Acnodes FES 2230 User Manual

FES2230

User Manual

FES2230: Fanless Embedded System Atom D2550
Dual Core 1.86GHz Processor

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

Fanless Embedded System

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

Copyright

This publi cati on c ontains inform ation that is prot ected by copyright. N o part of it m ay be reproduced i n
any form or by any m eans or used to make any transform ation/adaptation without the prior written
permission from the copyr ight holde rs. The manufacturer reserves the right to revise this publication and
m ake changes to its contents at any time, w ithout obl igation to noti fy any person or entity of such
revisions or changes.

©201 3. Al l Rights Reserved.

Trademarks

Al l tradem arks and registered trademarks of products appearing in this m anual are the properties of their
respective holders.

Notice:

1. The chan ges o r modifica tion s n ot expressly a ppro ved by th e p arty r espo nsible fo r compliance cou ld void th e user ’s auth ority

to op erate t he eq uipment .

2. Shielded int erfa ce ca bles must be used in or de r to comply wit h t he emission limits.

Static Electricity Precautions

It is quite easy to inadvertently dam age the system board, c omponents or devices e ven before i nstal ling
them i n your system unit. Static electri cal discharg e can dam age computer com ponents wi thout causing
any signs of physi cal dam age . You must take extra care in handl ing them to ensure against el ectrostatic
bui ld up.

1. To prevent electrostatic bui ld up, le ave the system board i n i ts anti-static bag unti l you are ready to install
it.

2. Wear an antistatic wrist st rap.

3. Do all preparation w ork on a stati c-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contac ts or
connections.

5. Avoi d touching the pins or contacting all m odul es and connectors. Hold modules or connectors by the ir
ends.

Impo rt ant:
Elect rost atic d ischa rge (ESD) can damage you r p rocessor, disk dr ive an d ot her compo nents. Perform t he up grade instru ct ion
pr ocedures describ ed at an ESD wor kstation on ly. If such a sta tion is no t availab le, yo u can provide some ESD protection by
wear in g a n ant istatic wrist st rap and attaching it to a met al part of the system chassis. If a wr ist strap is una vailab le, es tab lish
an d maintain contact with the syst em chassis th roug hout any p rocedures req uiring ESD protection .

FES2230

Safety Measures

Fanless Embedded System

To avoid dam age to the system :

• Use the correct A C input vol tage range to reduce the risk of ele ctric shock.

• Unplug the power cord before rem oving the system chassis cover for install ati on or servi cing. After

instal lation or servicing, cover the system chassis bef ore plugging the power cord.

Batte ry:

• Dange r of expl osion if battery incorrectly replaced.

• Repl ac e only w ith the same or e quival ent type re com mend by the manufacture r.

• Dispose of used batteries according to l ocal ordinance.

Warranty

1. Warranty does not cover dam ages or fai lures caused by m isuse of the product, inabili ty to use the

product, unauthorized replacem ent or any kind of alterations of components and product
specif ications.

2. The warranty i s voided if the product has been exposed to physi cal abuse , improper instal lation, a ny

kind of modific ation, acc idents or unauthorized repair of the product.

3. Unl ess otherwise instructed in this user m anual, the user m ay not, under any ci rcum stances, attem pt to

perform servi ce , adjustm ents or repairs on the product him se lf, whether the product is sti ll covered by
warranty or not. It must be returned to the place i t was purchased at, the fa ctory or an authorized
se rvic e agency for any re pai r work.

4. We w il l not be l iabl e for any indi re ct, spe cial, incidental or conseque nt damages to the product that has

be en m odif ied or alte red.

