical Specifications
1) Outline Drawing: According to the annexed outline drawing
2) Number of Pixels: 128 × 32
3) Panel Size: 30.0 × 11.50 × 1.45 (mm)
4) Active Area: 22.384 × 5.584 (mm)
5) Pixel Pitch: 0.175 × 0.175 (mm)
6) Pixel Size: 0.159 × 0.159 (mm)
7) Weight: 1.05 (g)
1.3 Active Area / Memory Mapping & Pixel Construction
Doc. No: SAS1-B026-B
.
(0, 0)
P0.175x32-0.016=5.584
P0.175x128-0.016=22.384
"A"
Segment 127
( Column 1 )
Driver IC Memory Mapping
x 32 in 128 x 64)
(128
Segment 0
( Column 128 )
Common 0
( Row 32 )
Common 31
( Row 1 )
(127, 31)
0.175
0.159
0.175
0.159
Detail "A"
Scale (10:1)
1
1.4 Mechanical Drawing
Remark
Original Drawing
DateItem
20090831
A
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
C1P
C2P
C2N
Symbol
3
2
1
Pin
( Row 1 )
( Row 32 )
Common 31
Common 0
Segment 0
( Column 128 )
P0.175x128-0.016=22.384
"A"
( Column 1 )
Segment 127
0.175
0.159
P0.175x32-0.016=5.584
0.159
0.175
Doc. No: SAS1-B026-B
.
A
Rev.
VSS
C1N
4
SCL
VCC
SDA
VDD
IREF
RES#
VBAT
VBREF
5
6
Detail "A"
7
8
Scale (10:1)
9
11
101214
VCOMH
13
Material
Drawing Number
DMX2832SDGF26
Size
Sheet
Soda Lime / Polyimide
Scale
P.M.
Cherry Lin
Ivy Lo
Panel / E.E.E.
x 32, Monochrome, COG Package
Ting-Kuo Hu
Drawn
Pixel Number: 128
UG-2832HSWEG02 Folding Type OEL Display Modu l e
Univision Technology Inc.
Humphrey Lin
By
Title
A3
1 of 1
1:1
20090831
20090831
20090831
20090831
Date
±1
mm
(2.4)
9±0.2
P0.62x(14-1)=8.06±0.05
2±0.3
1
4
6.799
6.1±0.2
10.5±0.3
W=0.32±0.03
0.1±0.03
SDA
VCOMH
VCC
IREF
14
RES#
SCL
VDD
6.2±0.1
C2P
C1P
VSS
VBAT
VBREF
C2N
C1N
1
2-R0.4±0.1
(2.01)
0.1±0.03
Contact Side
Unless Otherwise Specified
(1.6)
Contact Side
Signature
±0.3
Tolerance
Unit
Angle
Dimension
General Roughness
Customer Approval
510
8
8.4x8x0.05mm
(40.5)
Protective Tape
Glue
Remove Tape
t=0.15mm Max
(1.6)(22.81)
(31.6)
30±0.2 (Panel Size)
22.384 (A/A)
24.384 (V/A)
25.9 (Polarizer)
26.6±0.2 (Cap Size)
(2.1)
(2.1)
(1.1)
(1.1)
0.35±0.3
0.5±0.5
x 32 Pixels
128
Active Area 0.91"
5.584 (A/A)
7.584 (V/A)
8.8 (Polarizer)
11.5±0.2 (Cap Size)
11.5±0.2 (Panel Size)
1.45±0.1
Polarizer
t=0.2mm
(Reference Mechnical Design)
Notes:
2. Driver IC: SSD1306
1. Color: White
The actual assembled total thickness with above materials should be 1.80 Max.
4. Interface: I2C
3. FPC Number: UT-0206-P02
5. General Tolerance: ±0.30
6. The total thickness (1.55 Max) is without polarizer protective film & remove tape.
The drawing contained herein is the exclusive property of Univision. It is not allowed to copy, reproduce and or disclose in any formats without permission of Univision.
2
b
n
t
r
d
r
d
t
1.5 Pin Definition
Pin Number Symbol Type Function
PPoowweerr SSuuppppllyy
8 VDD P
7 VSS P
14 VCC P
DDrriivveerr
12 IREF I
13 VCOMH O
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
Doc. No: SAS1-B026-B
.
PPoowweerr SSuuppppllyy ffoorr LLooggiicc
This is a voltage supply pin. It must be connected to
external source.
