Acnodes FES 2236 User Manual

FES2236

User Manual

FES2236: Fanless Embedded System Atom D2550
Dual Core 1.86GHz Processor

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

Fanless Embedded System

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

Copyright

This publi cati on c ontains inform ation that is prot ected by copyright. N o part of it m ay be reproduced i n
any form or by any m eans or used to make any transform ation/adaptation without the prior written
permission from the copyr ight holde rs. The manufacturer reserves the right to revise this publication and
m ake changes to its contents at any time, w ithout obl igation to noti fy any person or entity of such
revisions or changes.

©201 3. Al l Rights Reserved.

Trademarks

Al l tradem arks and registered trademarks of products appearing in this m anual are the properties of their
respective holders.

Notice:

1. The chan ges o r modifica tion s n ot expressly a ppro ved by th e p arty r espo nsible fo r compliance cou ld void th e user ’s auth ority

to op erate t he eq uipment .

2. Shielded int erfa ce ca bles must be used in or de r to comply wit h t he emission limits.

Static Electricity Precautions

It is quite easy to inadvertently dam age the system board, c omponents or devices e ven before i nstal ling
them i n your system unit. Static electri cal discharg e can dam age computer com ponents wi thout causing
any signs of physi cal dam age . You must take extra care in handl ing them to ensure against el ectrostatic
bui ld up.

1. To prevent electrostatic bui ld up, le ave the system board i n i ts anti-static bag unti l you are ready to install
it.

2. Wear an antistatic wrist st rap.

3. Do all preparation w ork on a stati c-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contac ts or
connections.

5. Avoi d touching the pins or contacting all m odul es and connectors. Hold modules or connectors by the ir
ends.

Impo rt ant:
Elect rost atic d ischa rge (ESD) can damage you r p rocessor, disk dr ive an d ot her compo nents. Perform t he up grade instru ct ion
pr ocedures describ ed at an ESD wor kstation on ly. If such a sta tion is no t availab le, yo u can provide some ESD protection by
wear in g a n ant istatic wrist st rap and attaching it to a met al part of the system chassis. If a wr ist strap is una vailab le, es tab lish
an d maintain contact with the syst em chassis th roug hout any p rocedures req uiring ESD protection .

FES2236

Safety Measures

Fanless Embedded System

To avoid dam age to the system :

• Use the correct A C input vol tage range to reduce the risk of ele ctric shock.

• Unplug the power cord before rem oving the system chassis cover for install ati on or servi cing. After

instal lation or servicing, cover the system chassis bef ore plugging the power cord.

Batte ry:

• Dange r of expl osion if battery incorrectly replaced.

• Repl ac e only w ith the same or e quival ent type re com mend by the manufacture r.

• Dispose of used batteries according to l ocal ordinance.

Warranty

1. Warranty does not cover dam ages or fai lures caused by m isuse of the product, inabili ty to use the

product, unauthorized replacem ent or any kind of alterations of components and product
specif ications.

2. The warranty i s voided if the product has been exposed to physi cal abuse , improper instal lation, a ny

kind of modific ation, acc idents or unauthorized repair of the product.

3. Unl ess otherwise instructed in this user m anual, the user m ay not, under any ci rcum stances, attem pt to

perform servi ce , adjustm ents or repairs on the product him se lf, whether the product is sti ll covered by
warranty or not. It must be returned to the place i t was purchased at, the fa ctory or an authorized
se rvic e agency for any re pai r work.

4. We w il l not be l iabl e for any indi re ct, spe cial, incidental or conseque nt damages to the product that has

be en m odif ied or alte red.

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

FES2236

Copyright .................................................................................................................. 2

Trade marks ............................................................................................................... 2

Stati c Electrici ty P recautions .................................................................................... 2

Safety Me asures ....................................................................................................... 3

Warranty ................................................................................................................... 3

Chapter 1: Introduction

1-1 O verview .............................................................................................................. 5

1-2 P roduct Specification........................................................................................... 6

1-3 System Block Di agram ....................................................................................... .. 8

1-4 Me chanical Diagram ........................................................................................... 9

1-5 Front & Rear I/O ………........................................................................................... 10

Chapter 2: Pin D efinition & Jumper Se ttings
2-1 2 236U Fr ont panel P in Defi ni ti on……………….…………………………………………………… 11
2-2 2 236U Rear panel Pin Definition……… ……………………………………… ……………………… 13
2-3 Internal P in Defi niti on & Jum per Settings…………………………………………….…………. 16
2-4 MIO Board P in Definition & Jumper Settings…………………………………………………… 26
Chapter 3: BIOS Setup Menu