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

FES2230

Copyright .................................................................................................................. 2

Trade marks ............................................................................................................... 2

Stati c Electrici ty P recautions .............. ...................................................................... 2

Safety Me asures ....................................................................................................... 3

Warranty ................................................................................................................... 3

Chapter 1: Introduction

1-1 O verview .............................................................................................................. 5

1-2 P roduct Specification........................................................................................... 6

1-3 System Block Di agram ....................................................................................... .. 8

1-4 Me chanical Diagram ........................................................................................... 9

1-5 Front & Rear I/O ………….…...................................................................................... 10

Chapter 2: Pin D efinition & Jumper Se ttings
2-1 2 230D Front P anel P in Definition……… …………….………………… …………………………… 11
2-2 2 230D Re ar Pane l P in Defi niti on…………………….……………………………………………… 11
2-3 Internal P in Defi niti on & Jum per Settings……………………………………………………… . 15
Chapter 3: BIOS Setup Menu
3-1 BIOS Configuration O verview ………………………………………… …… …………………………. 25
3-2 Entering BIO S Setup……… …………………………………………………… …………………………… 25
3-3 Advanced BIOS Fe atures…………………………… ……………………………………………………. 28
3-4 O ther BIO S Settings ……..……………… ……………………………………………… ………… ….….. 35
3-5 Security Feature s…..………………… ……………………………………………… …… ..……………... 36
3-6 Boot M anagem ent Setup………………..……………………………………… …………….……..…. 37
3-7 Exi t BIO S Setup………… ………………..… ……………………………………………… ………………... 3 8
Appe ndix A..…………………… ……… ……………………………………………… …………………………… 39

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

Fanless Embedded System

Table of Con tents

© Copyrigh t 2013 Acnodes, Inc.
All ri ghts reserved . Produ ct descri pti on an d produ ct specificati ons
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

FES2230

Chapter 1: Intr

1-1 Overview

oduction

Fanless Embedded System

Acnodes’ FES 22 30 supports the exclusive features to provide custom er an improved and outstanding
experience by applyi ng the Atom D255 0 processor, (N2 800 / N 2600 avail able based on customers’ choi ce)
with i ts outstandi ng and re liable em bedded system with hi gh performance and l ow power consumption
remai ned.

The ne w launched Atom ™ P rocessor D25 50 Dual-core 1.86 GHz Processor carries out an enhanced function in
graphic performance for increasi ng the capabil ity in multi-media. The new FES 223 0 supports for reaching up
to 4 GB DDR3 - 8 00/1 066 as its maxim um me mory. For the disk dri ve storage, it is desi gned with 2.5” SATA
HDD and one M ini -P CI-E m SATA.

In orde r to m eet the network stabil ity, the FES 2 230 uses two Realte k 8 1xx 100/1 000 Mbps L AN with
Wake-On L AN & DM I to support and m aintain Ethe rnet function. The system designed w ith tw o D B-9
supports for RS-23 2/ 422/ 485 and two for RS-2 32 interface with auto-flow control. It also provides a
software programm ing Watchdog ( WDT) with tim er range from 1 to 255 se conds. For the audio output,
there has occupied with an ALC 662 for speaker.

In displ ay function, it supports for dual displ ay of DVI-I+DVI-D, and the VGA supports for 1920 x 1 200
(1 080P ) resol utions. The new FES 2 230 also equipped by NM 10 South Bridge Chipset that supplies high
spe ed storage inter fac e as in faster data transfer rate. The construction of FES 223 0 i s designed as Alumi num
housing Em bedded platform. For extended I/O devices, there is an optional support for 8 bit GP IO wi th TTL
level provided.

FES 2 230 is c apable to accept DC power input from 6 V~34 V. The power consumpti on can reach up to
22W in m ax imum with D25 50 chipsets. The system also offers opti onal support for Anti-V ibrati on and
Anti-Shock functi onal iti es to e nhance the pe rform ance and durabili ty of FES 223 0. The system is
valuable for all the em bedded applicati ons, and also we ll support with the Wi ndow 7, Window s XP and
Linux Operation system.

14628 Central Ave,
Chin o, CA 91710
tel: [phone], fax:[phone]

© Copyrigh t 2013 Acnodes, Inc.
All rights reserved. Product description and product specifi cations
are subj ect to chan ge without noti ce. For latest product informati on,
please visit Acnodes’ we b site at www.acnodes.c om.