GGrroouunndd ooff OOEELL SSyysstteemm
This is a ground pin. It also acts as a reference for the
logic pins, the OEL driving voltages, and the analog
circuits. It must be connected to external ground.
PPoowweerr SSuuppppllyy ffoorr OOEELL PPaanneell
This is the most positive voltage supply pin of the chip.
A stabilization capacitor should be connected
this pin and VSS when the converter is used. It must be
connected to external source when the converter is no
used.
etwee
CCuurrrreenntt RReeffeerreennccee ffoorr BBrriigghhttnneessss AAddjjuussttmmeenntt
This pin is segment current reference pin. A resisto
should be connected between this pin and VSS. Set the
current lower than 12.5μA.
VVoollttaaggee OOuuttppuutt HHiigghh LLeevveell ffoorr CCOOMM SSiiggnnaal
This pin is the input pin for the voltage output high level
for COM signals. A capacitor should be connecte
between this pin and VSS.
l
DDCC//DDCC CCoonnvveerrtteerr
5 VBAT P
6 VBREF P
3 / 4
1 / 2
IInntteerrffaaccee
C1P / C1N
C2P / C2N
I
9 RES# I
10 SCL I
11 SDA I/O
PPoowweerr SSuuppppllyy ffoorr DDCC//DDCC CCoonnvveerrtteerr CCiirrccuuiitt
This is the power supply pin for the internal buffer of the
DC/DC voltage converter. It must be connected to
external source when the converter is used. It should be
connected to VDD when the converter is not used.
VVoollttaaggee RReeffeerreennccee ffoorr DDCC//DDCC CCoonnvveerrtteerr CCiirrccuuiitt
This pin is the internal voltage reference of booste
circuit. A stabilization capacitor could be connecte
between this pin and VSS.
PPoossiittiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg IInnvveerrttiinngg CCaappaacciittoor
NNeeggaattiivvee TTeerrmmiinnaall ooff tthhee FFllyyiinngg BBoooosstt CCaappaacciittoorr
The charge-pump capacitors are required between the
terminals. They must be floated when the converter is
not used.
PPoowweerr RReesseett ffoorr CCoonnttrroolllleerr aanndd DDrriivveerr
This pin is reset signal input. When the pin is low,
initialization of the chip is executed.
II22CC BBuuss CClloocckk SSiiggnnaall
The transmission if information in the I2C bus is
following a clock signal. Each transmission of data bi
is taken place during a single clock period of this pin.
II22CC BBuuss DDaattaa SSiiggnnaall
This pin acts as a communication channel between the
transmitter and the receiver.
r
3
1.6 Block Diagram
1.6.1 VCC Supplied Externally
Pins connected to MCU interface: RES#, SCL, and SDA
C1: 1μF
C2: 2.2μF
C3: 4.7μF / 16V, X7R
R1: 390kΩ, R1 = (Voltage at IREF – VSS) / IREF
R2, R3: 2kΩ
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
Active Area 0.91"
128
C2P
x 32 Pixels
Segment 127
VBAT
VBREF
C1P
C1N
C2N
~~~ ~
SSD1306
VDD
VSS
RES#
SCL
R2
R3
C1
Doc. No: SAS1-B026-B
.
Common 0
Segment 0
VCOMH
SDA
IREF
R1
C3
C2
Common 31
VCC
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
1.6.2 VCC Generated by Internal DC/DC Circuit
Doc. No: SAS1-B026-B
.
Active Area 0.91"
128
C2N
C2P
C6
Pins connected to MCU interface: RES#, SCL, and SDA
C1, C2, C5, C6: 1μF
C3: 2.2μF
C4: 4.7μF / 16V, X7R
R1: 390kΩ, R1 = (Voltage at IREF – VSS) / IREF
R2, R3: 2kΩ
x 32 Pixels
Segment 127
VBAT
C1N
C1P
C5
~~~ ~
SSD1306
VDD
VSS
VBREF
C2 C1
RES#
R2
R3
SCL
Common 0
Segment 0
SDA
R1
Common 31
VCC
VCOMH
IREF
C4
C3
5
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
22.. AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss
Doc. No: SAS1-B026-B
.