3-1 BIOS Configuration O verview ………………………………………… ………………………………. 30
3-2 Entering BIO S Setup……… …………………………………………………… …………………………… 30
3-3 Advanced BIOS Fe atures…………………………… ……………………………………………………. 33
3-4 O ther BIO S Settings ……..……………… …………………………………………………… …… ….….. 40
3-5 Security Feature s…..………………… ……………………………………………… …… ..……………... 41
3-6 Boot M anagem ent Setup………………..……………………………………… …………….……..…. 42
3-7 Exi t BIO S Setup………… ………………..… ……………………………………………… ………………... 4 3

Appe ndix A..…………………… ……… ………………………………………………………… …… …… ……… 44

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

Fanless Embedded System

Table of Con tents

© Copyrigh t 2013 Acnodes, Inc.
All ri ghts reserved . Produ ct descri pti on an d produ ct specificati ons
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

FES2236

Chapter 1: Intr

1-1 Overview

oduction

Fanless Embedded System

Acnodes’ FE S 22 36 supports the exclusi ve features to provi de custom er an improved and outstandi ng
experie nce by applying the Atom D2550 processor, ( N28 00/ N2 600 avai labl e based on custom ers’ choic e)
w ith its outstanding and re liable embedded system with hi gh performance and low pow er consum ption
rema ined.

The ne w launched Atom ™ P rocessor D25 50 Dual-core 1.86 GHz Processor carries out an enhanced function in
graphic performance for increasi ng the capabil ity in multi-media. The new FES2 236 supports for reaching up
to 4 GB DDR3 - 8 00/1 066 as its maxim um me mory. For the disk dri ve storage, it is desi gned with 2.5” SATA
HDD and one M ini -P CI-E m SATA.

In orde r to m eet the network stabil ity, FES 2 236 uses two Realtek 81xx 100 /10 00 Mbps LA N w ith
Wake-On L AN & DM I to support and m aintain Ethe rnet function. The system designed w ith tw o D B-9
supports for RS-23 2/ 422/ 485 and two for RS-2 32 interface with auto-flow control; the expansion

avail abi lity could be up to si x COM s by re quest. It also provides a software program mi ng Watchdog (WDT)
with tim er range from 1 to 25 5 seconds. For the audio output, the re has occupied wi th an ALC 66 2 for
spe aker.

In displ ay function, it supports for dual displ ay of DVI-I+DVI-D, and the VGA supports for 1920 x 1 200
(1 080P ) resol utions. FES 2 236 is equipped by NM1 0 South Bridge Chipset that suppli es high speed storage
interface as i n faste r data transfer rate. For ex tended I/O devices, there i s an optional support for 8 bit GP IO

w ith T TL level provided.

FES 223 6 is capable to accept DC power i nput from 6 V~34 V. The power consumption can reach up to
22W in m ax imum with D25 50 chipsets. The syste m also offe rs optional support for A nti-Vibration and
Anti-Shock functiona lities to enhance the perform ance and durability of FES 223 6. The system is
valuable for all the em bedded applicati ons, and also we ll support with the Wi ndow 7, Window s XP and
Linux Operation system.

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

1-2 Pr

oduct Specification

P

rocessor

 At om D25 50 D ual-core 1.86 GHz Pr ocessor
 At om N2800 Dual-co re 1. 86 GHz Pro cesso r
 At om N2600 Dual-co re 1. 6 GHz Processor

Chipset

 NM 10 south Bridge C hipset

S

ystem Mem

 1 SODIMM Socket, up to 4 GB 800/ 1066 MHz D DR3 Memory

E

xpansion S lots

 1 P CI-104 expansion nod ule (2PCI master)
 2 M ini-PC I-E expansion slo t

Graphics

 Gr ap hic cor e 640 Mhz (D2550/N2800)/ 400 Mhz (N2600)
 Sup por t AVC/ H.264, VC1/WMV9, MPEG2 HW engin e
 Blu -Ray sup port (D2550)
 HD CP 1.3 an s PAVP 1. 1C content pr otectio n su pport
 Sup por t M icro soft DXVA 2.0 an d Overlay D D
 MS C OPP and P VP -OPM supp ort
 Enabling key ISVs-Cor el, Cyberlink, ArcSo ft
 Sup por ts OpenGL 3.0 and Micro soft DirectX9

Display

 Sup por t D VI-I+DVI-D or Dual 18/24 b it LVDS du al display
 DVI, VGA sup port 1920 x 1200 (1080 p) resolution
 D2550 LVDS sup port 1 channel 2 4 bit 1440 x 900 resol utio n
 N2 800/ N2600 LVDS supp or t 1 ch an nel 24 bit 1366 x 7 68 resolution