1-2 Pr

oduct Specification

Processor

Atom D 2550 Dual-c or e 1.86 GHz P rocessor
Atom N2800 Du al-core 1.86 GHz Pro cesso r
Atom N2600 Du al-core 1.6 GHz Pro cesso r

Chipset

NM10 sou th Bridge Chipset

System Memory

1 SODIM M Socket, u p to 4 GB 800/ 1066 MHz DDR3 M emory

Expansion Slots

1 PCI -104 expansion no dule (2PCI master )
2 Mini-P CI-E exp an sion slot

Graphics

Gr ap hic cor e 640 Mhz (D2550/N2800)/ 400 M hz (N260 0)
Su ppo rt AVC/ H. 264,
Blu -Ray su pport (D2550)
HDCP 1.3 ans PAVP 1.1C cont en t p rotection supp ort
Su ppo rt Mic roso ft D XVA 2.0 and Overlay DD
MS COPP an d PVP -OPM sup port
Enabling key ISVs-Co rel, Cyb erlink, ArcSoft
Su ppo rts OpenGL 3.0 and M icro soft DirectX9

Display

Su ppo rt DVI -I+D VI-D or Du al 18/24 b it LVDS d ual display
DVI, VGA su ppor t 19 20 x 1200 (1080p) resolut ion
D255 0 LVDS su pport 1 channel 24 bit 1440 x 900 resolution
N2800 LVDS supp ort 1 ch an nel 24 bit 1366 x 7 68 resolution

Audio

ALC 662 HD C odex supp ort

BIOS

Ph oenix BIOs, Sup port Power On After P ower Failure

Ethernet

2 Realtek 81xx 100/1000 Mbps LAN with Wake-On LAN & DMI

Disk Drive S torage

2.5” SATA HDD (share 1 P CI-104 space)
mSATA (occu py 1 Mini-PCI-E)

RS-232/422/485 Support

2 DB-9 for RS-23 2/422/485 & 2 for RS-232 (rear I/O 1) with au to-flow co ntrol.
Option al ex pansio n to 6 C OM.

Watchdog Timer

Programmable WDT fr om 1 to 255 sec on ds/ min utes

Function

VC1/WM

V9, MPEG2 HW engine

Optional Support Digital I/O

Option al su pport 8 bit GPIO with TTL level

Remote P ower

Option al su pport Remote Power On/Off function

On

Front

P ower & HD D Led

Po wer & System Reset bu tton, 2 o ptional WiFi an ten na

Panel Extend I/O

Rear P anel E xtend I/O

Sc rew-Lock D C power in put con nector
1 female DB-44 (I/O 2) t o 4 male DB-9 for 2 RS-232/422/485 & 2 RS-232
DVI-I + D VI-D display in ter face
4 USB, 2 RJ-45 100/1000 M bit L AN connec tor
1 Micro ph one-in, 1 Line-out con nector (occupy DB-44 I/O 1 sp ace; may remove M icro Phone-in & Line-o ut fo r o ptional
I/O exp an sion).

Rear P anel Optional I/O

2 DB-9/15 (I/O 3 & 4 ) for PC I-104 mo dule o r C OM 5 & 6

Power Supply

DC 6 V~34 V inpu t, 2 4 VDC/0.85A, 12VDC/ 1.7A, AT/ATX po wer typ e
Po wer adapter: AC to DC , D C 12V/5A 60W (Optional)

Power Consumption

Typical Power C
Maximum Power Con

Environment

Oper ation Temper atur e:

- With extend temperature HD D:

- With SSD / mSATA:

Sto rage Temper atur e:

Relative Humidity: 10%~90%

Anti-Vibr ation (operation):

-

- 2G rms @10~500Hz r an dom, 3 axes (HD D with anti-vib ration kit, SSD /mSATA withou t anti-vibration kit)

Anti-Sh ock (no n-o perat io n):

