1) UNLESS OTHERWISE SPECIFIED RESISTORS HAVE 5% TOLERANCE.
2) UNLESS OTHERWISE SPECIFIED CAPACITORS HAVE 20% TOLERANCE.
CC
BB
IMPORTANT NOTICE:
1. THIS DOCUMENT MAY NOT REFLECT THE MOST RECENT CHANGES IN BOARD DEVELOPMENT
AND DEBUG. ANY DEVELOPER INTENDING TO USE THIS SCHEMATIC AS A REFERNCE SHOULD
CONTACT THEIR LOCAL FIELD APPLICATIONS ENGINEER, REGIONAL SALES OFFICE , O R
PROGRAM MANAGER FOR SCHEMATIC UPDATES, DESIGN RECOM MENDA TION S AND PCB L AYOU T
GUIDELINES. AMD ALSO RECOMMENDS A DESIGN REVIEW OF BOTH THE SCHEMATIC DIAGRAM
AND PCB LAYOUT BEFORE CONSIDERING PRODUC TIO N.
2. AMD RESERVES THE RIGHT TO CHANGE DESIGNS OR SPECIFICATIONS WITHOU T NO TICE .
CUSTOMERS ARE ADVISED TO OBTAIN THE LATEST VERSIONS OF PRODUCT SPECIFICATIONS,
WHICH SHOULD BE CONSIDERED IN EVALUATING A PRODUCT'S APPROPRIATENESS FOR A
PARTICULAR USE.
3. AMD MAKES NO WARRANTIES, EXPRESSED OR IMPLIED, FOR MERCHANTABILITY OR FITNESS
FOR A PARTICULAR APPLICATION. IN NO EVENT SHALL AMD BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES AS A RESULT OF THE PE RFOR MAN CE,
AA
OR FAILURE TO PEFORM, OF ANY AMD PRODUCT OR DOCUMENTATION.
DPage 13 - Added design note regarding USB VCORE supply.
04-10-2007
CC
*
Page 8 - Changed LX symbol - DRG B 6 p i n f r om Y32 to AH8B
*
Page 10 - Connected C102-C108 to Ground
*
Page 13 - Connected C133-C137 and C149-C152 to Ground
*
*
BB
AA
5
4
3
2
*AMD CONFIDENTIAL*
Advanced Micro Devices
1351 South Sunset St.
Longmont CO 80501
Title
AMD GEODE™ LX EPIC RDK Reference Schematic
Document NumberRev
Size
B
40744D
Date:Sheet
Wednesday, April 11, 2007
1
226
of
5
4
3
2
1
MONITOR
DD
LVDS
HD/CD
CC
X2
HOST
X1
PRIMARY IDEATA-100
CRT
TFT
USB2.0
AMD Geode™
LX Processor
PCI BUS (33MHz)
AMD Geode™
CS5536
MEMORY BUS
PCI TO ISA
BRIDGE
10 / 100
ETHERNET
2 PORT
SODIMM200
DDR
FULL ISA
Companion
uDOC FLASH
STORAGE
CLIENT
X1
BB
14.318 MHz
Crystal
Clock
Synthesizer
(MK1491-09F)
PCI(33 MHz)
66 MHz
48 MHz
REFCLK
Device
SIO
SPI
AC97
AUDIO CODEC
5.1 SUPPORT
BIOS
FLASH
LEGACY
PARALLEL
SERIAL
KB/MS
VCORE(1.25V)
VMEM (2.6V)
AA
VCC5
VCC5SB
5
DC/DC
VCC3 (3.3V)
VCORESB (1.225V)
VCC3SB (3.3V)
4
BASEBOARD ONLY
3
2
*AMD CONFIDENTIAL*
Advanced Micro Devices
1351 South Sunset St.
Longmont CO 80501
Title
AMD GEODE™ LX EPIC RDK Reference Sc hematic
Document NumberRev
Size
B
40744D
Date:Sheet
Wednesday, April 11, 2007
1
326
of
5
4
3
2
1
5VSB
VMEM @ 2A Max
DC/DC
AOZ1012
DD
WORKING
EN
AMD
Geode™ LX
5V
DC/DC
AOZ1012
WORK AUX
5V
EN
DC/DC
AOZ1012
CC
WORK AUX
5VSB
EN
VCC3 @ 2A Max
VCORE @ 2A Max
VCC3SB
DESIGN NOTE: This design uses
LVD to generate system reset.