Audio

 AL C 662 HD Co dex su ppo rt

BIOS

 Pho en ix BIOs, Supp or t P ower On After Power Failu re

E

thernet

 2 Realtek 81x x 100/1 000 M bps L AN with Wake-On LAN & DM I

Disk Drive Storage

 2.5” SATA HDD (occup y 1 PCI-104 sp ace)
 mSATA (occup y 1 Mini-P CI -E)

RS -

232/422/485 S

 2 DB-9 for RS-232/422/485 & 2 for RS-232 (rear COM 1) with aut o-flow co ntrol.

W atchdog T im er



Programmab

Function

le WDT from 1 to 255 second s/ minu tes

ory

upport

Optional

 Optional sup port 8 bit GPIO with TTL level

Remote Power

 Option al sup port Remote Power On /Off function

support Digital I/O

On

Front P

 Power & HDD LED, Power & System Reset button
 2 USB, 4 DB-9 for RS-232,

anel Extend I/O

Removab

le CF

Rear Panel Extend I/O

 Scr ew-Lock DC p ower in put conn ec tor
 1 female DB-44 (COM 2) to 4 male DB-9 fo r 2 RS-232/422/485 &2 RS-232
 DVI-I + DVI-D disp lay int erface
 4 USB, 2 RJ-45 100/100 0 Mb it LAN connector
 1 Mic ro pho ne-in , 1 Line-o ut con nector (o ccupy D B-44 I/O 1 space; may remove Micro Phone-in & Line-o ut fo r o ptio nal

I/O exp ansio

Rear Panel Optional I/O

 2 DB-9/15 (C OM 3 & 4) for PCI -104 module or COM 5, 6

P

ower S upply

 DC 6V~34V in put, 24 VDC/0.85A, 12VDC/ 1. 7A, AT/ATX po wer type
 Power ad ap ter : AC to DC , D C 12V/5A 60W (Optional)

P

ower

 Typical P ower Co nsu mpt io n: 17W/ 12W/ 9W (D2550 / N2800/ N2600)
 Maximum Power C onsumption: 22W/ 17 W/ 14W (D 2550/ N2800/ N26 00)

E nvironment



Operatio

- With extend temperature HDD :

- With SSD / mSATA:

 Stor age Temperature:
 Relative Humidity: 10%~90%
 An ti-Vibration (o peration):

-

MIL-810F-514.5C -VII

- 2G rms @10~500Hz r an dom, 3 axes (HD D with anti-vib ration kit, SSD /mSATA withou t anti-vibration kit)

 An ti-Shoc k (n on-operation):

-

IEC-60028-2-27

- 50G rms, 11ms dur atio n (HD D with an ti-vib ration kit, SSD / mSATA with out anti-vib ratio n kit)

Dim ensions and Weight

 Dimen sion W x H x D: 200mm x 89.83mm x 185.5mm (7. 87” x 5.34” x 7.30”)
 Weight (Net/ Gross): 4.2 KG (9.24lb)/ 4.8KG (10.56lb)

Mechanical

 Mou nting: D esk/ Wall Mou nt
 Con stru ction: Aluminum h ousing

Certification &

 CE/FCC C lass A

n).

Consum ption (with

n Temperature:

-20°C~60°C

-40°C~85°C
(Non-con

OS Supports

HDD )

-20°C~60°C

densin g)

1-3 System

FES

2236

Block Diagram

1-4 Mechanical Diagram

FES

2236

s

1-5 Front & Rear I/O

Front

Panel

Rear Panel

Chapter 2: Pin Definition

PIN

Sig nal

PIN

Sig nal

1

5V 5 5V

2

D- 6 D-

3

D+ 7 D+

4

G ND

8

GND

PIN

Sign al

PIN

Si gnal

1

DCD

6

C TS

2

DSR

7

D TR

3

RXD

8

RI

4

RTS

9

GND

5

TXD

10

+5V

2-1 2236 Front panel Pin Definition

1.

Two U SB Connector

2.

Power On/Off Button

3.

System Reset B utton

4.

Power, HDD L ED

& Jumper Settings

5. COM 5-8 (D B-9): RS-232

6.