-

- 50G rms, 11ms dur atio n (HD D with an ti-vib ration kit, SSD / mSATA with out anti-vib ratio n kit)

onsumptio

n: 17W/ 12W/ 9W (D2550 / N2800/ N2600)

sumption

-40°C ~85°C

MIL-810F-514.5C-VII

IEC-60028-2-27

-20°C~60°C

Dimensions and W eight

D imension W x H x D : 200mm x 86.5mm x 133. 5mm (7.87” x 3.41” x 5.26”)
Weigh t (Net / Gr oss): 2. 0KG (4. 4lb)/ 2. 7KG (5.94lb)

(with

: 22W/ 17 W/ 14W (D 2550/ N2800/ N26 00)

(Non-con

HDD)

-20°C~60°C

densin g)

Mechanical

Mo unting: Din Rail M oun t

C onstruct io n: D IN Rail Heavy-Du ty Steel Embedded platform

Certification &

C E/FCC Class A
Windo ws 7, Win X P, Linux

OS Supports

1-3 System

FES

2230

Block Diagram

1-4 Mechanical Diagrams

FES

2230

1-5 Fr

ont

& Rear I/O

Front

Panel

Rear Panel

Chapter 2: Pin Definition & Jumper Settings

PIN

Sig nal

PIN

Sig nal

1

5V 5 5V

2

D- 6 D-

3

D+ 7 D+

4

G ND

8

GND

PIN

Definition

PIN

D efi niti on

1

Lan_T X1+

2

Lan_T X1-

3

Lan_T X2+

4

Lan_TX3+

5

Lan_TX3-

6

Lan_T X2-

7

Lan_T X4+

8

Lan_T X4-

2-1 2230 Front panel Pin Definition

1.

Power On/Off & Reset B utton

2.

Power & HDD Led

3.

2 optional W iFi ante nna

2-2 2230 Rear Panel Pin Definition

1.

USB Connector

2. LAN 1 & 2 (RJ-45)

3. DVI-D: J1 8 DV I 2 ( DVI-D ) connector

4. DVI-I: J15 DV I 1 ( DVI-I ) connector

5. Power Input

PIN

Definition

1

90V-120V

2

G ND

3

Remote On/Off

Signal name

Description

Signal name

Descr

iption

D +

Data positive

RTS

Requ est To Send

D -

Data negative

TXD

Transmitted D ata

GND

Ground

CTS

Clear To Sen d

D CD

Data Carrier D etec t

DTR

D ata Terminal Ready

D SR

Data Set Ready

RI

Ring In dicato r

RXD

Rec eived Data

6. COM 3 (I/O3) DB-9: Optional PCI-1 04 extension module

7. COM 4 (I/O4) DB-15 : Optional PCI-104 extension module

8. COM 1 (I/O1): M icro phone -Out & Line-Out Connector

9.

COM 2 (I/O2) DB-44: RS-2 32/ 422/ 485

COM 2 Exter nal Cable:

2-3 Internal Pin Definition & Jumper Settings

2-3.1 Main Board T

op

View

2-3.2 Main Board Pin Definition and Jum per S ettings

PIN

Sig nal

1

＋12V

2

GND

3

+5V

4

GND

PIN

S ignal

1

G ND

2

TX+

3

TX-

4

G ND

5

RX-

6

R X+

7

G ND

PIN

Si gnal

PIN

Sig nal

PIN

Sig nal

PIN

S ignal

1

LC DL0-

11

LCD L3+-

21

LCD _PWR

31

U SB_G ND

2

LC DL0+

12

GND

22

LCD _PWR

32

U SB_D ATA-

3

GND

13

DDC_DATA

23

LCD _PWR

33

U SB_D ATA+

4

LC DL1-

14

DDC_CLK

24

LCD _PWR

34

U SB_VCC

5

LC DL1+

15

GND

25

GND

35

SYS-PWR-SW

6

GND

16

BL_E N/BL_EN#

26

GND

36

＋12V

7

LC DL2-

17

BL_ADJ_PWM

27

BL_PWR

37

＋12V

8

LC DL2+

18

GND

28

BL_PWR

38

＋12V

9

GND

19

LVDS_CLK-

29

BL_PWR

39

+5V

10

LC DL3-

20

LVDS_CLK+

30

NC

40

+5V

1. 2 .5" HDD Power Connector [Board Location: J1]