Parameter Symbol Min Max Unit Notes
Supply Voltage for Logic V
Supply Voltage for Display V
Supply Voltage for DC/DC V
Operating Temperature T
Storage Temperature T
DD
CC
BAT
OP
STG
-0.3 4 V 1, 2
0 11 V 1, 2
-0.3 5 V 1, 2
-40 70
-40 80
°C
°C
Life Time (120 cd/m2) 10,000 - hour 3
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings,
permanent breakage of the module may occur. Also, for normal operations, it is
desirable to use this module under the conditions according to Section 3.
“Optics & Electrical Characteristics”. If this module is used beyond these
conditions, malfunctioning of the module can occur and the reliability of the
module may deteriorate.
Note 3: VCC = 7.25V, Ta = 25°C, 50% Checkerboard.
Software configuration follows Section 4.4 Initialization.
End of lifetime is specified as 50% of initial brightness reached. The average
operating lifetime at room temperature is estimated by the accelerated operation
at high temperature conditions.
-
-
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33.. OOppttiiccss && EElleeccttrriiccaall CChhaarraacctteerriissttiiccss
3.1 Optics Characteristics
Characteristics Symbol Conditions Min Typ Max Unit
Brightness L
C.I.E. (White)
br
(x)
(y)
Dark Room Contrast CR -
V iew Angle >160 - -
* Optical measurement taken at VDD = 2.8V, VCC = 7.25V.
Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics
Characteristics
Supply Voltage for Logic V
Supply Voltage for Display
(Supplied Externally)
Supply Voltage for DC/DC V
Supply Voltage for Display
(Generated by Internal DC/DC)
High Level Input V
Low Level Input V
High Level Output V
Low Level Output V
Operating Current for V
Operating Current for V
(VCC Supplied Externally)
Symbol Conditions Min Typ Max Unit
DD
V
CC
BAT
V
CC
IH
IL
OH
OL
DD
CC
I
DD
I
CC
Doc. No: SAS1-B026-B
.
Note 4 120 150 - cd/m
C.I.E. 1931
0.25
0.27
- 1.65 2.8 3.3 V
Note 4 7 7.25 7.5 V
Internal DC/DC Enable
3.3 - 4.2 V
Note 4 7 - 7.5 V
-
0.8×V
-
I
= 100μA, 3.3MHz
OUT
I
= 100μA, 3.3MHz
OUT
0.9×V
- - 180 300
Note 5 - 4.3 5.4 mA
Note 6 - 6.8 8.5 mA
0.29
0.31
>2000:1
- V
DD
0 -
DD
0 -
0.2×V
- V
0.1×V
0.33
0.35
-
degree
DD
DD
V
V
V
V
DD
DD
μA
2
Operating Current for V
BAT
(VCC Generated by Internal DC/DC)
Sleep Mode Current for V
Sleep Mode Current for V
DD IDD, SLEEP
CCICC, SLEEP
I
BAT
Note 5 - 14.0 17.5 mA
Note 6 - 21.7 27.1 mA
-
-
-
-
1 5
2 10
μA
μA
Note 4: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the
change of the panel characteristics and the customer’s request.
Note 5: VDD = 2.8V, VCC = 7.25V, 50% Display Area Turn on.
Note 6: VDD = 2.8V, VCC = 7.25V, 100% Display Area Turn on.
* Software configuration follows Section 4.4 Initialization.
7
3.3 AC Characteristics
Symbol Description Min Max Unit
t
cycle
t
HSTART
t
HD
t
SD
t
SSTART
t
SSTOP
t
R
t
F
t
IDLE
* (VDD - VSS = 2.8V, Ta = 25°C)
Doc. No: SAS1-B026-B
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
.
Clock Cycle Time 2.5 - us
Start Condition Hold Time 0.6 - us
Data Hold Time (for “SDA
” Pin) 0
OUT
- ns
Data Hold Time (for “SDAIN” Pin) 300
Data Setup Time 100 - ns
Start Condition Setup Time
(Only relevant for a repeated Start
0.6 - us
condition)
Stop Condition Setup Time 0.6 - us
Rise Time for Data and Clock Pin 300 ns
Fall Time for Data and Clock Pin 300 ns
Idle Time before a New Transmission can
Start
1.3 - us
8
V
V
CCC
C
V
p
V
CCC
C
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
44.. FFuunnccttiioonnaall SSppeecciiffiiccaattiioonn
4.1. Commands
Refer to the Technical Manual for the SSD1306
4.2 Power down and Power up Sequence
To protect OEL panel and extend the panel life time, the driver IC power up/down
routine should include a delay period between high voltage and low voltage power
sources during turn on/off. It gives the OEL panel enough time to complete the
action of charge and discharge before/after the operation.