Pin

Definition

Pin

D efi niti on

1

G ND

26

NC

2

C F_D3

27

CF _D11

3

C F_D4

28

CF _D12

4

C F_D5

29

CF _D13

5

C F_D6

30

CF _D14

6

C F_D7

31

CF _D15

7

CF_CS0

32

CF_CS1

8

G ND

33

NC

9

G ND

34

C F_I ORD

10

G ND

35

C F_I OWR

11

G ND

36

CF_PWR

12

G ND

37

NC

13

C F_PWR

38

CF_PWR

14

G ND

39

Ca ble Select

15

G ND

40

NC

16

G ND

41

CF_RST

17

G ND

42

CF_IORDY

18

CF_A2

43

C F_DMARQ

19

CF_A1

44

C F_DMACK

20

CF_A0

45

NC

21

C F_D0

46

NC

22

C F_D1

47

CF_D8

23

C F_D2

48

CF_D9

24

NC

49

CF _D10

25

C F_C D

50

GN D

Signal name

Descr

iption

Signal name

Description

D

+

Data p

ositive

RTS

Requ est To

Send

D

-

Data

negative

TXD

Tr an smitted Data

GND

Grou

nd

CTS

Clear To

Send

DC

D

Data Carrier D etec t

DTR

Data Termin al Ready

DSR

Data Set Ready

RI

Ring Ind

icator

RX

D Rec eived D

ata

CF Socke t

2-2 2236 Rear panel Pin Definition

PIN

Definition

PIN

D efi niti on

1

LINE_OUT _Left

2

LI NE_OUT _Rig ht

3

AU DIO_AGND

4

AUDI O_AGND

5

LINE_IN_Left

6

LINE_IN_Rig ht

7

AU DIO_AGND

8

AUDI O_AGND

9

Mi cro phone_I N1

10

M icro phone _I N2

PIN

Definition

PIN

D efi niti on

1

Lan_T X1+

2

Lan_T X1-

3

Lan_T X2+

4

Lan_TX3+

5

Lan_TX3-

6

Lan_T X2-

7

Lan_T X4+

8

Lan_T X4-

PIN

Definition

1

90V-120V

2 G ND

3

Remote On/Off

PIN

Sign al

PIN

Si gnal

1

DCD

6

C TS

2

DSR

7

D TR

3

RXD

8

RI

4

RTS

9

GND

5

TXD

10

+5V

1. Micro phone-out Connector

2. Line-Out Connector

3. LAN 1 & 2 (RJ-45)

4. DVI-D: J1 8 DV I 2 ( DVI-D ) connector

5. DVI-I: J15 DV I 1 ( DVI-I ) connector

6. Power Input

7. COM 3 & 4 (DB -9/ DB-15): Optional PCI-104 extension module

8. COM 1 (D B-9): RS-232

9.

COM 2 Connector (DB-44 ): RS-23 2/ 42 2/ 4 85

COM 2 Exter nal Cable:

2-3 Internal

2-3.1 Main B oard Top View

Pin Definition & Jumper Settings

2-3.2 Main Board Pin Definition

PIN

Sig nal

1

＋12V

2

GND

3

+5V

4

GND

PIN

S ignal

1

G ND

2

TX+

3

TX-

4

G ND

5

RX-

6

R X+

7

G ND

PIN

Si gnal

PIN

Sig nal

PIN

Sig nal

PIN

S ignal

1

LC DL0-

11

LCD L3+-

21

LCD _PWR

31

U SB_G ND

2

LC DL0+

12

GND

22

LCD _PWR

32

U SB_D ATA-

3

GND

13

DDC_DATA

23

LCD _PWR

33

U SB_D ATA+

4

LC DL1-

14

DDC_CLK

24

LCD _PWR

34

U SB_VCC

5

LC DL1+

15

GND

25

GND

35

SYS-PWR-SW

6

GND

16

BL_E N/BL_EN#

26

GND

36

＋12V

7

LC DL2-

17

BL_ADJ_PWM

27

BL_PWR

37

＋12V

8

LC DL2+

18

GND

28

BL_PWR

38

＋12V

9

GND

19

LVDS_CLK-

29

BL_PWR

39

+5V

10

LC DL3-

20

LVDS_CLK+

30

NC

40

+5V

1. 2 .5" HDD Power Connector [Board Location: J1]