2. SATA Connector [Board Location: CN4]

3. D DR3 SODIMM

4. LV DS1 Connector [Board Location: J15]

5. LVD S2 Connector [Boa rd Location: J18 ]

PIN

Si gnal

PIN

Si gnal

PIN

Si gnal

PIN

Sig nal

1

LCDL0-

11

LCDL3+-

21

LCD_PWR

31

USB_GND

2

LCDL0+

12

GND

22

LCD_PWR

32

USB_DATA-

3

GND

13

DDC_D AT A

23

LCD_PWR

33

USB_DATA+

4

LCDL1-

14

DDC_C LK

24

LCD_PWR

34

USB_VCC

5

LCDL1+

15

GND

25

GND

35

SYS-PWR-SW

6

GND

16

BL_EN/BL_EN#

26

GND

36

＋12V

7

LCDL2-

17

BL_AD J_PWM

27

BL_PWR

37

＋12V

8

LCDL2+

18

GND

28

BL_PWR

38

＋12V

9

GND

19

LVD S_CLK-

29

BL_PWR

39

+5V

10

LCDL3-

20

LVD S_CLK+

30

NC

40

+5V

6. PCI-10 4 Slot [Board Location: CN6 ]

7. Internal KB/M ouse Connector ( WTB_1 X6_ 2.0mm _M al e_DIP) [B oard Location: J9]

PIN

Sign al

1

M_CLK

2

+5V

3

M_DATA

4

KB_DATA

5

G ND

6

KB_CLK

Socket

Location

Sig nal

Defaul t

PCI -E1

C N2

M ini PCI-E & m SATA

m SATA

PCI -E2

C N3

Mini PCI- E

PIN

S ignal

PIN

Sig nal

1 U SB_POWER

5 U SB_POWER

2

USB1_DAT A-

6

U SB2_DATA-

3

U SB1_DATA+

7

U SB2_DATA+

4

G ND

8

GND

PIN

Signal

1

Power LED+

2

Pow er LED -

3

HDD LED+

4

H DD LE D-

PIN

Signal

1

PWR_BU T_IN

2

PWR_BUT_GND

3

RST_BU T_IN

4

R ST_BUT _G ND

8. Mini PCI Socket 1, 2 (Mini PCI_124P in_8m m_SMD) [Boa rd Location: CN 2, CN 3]

9. External USB Por t 1~2 [B oa rd Location: USB1]

External USB Port 3~4 [Board Location: USB2]

10. Internal USB Por t 1~2 [Board Location: CN1]

Internal U SB Port 3~4 [Board Location: CN5]

11. Internal LED Connector [Board Location: J6]

12. Power & Reset Button Connector [Board Location: J7]

13 . External L G igabyte Ether ne t Port 1 & Port 2 [Board Location: J11 & J13]

PIN

Sig nal

PIN

S ignal

1

LNA_TX1+

2

LNA_TX1-

3

LNA_TX2+

4

LNA_TX3+

5

LNA_TX3-

6

LNA_TX2-

7

LNA_TX4+-

8

LNA_TX4-

PIN

Sig nal

1

+5V

2

DI 0

3

DI 1

4

DI 2

5

DI3

6

DI4

7

DI5

8

DO 0

9

DO 1

10

GND

PIN

RS-232

1

DCD

2

DSR

3

RXD

4

R TS

5

TXD

6

CTS

7

DTR

8

RI

9

GND

10

+5V

Internal LAN Port 1 & L AN Port 2 Connector [B oard Location: J1 2 &J14]

14 . External DV I 1 & DV I 2 [Board Location: J15 & J18 ]

15 . Internal GPIO (Low Active) [Boa rd Location: J2 2]