4.2.1 Power up Sequence:
1. Power up V
DD
2. Send Display off command
3. Initialization
4. Clear Screen
5. Power up V
CC
6. Delay 100ms
(When VCC is stable)
7. Send Display on command
4.2.2 Power down Sequence:
1. Send Display off command
2. Power down V
CC
3. Delay 100ms
(When VCC is reach 0 and panel
is completely discharges)
4. Power down V
DD
4.3 Reset Circuit
V
CC
V
DD
VSS/Ground
V
CC
V
DD
VSS/Ground
Doc. No: SAS1-B026-B
.
V
oonn
D
DDD
V
oonn
sppllaayy oonn
DDiis
s
pllaayy ooffff
DDiis
V
offff
o
V
ooffff
D
DDD
When RES# input is low, the chip is initialized with the following status:
1. Display is OFF
2. 128×64 Display Mode
3. Normal segment and display data column and row address mapping (SEG0
mapped to column address 00h and COM0 mapped to row address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9. Normal display mode (Equivalent to A4h command)
9
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
4.4 Actual Application Example
Command usage and explanation of an actual example
<Initialization>
Set Display Off
0xAE
Set Display Clock Divide Ratio/Oscillator Frequency
0xD5, 0x80
Set Multiplex Ratio
0xA8, 0x1F
Set Segment Re-Map
0xA1
Set COM Output Scan Direction
0xC8
Set COM Pins Hardware Configuration
0xDA, 0x02
Doc. No: SAS1-B026-B
.
Set Entire Display On/Off
0xA4
Set Normal/Inverse Display
0xA6
Clear Screen
Set Display Offset
0xD3, 0x00
Set Display Start Line
0x40
* Set Charge Pump
0x8D, 0x10
(1)
/ 0x14
(2)
Set Contrast Control
0x81, 0x8F
* Set Pre-Charge Period
0xD9, 0x22
Set VCOMH Deselect Level
(1)
/ 0xF1
0xDB, 0x40
(2)
Set Display On
0xAF
* Written Value for Parameters
(1)
Î VCC Supplied Externally
(2)
Î VCC Generated by Internal DC/DC Circuit
If the noise is accidentally occurred at the displaying window during the operation,
please reset the display in order to recover the display function.
10
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
55.. RReelliiaabbiilliittyy
5.1 Contents of Reliability Tests
High Temperature Operation
Low Temperature Operation
High Temperature Storage
Low Temperature Storage
High Temperature/Humidity Operation
Thermal Shock
* The samples used for the above tests do not include polarizer.
* No moisture condensation is observed during tests.
5.2 Failure Check Standard
Item Conditions Criteria
Doc. No: SAS1-B026-B
.
70°C, 240 hrs
-40°C, 240 hrs
80°C, 240 hrs
-40°C, 240 hrs
60°C, 90% RH, 120 hrs
-40°C ⇔ 85°C, 24 cycles
60 mins dwell
The operational
functions work.
After the completion of the described reliability test, the samples were left at room
temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.
11
UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
66.. OOuuttggooiinngg QQuuaalliittyy CCoonnttrrooll SSppeecciiffiiccaattiioonnss
6.1 Environment Required
Customer’s test & measurement are required to be conducted under the following
conditions:
Temperature: 23 ± 5°C
Humidity: 55 ± 15 %RH
Fluorescent Lamp: 30W
Distance between the Panel & Lamp: ≥ 50 cm
Distance between the Panel & Eyes of the Inspector: ≥ 30 cm
Finger glove (or finger cover) must be worn by the inspector.
Inspection table or jig must be anti-electrostatic.
6.2 Sampling Plan
Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level
Doc. No: SAS1-B026-B
.
Partition AQL Definition
Major 0.65 Defects in Pattern Check (Display On)
Minor 1.0 Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area
Check Item
Classification
Criteria
X > 6 mm (Along with Edge)
Y > 1 mm (Perpendicular to edge)
X
Panel
General Chipping
Minor
Y
X
Y
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued)
Check Item
Classification
Doc. No: SAS1-B026-B
.
Criteria
Any crack is not allowable.