and Jum per S ettings

2. SATA Connector [Board Location: CN4]

3. D DR3 SODIMM

4. LV DS1 Connector [Board Location: J15]

5. LVD S2 Connector [Boa rd Location: J18 ]

PIN

Si gnal

PIN

Si gnal

PIN

Si gnal

PIN

Sig nal

1

LCDL0-

11

LCDL3+-

21

LCD_PWR

31

USB_GND

2

LCDL0+

12

GND

22

LCD_PWR

32

USB_DATA-

3

GND

13

DDC_D AT A

23

LCD_PWR

33

USB_DATA+

4

LCDL1-

14

DDC_C LK

24

LCD_PWR

34

USB_VCC

5

LCDL1+

15

GND

25

GND

35

SYS-PWR-SW

6

GND

16

BL_EN/BL_EN#

26

GND

36

＋12V

7

LCDL2-

17

BL_AD J_PWM

27

BL_PWR

37

＋12V

8

LCDL2+

18

GND

28

BL_PWR

38

＋12V

9

GND

19

LVD S_CLK-

29

BL_PWR

39

+5V

10

LCDL3-

20

LVD S_CLK+

30

NC

40

+5V

6. PCI-10 4 Slot [Board Location: CN6 ]

7. Internal KB/M ouse Connector ( WTB_1 X6_ 2.0mm _M al e_DIP) [B oard Location: J9]

PIN

Sign al

1

M_CLK

2

+5V

3

M_DATA

4

KB_DATA

5

G ND

6

KB_CLK

Socket

Location

Sig nal

Defaul t

PCI -E1

C N2

M ini PCI-E & m SATA

m SATA

PCI -E2

C N3

Mini PCI- E

PIN

S ignal

PIN

Sig nal

1 U SB_POWER

5 U SB_POWER

2

USB1_DAT A-

6

U SB2_DATA-

3

U SB1_DATA+

7

U SB2_DATA+

4

G ND

8

GND

PIN

Signal

1

Power LED+

2

Pow er LED -

3

HDD LED+

4

H DD LE D-

PIN

Signal

1

PWR_BU T_IN

2

PWR_BUT_GND

3

RST_BU T_IN

4

R ST_BUT _G ND

8. Mini PCI Socket 1, 2 (Mini PCI_124P in_8m m_SMD) [Boa rd Location: CN 2, CN 3]

9. External USB Por t 1~2 [B oa rd Location: USB1]

External USB Port 3~4 [Board Location: USB2]

10. Internal USB Por t 1~2 [Board Location: CN1]

Internal U SB Port 3~4 [Board Location: CN5]

11. Internal LED Connector [Board Location: J6]

12. Power & Reset Button Connector [Board Location: J7]

13 . External L G igabyte Ether ne t Port 1 & Port 2 [Board Location: J11 & J13]

PIN

Sig nal

PIN

S ignal

1

LNA_TX1+

2

LNA_TX1-

3

LNA_TX2+

4

LNA_TX3+

5

LNA_TX3-

6

LNA_TX2-

7

LNA_TX4+-

8

LNA_TX4-

PIN

Sig nal

1

+5V

2

DI 0

3

DI 1

4

DI 2

5

DI3

6

DI4

7

DI5

8

DO 0

9

DO 1

10

GND

PIN

RS-232

1

DCD

2

DSR

3

RXD

4

R TS

5

TXD

6

CTS

7

DTR

8

RI

9

GND

10

+5V

Internal LAN Port 1 & L AN Port 2 Connector [B oard Location: J1 2 &J14]

14 . External DV I 1 & DV I 2 [Board Location: J15 & J18 ]

15 . Internal GPIO (Low Active) [Boa rd Location: J2 2]

16 . Internal COM 5, COM 6 Connector [Board Location: J29, J31 ]

17 . Internal COM 1~COM4 Conne ctor [Boa rd Location: J3 6]

PIN

RS -232/422/485

PIN

R S-232/422/485

1

D CD1/ TXD1-/ Data 1-

2

R XD 1/T XD 1+/Data1+

3

TXD1/RXD1+/NA

4

D TR1/RXD1-/NA

5

GND1/GND1/GND 1

6

DSR/RT S-/RTS1-

7

RT S1/ RTS1+/ RTS1+

8

CT S1/ CTS1+/ CTS1+

9

RI1/CT S1-/ CTS1-

10

＋5V/＋5V/＋5V-

11

D CD2/ TXD2-/ Data 2-

12

R XD 2/T XD 2+/Data2+

13

TXD2/RXD2+/NA

14

D TR2/RXD2-/NA

15

GND2/GND2/GND 2

16

DSR2/RTS2-/RT S2-

17

RT S2/ RTS2+/ RTS2+

18

CT S2/ CTS2+/ CTS2+

19

RI2/CT S2-/ CTS2-

20

＋5V/＋5V/＋5V-

21

DC D3

22

RX D3

23

TXD3

24

DTR3

25

G ND3

26

DSR3-

27

RT S3

28

CTS3

29

R I3

30

＋5V-

31

DC D4

32

RX D4

33

TXD4

34

DTR4

35

G ND4

36

DSR4

37

RT S4

38

CTS4

39

R I4

40

+5V

PIN

Sig nal

1

LINE-OU T_Right

2

AUDI O_AG ND

3

LI NE _OU T_Left

4

LINE_IN_Right

5

M IC_IN

6

LINE_IN_Left

PIN

Sig nal

1

6V~36V

2

GND

3

Ig ni tion_I N

18 . Audio Conne ctor [Board Location: J4 ]