16 . Internal COM 5, COM 6 Connector [Board Location: J29, J31 ]

17 . Internal COM 1~COM4 Conne ctor [Boa rd Location: J3 6]

PIN

RS -232/422/485

PIN

R S-232/422/485

1

D CD1/ TXD1-/ Data 1-

2

R XD 1/T XD 1+/Data1+

3

TXD1/RXD1+/NA

4

D TR1/RXD1-/NA

5

GND1/GND1/GND 1

6

DSR/RT S-/RTS1-

7

RT S1/ RTS1+/ RTS1+

8

CT S1/ CTS1+/ CTS1+

9

RI1/CT S1-/ CTS1-

10

＋5V/＋5V/＋5V-

11

D CD2/ TXD2-/ Data 2-

12

R XD 2/T XD 2+/Data2+

13

TXD2/RXD2+/NA

14

D TR2/RXD2-/NA

15

GND2/GND2/GND 2

16

DSR2/RTS2-/RT S2-

17

RT S2/ RTS2+/ RTS2+

18

CT S2/ CTS2+/ CTS2+

19

RI2/CT S2-/ CTS2-

20

＋5V/＋5V/＋5V-

21

DC D3

22

RX D3

23

TXD3

24

DTR3

25

G ND3

26

DSR3-

27

RT S3

28

CTS3

29

R I3

30

＋5V-

31

DC D4

32

RX D4

33

TXD4

34

DTR4

35

G ND4

36

DSR4

37

RT S4

38

CTS4

39

R I4

40

+5V

PIN

Sig nal

1

LINE-OU T_Right

2

AUDI O_AG ND

3

LI NE _OU T_Left

4

LINE_IN_Right

5

M IC_IN

6

LINE_IN_Left

PIN

Sig nal

1

6V~36V

2

GND

3

Ig ni tion_I N

18 . Audio Conne ctor [Board Location: J4 ]

19 . External Power Input Connector [Board Location: J3 3]

20 . BAT 1: RTC Battery Connec tor

1

Battery_VCC

2

Ba ttery_G ND

1

Buz zer-

2

Buzz er+

PIN

Sig nal

PIN

Sig nal

1

DC -IN _VCC

2

DC_ IN _VCC

3

BAT_OU T_VCC

4

BAT_ OUT_VCC

5

BAT_GN D

6

BAT_GN D

7

BAT_GN D

8

Ignition_IN_TTL

9

SM_ BU S_ Data

10

SM_ BU S_CLK

21 . Optional Internal Buzzer Conne ctor [Board Location: J3 ]

22 . Optional External Battery Connector [Board Location: CN7]