Since LVD only monitors Vcore ,
the designer must guarantee that
Vio and other required voltages
are valid at or before Vcore. If this
cannot be guaranteed, then
RESET_WORK# must be used to
hold system in reset until Vio and
Vcore and any other requir ed
voltages are valid.
DESIGN NOTE: BA0,BA1
must be trace length
matched to within 50 mils.
MBA0
MBA1
C20B10
TLA0
B15
TLA1
B13
MD0
P2
MD1
N2
MD2
M3
MD3
K2
MD4
P3
MD5
N1
MD6
L3
MD7
K1
MD8
J2
MD9
J1
MD10
F3
MD11
E3
MD12
J3
MD13
G1
MD14
F2
MD15
F1
MD16
D2
MD17
B4
MD18
B6
MD19
C8
MD20
D1
MD21
A4
MD22
A7
MD23
B7
MD24
B9
MD25
C10
MD26
A12
MD27
B12
MD28
A9
MD29
C9
MD30
C11
MD31
A13
MD32
A15
MD33
B17
MD34
B19
MD35
B22
MD36
B16
MD37
A17
MD38
B20
MD39
A20
MD40
A22
MD41
A23
MD42
A25
MD43
A26
MD44
C22
MD45
C23
MD46
B25
MD47
B26
MD48
D31
MD49
F31
MD50
K30
MD51
K31
MD52
G30
MD53
G31
MD54
J31
MD55
J30
MD56
M31
MD57
M30
MD58
R30
MD59
R31
MD60
L29
MD61
M29
MD62
P30
MD63
R29
MVREF
P1
1
C2
100nF
DGND
4
RN1
33
RN2
33
RN3
33
RN4
33
RN5
33
RN6
33
RN7
33
RN8
33
RN9
33
RN10
33
RN11
33
RN12
33
RN13
33
RN15
33
RN17
33
RN19
33
MD5
MD1
MD4
MD0
MD6
MD2
MDQM0
MDQS0
MD12
MD8
MD7
MD3
MDQM1
MDQS1
MD13
MD9
MD15
MD11
MD14
MD10
MD21
MD17
MD20
MD16
MD22
MD18
MDQM2
MDQS2
MD28
MD24
MD23
MD19
MDQM3
MDQS3
MD29
MD25
MD31
MD27
MD30
MD26
TLA0
TLA1
MD37
MD33
MD36
MD32
MD38
MD34
MDQM4
MDQS4
MD44
MD40
MD39
MD35
MDQM5
MDQS5
MD45
MD41
MD47
MD43
MD46
MD42
3
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
RMD5 7
RMD1 7
RMD4 7
RMD0 7
RMD6 7
RMD2 7
RMDQM0 7
RMDQS0 7
RMD12 7
RMD8 7
RMD7 7
RMD3 7
RMDQM1 7
RMDQS1 7
RMD13 7
RMD9 7
RMD15 7
RMD11 7
RMD14 7
RMD10 7
RMD21 7
RMD17 7
RMD20 7
RMD16 7
RMD22 7
RMD18 7
RMDQM2 7
RMDQS2 7
RMD28 7
RMD24 7
RMD23 7
RMD19 7
RMDQM3 7
RMDQS3 7
RMD29 7
RMD25 7
RMD31 7
RMD27 7
RMD30 7
RMD26 7
RTLA0 7
RTLA1 7
RMD37 7
RMD33 7
RMD36 7
RMD32 7
RMD38 7
RMD34 7
RMDQM4 7
RMDQS4 7
RMD44 7
RMD40 7
RMD39 7
RMD35 7
RMDQM5 7
RMDQS5 7
RMD45 7
RMD41 7
RMD47 7
RMD43 7
RMD46 7
RMD42 7
3
DESIGN NOTE:
Swap series
resistors on the
DQS lines in
order minimize
the number of
vias.