19 . External Power Input Connector [Board Location: J3 3]

20 . BAT 1: RTC Battery Connec tor

1

Battery_VCC

2

Ba ttery_G ND

1

Buz zer-

2

Buzz er+

PIN

Sig nal

PIN

Sig nal

1

DC -IN _VCC

2

DC_ IN _VCC

3

BAT_OU T_VCC

4

BAT_ OUT_VCC

5

BAT_GN D

6

BAT_GN D

7

BAT_GN D

8

Ignition_IN_TTL

9

SM_ BU S_ Data

10

SM_ BU S_CLK

21 . Optional Internal Buzzer Conne ctor [Board Location: J3 ]

22 . Optional External Battery Connector [Board Location: CN7]

2-3.3Jumper Settings

Def aul t

Jumper Selector

Power ON S elect

1-2

Auto Pow er ON

x

2-3

B utton POWER ON

Def aul t

Jumper Selector

B utton Select

x

1-2

Power ON B utton

2-3

Sys tem Reset Button

Def aul t

Jumper Selector

Po wer IN

x

1-2

Power I n Wi thout Control

2-3

Power I N control by I gnition or
External MCU o r Externa l Battery

Ig nition

Def aul t

J umper Sel ecto r

Ignition Control

x

1-2

Sho rt

Power ON Button

1-2

Open

Sys tem Reset Button

Def aul t

J umper Sel ecto r

CMOS

x

1-2

Short

Norm al

2-3

Short

CM OS Cl ear

PIN

Si gnal

1

3. 3V

2

L1_PWR

3

5V

Def aul t

Jumper Selector

LVD S 1 Power

x

1-2

3. 3V

2-3

5V

1. Power ON Select [Board Location: JP7]

2. Button Se lect [Board Location: JP13]

3. Power IN Control Select [Board Location: JP12 ]

4. Ignition Select [Board Location: JP14 ]

5. CM OS Cle ar ( Jumper_2.0m m) [Board Location: JP5]

6. LV DS 1 Powe r Select [Boa rd Location: JP1 ]

7. LV DS 1 Backlight Powe r Select [Boa rd Location: JP2]

PIN

Si gnal

1

12V

2

BL1_PWR

3

5V

Def aul t

Jumper Selector

LVDS 1 Backlight Power

x

1-2

12V

2-3

5V

PIN

Si gnal

1

BL1EN

2

BL1EN_G PO

3

B L1EN#

Def aul t

Jumper Selector

LVD S 1 B ackli ght Level

x

1-2 High E nable

2-3

Low Ena ble

PIN

Si gnal

1

3. 3V

2

B L1EN_PWR

3

5V

Def aul t

Jumper Selector

LVDS 1 Back light Enable Po wer

x

1-2

3. 3V

2-3

5V

PIN

Sig nal

1

3. 3V

2

L2_PWR

3

5V

Def aul t

J umper Sel ecto r

LVDS 2 Power

x

1-2

3.3V

2-3

5V

8. LV DS 1 Backlight Enable Level Select [Boa rd Location: JP3 ]

9. LV DS 1 Backlight Enable Power Select [Board Location: JP4]

10.