2-3.3Jumper Settings

Def aul t

Jumper Selector

Power ON S elect

1-2

Auto Pow er ON

x

2-3

B utton POWER ON

Def aul t

Jumper Selector

B utton Select

x

1-2

Power ON B utton

2-3

Sys tem Reset Button

Def aul t

Jumper Selector

Po wer IN

x

1-2

Power I n Wi thout Control

2-3

Power I N control by I gnition or
External MCU o r Externa l Battery

Ig nition

Def aul t

J umper Sel ecto r

Ignition Control

x

1-2

Sho rt

Power ON Button

1-2

Open

Sys tem Reset Button

Def aul t

J umper Sel ecto r

CMOS

x

1-2

Short

Norm al

2-3

Short

CM OS Cl ear

PIN

Si gnal

1

3. 3V

2

L1_PWR

3

5V

Def aul t

Jumper Selector

LVD S 1 Power

x

1-2

3. 3V

2-3

5V

1. Power ON Select [Board Location: JP7]

2. Button Se lect [Board Location: JP13]

3. Power IN Control Select [Board Location: JP12 ]

4. Ignition Select [Board Location: JP14 ]

5. CM OS Cle ar ( Jumper_2.0m m) [Board Location: JP5]

6. LV DS 1 Powe r Select [Boa rd Location: JP1 ]

7. LV DS 1 Backlight Powe r Select [Boa rd Location: JP2]

PIN

Si gnal

1

12V

2

BL1_PWR

3

5V

Def aul t

Jumper Selector

LVDS 1 Backlight Power

x

1-2

12V

2-3

5V

PIN

Si gnal

1

BL1EN

2

BL1EN_G PO

3

B L1EN#

Def aul t

Jumper Selector

LVD S 1 B ackli ght Level

x

1-2 High E nable

2-3

Low Ena ble

PIN

Si gnal

1

3. 3V

2

B L1EN_PWR

3

5V

Def aul t

Jumper Selector

LVDS 1 Back light Enable Po wer

x

1-2

3. 3V

2-3

5V

PIN

Sig nal

1

3. 3V

2

L2_PWR

3

5V

Def aul t

J umper Sel ecto r

LVDS 2 Power

x

1-2

3.3V

2-3

5V

8. LV DS 1 Backlight Enable Level Select [Boa rd Location: JP3 ]

9. LV DS 1 Backlight Enable Power Select [Board Location: JP4]

10.

11. LV DS 2 Powe r Select [Boa rd Location: JP8 ]

12. LV DS 2 Backlight Powe r Select [Boa rd Location: JP9]

PIN

Sig nal

1

12V

2

B L2_PWR

3

5V

Def aul t

J umper Sel ecto r

LVDS 2 Backl ight Power

x

1-2

12V

2-3

5V

PIN

Sig nal

1

BL2E N

2

BL2E N_GPO

3

BL2E N#

Def aul t

J umper Sel ecto r

LVDS 2 B ackligh t Level

x

1-2

High Ena ble

2-3

Low Ena ble

PIN

Sig nal

1

3. 3V

2

BL2EN_PWR

3

5V

Def aul t

J umper Sel ecto r

LVD S 2 Backli ght Enabl e Power

x

1-2

3.3V

2-3

5V

Def aul t

J umper Sel ector

Button Sel ect

1-2

Pow er In <8V, System Keep OFF

2-3

Pow er IN <15V, System Keep OFF

5-6

Reserved

x

7-8

Bypass This Function

13. LV DS 2 Backlight Enable Level Select [Board Location: JP10 ]

14. LV DS 2 Backlight Enable Power Select [Board Location: JP11]

15. Input Power OFF Level Select [Board Location: J34]

Chapter 3: BIOS Setup Menu

3-1. BIOS Configuration Overview

The m ain board employs the P hoenix SecureCore Tiano BIO S. The BIO S (Basic Input and O utput System) is a
program used to i ni ti alize and set up basi c I/O peripherals of the com puter, whi ch includes the PCI bus and
connec ted devices such as the di skette drive , the keyboard and so on.

3-2. Entering BIOS Setup

When the FES 22 30 is turned on, the BIOS wil l pe rform Power -O n Self Test (P OST) on the system and
display the size of the mem ory that is be ing te sted. P ress the [Del] key to ente r the BIOS Se tup utility, and
then the main m enu wi ll be show ed on the screen.

In thi s chapter we wil l i ntroduce the contents of BIO S used in FES 223 0. Through unde rstandi ng BIOS
se tting wi ll be helpful in application of FE S 2 230 .

The BIO S Setup m ain menu include s some opti ons as the following screen. Use the
[Up/Down] arrow key to highlight the option that you want to m odify, and then pre ss the [Enter] key to
se lect the option and confi gure the functions.

S

ystem D ate & System

In thi s secti on, you m ay view or revise for the System Date & Time.

Tim e

S

ystem Inform ation

In this section, you may review for the system inf orm ation clearly.

B oot Features

1. Select Boot f eatures.

2. Selects Power-on state for Numl ock funct ion.

E rror M

anager

The sec ti on of Error Manage r in the Main me nu all ows f or displayi ng er ror m anager Log
inf orm ation.