Panel Crack Minor
Cupper Exposed
(Even Pin or Film)
Minor
Not Allowable by Naked Eye
Inspection
Film or Trace Damage Minor
Terminal Lead Twist Minor
Terminal Lead Broken Minor
Not Allowable
Not Allowable
Terminal Lead Prober
Mark
Acceptable
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued)
Check Item
Classification
Doc. No: SAS1-B026-B
.
Criteria
NG if any bent lead cause lead
shorting.
Minor
Terminal Lead Bent
(Not Twist or Broken)
NG for horizontally bent lead more
than 50% of its width.
Minor
Glue or Contamination
on Pin
(Couldn’t Be Removed
Minor
by Alcohol)
Ink Marking on Back
Side of panel
Acceptable Ignore for Any
(Exclude on Film)
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
6.3.2 Cosmetic Check (Display Off) in Active Area
Check Item
Any Dirt & Scratch on
Polarizer’s Protective Film
Classification
Acceptable
Scratches, Fiber, Line-Shape
Defect
Minor
(On Polarizer)
Dirt, Black Spot, Foreign
Material,
Minor
(On Polarizer)
Doc. No: SAS1-B026-B
.
Criteria
Ignore for not Affect the
Polarizer
W ≤ 0.1 Ignore
W > 0.1, L ≤ 2 n ≤ 1
L > 2 n = 0
Φ ≤ 0.1 Ignore
0.1 <Φ ≤ 0.25 n ≤ 1
0.25 <Φ n = 0
Φ ≤ 0.5
Î Ignore if no Influence on
Display
0.5 < Φ n = 0
Dent, Bubbles, White spot
(Any Transparent Spot on
Minor
Polarizer)
Fingerprint, Flow Mark
(On Polarizer)
Minor Not Allowable
* Protective film should not be tear off when cosmetic check.
** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2
L
: Minor Axis
W
a: Major Axis
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6.3.3 Pattern Check (Display On) in Active Area
Check Item
Classification
Doc. No: SAS1-B026-B
.
Criteria
No Display Major
Flicker Major Not Allowable
Missing Line Major
Pixel Short Major
Darker Pixel Major
Wrong Display Major
Un-uniform Major
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
77.. PPaacckkaaggee SSppeecciiffiiccaattiioonns
EPE COVER FOAM 351x212x1,
ANTISTATIC x 1 Pcs
Module
Tray 420x285 T=0.8mm
s
x 1 pcs (Empty)
x s 15 pc
A
Staggered Stacking
Exsiccator x 2 pc s
Wra d with adhesive tape
ppe
x cs
16 p
B
Vacuum packing bag
EPE PROTECTTIVE
370mm x 280mm x 20mm
EPE PROTECTTIVE
Doc. No: SAS1-B026-B
.
cs Tray Vacuum packing
16 P
B
Brimary Box 4 SET
Primary Box C SET
CARTON BOX
Label
Primary L450mm x W296 x H110, B wave
x 4Pcs
Label
C
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Univision Technology Inc.
Part ID :
Lot ID :
Q'ty :
QC :
Item Quantity
Holding Trays (A) 15 per Primary Box
T otal Trays (B) 16 per Primary Box (Including 1 Empty Tray)
Primary Box (C) 1~4 per Carton (4 as Major / Maximum)
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
88.. PPrreeccaauuttiioonnss WWhheenn UUssiinngg TThheessee OOEELL DDiissppllaayy MMoodduullees
8.1 Handling Precautions
1) Since the display panel is being made of glass, do not apply mechanical
impacts such us dropping from a high position.
2) If the display panel is broken by some accident and the internal organic
substance leaks out, be careful not to inhale nor lick the organic substance.
3) If pressure is applied to the display surface or its neighborhood of the OEL
display module, the cell structure may be damaged and be careful not to apply
pressure to these sections.
4) The polarizer covering the surface of the OEL di splay module is soft and easily
scratched. Please be careful when handling the OEL display module.
5) When the surface of the polarizer of the OEL display module has soil, clean the
surface. It takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth
containing solvent such as ethyl alcohol, since the surface of the polarizer will
become cloudy.
Also, pay attention that the following liquid and solvent may spoil the
polarizer:
* Water
* Ketone
* Aromatic Solvents
6) Hold OEL display module very carefully when placing OEL display module
into the system housing. Do not apply excessive stress or pressure to OEL
display module. And, do not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient
rigidity for the outer cases.