11. LV DS 2 Powe r Select [Boa rd Location: JP8 ]

12. LV DS 2 Backlight Powe r Select [Boa rd Location: JP9]

PIN

Sig nal

1

12V

2

B L2_PWR

3

5V

Def aul t

J umper Sel ecto r

LVDS 2 Backl ight Power

x

1-2

12V

2-3

5V

PIN

Sig nal

1

BL2E N

2

BL2E N_GPO

3

BL2E N#

Def aul t

J umper Sel ecto r

LVDS 2 B ackligh t Level

x

1-2

High Ena ble

2-3

Low Ena ble

PIN

Sig nal

1

3. 3V

2

BL2EN_PWR

3

5V

Def aul t

J umper Sel ecto r

LVD S 2 Backli ght Enabl e Power

x

1-2

3.3V

2-3

5V

Def aul t

J umper Sel ector

Button Sel ect

1-2

Pow er In <8V, System Keep OFF

2-3

Pow er IN <15V, System Keep OFF

5-6

Reserved

x

7-8

Bypass This Function

13. LV DS 2 Backlight Enable Level Select [Board Location: JP10 ]

14. LV DS 2 Backlight Enable Power Select [Board Location: JP11]

15. Input Power OFF Level Select [Board Location: J34]

2-4 MIO Board Pin Definition & Jumper Settings

PIN

Signal

1

5V

2

D-

3

D+

4

G ND

PIN

Sig nal

PIN

Sign al

1

V CC3

2

VC C3

3

TR ST#

4

GND

5

T DI

6

GND

7

T MS

8

GND

9

TC K

10

GND

11

RTCK

12

GND

13

TDO

14

GND

15

RE SET#

16

GND

17

Pull dow n

18

GND

19

Pull dow n

20

GND

2-4.1

2-4.2 MIO

1. USB Connector [MIO Board Location: CN1 ]

FES

2236 MIO

B

oard Pin D efinition

Board Top View

2. uP JTAG [MIO Board Loc ation: CN3]

3. CF Socket [M IO Board Location: CN 4]

PIN S ignal

PIN Si gnal

1

GND

26

NC

2

CF_D3

27

C F_D11

3

CF_D4

28

C F_D12

4

CF_D5

29

C F_D13

5

CF_D6

30

C F_D14

6

CF_D7

31

C F_D15

7

C F_CS0

32

CF_CS1

8

GND

33

NC

9

GND

34

CF_I OR D

10

GND

35

C F_I OWR

11

GND

36

CF_PWR

12

GND

37

NC

13

C F_PWR

38

CF_PWR

14

GND

39

Ca ble Select

15

GND

40

NC

16

GND

41

CF_RST

17

GND

42

CF_IORDY

18

CF_A2

43

C F_DM ARQ

19

CF_A1

44

CF_DMACK

20

CF_A0

45

NC

21

CF_D0

46

NC

22

CF_D1

47

CF_D 8

23

CF_D2

48

CF_D 9

24

NC

49

C F_D10

25

CF_CD

50

GND

PIN

S ignal

PIN

Si gnal

1

DCD

6

DSR

2

RXD

7

RTS

3

TXD

8

CTS

4

DTR

9

RI/ 5V

5

GND

4. RS-232 Connector [MIO Board Location: CN5(A,B)]

5. RS-232 Connector [MIO Board Location: CN6(A,B)]

PIN

Signal

PIN

Si gnal

1

DC D

6

DSR

2

RXD

7

RTS

3

T XD

8

CTS

4

DT R

9

RI

5

G ND

PIN

Signal

PIN

Si gnal

1

NC

2

DSR2-

3

RX

4

RT S2-

5

T X

6

C TS2-

7

DTR2-

8

NC

9

G ND

10

NC

PIN

Signal

PIN

Si gnal

1

5V 5 5V

2

D- 6 D -

3

D + 7 D+

4

G ND

8

GND

RS-23 2

6. COM Port Conne ct or [M IO Boa rd Location: COM 1]

7. USB Connec tor [M IO Board Location: USB2]

2-4.3 MIO

B

oard Jumper S etting

1. uP Programming (P rogrammer Interface Connected to COM 1) [MIO Board Location: JP1]

2. CF Select [M IO Board Location: JP2]

3. Supply 5V [CN5 (A,B)Pin 9] [MIO Board Location: JP3 & JP4]

4. Power ON Mode Select [M IO Board Location: JP5 & JP6]

Chapter 3: BIOS Setup Menu

3-1. BIOS Configuration Overview

The m ain board em ploys the P hoenix SecureCore Tiano BIOS. The BIOS (Basic Input and O utput System ) is a
program used to i ni ti alize and set up basic I/O periphe rals of the compute r, which includes the P CI bus and
connec ted devices such as the di skette drive , the keyboard and so on.

3-2. Entering BIOS Setup

When FES 2 236 i s turned on, the BIO S wi ll perform Powe r-O n Self Te st ( PO ST) on the system and
display the size of the mem ory that i s being tested. P re ss the [Del] ke y to ente r the BIOS Setup utility, and
then the main m enu wi ll be show ed on the screen.

In thi s chapter w e wil l i ntroduce the contents of BIO S used in FES 22 36 . Through understanding BIO S
se tting wi ll be helpful in applicati on of FES 2 236 .

The BIO S Setup m ain menu include s some opti ons as the following screen. Use the
[Up/Down] arrow key to highlight the option that you want to m odify, and then pre ss the [Enter] key to
se lect the option and confi gure the functions.