3-3 Advanced BIOS Features

The <Advanced BIO S Feature s> option c onsi sts of conf iguration entri es that al low you to improve the
syste m performance, or set up system features accordi ng to your pre ference.

3-3.1 Boot Configuration

 Quick B oot

Quick Boot is a standard feature of the Secure Core Tiano BIOS, whi ch supports f or f astest boot time
in the industry.

 High Resolution Graphics
 Diagnostic Splash Screen
 BIOS Level USB
 U SB Legacy

Legacy m ode support enable s devices to funct ion in an operat ing environm ent that is not
USB-aware.

 Console Redire ction
 U EFI Boot

The UEFI ena ble s user to customize rapidly, inc reases the complexi ty at the hardware level, and
integrates the additional features from the fi rm w are . The UEFI P OST tim e is approxi mately 5
seconds, whic h satisfy user’s dem and to access information i nstantl y.

 Legacy Boot
 Load OPROM

3-3.2

ACP I Configuration

Thi s feature allows you to e nable/di sable the Advanced Configurati on and Power Management

(ACP I).

3-3.3

P

rocessor C onfiguration

3-3.4 Serial

ATA (S ATA )

3-3.5 North B ridge C onfiguration

 IGD Confi guration

3-3.6 South

Bridge Configuration

 SB USB Confi guration

 SB P CI Express Configurati on

3-3.7

S MB IOS

E

vent

Log

3-3.8 Intel Fast Flash Standby

The i FFs technology is deve loped by Intel speci fical ly for SSD to all ow correct ly resum e from OS
suspension even after experie nci ng a pow er fai lure.

3-4 Other BIOS Settings

3-4.1

In this section, you may select the prefe rred Mode for applying onto CO M1 and CO M2 .

S

uper IO Configurati

on

3-4.2 Hardware Monitor

This feature al low s you to m onitor the temperature of CPU and Syste m tem pe rature .

3-5 Security Features

The SecureCore Tiano supports for TCG, iTP M, Intel ATT and Phoenix Fa ilSafe. It provi des a secure root of
trust that can authenticate operating systems, such as M icrosoft Windows Vista and Windows 7. It also
provides for m ulti -factor biome tri c authenti cation to ve rify the ident ity of a user prior to a ny operating
syste m being loaded.

Fea ture s under this se ction including :

Set or clear the supervisor a ccount’s password.
Set User P assw ord

A uthenticate Use r on Boot
HDD password sel ectable

Set HDD User P assw ord

3-6 Boot

Management Setup

In this se ction, you m ay view or configure devices.

3-7 Exit BIOS Set

up

 Exit Sa ving Changes

This selection enable s you to confirm SA VE the changes and ex it BIO S se tup.

 Exit Discarding Change s

This selection enable s you to confirm Exit the BIOS setup without saving any change s.

 Load Setup Defaults

This selection enable s you to load the default values for all the setup features.

 Discard Changes

This selection enable s you to discard al l the changes.

 Save Changes

This selection enable s you to save all the changes been made to the BIO S setup.

A

PPENDIX

GHOST R ECOVE RY GUID

A

E

1. Choose [LOCAL], w hich i s the category you going to exe cute recove ry.

2. Choose [PARTITION ], whi ch is the ha rd-disk partition.

3. Choose [From Image], which refers to recover from i mage file.

4. Choose the l ocation of the image file where was saved.

5. Choose [3 .GHO] image fil e as example just entered.

6. Here w il l display the fil e name bei ng sele cted.

7. Click on [OPEN].

8. Check and revi ew the Image File being sele cted.

9. Click on [OK].

10. Choose the [Destination Drive] of disk you going to recovery the im age fi le TO.

11. After sele cted, click on [OK].

12. Select [Destination Pa rtition], w hi ch is the disk you going to recover the im age fi le FROM.

13. After sele cted, click [OK].

?

Here is the WARNIN G to inform you the R ECOV ERY process is going to be executed: The

in form atio n from the selected Partitio n w ill be recov ered .

14. Click on [Y ES]: The recovery process w ill begi n.