Doc. No: SAS1-B026-B
.
s
7) Do not apply stress to the LSI chips and the surrounding molded sections.
8) Do not disassemble nor modify the OEL display module.
9) Do not apply input signals while the logic power is off.
10) Pay sufficient attention to the working environments when handing OEL
display modules to prevent occurrence of element breakage accidents by static
electricity.
* Be sure to make human body grounding when handling OEL display
modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work
under dry environments.
* Protective film is being applied to the surface of the display panel of the OEL
display module. Be careful since static electricity may be generated when
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UUnniivviissiioonn TTeecchhnnoollooggyy IInncc.
exfoliating the protective film.
11) Protection film is being applied to the surface of the display panel and removes
the protection film before assembling it. At this time, if the OEL display
module has been stored for a long period of time, residue adhesive material of
the protection film may remain on the surface of the display panel after
removed of the film. In such case, remove the residue material by the method
introduced in the above Section 5).
12) If electric current is applied when the OEL display module is being dewed or
when it is placed under high humidity environments, the electrodes may be
corroded and be careful to avoid the above.
8.2 Storage Precautions
1) When storing OEL display modules, put them in static electricity preventive
bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc.
and, also, avoiding high temperature and high humidity environments or low
temperature (less than 0°C) environments. (We recommend you to store these
modules in the packaged state when they were shipped from Univision
Technology Inc.)
At that time, be careful not to let water drops adhere to the packages or bags nor
let dewing occur with them.
2) If electric current is applied when water drops are adhering to the surface of the
OEL display module, when the OEL display module is being dewed or when it
is placed under high humidity environments, the electrodes may be corroded
and be careful about the above.
8.3 Designing Precautions
Doc. No: SAS1-B026-B
.
1) The absolute maximum ratings are the ratings which cannot be exceeded for
OEL display module, and if these values are exceeded, panel damage may be
happen.
2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the
VIL and VIH specifications and, at the same time, to make the signal line cable
as short as possible.
3) We recommend you to install excess current preventive unit (fuses, etc.) to the
power circuit (VDD). (Recommend value: 0.5A)
4) Pay sufficient attention to avoid occurrence of mutual noise interference with
the neighboring devices.
5) As for EMI, take necessary measures on the equipment side basically.
6) When fastening the OEL display module, fasten the external plastic housing
section.
7) If power supply to the OEL display module is forcibly shut down by such errors
as taking out the main battery while the OEL display panel is in operation, we
cannot guarantee the quality of this OEL display module.
8) The electric potential to be connected to the rear face of the IC chip should be
as follows: SSD1306
* Connection (contact) to any other potential than the above may lead to
rupture of the IC.
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Doc. No: SAS1-B026-B
.
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8.4 Precautions when disposing of the OEL display modules
1) Request the qualified companies to handle industrial wastes when disposing of
the OEL display modules. Or, when burning them, be sure to observe the
environmental and hygienic laws and regulations.
8.5 Other Precautions
1) When an OEL display module is operated for a long of time with fixed pattern
may remain as an after image or slight contrast deviation may occur.
Nonetheless, if the operation is interrupted and left unused for a while, normal
state can be restored. Also, there will be no problem in the reliability of the
module.
2) To protect OEL display modules from performance drops by static electricity
rapture, etc., do not touch the following sections whenever possible while
handling the OEL display modules.
* Pins and electrodes
* Pattern layouts such as the FPC
3) With this OEL display module, the OEL driver is being exposed. Generally
speaking, semiconductor elements change their characteristics when light is
radiated according to the principle of the solar battery. Consequently, if this
OEL driver is exposed to light, malfunctioning may occur.
* Design the product and installation method so that the OEL driver may be
shielded from light in actual usage.
* Design the product and installation method so that the OEL driver may be
shielded from light during the inspection processes.
4) Although this OEL display module stores the operation state data by the
commands and the indication data, when excessive external noise, etc. enters
into the module, the internal status may be changed. It therefore is necessary
to take appropriate measures to suppress noise generation or to protect from
influences of noise on the system design.
5) We recommend you to construct its software to make periodical refreshment of
the operation statuses (re-setting of the commands and re-transference of the
display data) to cope with catastrophic noise.
Doc. No: SAS1-B026-B
.
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