S

ystem D ate & System

In thi s secti on, you m ay view or revise for the System Date & Time.

Tim e

S

ystem Inform ation

In this section, you may review for the system inf orm ation clearly.

B oot Features

1. Select Boot f eatures.

2. Selects Power-on state for Numl ock funct ion.

E rror M

anager

The sec ti on of Error Manage r in the Main me nu all ows f or displayi ng er ror m anager Log
inf orm ation.

3-3 Advanced BIOS Features

The <Advanced BIO S Feature s> option c onsi sts of conf iguration entri es that al low you to improve the
syste m performance, or set up system features accordi ng to your pre ference.

3-3.1 Boot Configuration

 Quick B oot

Quick Boot is a standard feature of the Secure Core Tiano BIOS, whi ch supports f or f astest boot time
in the industry.

 High Resolution Graphics
 Diagnostic Splash Screen
 BIOS Level USB
 U SB Legacy

Legacy m ode support enable s devices to funct ion in an operat ing environm ent that is not
USB-aware.

 Console Redire ction
 U EFI Boot

The UEFI ena ble s user to customize rapidly, inc reases the complexi ty at the hardware level, and
integrates the additional features from the fi rm w are . The UEFI P OST tim e is approxi mately 5
seconds, whic h satisfy user’s dem and to access information i nstantl y.

 Legacy Boot
 Load OPROM

3-3.2

ACP I Configuration

Thi s feature allows you to e nable/di sable the Advanced Configurati on and Power Management
(ACP I).

3-3.3

P

rocessor C onfiguration

3-3.4 Serial

ATA (S ATA )

3-3.5 North B ridge C onfiguration

 IGD Confi guration

3-3.6 South

Bridge Configuration

 SB USB Confi guration

 SB P CI Express Configurati on

3-3.7

S MB IOS

E

vent

Log

3-3.8 Intel Fast Flash Standby

The i FFs technology is deve loped by Intel speci fical ly for SSD to all ow correct ly resum e from OS
suspension even after experie nci ng a pow er fai lure.

3-4 Other BIOS Settings

3-4.1

In this section, you may select the prefe rred Mode for applying onto CO M1 and CO M2 .

S

uper IO Configurati

on

3-4.2 Hardware Monitor

This feature al low s you to m onitor the temperature of CPU and Syste m tem pe rature .

3-5 Security Features

The SecureCore Tiano supports for TCG, iTP M, Intel ATT and Phoenix Fa ilSafe. It provi des a secure root of
trust that can authenticate operating systems, such as M icrosoft Windows Vista and Windows 7. It also
provides for m ulti -factor biome tri c authenti cation to ve rify the ident ity of a user prior to a ny operating
syste m being loaded.

Fea ture s under this se ction including :

Set or clear the supervisor a ccount’s password.
Set User P assw ord

A uthenticate Use r on Boot
HDD password sel ectable

Set HDD User P assw ord

3-6 Boot

Management Setup

In this se ction, you m ay view or configure devices.

3-7 Exit BIOS Set

up

 Exit Sa ving Changes

This selection enable s you to confirm SA VE the changes and ex it BIO S se tup.

 Exit Discarding Change s

This selection enable s you to confirm Exit the BIOS setup without saving any change s.

 Load Setup Defaults

This selection enable s you to load the default values for all the setup features.

 Discard Changes

This selection enable s you to discard al l the changes.

 Save Changes

This selection enable s you to save all the changes been made to the BIO S setup.

A

PPENDIX

GHOST R ECOVE RY GUID

A

E

1. Choose [LOCAL], w hich i s the category you going to exe cute recove ry.

2. Choose [PARTITION ], whi ch is the ha rd-disk partition.

3. Choose [From Image], which refers to recover from i mage file.

4. Choose the l ocation of the image file where was saved.

5. Choose [3 .GHO] image fil e as example just entered.

6. Here w il l display the fil e name bei ng sele cted.

7. Click on [OPEN].

8. Check and revi ew the Image File being sele cted.

9. Click on [OK].

10. Choose the [Destination Drive] of disk you going to recovery the im age fi le TO.

11. After sele cted, click on [OK].

12. Select [Destination Pa rtition], w hi ch is the disk you going to recover the im age fi le FROM.

13. After sele cted, click [OK].

?

Here is the WARNIN G to inform you the R ECOV ERY process is going to be executed: The

in form atio n from the selected Partitio n w ill be recov ered .

14. Click on [Y ES]: The recovery process w ill begi n.