DESIGN
NOTE: Swap
series
resistors on
the address
lines in order
minimize the
number of
vias.
DESIGN NOTE:
Do not swap
series resistors
on the DQS,
DQM or Data
lines with the
Address or
control lines.
DESIGN
NOTE: Swap
series
resistors on
the data lines
in order
minimize the
number of
vias.
DESIGN
NOTE: Place
data bus
series
resistors as
close to the
memory
devices as
possible.
RN21
33
RN23
33
RN24
33
RN26
33
RN27
33
RN14
22
RN16
22
RN18
22
RN20
22
RN22
22
RN25
22
MD53
MD49
MD52
MD48
MD54
MD50
MDQM6
MDQS6
MD60
MD56
MD55
MD51
MDQM7
MDQS7
MD61
MD57
MD63
MD59
MD62
MD58
MA11
MA12
MCKE0
MA6
MA7
MA8
MA9
MA2
MA3
MA4
MA5
MBA1
MA10
MA0
MA1
MCAS#
MWE#
MRAS#
MB
A0
MCS1#
MCS0#
MA13
2
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
1
8
2
7
3
6
45
RMD53 7
RMD49 7
RMD52 7
RMD48 7
RMD54 7
RMD50 7
RMDQM6 7
RMDQS6 7
RMD60 7
RMD56 7
RMD55 7
RMD51 7
RMDQM7 7
RMDQS7 7
RMD61 7
RMD57 7
RMD63 7
RMD59 7
RMD62 7
RMD58 7
RMA11 7
RMA12 7
RMCKE0 7
RMA6 7
RMA7 7
RMA8 7
RMA9 7
RMA2 7
RMA3 7
RMA4 7
RMA5 7
RMBA1 7
RMA10 7
RMA0 7
RMA1 7
RMCAS# 7
RMWE# 7
RMRAS# 7
RMBA0 7
RMCS1# 7
RMCS0# 7
RMA13 7
DESIGN NOTE: Place DQS and
DQM series resistors as close
to the SODIMM connector as
possible.
DESIGN NOTE: This schematic shows a
non-parallel terminated DDR solution.
There may be restrictions as to the total
number of DRAMS and the number of
banks supported on the SODIMM. See LX
layout guidelines for current restrictions.
DESIGN NOTE: Place address
and control series resistors as
close to the processor as
possible.
DESIGN NOTE: This schematic
shows a non-parallel terminated
DDR solution. There may be
restrictions as to the total number
of DRAMS and the number of banks
supported on the SODIMM. See LX
layout guidelines for current
restrictions.
DESIGN NOTE: When using 16 data capture
mode (Mode 4 - BT.601), the TFT interface
cannot be used due to pin sharing conflicts.
DESIGN NOTE: There are two conventions
for connecting 24 bit panels. One is backward
compatible with 18 bit panels. The connections
defined here are backwards compatible.
DESIGN NOTE: AGND_VGA should be an
island with single point connection to the
full ground plane to reduce noise content.
Zero ohm resistor can be removed as
long as above condition is met.
HSYNC_C
24
DGND
VCC3
53
1
24
DGND
DGND
U22
NC7SZ125/SC70
DGND
U23
NC7SZ125/SC70
*AMD CONFIDENTIAL*
Advanced Micro Devices
1351 South Sunset St.
Longmont CO 80501
Title
AMD GEODE™ LX EPIC RDK Reference Sc hematic
Document NumberRev
Size
B
40744D
Date:Sheet
Wednesday, April 11, 2007
1
826
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